LINER LTC2620IUFDTRPBF Octal 16-/14-/12-bit rail-to-rail dacs in 16-lead ssop Datasheet

LTC2600/LTC2610/LTC2620
Octal 16-/14-/12-Bit
Rail-to-Rail DACs in 16-Lead SSOP
DESCRIPTION
FEATURES
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Smallest Pin-Compatible Octal DACs:
LTC2600: 16 Bits
LTC2610: 14 Bits
LTC2620: 12 Bits
Guaranteed 16-Bit Monotonic Over Temperature
Wide 2.5V to 5.5V Supply Range
Low Power Operation: 250μA per DAC at 3V
Individual Channel Power-Down to 1μA, Max
Ultralow Crosstalk Between DACs (<10μV)
High Rail-to-Rail Output Drive (±15mA, Min)
Double-Buffered Digital Inputs
Pin-Compatible 10-/8-Bit Versions (LTC1660/LTC1665)
Tiny 16-Lead Narrow SSOP
and 20-Lead 4mm × 5mm QFN Packages
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These parts establish new board-density benchmarks for
16- and 14-bit DACs and advance performance standards for
output drive, crosstalk and load regulation in single-supply,
voltage-output multiples.
The parts use a simple SPI/MICROWIRE compatible 3-wire
serial interface which can be operated at clock rates up
to 50MHz. Daisychain capability and a hardware CLR
function are included.
The LTC2600/LTC2610/LTC2620 incorporate a power-on
reset circuit. During power-up, the voltage outputs rise less
than 10mV above zero-scale; and after power-up, they stay
at zero-scale until a valid write and update take place.
APPLICATIONS
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The LTC®2600/LTC2610/LTC2620 are octal 16-, 14- and
12-bit, 2.5V-to-5.5V rail-to-rail voltage-output DACs in
16-lead narrow SSOP and 20-lead 4mm × 5mm QFN
packages. They have built-in high performance output
buffers and are guaranteed monotonic.
Mobile Communications
Process Control and Industrial Automation
Instrumentation
Automatic Test Equipment
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear
Technology Corporation. All other trademarks are the property of their respective owners.
BLOCK DIAGRAM
DAC A
REGISTER
2
REGISTER
(1) VOUTA
16 VCC
REGISTER
1
REGISTER
GND
(20)
DAC H
(17)
15 VOUTH (16)
REGISTER
DAC B
REGISTER
3
REGISTER
(2) VOUTB
REGISTER
Differential Nonlinearity (LTC2600)
DAC G
1.0
14 VOUTG (15)
VCC = 5V
VREF = 4.096V
0.8
REF
6
DAC D
REGISTER
DAC E
13 VOUTF
12 VOUTE
(14)
(13)
DNL (LSB)
REGISTER
REGISTER
0.4
DAC F
REGISTER
5
REGISTER
(4) V
OUTD
DAC C
REGISTER
4
REGISTER
(3) VOUTC
REGISTER
0.6
0.2
0
–0.2
–0.4
–0.6
–0.8
(5)
(7) CS/LD
7
(8)
8
SCK
POWER-ON
RESET
CONTROL
LOGIC
11
CLR
(11)
10
SDO
(10)
SDI
(9)
DECODE
32-BIT SHIFT REGISTER
9
–1.0
0
16384
32768
CODE
49152
65535
2600 G21
2600 BD
NOTE: NUMBERS IN PARENTHESIS REFER TO THE UFD PACKAGE
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1
LTC2600/LTC2610/LTC2620
ABSOLUTE MAXIMUM RATINGS
(Note 1)
Any Pin to GND ........................................... –0.3V to 6V
Any Pin to VCC ............................................ –6V to 0.3V
Operating Temperature Range
LTC2600C/LTC2610C/LTC2620C ............. 0°C to 70°C
LTC2600I/LTC2610I/LTC2620I............. –40°C to 85°C
Storage Temperature Range.................. –65°C to 150°C
Maximum Junction Temperature........................... 125°C
Lead Temperature (Soldering, 10 sec) ................. 300°C
PIN CONFIGURATION
VCC
DNC
TOP VIEW
DNC
GND
TOP VIEW
20 19 18 17
GND
1
16 VCC
VOUTA
2
15 VOUTH
VOUTB
3
14 VOUTG
VOUTC
4
13 VOUTF
VOUTD
5
12 VOUTE
REF 5
12 DNC
REF
6
11 CLR
DNC 6
11 CLR
CS/LD
7
10 SDO
SCK
8
9
VOUTA 1
16 VOUTH
VOUTB 2
15 VOUTG
VOUTC 3
8
9 10
SDI
SDO
7
SCK
GN PACKAGE
16-LEAD PLASTIC SSOP
TJMAX = 125°C, θJA = 150°C/W
13 VOUTE
CS/LD
SDI
14 VOUTF
21
VOUTD 4
UFD PACKAGE
20-LEAD (4mm s 5mm) PLASTIC QFN
TJMAX = 150°C, θJA = 43°C/W
EXPOSED PAD (PIN 21) IS GND, MUST BE SOLDERED TO PCB
ORDER INFORMATION
LEAD FREE FINISH
TAPE AND REEL
PART MARKING*
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LTC2600CUFD#PBF
LTC2600CUFD#TRPBF
2600
20-Lead (4mm × 5mm) Plastic DFN
0°C to 70°C
LTC2600IUFD#PBF
LTC2600IUFD#TRPBF
2600
20-Lead (4mm × 5mm) Plastic DFN
–40°C to 85°C
LTC2600CGN#PBF
LTC2600CGN#TRPBF
2600
16-Lead Plastic SSOP
0°C to 70°C
LTC2600IGN#PBF
LTC2600IGN#TRPBF
2600I
16-Lead Plastic SSOP
–40°C to 85°C
LTC2610CUFD#PBF
LTC2610CUFD#TRPBF
2610
20-Lead (4mm × 5mm) Plastic DFN
0°C to 70°C
LTC2610IUFD#PBF
LTC2610IUFD#TRPBF
2610
20-Lead (4mm × 5mm) Plastic DFN
–40°C to 85°C
LTC2610CGN#PBF
LTC2610CGN#TRPBF
2610
16-Lead Plastic SSOP
0°C to 70°C
LTC2610IGN#PBF
LTC2610IGN#TRPBF
2610I
16-Lead Plastic SSOP
–40°C to 85°C
LTC2620CUFD#PBF
LTC2620CUFD#TRPBF
2620
20-Lead (4mm × 5mm) Plastic DFN
0°C to 70°C
LTC2620IUFD#PBF
LTC2620IUFD#TRPBF
2620
20-Lead (4mm × 5mm) Plastic DFN
–40°C to 85°C
LTC2620CGN#PBF
LTC2620CGN#TRPBF
2620
16-Lead Plastic SSOP
0°C to 70°C
LTC2620IGN#PBF
LTC2620IGN#TRPBF
2620I
16-Lead Plastic SSOP
–40°C to 85°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
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2
LTC2600/LTC2610/LTC2620
ELECTRICAL CHARACTERISTICS
The l denotes specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VCC = 2.5V to 5.5V, VREF ≤ VCC, VOUT unloaded, unless otherwise noted.
