Semtech EDGE819 Octal, 18v pin electronics driver Datasheet

Edge819
Octal, 18V Pin
Electronics Driver
TEST AND MEASUREMENT PRODUCTS
Description
Features
The Edge819 is an octal pin electronics driver fabricated
in a wide voltage CMOS process. It is designed specifically
for Test During Burn In (TDBI) applications, where cost,
functional density, and power are all at a premium.
•
•
•
•
•
18V I/O Range
50 MHz Operation
Per Pin Flexibility
Flex In Digital Inputs
Small footprint (100 pin MQFP)
The Edge819 incorporates eight channels of programmable
drivers into one 14 mm X 20 mm 100 pin MQFP package.
Each channel has per pin driver levels, data, and high
impedance control.
The Edge819 uses "Flex In" digital inputs and, therefore,
can mate directly with any digital technology.
Applications
The Edge819 is pin and functionally compatible with the
Edge818, except the Edge819 does not have any
comparators.
• Burn In ATE
• Low Cost ATE
• Instrumentation
The 18V driver output range allows the Edge819 to
interface directly with TTL, ECL, CMOS (3.3V and 5V),
LVCMOS, and custom level circuitry, as well as the high
voltage (Super Voltage) level required for many special
test modes for Flash Devices.
Functional Block Diagram
VH VL
DATA
EN*
8
8
Revision 2 / August 16, 2004
8
DOUT
1
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Edge819
TEST AND MEASUREMENT PRODUCTS
PIN Description
Pin Name
Pin #
DATA ( 0:7)
100, 4, 8, 12, 19, 23, 27, 31
EN* ( 0:7)
3, 7, 11, 15, 16, 20, 24, 28
N/ C
1, 5, 9, 13, 18, 22, 26, 30, 2, 6,
10, 14, 17, 21, 25, 29
DOUT ( 0:7)
79, 75, 71, 67, 64, 60, 56, 52
Driv er out put s.
N/ C
81, 77, 73, 69, 62, 58, 54, 50
No c onnec t .
V H ( 0:7)
80, 76, 72, 68, 63, 59, 55, 51
Unbuffered analog input s t hat set t he driv er "hig h"
v olt ag e lev el.
V L ( 0:7)
78, 74, 70, 66, 65, 61, 57, 53
Unbuffered analog input s t hat set t he driv er "low "
v olt ag e lev el.
N/ C
97, 95, 89, 87, 44, 42, 36, 34
No c onnec t .
N/ C
96, 94, 88, 86, 45, 43, 37, 35
No c onnec t .
VBB
46, 85
A nalog input v olt ag e t hat set s t he t hreshold for t he
dig it al input s.
N/ C
33, 98
No c onnec t .
N/ C
32, 99
No c onnec t .
VCC
40, 41, 47, 49, 82, 84, 90, 91
P osit iv e pow er supply.
V EE
38, 39, 48, 83, 92, 93
Neg at iv e pow er supply.
 2004 Semtech Corp. / Rev. 2, 8/16/04
Description
2
Dig it al input s w hic h det er mine t he hig h/ low st at e of
t he driv er w hen it is enabled.
Dig it al input s w hic h enable/ disable t he driv er.
No c onnec t .
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Edge819
DATA0
N/C
N/C
N/C
N/C
N/C
N/C
VEE
VEE
VCC
VCC
N/C
N/C
N/C
N/C
VBB
VCC
VEE
VCC
N/C
TEST AND MEASUREMENT PRODUCTS
PIN Description (continued)
81
N/C
N/C
EN*0
DATA1
N/C
N/C
EN*1
DATA2
N/C
N/C
EN*2
DATA3
N/C
N/C
EN*3
EN*4
N/C
N/C
DATA4
EN*5
N/C
N/C
DATA5
EN*6
N/C
N/C
DATA6
EN*7
N/C
N/C
1
100 Lead – 14 X 20 MQFP
51
VH0
DOUT0
VL0
N/C
VH1
DOUT1
VL1
N/C
VH2
DOUT2
VL2
N/C
VH3
DOUT3
VL3
VL4
DOUT4
VH4
N/C
VL5
DOUT5
VH5
N/C
VL6
DOUT6
VH6
N/C
VL7
DOUT7
VH7
DATA7
N/C
N/C
N/C
N/C
N/C
N/C
VEE
VEE
VCC
VCC
N/C
N/C
N/C
N/C
VBB
VCC
VEE
VCC
N/C
31
 2004 Semtech Corp. / Rev. 2, 8/16/04
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Edge819
TEST AND MEASUREMENT PRODUCTS
Circuit Description
Driver Description
Driver High and Low
The Edge819 supports programmable high and low levels
and tristate per channel. There are no shared lines
between any drivers. The EN* and DATA signals are wide
voltage high impedance analog inputs capable of receiving
digital signals over a wide common mode range. VBB is
the high impedance analog input which sets the threshold
for EN* and DATA.
