MURS480ET3G SWITCHMODEt Power Rectifiers Ultrafast “E'' Series with High Reverse Energy Capability These state-of-the-art devices are designed for use in switching power supplies, inverters and as free wheeling diodes. http://onsemi.com ULTRAFAST RECTIFIER 4.0 AMPERES, 800 VOLTS Features •20 mJ Avalanche Energy Guaranteed •Excellent Protection Against Voltage Transients in Switching Inductive Load Circuits •Ultrafast 75 Nanosecond Recovery Time •175°C Operating Junction Temperature •Low Forward Voltage •Low Leakage Current •High Temperature Glass Passivated Junction •Reverse Voltage to 800 V •These are Pb-Free Devices SMC CASE 403 PLASTIC MARKING DIAGRAM AYWW U4A Mechanical Characteristics: •Case: Epoxy, Molded •Weight: 217 mg (Approximately) •Finish: All External Surfaces Corrosion Resistant and Terminal U4 = Specific Device Code A = Assembly Location Y = Year WW= Work Week Leads are Readily Solderable •Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds •Shipped in 16 mm Tape & Reel, 2500 Units per Reel •Polarity: Notch in Plastic Body Indicates Cathode Lead ORDERING INFORMATION MAXIMUM RATINGS Rating Symbol Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage MURS480E VRRM VRWM VR Average Rectified Forward Current IF(AV) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Operating Junction and Storage Temperature Range Value Unit Device Package Shipping† SMC (Pb-Free) 2500/Tape & Reel V MURS480ET3G 4.0 @ TL=110°C A †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. IFSM 70 A TJ, Tstg -65 to +175 °C 800 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. © Semiconductor Components Industries, LLC, 2007 July, 2007 - Rev. 1 1 Publication Order Number: MURS480E/D MURS480ET3G THERMAL CHARACTERISTICS Symbol Value Unit Maximum Thermal Resistance, Junction-to-Lead Rating RqJL 11 °C/W Maximum Thermal Resistance, Junction-to-Ambient RqJA 165 °C/W Symbol Max Unit ELECTRICAL CHARACTERISTICS Characteristic Maximum Instantaneous Forward Voltage (Note 1) (iF = 3.0 Amps, TJ = 150°C) (iF = 3.0 Amps, TJ = 25°C) (iF = 4.0 Amps, TJ = 25°C) vF V Maximum Instantaneous Reverse Current (Note 1) (Rated dc Voltage, TJ = 150°C) (Rated dc Voltage, TJ = 25°C) iR Maximum Reverse Recovery Time (IF = 1.0 A, di/dt = 50 A/ms) (IF = 0.5 A, iR = 1.0 A, IREC = 0.25 A) trr Maximum Forward Recovery Time (IF = 1.0 Amp, di/dt = 100 Amp/ms, Recovery to 1.0 V) tfr 75 ns WAVAL 20 mJ 1.53 1.75 1.85 mA 900 25 ns 100 75 Controlled Avalanche Energy 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle v 2.0%. http://onsemi.com 2 MURS480ET3G 1000 400 200 100 40 20 10 4.0 2.0 1.0 0.4 0.2 0.1 0.04 0.02 0.01 0.004 0.002 0.001 IR, REVERSE CURRENT (mA) 20 25°C TJ = 175°C 10 100°C 7.0 3.0 2.0 25°C 0 100 200 400 300 500 600 700 VR, REVERSE VOLTAGE (VOLTS) 0.7 Figure 2. Typical Reverse Current 800 0.5 0.3 0.2 0.1 0.07 0.05 0.03 0.02 8 7 6 dc 5 0.2 0.6 0.4 0.8 1.0 1.2 1.4 1.6 1.8 SQUARE WAVE 4 3 2 1 0 0 2 0 20 60 40 80 100 120 140 160 180 vF, INSTANTANEOUS VOLTAGE (V) TL, LEAD TEMPERATURE (°C) Figure 1. Typical Forward Voltage Figure 3. Current Derating Lead 60 1000 50 40 C, CAPACITANCE (pF) PF(AV), AVERAGE POWER DISSIPATION (W) 100°C 1.0 IF, AVERAGE FORWARD CURRENT (A) iF, INSTANTANEOUS FORWARD CURRENT (A) 5.0 TJ = 175°C SQUARE WAVE 30 dc 20 100 10 10 0 1 0 5 10 15 20 0 25 50 75 100 125 150 VR, REVERSE VOLTAGE (V) IF(AV), AVERAGE FORWARD CURRENT (A) Figure 4. Power Dissipation Figure 5. Typical Capacitance http://onsemi.com 3 175 200 MURS480ET3G PACKAGE DIMENSIONS SMC PLASTIC PACKAGE CASE 403-03 ISSUE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. 4. 403-01 THRU -02 OBSOLETE, NEW STANDARD 403-03. HE E b DIM A A1 b c D E HE L L1 D MIN 1.90 0.05 2.92 0.15 5.59 6.60 7.75 0.76 MILLIMETERS NOM MAX 2.13 2.41 0.10 0.15 3.00 3.07 0.23 0.30 5.84 6.10 6.86 7.11 7.94 8.13 1.02 1.27 0.51 REF MIN 0.075 0.002 0.115 0.006 0.220 0.260 0.305 0.030 INCHES NOM 0.084 0.004 0.118 0.009 0.230 0.270 0.313 0.040 0.020 REF MAX 0.095 0.006 0.121 0.012 0.240 0.280 0.320 0.050 A L L1 c A1 SOLDERING FOOTPRINT* 4.343 0.171 3.810 0.150 2.794 0.110 SCALE 4:1 mm Ǔ ǒinches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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