SYMBOL PARAMETER
CONDITIONS
MIN
LTC2620
TYP MAX
MIN
LTC2610
TYP MAX
MIN
LTC2600
TYP MAX
UNITS
DC Performance
Resolution
l
12
14
16
12
14
16
Monotonicity
VCC = 5V, VREF = 4.096V (Note 2)
l
DNL
Differential Nonlinearity
VCC = 5V, VREF = 4.096V (Note 2)
l
INL
Integral Nonlinearity
VCC = 5V, VREF = 4.096V (Note 2)
l
±0.75
Load Regulation
VREF = VCC = 5V, Mid-Scale
IOUT = 0mA to 15mA Sourcing
IOUT = 0mA to 15mA Sinking
l
l
VREF = VCC = 2.5V, Mid-Scale
IOUT = 0mA to 7.5mA Sourcing
IOUT = 0mA to 7.5mA Sinking
l
l
Bits
Bits
±1
LSB
±3
±16
±12
±64
LSB
0.025 0.125
0.025 0.125
0.1
0.1
0.5
0.5
0.3
0.3
2
2
LSB/mA
LSB/mA
0.05
0.05
0.25
0.25
0.2
0.2
1
1
0.8
0.8
4
4
LSB/mA
LSB/mA
±0.5
±1
±4
ZSE
Zero-Scale Error
VCC = 5V, VREF = 4.096V Code = 0
1
9
1
9
1
9
mV
VOS
Offset Error
VCC = 5V, VREF = 4.096V (Note 7)
±1
±9
±1
±9
±1
±9
mV
VOS Temperature
Coefficient
GE
Gain Error
±3
VCC = 5V, VREF = 4.096V
Gain Temperature
Coefficient
±0.2
±6.5
±3
±0.7
±0.2
μV/°C
±3
±0.7
±0.2
±6.5
±0.7
%FSR
ppm/°C
±6.5
The l denotes specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C.
VCC = 2.5V to 5.5V, VREF ≤ VCC, VOUT unloaded, unless otherwise noted.
SYMBOL PARAMETER
CONDITIONS
LTC2600/LTC2610/LTC2620
MIN
TYP
MAX
PSR
Power Supply Rejection
VCC = ±10%
–80
ROUT
DC Output Impedance
l
VREF = VCC = 5V, Mid-Scale; –15mA ≤ IOUT ≤ 15mA
VREF = VCC = 2.5V, Mid-Scale; –7.5mA ≤ IOUT ≤ 7.5mA l
0.025
0.030
DC Crosstalk (Note 4)
Due to Full-Scale Output Change (Note 5)
Due to Load Current Change
Due to Powering Down (per Channel)
±10
±3.5
±7.3
Short-Circuit Output Current
VCC = 5.5V, VREF = 5.6V
Code: Zero-Scale; Forcing Output to VCC
Code: Full-Scale; Forcing Output to GND
l
l
15
15
34
34
60
60
mA
mA
VCC = 2.5V, VREF = 5.6V
Code: Zero-Scale; Forcing Output to VCC
Code: Full-Scale; Forcing Output to GND
l
l
7.5
7.5
18
24
50
50
mA
mA
Input Voltage Range
l
0
VCC
V
Resistance
l
11
20
kΩ
ISC
UNITS
dB
0.15
0.15
Ω
Ω
μV
μV/mA
μV
Reference Input
Normal Mode
Capacitance
IREF
Reference Current, Power-Down
Mode
16
90
All DACs Powered Down
l
0.001
pF
1
μA
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LTC2600/LTC2610/LTC2620
ELECTRICAL CHARACTERISTICS
The l denotes specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VCC = 2.5V to 5.5V, VREF ≤ VCC, VOUT unloaded, unless otherwise noted.
SYMBOL PARAMETER
LTC2600/LTC2610/LTC2620
MIN
TYP
MAX
CONDITIONS
UNITS
Power Supply
l
VCC
Positive Supply Voltage
2.5
ICC
Supply Current
VCC = 5V (Note 3)
VCC = 3V (Note 3)
All DACs Powered Down (Note 3) VCC = 5V
All DACs Powered Down (Note 3) VCC = 3V
l
l
l
l
VIH
Digital Input High Voltage
VCC = 2.5V to 5.5V
VCC = 2.5V to 3.6V
l
l
VIL
Digital Input Low Voltage
VCC = 4.5V to 5.5V
VCC = 2.5V to 5.5V
l
l
VOH
Digital Output High Voltage
Load Current = –100μA
l VCC – 0.4
VOL
Digital Output Low Voltage
Load Current = +100μA
l
0.4
V
±1
μA
8
pF
2.6
2.0
0.35
0.10
5.5
V
4
3.2
1
1
mA
mA
μA
μA
Digital I/O
ILK
Digital Input Leakage
VIN = GND to VCC
l
CIN
Digital Input Capacitance
(Note 6)
l
2.4
2.0
V
V
0.8
0.6
V
V
V
The l denotes specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C.
