BRIGHT BL-PDP-GRS-C10 Z-bend domiled gap surface mount led. Datasheet

AMERICAN BRIGHT OPTOELECTRONICS CORP.
Z-BEND DOMILED GaP 10mA BL-PDP-GRS-C10
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Feature:
1. Surface mount LED.
2. 120° viewing angle.
3. Small package outline (LxWxH) of 3.2 x 2.8 x 1.8 mm.
4. Qualified according to JEDEC moisture sensitivity Level 2.
5. Compatible to both IR reflow soldering and TTW soldering.
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Package Dimension:
Recommended Solder Pad
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AMERICAN BRIGHT OPTOELECTRONICS CORP.
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Z-BEND DOMILED GaP 10mA BL-PDP-GRS-C10
Optical Characteristics:
Part Number
BL-PDP-GRS-C10
BIN G1
BIN G2
BIN H1
BIN H2
Chip Technology
Color
Luminous Intensity @ IF = 10mA
Iv (mcd)
GaP /
1.80 – 4.50
Green, 560nm
1.80 – 2.24
2.24 – 2.80
2.80 – 3.55
3.55 – 4.50
Forward voltage
Chip Type
@ If=10 mA.
2.05 V (typ.); 2.45 V (max)
Viewing Angle
GaP
Reverse current, IR
@ VR = 5V, (max)
at 50% Iv
100 µA
120°
Note:
1. Other luminous intensity groups are also available upon request.
2. Luminous intensity is measured with an accuracy of ±11%.
3. Wavelength binning is carried for all units as per the wavelength-binning table. Only one
wavelength group is allowed for each reel.
4. An optional Vf binning is also available upon request. Binning scheme is as per following table.
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Absolute Maximum Ratings:
Parameter
Maximum Value
Unit
DC forward current.
30
mA
Peak pulse current; (tp ≤ 10 µs, Duty cycle = 0.005)
500
mA
5
V
100
°C
Operating temperature.
-40 … +100
°C
Storage temperature.
-40 … +100
°C
75
mW
Reverse voltage.
LED junction temperature.
Power dissipation ( at room temperature )
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Vf Binning:
Vf Bin @ 10mA
Forward voltage (V)
01
1.25 … 1.55
02
1.55 … 1.85
03
1.85 … 2.15
04
2.15 … 2.45
Forward voltage, Vf is measured with an accuracy of ±0.1 V.
V.4 Page: 2 of 5
AMERICAN BRIGHT OPTOELECTRONICS CORP.
Z-BEND DOMILED GaP 10mA BL-PDP-GRS-C10
•
Wavelength Grouping:
Color
Group
BL-PDP; Pure Green
Wavelength distribution (nm)
Full
552.5 – 564.5
W
552.5 – 555.5
X
555.5 – 558.5
Y
558.5 – 561.5
Z
561.5 – 564.5
Wavelength is measured with an accuracy of ±1 nm.
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Typical electro-optical characteristics curves:
Fig.1 Relative luminous intensity vs. forward current.
Fig.2 Forward current vs. forward voltage.
Forward Current vs. Forward Voltage
4.0
35
3.5
Forward Current (mA)
Relative intensity. Normalized at 10 mA.
Intensity vs. DC Forw ard Current
3.0
2.5
2.0
1.5
1.0
0.5
30
25
20
15
10
5
0
0.0
0
5
10
15
20
25
30
1.0
35
1.2
1.4
Fig.3 Radiation pattern.
30°
20°
10°
1.6
1.8
2.0
2.2
2.4
2.6
Forward Voltage (V)
FORW ARD CURRENT (m A)
Fig.4 Maximum forward current vs. temperature.
0°
35
1.0
30
40°
0.8
50°
60°
70°
0.6
0.4
20
15
10
5
0.2
0
80°
90°
Forward Current, If
25
0
0
10
20
30
40
50
60
70
80
90
Ambient Temperature
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100
AMERICAN BRIGHT OPTOELECTRONICS CORP.
Z-BEND DOMILED GaP 10mA BL-PDP-GRS-C10
Fig.6 Recommended IR-reflow Soldering Profile (acc. to IPC 9501).
Classification Reflow Profile (JEDEC J-STD-020B)
275
250
Temperature (oC)
225
200
235-240oC
10 30s
Ramp-up
3 oC/sec
o
183 C
175
60-150s
150
125
Rampdown
100
Preheat
60-
75
50
360s max
25
0
50
100
150
200
Time (sec)
Fig.7 Recommended TTW Soldering Profile (acc. to CECC 00802).
V.4 Page: 4 of 5
AMERICAN BRIGHT OPTOELECTRONICS CORP.
Z-BEND DOMILED GaP 10mA BL-PDP-GRS-C10
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Taping And Orientation:
Reels come in quantity of 2000 units.
Reel diameters is 180 mm
V.4 Page: 5 of 5
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