VH and VL define the logical "1" and "0" levels of the driver,
and can be adjusted anywhere over the range determined
by VCC and VEE. There are no restrictions between VH
and VL, other than they must remain within the power
supply levels.
EN*, DATA
> VBB
< VBB
Status
"1"
"0"
DATA
X
1
0
In a functional testing environment, where a resistor is
added in series with the driver output to create a 50Ω
driver, the Edge819 can withstand a short to any legal
voltage for an indefinite amount of time.
In a low impedance application, with no additional output
resistance, the system should be designed to check for a
short circuit prior to connecting the driver, and tristate the
driver if a short is detected.
DOUT
HiZ
VH
VL
 2004 Semtech Corp. / Rev. 2, 8/16/04
VH ≤ VCC
VL ≤ VCC
Driver Output Protection
With EN* high, the driver goes into a high impedance state.
With EN* low, DATA high forces the driver into a high state,
and DATA low forces the driver into a low state.
EN*
1
0
0
VEE ≤
VEE ≤
4
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Edge819
TEST AND MEASUREMENT PRODUCTS
Application Information
Power Supply Decoupling
VCC and VEE should be decoupled to GND with a .1 µF
chip capacitor in parallel with a .001 µF chip capacitor. A
VCC and VEE plane, or at least a solid power bus, is
recommended for optimal performance.
The three diode configuration shown in Figure 1 should
be used on a once-per-board basis.
VH and VL Decoupling
VCC
External
Logic
Supply
As the VH and VL inputs are unbuffered and supply the
driver output current, which can be quite large during edge
transitions, decoupling capacitors for these inputs are
recommended in proportion to the amount of output
current requirements.
VDD
1N5820 or
Equivalent
For applications where VH and VL are shared over multiple
channels, a solid power plane to distribute these levels is
preferred.
External
System
Ground
VEE
VBB
The two VBB pins are connected together on-chip.
Therefore, only one VBB needs to be connected to for
proper 819 operation.
The two pins may be used to daisy chain a VBB signal
across a PC Board without having to route the actual signal
underneath the 819.
Power Supplies
The Edge819 has several power supply requirements to
protect the part in power supply fault situations, as well
as during power up and power down sequences.
The following power supply requirements must be satisifed
at all times:
Figure 1.
Power Supply Protection Scheme
Warning: It is extremely important that the voltage on any
device pin does not exceed the range of VEE –0.5V to VCC
+0.5V at any time, either during power up, normal
operation, or during power down. Failure to adhere to this
requirement could result in latchup of the device, which
could be destructive if the system power supplies are
capable of supplying large amounts of current. Even if the
device is not immediately destroyed, the cumulative
damage caused by the stress of repeated latchup may
affect device reliability.