VCC = 2.5V to 5.5V, VREF ≤ VCC, VOUT unloaded, unless otherwise noted.
SYMBOL PARAMETER
CONDITIONS
MIN
LTC2620
TYP MAX
MIN
LTC2610
TYP MAX
MIN
LTC2600
TYP MAX
UNITS
AC Performance
tS
Settling Time (Note 8)
7
9
7
9
10
μs
μs
2.7
2.7
4.8
2.7
4.8
5.2
μs
μs
μs
Voltage Output Slew Rate
0.80
0.80
0.80
V/μs
Capacitive Load Driving
1000
1000
1000
pF
At Mid-Scale Transition
12
12
12
180
180
180
kHz
Output Voltage Noise Density
At f = 1kHz
At f = 10kHz
120
100
120
100
120
100
nV/√Hz
nV/√Hz
Output Voltage Noise
0.1Hz to 10Hz
15
15
15
μVP-P
Settling Time for 1LSB Step
(Note 9)
Glitch Impulse
±0.024% (±1LSB at 12 Bits)
±0.006% (±1LSB at 14 Bits)
±0.0015% (±1LSB at 16 Bits)
7
±0.024% (±1LSB at 12 Bits)
±0.006% (±1LSB at 14 Bits)
±0.0015% (±1LSB at 16 Bits)
Multiplying Bandwidth
en
nV • s
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LTC2600/LTC2610/LTC2620
TIMING CHARACTERISTICS
The l denotes specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C. (See Figure 1) (Note 6)
SYMBOL PARAMETER
LTC2600/LTC2610/LTC2620
MIN
TYP
MAX
CONDITIONS
UNITS
VCC = 2.5V to 5.5V
t1
SDI Valid to SCK Setup
l
4
ns
t2
SDI Valid to SCK Hold
l
4
ns
t3
SCK High Time
l
9
ns
t4
SCK Low Time
l
9
ns
t5
CS/LD Pulse Width
l
10
ns
t6
LSB SCK High to CS/LD High
l
7
ns
t7
CS/LD Low to SCK High
l
7
ns
t8
SDO Propagation Delay from SCK Falling Edge
CLOAD = 10pF
VCC = 4.5V to 5.5V
VCC = 2.5V to 5.5V
l
l
20
45
ns
ns
t9
CLR Pulse Width
l
20
ns
t10
CS/LD High to SCK Positive Edge
l
7
ns
SCK Frequency
50% Duty Cycle
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: Linearity and monotonicity are defined from code kL to code
2N – 1, where N is the resolution and kL is given by kL = 0.016(2N/VREF),
rounded to the nearest whole code. For VREF = 4.096V and N = 16, kL =
256 and linearity is defined from code 256 to code 65,535.
Note 3: Digital inputs at 0V or VCC.
Note 4: DC crosstalk is measured with VCC = 5V and VREF = 4.096V,
with the measured DAC at mid-scale, unless otherwise noted.
l
50
MHz
Note 5: RL = 2kΩ to GND or VCC.
Note 6: Guaranteed by design and not production tested.
Note 7: Inferred from measurement at code 256 (LTC2600),
code 64 (LTC2610) or code 16 (LTC2620), and at full-scale.
Note 8: VCC = 5V, VREF = 4.096V. DAC is stepped 1/4-scale to 3/4-scale
and 3/4-scale to 1/4-scale. Load is 2k in parallel with 200pF to GND.
Note 9: VCC = 5V, VREF = 4.096V. DAC is stepped ±1LSB between halfscale and half-scale – 1. Load is 2k in parallel with 200pF to GND.
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LTC2600/LTC2610/LTC2620
TYPICAL PERFORMANCE CHARACTERISTICS
LTC2600
Integral Nonlinearity (INL)
32
Differential Nonlinearity (DNL)
1.0
VCC = 5V
VREF = 4.096V
24
INL vs Temperature
32
VCC = 5V
VREF = 4.096V
0.8
VCC = 5V
VREF = 4.096V
24
0.6
16
0
–8
0.2
INL (LSB)
DNL (LSB)
8
INL (LSB)
16
0.4
0
–0.2
INL (POS)
8
0
–8
INL (NEG)
–0.4
–16
–0.6
–24
–32
–16
–24
–0.8
16384
0
32768
CODE
49152
–1.0
65535
0
16384
32768
CODE
49152
DNL vs Temperature
VCC = 5V
VREF = 4.096V
90
1.5
VCC = 5.5V
24
VCC = 5.5V
1.0
16
0.2
0
–0.2
0
–8
DNL (NEG)
–0.4
0.5
INL (POS)
8
DNL (LSB)
DNL (POS)
INL (LSB)
DNL (LSB)
70
DNL vs VREF
32
0.4
INL (NEG)
DNL (POS)
0
DNL (NEG)
–0.5
–16
–0.6
–1.0
–24
–0.8
–1.0
–50
–10 10
30
50
TEMPERATURE (°C)
2600 G22
INL vs VREF
1.0
0.6
–30
2600 G21
2600 G20
0.8
–32
–50
65535
–30
–10 10
30
50
TEMPERATURE (°C)
70
90
–32
0
1
2
3
VREF (V)
4
2600 G23
5
–1.5
0
1
2
3
VREF (V)
2600 G24
Settling to ±1LSB
4
5
2600 G25
Settling of Full-Scale Step
VOUT
100μV/DIV
VOUT
100μV/DIV
9.7μs
12.3μs
CS/LD
2V/DIV
CS/LD
2V/DIV
2μs/DIV
VCC = 5V, VREF = 4.096V
1/4-SCALE TO 3/4-SCALE STEP
RL = 2k, CL = 200pF
AVERAGE OF 2048 EVENTS
2600 G26
5μs/DIV
2600 G27
SETTLING TO ±1LSB
VCC = 5V, VREF = 4.096V
CODE 512 TO 65535 STEP
RL = 2k, CL = 200pF
AVERAGE OF 2048 EVENTS
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6
LTC2600/LTC2610/LTC2620
TYPICAL PERFORMANCE CHARACTERISTICS
LTC2610
Differential Nonlinearity (DNL)
Integral Nonlinearity (INL)
8
1.0
VCC = 5V
VREF = 4.096V
6
VCC = 5V
VREF = 4.096V
0.8
0.6
4
0.4
2
DNL (LSB)
INL (LSB)
Settling to ±1LSB
0
–2
VOUT
100μV/DIV
0.2
0
CS/LD
2V/DIV
–0.2
–0.4
–4
8.9μs
–0.6
–6
–0.8
–8
–1.0
0
4096
8192
CODE
12288
16383
2600 G30
2μs/DIV
0
4096
8192
CODE
12288
2600 G28
VCC = 5V, VREF = 4.096V
1/4-SCALE TO 3/4-SCALE STEP
RL = 2k, CL = 200pF
AVERAGE OF 2048 EVENTS
16383
2600 G29
LTC2620
Integral Nonlinearity (INL)
2.0
Differential Nonlinearity (DNL)
1.0
VCC = 5V
VREF = 4.096V
1.5
0.6
6.8μs
0.4
0.5
DNL (LSB)
INL (LSB)
VCC = 5V
VREF = 4.096V
0.8
1.0
0
–0.5
VOUT
1mV/DIV
0.2
0
CS/LD
2V/DIV
–0.2
–0.4
–1.0
–0.6
–1.5
–2.0
Settling to ±1LSB
2μs/DIV
–0.8
0
1024
2048
CODE
3072
–1.0
4095
0
1024
2048
CODE
3072
2600 G31
2600 G33
VCC = 5V, VREF = 4.096V
1/4-SCALE TO 3/4-SCALE STEP
RL = 2k, CL = 200pF
AVERAGE OF 2048 EVENTS
4095
2600 G32
LTC2600/LTC2610/LTC2620
Load Regulation
Current Limiting
0.06
$VOUT (V)
0.04
CODE = MIDSCALE
–0.06
0.4
VREF = VCC = 3V
0.2
0
–0.2
VREF = VCC = 5V
–0.4
VREF = VCC = 5V
1
0
–1
VREF = VCC = 3V
–0.6
–0.08
–0.10
10
–40 –30 –20 –10 0
IOUT (mA)
2
0.6
VREF = VCC = 3V
0
–0.04
CODE = MIDSCALE
0.8
VREF = VCC = 5V
0.02
–0.02
Offset Error vs Temperature
3
OFFSET ERROR (mV)
0.08
1.0
$VOUT (mV)
0.10
–2
–0.8
20
30
40
2600 G01
–1.0
–35
–25
–15
–5
5
IOUT (mA)
15
25
35
2600 G02
–3
–50
–30
–10 10
30
50
TEMPERATURE (°C)
70
90
2600 G03
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LTC2600/LTC2610/LTC2620
TYPICAL PERFORMANCE CHARACTERISTICS
LTC2600/LTC2610/LTC2620
Gain Error vs Temperature
Zero-Scale Error vs Temperature
3
3
0.3
2.0
1.5
1.0
2
0.2
OFFSET ERROR (mV)
GAIN ERROR (%FSR)
2.5
ZERO-SCALE ERROR (mV)
Offset Error vs VCC
0.4
0.1
0
–0.1
0
–1
–0.2
0.5
–2
–0.3
0
–50
–30
–10 10
30
50
TEMPERATURE (°C)
70
90
–0.4
–50
–30
–10 10
30
50
TEMPERATURE (°C)
70
2600 G04
0.4
–3
2.5
90
3.5
3
4
VCC (V)
4.5
5
2600 G05
Gain Error vs VCC
5.5
2600 G06
ICC Shutdown vs VCC
Large-Signal Response
450
0.3
400
0.2
350
0.1
300
ICC (nA)
GAIN ERROR (%FSR)
1
0
–0.1
VOUT
0.5V/DIV
250
200
VREF = VCC = 5V
1/4-SCALE TO 3/4-SCALE
150
–0.2
100
–0.3
2.5μs/DIV
50
–0.4
2.5
3
3.5
4
VCC (V)
4.5
5
5.5
0
2.5
3
3.5
4
VCC (V)
4.5
2600 G07
5
2600 G09
5.5
2600 G08
Mid-Scale Glitch Impulse
Headroom at Rails
vs Output Current
Power-On Reset Glitch
5.0
5V SOURCING
4.5
4.0
VOUT
10mV/DIV
3.5
12nV-s TYP
VOUT (V)
VCC
1V/DIV
4mV
4mVPEAK
PEAK
CS/LD
5V/DIV
VOUT
10mV/DIV
2.5μs/DIV
2600 G10
3V SOURCING
3.0
2.5
2.0
1.5
5V SINKING
1.0
250μs/DIV
3V SINKING
2600 G11
0.5
0
0
1
2
3
4 5 6
IOUT (mA)
7
8
9
10
2600 G12
2600fe
8
LTC2600/LTC2610/LTC2620
TYPICAL PERFORMANCE CHARACTERISTICS
LTC2600/LTC2610/LTC2620
VCC = 5V
SWEEP SCK, SDI
AND CS/LD
0V TO VCC
2.3
2.2
VCC = 5V
VREF = 2V
VOUT
0.5V/DIV
2.1
2.0
VOUT
1V/DIV
DACs A TO G IN
POWER-DOWN MODE
1.9
CS/LD
5V/DIV
1.8
CLR
5V/DIV
1.7
2.5μs/DIV
1.6
0.5
1
1.5 2 2.5 3 3.5
LOGIC VOLTAGE (V)
4
4.5
1μs/DIV
2600 G14
2600 G15
5
2600 G13
Output Voltage Noise,
0.1Hz to 10Hz
Multiplying Bandwidth
0
–3
–6
–9
–12
VOUT
10μV/DIV
–15
–18
–21
–24
VCC = 5V
VREF (DC) = 2V
VREF (AC) = 0.2VP-P
CODE = FULL SCALE
–27
–30
–33
–36
1k
10k
100k
FREQUENCY (Hz)
0
1
2
3
4 5 6
SECONDS
7
8
9
10
2600 G17
1M
2600 G16
Short-Circuit Output Current
vs VOUT (Sourcing)
Short-Circuit Output Current
vs VOUT (Sinking)
0mA
10mA/DIV
0
dB
1.5
10mA/DIV
ICC (mA)
Hardware CLR
Exiting Power-Down to Mid-Scale
Supply Current vs Logic Voltage
2.4
0mA
VCC = 5.5V
1V/DIV
VREF = 5.6V
CODE = 0
VOUT SWEPT 0V TO VCC
2600 G18
1V/DIV
VCC = 5.5V
VREF = 5.6V
CODE = FULL SCALE
VOUT SWEPT VCC TO 0V
2600 G19
2600fe
9
LTC2600/LTC2610/LTC2620
PIN FUNCTIONS
(GN/UFD)
GND (Pin 1/Pin 20): Analog Ground.