VEE ≤ All I/O Pins ≤ VCC at all times
The power sequence below can be used as a guideline
when operating the Edge819:
Power-On Sequencing
1. VCC (Substrate)
2. VEE
3. I/O Pins
Power-Off Sequencing
1. I/O Pins
2. VEE
3. VCC
 2004 Semtech Corp. / Rev. 2, 8/16/04
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Edge819
TEST AND MEASUREMENT PRODUCTS
Package Information
100-Pin MQFP
14 mm x 20 mm
PIN Descriptions
4
0.25
4X
C
A–B
D
D
D2
Z
3
D
3
–D–
–A–
–B–
3
E2
–E–
4
e
Z
SEE DETAIL "A"
E
TOP VIEW
2
4X
5
7
0.20
C
A–B
D
5
7
D1
7
E1
O
O
C
5
BOTTOM VIEW
 2004 Semtech Corp. / Rev. 2, 8/16/04
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Edge819
TEST AND MEASUREMENT PRODUCTS
Package Information (continued)
0.40 MIN.
"
˚"
0 MIN.
e/2
A2
–" 0.10 S
0.13 / 0.30 R. TYP.
–A, B, D–
0.13"
R. MIN.
3
GAGE "
PLANE
C
C
A1
DETAIL "A"
BASE"
PLANE
0.25
L
˚"
0–7
1.60 REF.
SEATING"
PLANE
DETAIL "B"
˚
12 – 16
ccc
8
SEE DETAIL "B"
A
1.28 REF.
C A–B S D S
WITH LEAD FINISH
B
–H–
M
2
0.076
12
0.13 / 0.17
0.13 / 0.23
–C–
˚
12 – 16
B
1
BASE METAL
SECTION C–C
Variations
(all dimensions in millimeters)
Symbol
Notes:
1. All dimensions and tolerances conform to ANSI Y14.5-1982.
2. Datum plane -H- located at mold parting line and coincident
with lead, where lead exits plastic body at bottom of parting
line.
3. Datums A-B and -D- to be determined where centerline between
leads exits plastic body at datum plane -H-.
4. To be determined at seating plane -C-.
5. Dimensions D1 and E1 do not include mold protrusion.
Allowable mold protrusion is 0.254 mm per side. Dimensions
D1 and E1 do include mold mismatch and are determined at
datum plane -H-.
6. “N” is the total # of terminals.
7. Package top dimensions are smaller than bottom dimensions
and top of package will not overhang bottom of package.
8. Dimension B does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08 mm total in excess of the
dimension at maximum material condition. Dambar cannot
be located on the lowerradius or the foot.
9. All dimensions are in millimeters.
10. Maximum allowable die thickness to be assembled in this
package family is 0.635 millimeters.
11. This drawing conforms to JEDEC registered outlines MS-108
and MS-022.
12. These dimensions apply to the flat section of the lead between
0.10 mm and 0.25 mm from the lead tip.
 2004 Semtech Corp. / Rev. 2, 8/16/04
Min
A
Max
3.40
A1
0.25
0.33
A2
2.57
2.71
Note
Gap above PCB
2.87
Body Thickness
23.20 BSC
4
5
D1
20.00 BSC
D2
18.85 REF
ZD
0.58 REF
E
17.20
4
E1
14.00 BSC
5
E2
12.35 REF
ZE
0.83 REF
0.73
0.88
N
100
e
0.65 BSC
B
0.22
B1
0.22
ccc
Body Dimension
Body Dimension
1.03
6
Pin Count
Lead Pitch
0.38
0.30
Comments
Height above PCB
D
L
7
Nom
3.04
0.33
8
Pad Dimension
Pad Dimension
0.13
ND
30
Side Pin Count
NE
20
Side Pin Count
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Edge819
TEST AND MEASUREMENT PRODUCTS
Recommended Operating Conditions
Parameter
Total Analog Supply
Symbol
Min
VCC - VEE
+10
Typ
Max
Units
+18
V
Ambient Operating Temperature
TA
70
oC
Junction Temperature
TJ
+125
oC
Thermal Resistance of Package
(Junction to Still Air)
θJ A
32.2
o C/W
Thermal Resistance of Package
(Junction to Case)
θJ C
12.4
o C/W
Absolute Maximum Ratings
Parameter
Symbol
Min
Max
Units
Total Power Supply
VCC – VEE
– 0.5
19.0
V
Digital Input Voltages
DATA, EN*
VEE – .5
VCC + .5
V
Analog Input Voltages
VH, VL, VBB
VEE – .5
VCC + .5
V
DOUT
VEE – .5
VCC + .5
V
Ambient Operating Temperature
TA
– 50
+125
oC
Storage Temperature
TS
– 65
+150
oC
Junction Temperature
TJ
+150
oC
TSOL
+260
Analog Output Voltages
Soldering Temperature
(5 seconds, .25" from the pin)
oC
Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
This is a stress rating only, and functional operation of the device at these, or any other conditions beyond
those listed, is not implied. Exposure to absolute maximum conditions for extended periods may affect device
reliability.