VOUTA to VOUTH (Pins 2-5 and 12-15/Pins 1-48 and
13-16): DAC Analog Voltage Outputs. The output range
is 0 – VREF.
REF (Pin 6/Pin 5): Reference Voltage Input. 0V ≤ VREF
≤ VCC.
CS/LD (Pin 7/Pin 7): Serial Interface Chip Select/Load
Input. When CS/LD is low, SCK is enabled for shifting
data on SDI into the register. When CS/LD is taken high,
SCK is disabled and the specified command (see Table 1)
is executed.
SCK (Pin 8/Pin 8): Serial Interface Clock Input. CMOS
and TTL compatible.
SDI (Pin 9/Pin 9): Serial Interface Data Input. Data is applied to SDI for transfer to the device at the rising edge
of SCK. The LTC2600, LTC2610 and LTC2620 accept input
word lengths of either 24 or 32 bits.
SDO (Pin 10/Pin 10): Serial Interface Data Output. This pin
is used for daisychain operation. The serial output of the
shift register appears at the SDO pin. The data transferred
to the device via the SDI pin is delayed 32 SCK rising
edges before being output at the next falling edge. SDO
is an active output and does not go high impedance, even
when CS/LD is taken to a logic high level.
CLR (Pin 11/Pin 11): Asynchronous Clear Input. A logic
low at this level-triggered input clears all registers and
causes the DAC voltage outputs to drop to 0V. CMOS and
TTL compatible.
VCC (Pin 16/Pin 17): Supply Voltage Input. 2.5V ≤ VCC
≤ 5.5V.
DNC (Pins 6, 12, 18, 19 UFD Only): Do Not Connect.
Exposed Pad (Pin 21 UFD Only): Ground. The exposed
pad must be soldered to the PCB.
2600fe
10
LTC2600/LTC2610/LTC2620
VOUTA
2
DAC A
DAC
REGISTER
INPUT
REGISTER
INPUT
REGISTER
(2)
VOUTB
3
DAC B
DAC
REGISTER
INPUT
REGISTER
INPUT
REGISTER
(3)
VOUTC
4
DAC C
DAC
REGISTER
INPUT
REGISTER
INPUT
REGISTER
(4)
VOUTD
5
DAC D
INPUT
REGISTER
INPUT
REGISTER
(5)
REF
6
(7)
CS/LD
7
(8)
SCK
8
(17)
DAC
REGISTER
(1)
16 VCC
DAC H
15 VOUTH
(16)
DAC
REGISTER
1
DAC G
14 VOUTG
(15)
DAC
REGISTER
GND
DAC F
13 VOUTF
(14)
DAC
REGISTER
(20)
DAC
REGISTER
BLOCK DIAGRAM
DAC E
12 VOUTE
(13)
POWER-ON
RESET
CONTROL
LOGIC
11
CLR
(11)
10
SDO
(10)
9
SDI
(9)
DECODE
32-BIT SHIFT REGISTER
2600 BD02
NOTE: NUMBERS IN PARENTHESIS REFER TO THE UFD PACKAGE
TIMING DIAGRAM
t1
t2
SCK
t3
1
t6
t4
2
3
23
24
t10
SDI
t5
t7
CS/LD
t8
SDO
2600 F01
2600fe
11
LTC2600/LTC2610/LTC2620
OPERATION
Power-On Reset
Serial Interface
The LTC2600/LTC2610/LTC2620 clear the outputs to
zero-scale when power is first applied, making system
initialization consistent and repeatable.
The CS/LD input is level triggered. When this input is taken
low, it acts as a chip-select signal, powering on the SDI and
SCK buffers and enabling the input shift register. Data (SDI
input) is transferred at the next 24 rising SCK edges. The
4-bit command, C3-C0, is loaded first; then the 4-bit DAC
address, A3-A0; and finally the 16-bit data word. The data
word comprises the 16-, 14- or 12-bit input code, ordered
MSB-to-LSB, followed by 0, 2 or 4 don’t-care bits (LTC2600,
LTC2610 and LTC2620 respectively). Data can only be
transferred to the device when the CS/LD signal is low.The
rising edge of CS/LD ends the data transfer and causes the
device to carry out the action specified in the 24-bit input
word. The complete sequence is shown in Figure 2a.
For some applications, downstream circuits are active during
DAC power-up, and may be sensitive to nonzero outputs
from the DAC during this time. The LTC2600/2610/2620
contain circuitry to reduce the power-on glitch: the analog
outputs typically rise less than 10mV above zero-scale
during power on if the power supply is ramped to 5V in 1ms
or more. In general, the glitch amplitude decreases as the
power supply ramp time is increased. See Power-On Reset
Glitch in the Typical Performance Characteristics section.
Power Supply Sequencing
The voltage at REF (Pin 6) should be kept within the
range –0.3V ≤ VREF ≤ VCC + 0.3V (see Absolute Maximum
Ratings). Particular care should be taken to observe these
limits during power supply turn-on and turn-off sequences,
when the voltage at VCC (Pin 16) is in transition.
Transfer Function
The digital-to-analog transfer function is:
⎛ k ⎞
VOUT(IDEAL) = ⎜ N ⎟ VREF
⎝2 ⎠
The command (C3-C0) and address (A3-A0) assignments
are shown in Table 1. The first four commands in the table
consist of write and update operations. A write operation
loads a 16-bit data word from the 32-bit shift register
into the input register of the selected DAC, n. An update
operation copies the data word from the input register to
the DAC register. Once copied into the DAC register, the
data word becomes the active 16-, 14- or 12-bit input
code, and is converted to an analog voltage at the DAC
output. The update operation also powers up the selected
DAC if it had been in power-down mode. The data path
and registers are shown in the Block Diagram.
where k is the decimal equivalent of the binary DAC
input code, N is the resolution and VREF is the voltage at
REF (Pin 6).
While the minimum input word is 24 bits, it may optionally
be extended to 32 bits. To use the 32-bit word width, 8
don’t-care bits are transferred to the device first, followed
by the 24-bit word as just described. Figure 2b shows the
Table 1.
ADDRESS (n)*
COMMAND*
A3
A2
A1
A0
C3
C2
C1
C0
0
0
0
0
DAC A
0
0
0
0
Write to Input Register n
0
0
0
1
DAC B
0
0
0
1
Update (Power Up) DAC Register n
0
0
1
0
DAC C
0
0
1
0
Write to Input Register n, Update (Power Up) All n
0
0
1
1
DAC D
0
0
1
1
Write to and Update (Power Up) n
0
1
0
0
DAC E
0
1
0
0
Power Down n
0
1
0
1
DAC F
1
1
1
1
No Operation
0
1
1
0
DAC G
0
1
1
1
DAC H
1
1
1
1
All DACs
*Command and address codes not shown are reserved and should not be used.
2600fe
12
LTC2600/LTC2610/LTC2620
OPERATION
INPUT WORD (LTC2600)
COMMAND
C3
C2
C1 C0
ADDRESS
A3
A2
A1
DATA (16 BITS)
A0
D15 D14 D13 D12 D11 D10 D9
D8 D7 D6 D5
D4
D3
D2
D1 D0
MSB
LSB
2600 TBL01
INPUT WORD (LTC2610)
COMMAND
C3
C2
C1 C0
ADDRESS
A3
A2
A1
DATA (14 BITS + 2 DON’T-CARE BITS)
A0
D13 D12 D11 D10 D9
D8 D7 D6 D5
D4
D3
D2
D1 D0
MSB
X
X
LSB
2600 TBL02
INPUT WORD (LTC2620)
COMMAND
C3
C2
C1 C0
ADDRESS
A3
A2
A1
DATA (12 BITS + 4 DON’T-CARE BITS)
A0
D11 D10 D9
D8 D7 D6 D5
MSB
D4
D3
D2
D1 D0
X
X
X
X
LSB
2600 TBL03
32-bit sequence. The 32-bit word is required for daisychain operation, and is also available to accommodate
microprocessors which have a minimum word width of
16 bits (2 bytes).
Daisychain Operation
The serial output of the shift register appears at the SDO
pin. Data transferred to the device from the SDI input is
delayed 32 SCK rising edges before being output at the
next SCK falling edge.
The SDO output can be used to facilitate control of multiple
serial devices from a single 3-wire serial port (i.e., SCK,
SDI and CS/LD). Such a “daisychain” series is configured
by connecting SDO of each upstream device to SDI of the
next device in the chain. The shift registers of the devices
are thus connected in series, effectively forming a single
input shift register which extends through the entire
chain. Because of this, the devices can be addressed and
controlled individually by simply concatenating their input
words; the first instruction addresses the last device in
the chain and so forth. The SCK and CS/LD signals are
common to all devices in the series.
In use, CS/LD is first taken low. Then the concatenated
input data is transferred to the chain, using SDI of the
first device as the data input. When the data transfer is
complete, CS/LD is taken high, completing the instruction
sequence for all devices simultaneously. A single device
can be controlled by using the no-operation command
(1111) for the other devices in the chain.
2600fe
13
LTC2600/LTC2610/LTC2620
OPERATION
Power-Down Mode
Voltage Outputs
For power-constrained applications, power-down mode
can be used to reduce the supply current whenever less
than eight outputs are needed. When in power-down, the
buffer amplifiers and reference inputs are disabled, and
draw essentially zero current. The DAC outputs are put
into a high impedance state, and the output pins are passively pulled to ground through individual 90k resistors.
When all eight DACs are powered down, the master bias
generation circuit is also disabled. Input- and DAC-register
contents are not disturbed during power-down.
Each of the 8 rail-to-rail amplifiers contained in these parts
has guaranteed load regulation when sourcing or sinking
up to 15mA at 5V (7.5mA at 3V).
Any channel or combination of channels can be put into
power-down mode by using command 0100b in combination with the appropriate DAC address, (n). The 16-bit
data word is ignored. The supply and reference currents
are reduced by approximately 1/8 for each DAC powered
down; the effective resistance at REF (Pin 6) rises accordingly, becoming a high impedance input (typically > 1GΩ)
when all eight DACs are powered down.
Normal operation can be resumed by executing any
command which includes a DAC update, as shown in
Table 1. The selected DAC is powered up as its voltage
output is updated.
There is an initial delay as the DAC powers up before it
begins its usual settling behavior. If less than eight DACs
are in a powered-down state prior to the update command,
the power-up delay is 5μs. If, on the other hand, all eight
DACs are powered down, then the master bias generation circuit is also disabled and must be restarted. In this
case, the power-up delay is greater: 12μs for VCC = 5V,
30μs for VCC = 3V.
Load regulation is a measure of the amplifier’s ability to
maintain the rated voltage accuracy over a wide range of
load conditions. The measured change in output voltage
per milliampere of forced load current change is expressed
in LSB/mA.