 2004 Semtech Corp. / Rev. 2, 8/16/04
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Edge819
TEST AND MEASUREMENT PRODUCTS
DC Characteristics
Parameter
Symbol
Min
VH
VL
VH – VL
Ileak
Rout
Iout DC
Iout AC
VEE
VEE
VEE
– 2.0
9.0
– 125
– 400
EN*, DATA - VBB
VBB – EN*, DATA
Iin
DATA, EN*
1.0
1.0
– 100
VEE
ICC
IEE
36
36
Typ
Max
Units
VCC
VCC
VCC
+2.0
15
+125
+400
V
V
V
nA
Ω
mA
mA
0
+100
VCC
V
V
nA
V
57
57
78
78
mA
mA
Driver
High Voltage
Low Voltage
Output Swing
HiZ Leakage Current
Output Impedance
DC Output Current (Note 1)
AC Output Current (Note 2)
0
12
Digital Inputs
Input High Voltage
Input Low Voltage
Input Current
Common Mode Range
Power Supplies
Positive Supply Current (Note 3)
Negative Supply Current (Note 3)
Test conditions (unless otherwise specified): "Recommended Operating Conditions". VCC = +15V,
VEE = –3V.
Note 1:
Note 2:
Note 3:
DC output current is specified per individual driver.
Surge current capability for durations of < 2 seconds.
VCC = +15V, VEE = –3V.
 2004 Semtech Corp. / Rev. 2, 8/16/04
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Edge819
TEST AND MEASUREMENT PRODUCTS
AC Characteristics
Parameter
Symbol
Min
Typ
Max
Units
T pd
T pd
T pd
9.5
10
11
14.5
20
16
19.5
30
21
ns
ns
ns
Driver
DA T A t o DOUT ( Not es 2, 4)
EN* t o DOUT ( A c t iv e t o HiZ ) ( Not e 1)
EN* t o DOUT ( HiZ t o A c t iv e)
R ise/ F all T imes ( Not e 2)
1V Sw ing ( 20% - 80%)
3V Sw ing ( 10% - 90%)
5V Sw ing ( 10% - 90%)
10V Sw ing ( 10% - 90%)
15V Sw ing ( 10% - 90%)
T r/ T f
T r/ T f
T r/ T f
T r/ T f
T r/ T f
M ax imum Operat ing F requenc y ( Not e 3)
F max
ns
ns
ns
ns
ns
3.0
3.5
4.0
4.5
5.0
50
M inimum P ulse W idt h
M Hz
8
11
ns
Test conditions (unless otherwise specified): "Recommended Operating Conditions". VCC = +15V,
VEE = –3V.
Note 1:
Note 2:
Note 3:
Note 4:
Load = 10 mA and measured when a 1V change at the output is detected. (VH = 3V,
VL = 0V, VFLOAT = 1.5V, tested at 1V and 2V.)
Into 18 cm of 50 Ω transmission line terminate with 1 KΩ and 5 pF, with proper series termination
resistor. Guaranteed by characterization. This parameter is not tested in production.
This parameter is production tested at 40 MHz.
From VBB threshold of DATA to 50% level of DOUT.
Ordering Information
Model Number
Package
E819A HF
100 lead M QF P
14 mm x 20 mm B ody Size
w / I nt er nal Heat Spreader
EV M 819A HF
Edg e819 Ev aluat ion B oard
Contact Information
Semtech Corporation
Test and Measurement Division
10021 Willow Creek Rd., San Diego, CA 92131
Phone: (858)695-1808 FAX (858)695-2633
 2004 Semtech Corp. / Rev. 2, 8/16/04
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