DC output impedance is equivalent to load regulation, and
may be derived from it by simply calculating a change in
units from LSB/mA to Ohms. The amplifiers’ DC output
impedance is 0.025Ω when driving a load well away from
the rails.
When drawing a load current from either rail, the output
voltage headroom with respect to that rail is limited by
the 25Ω typical channel resistance of the output devices;
e.g., when sinking 1mA, the minimum output voltage =
25Ω • 1mA = 25mV. See the graph Headroom at Rails vs
Output Current in the Typical Performance Characteristics
section.
The amplifiers are stable driving capacitive loads of up
to 1000pF.
Board Layout
The excellent load regulation and DC crosstalk performance
of these devices is achieved in part by keeping “signal”
and “power” grounds separated internally and by reducing
shared internal resistance to just 0.005Ω.
2600fe
14
LTC2600/LTC2610/LTC2620
OPERATION
The GND pin functions both as the node to which the reference and output voltages are referred and as a return path
for power currents in the device. Because of this, careful
thought should be given to the grounding scheme and
board layout in order to ensure rated performance.
The PC board should have separate areas for the analog
and digital sections of the circuit. This keeps digital signals
away from sensitive analog signals and facilitates the use
of separate digital and analog ground planes which have
minimal capacitive and resistive interaction with each
other.
Digital and analog ground planes should be joined at only
one point, establishing a system star ground as close to
the device’s ground pin as possible. Ideally, the analog
ground plane should be located on the component side of
the board, and should be allowed to run under the part to
shield it from noise. Analog ground should be a continuous
and uninterrupted plane, except for necessary lead pads
and vias, with signal traces on another layer.
The GND pin of the part should be connected to analog
ground. Resistance from the GND pin to system star
ground should be as low as possible. Resistance here will
add directly to the effective DC output impedance of the
device (typically 0.025Ω), and will degrade DC crosstalk.
Note that the LTC2600/LTC2610/LTC2620 are no more
susceptible to these effects than other parts of their type;
on the contrary, they allow layout-based performance
improvements to shine rather than limiting attainable
performance with excessive internal resistance.
Rail-to-Rail Output Considerations
In any rail-to-rail voltage output device, the output is limited
to voltages within the supply range.
Since the analog outputs of the device cannot go below
ground, they may limit for the lowest codes as shown
in Figure 3b. Similarly, limiting can occur near full scale
when the REF pin is tied to VCC. If VREF = VCC and the DAC
full-scale error (FSE) is positive, the output for the highest
codes limits at VCC as shown in Figure 3c. No full-scale
limiting can occur if VREF is less than VCC – FSE.
Offset and linearity are defined and tested over the region
of the DAC transfer function where no output limiting can
occur.
2600fe
15
16
X
X
SDI
SDO
SCK
CS/LD
1
X
X
2
X
X
3
X
4
X
X
X
DON’T CARE
5
C3
SDI
C2
2
C1
3
X
X
6
X
X
7
C3
C2
10
C1
11
C2
C1
COMMAND WORD
9
C3
A1
7
ADDRESS WORD
A2
6
A0
8
D15
9
D14
10
D12
12
D11
13
D10
14
24-BIT INPUT WORD
D13
11
D9
15
D7
17
DATA WORD
D8
16
D6
18
D5
C0
C0
A3
A3
A2
14
A1
15
A2
A1
ADDRESS WORD
13
A0
A0
16
17
D15
D15
PREVIOUS 32-BIT INPUT WORD
12
D14
D14
18
t2
t8
D9
D9
t4
23
PREVIOUS D15
t3
17
D10
D10
22
SDO
t1
D11
D11
21
D15
D12
D12
20
SDI
SCK
D13
D13
19
25
18
D7
PREVIOUS D14
D14
D8
DATA WORD
D6
D5
D4
D3
D2
D2
30
YYYY F02a
29
D3
24
D0
28
D4
23
D1
27
D5
22
D2
26
D6
21
D3
D7
20
D4
24
D8
19
Figure 2a. LTC2600 24-Bit Load Sequence (Minimum Input Word).
LTC2610 SDI Data Word: 14-Bit Input Code + 2 Don’t-Care Bits;
LTC2620 SDI Data Word: 12-Bit Input Code + 4 Don’t-Care Bits
A3
5
D1
D1
31
YYYY F02b
CURRENT
32-BIT
INPUT WORD
D0
D0
32
OPERATION
Figure 2b. LTC2600 32-Bit Load Sequence (Required for Daisy-Chain Operation).
LTC2610 SDI/SDO Data Word: 14-Bit Input Code + 2 Don’t-Care Bits;
LTC2620 SDI/SDO Data Word: 12-Bit Input Code + 4 Don’t-Care Bits
X
X
4
C0
8
COMMAND WORD
1
SCK
CS/LD
LTC2600/LTC2610/LTC2620
2600fe
LTC2600/LTC2610/LTC2620
OPERATION
VREF = VCC
VREF = VCC
POSITIVE
FSE
OUTPUT
VOLTAGE
OUTPUT
VOLTAGE
INPUT CODE
(c)
OUTPUT
VOLTAGE
0
0V
NEGATIVE
OFFSET
32, 768
INPUT CODE
(a)
65, 535
INPUT CODE
(b)
2600 F03
Figure 3. Effects of Rail-to-Rail Operation On a DAC Transfer Curve. (a) Overall Transfer Function (b) Effect
of Negative Offset for Codes Near Zero-Scale (c) Effect of Positive Full-Scale Error for Codes Near Full Scale
PACKAGE DESCRIPTION
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
.189 – .196*
(4.801 – 4.978)
.045 ±.005
16 15 14 13 12 11 10 9
.254 MIN
.009
(0.229)
REF
.150 – .165
.229 – .244
(5.817 – 6.198)
.0165 ± .0015
.150 – .157**
(3.810 – 3.988)
.0250 BSC
RECOMMENDED SOLDER PAD LAYOUT
1
.015 ± .004
× 45°
(0.38 ± 0.10)
.007 – .0098
(0.178 – 0.249)
.0532 – .0688
(1.35 – 1.75)
2 3
4
5 6
7
8
.004 – .0098
(0.102 – 0.249)
0° – 8° TYP
.016 – .050
(0.406 – 1.270)
NOTE:
1. CONTROLLING DIMENSION: INCHES
INCHES
2. DIMENSIONS ARE IN
(MILLIMETERS)
.008 – .012
(0.203 – 0.305)
TYP
.0250
(0.635)
BSC
GN16 (SSOP) 0204
3. DRAWING NOT TO SCALE
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
2600fe
17
LTC2600/LTC2610/LTC2620
PACKAGE DESCRIPTION
UFD Package
20-Lead Plastic QFN (4mm × 5mm)
(Reference LTC DWG # 05-08-1711 Rev B)
0.70 p 0.05
4.50 p 0.05
1.50 REF
3.10 p 0.05
2.65 p 0.05
3.65 p 0.05
PACKAGE OUTLINE
0.25 p 0.05
0.50 BSC
2.50 REF
4.10 p 0.05
5.50 p 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
4.00 p 0.10
(2 SIDES)
0.75 p 0.05
PIN 1 NOTCH
R = 0.20 OR
C = 0.35
1.50 REF
R = 0.05 TYP
19
20
0.40 p 0.10
PIN 1
TOP MARK
(NOTE 6)
1
2
5.00 p 0.10
(2 SIDES)
2.50 REF
3.65 p 0.10
2.65 p 0.10
(UFD20) QFN 0506 REV B
0.200 REF
0.00 – 0.05
R = 0.115
TYP
0.25 p 0.05
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
2600fe
18
LTC2600/LTC2610/LTC2620
REVISION HISTORY
(Revision history begins at Rev D)
REV
DATE
DESCRIPTION
PAGE NUMBER
D
03/10
Revise GN Part Markings in Order Information
E
05/10
Changed “No Connect” pins to “Do Not Connect” in Pin Configuration and Pin Functions sections
2
2, 10
2600fe
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
19
LTC2600/LTC2610/LTC2620
TYPICAL APPLICATION
Schematic for LTC2600 Demonstration Circuit DC579. The Outputs Are Measured by an Onboard LTC2428
1
4
3
2
1
VSS SDA
A2
SCL
A1
WP
A0
VCC
VREF
VCC
1
TP1
TP2
5
R1, R3, R4
R1 are 4.99k, 1%
6
R3
R2
7.5k
R4
11
7
C3
0.1μF
8
C2
0.1μF
6
REF
CLR
VCC
VOUTA
U1
24LC025
VOUTB
14
12
10
8
6
4
2
5V
VCC
C1
0.1μF
+
+
+
+
+
+
+
+
+
+
+
+
+
+
13
11
9
7
5
3
1
SCK
8
CS
7
9
10
MOSI
MISO
VOUTC
SCK
VOUTD
LS/LD
VOUTE
VOUTF
SDI
VOUTG
SDO
VOUTH
16
2
1
TP16
VIN
TP3
DAC A
1
TP14
GND
4
1
TP4
DAC B
1
TP15
GND
1
TP5
DAC C
1
TP6
DAC D
1
TP7
DAC E
1
TP8
DAC F
1
TP9
DAC G
5
12
13
14
15
GND
1
1
3
U2
LTC2600CGN
J1
HD2X7
1
VIN
TP10
DAC H
VREF
VOUT
VIN
6
9
1
C6
0.1μF
1
5V
4.096V
2
3 JP2
TP11
VREF
C7
4.7μF
6.3V
VREF
U5
LT1461ACS8-4
2
3
C9
0.1μF
VIN
VOUT
6
VCC
1
SHDN
GND
4
C5
0.1μF
R8
22Ω
C10
100pF
7
4
MUXOUT
ADCIN
3
3
2
2
8
1
JP1
ON/OFF
DISABLE
ADC
VCC VCC
FSSET
VREF
GND
4
VCC
C4
0.1μF
R5
7.5k
U4
LT1236ACS8-5
2
VCC
1
5VREF
C8 REGULATOR
1μF
16V
2
3 JP3
1
VCC
TP12
VCC
TP13
GND
CH0
10
CH1
11
CH2
12
CH3
13
CH4
14
CH5
15
CH6
17
CH7
5
ZSSET
CSADC
CSMUX
4-/8-CHANNEL
MUX
+
20-BIT
ADC
SCK
CLK
DIN
–
LTC2424/LTC2428
SD0
FO
GND GND GND GND GND GND GND
1
U3
LTC2428CG
6
16
18
22
27
28
23
20
R6
7.5k
CS
25
19
SCK
21
24
26
R7
7.5k
5V
RELATED PARTS
PART NUMBER
DESCRIPTION
COMMENTS
LTC1458/LTC1458L
Quad 12-Bit Rail-to-Rail Output DACs with Added Functionality
LTC1458: VCC = 4.5V to 5.5V, VOUT = 0V to 4.096V
LTC1458L: VCC = 2.7V to 5.5V, VOUT = 0V to 2.5V
LTC1654
Dual 14-Bit Rail-to-Rail VOUT DAC
Programmable Speed/Power, 3.5μs/750μA, 8μs/450μA
LTC1655/LTC1655L
Single 16-Bit VOUT DAC with Serial Interface in SO-8
VCC = 5V(3V), Low Power, Deglitched
LTC1657/LTC1657L
Parrallel 5V/3V 16-Bit VOUT DAC
Low Power, Deglitched, Rail-to-Rail VOUT
LTC1660/LTC1665
Octal 10/8-Bit VOUT DAC in 16-Pin Narrow SSOP
VCC = 2.7V to 5.5V, Micropower, Rail-to-Rail Output
LTC1821
Parallel 16-Bit Voltage Output DAC
Precision 16-Bit Settling in 2μs for 10V Step
2600fe
20 Linear Technology Corporation
LT 0510 REV E • PRINTED IN USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear.com
© LINEAR TECHNOLOGY CORPORATION 2003
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