ON MC33375ST-5.0T3 Low dropout micropower voltage regulator Datasheet

MC33375
Advance Information
Low Dropout 300 mA
Voltage Regulator
with ON/OFF Control
The MC33375 series are micropower low dropout voltage
regulators available in a wide variety of output voltages as well as
packages, SOT–223, and SOP–8 surface mount packages. These
devices feature a very low quiescent current and are capable of
supplying output currents up to 300 mA. Internal current and thermal
limiting protection are provided by the presence of a short circuit at the
output and an internal thermal shutdown circuit.
The MC33375 has a control pin that allows a logic level signal to
turn–off or turn–on the regulator output.
Due to the low input–to–output voltage differential and bias current
specifications, these devices are ideally suited for battery powered
computer, consumer, and industrial equipment where an extension of
useful battery life is desirable.
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LOW DROPOUT
MICROPOWER VOLTAGE
REGULATOR
Gnd
4
A = Manufacturing Code
YW = Date
xx = Version
AYW
375xx
1
2
3
Vin ON/OFF Vout
Features:
• Low Quiescent Current (0.3 mA in OFF mode; 125 mA in ON mode)
• Low Input–to–Output Voltage Differential of 25 mV at IO = 10 mA,
•
•
•
•
4
1
3
and 260 mV at IO = 300 mA
Extremely Tight Line and Load Regulation
Stable with Output Capacitance of only 0.33 mF for 2.5 V Output
Voltage
Internal Current and Thermal Limiting
Logic Level ON/OFF Control
PLASTIC
ST SUFFIX
CASE 318E
1
8
2
7
Output
Input
Gnd
Simplified Block Diagram
ALYW
375xx
3
Gnd
Vin
Vout
ON/OFF
4
Gnd
6
Gnd
5
N/C
Pins 4 and 5 Not Connected
Thermal &
Anti–sat
Protection
AL = Manufacturing Code
YW = Date
xx = Version
On/Off
Rint
8
1
On/Off
Block
1.23 V
V. Ref.
PLASTIC
D SUFFIX
CASE 751
54 K
Gnd
This device contains 41 active transistors
ORDERING INFORMATION
This document contains information on a new product. Specifications and information
herein are subject to change without notice.
 Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev. 4
1
See detailed ordering and shipping information in the
package dimensions section on page 10 of this data sheet.
Publication Order Number:
MC33375/D
MC33375
ELECTRICAL CHARACTERISTICS (CL = 1.0µF, TA = 25°C, for min/max values TJ = –40°C to +125°C, Note 1)
Symbol
Characteristic
Output Voltage
1.8 V Suffix
2.5 V Suffix
3.0 V Suffix
3.3 V Suffix
5.0 V Suffix
IO = 0 mA to 250 mA
TA = 25°C, Vin = [VO + 1] V
Min
Typ
Max
1.782
2.475
2.970
3.267
4.950
1.80
2.50
3.00
3.30
5.00
1.818
2.525
3.030
3.333
5.05
1.764
2.450
2.940
3.234
4.900
—
—
—
—
—
1.836
2.550
3.060
3.366
5.100
VO
Unit
Vdc
1.8 V Suffix
2.5 V Suffix
3.0 V Suffix
3.3 V Suffix
5.0 V Suffix
Vin = [VO + 1] V, 0 < IO < 100 mA
2% Tolerance from TJ = –40 to +125°C
Line Regulation
Vin = [VO + 1] V to 12 V, IO = 250 mA,
All Suffixes TA = 25°C
Regline
–
2.0
10
mV
Load Regulation
Vin = [VO + 1] V, IO = 0 mA to 250 mA,
All Suffixes TA = 25°C
Regload
–
5.0
25
mV
—
—
—
—
25
115
220
260
100
200
400
500
65
75
—
—
—
160
46
—
—
—
—
—
125
0.3
1100
200
4.0
1500
—
450
—
2.4
—
—
—
—
—
—
0.5
0.3
—
150
—
Dropout Voltage
IO = 10 mA
IO = 100 mA
IO = 250 mA
IO = 300 mA
Vin – VO
TJ = –40°C to +125°C
Ripple Rejection (120 Hz)
Vin(peak–peak) = [VO + 1.5] V to [VO + 5.5] V
Output Noise Voltage
C L = 1 mF
IO = 50 mA (10 Hz to 100 kHz)
CL = 200 mF
—
mV
dB
mVrms
Vn
CURRENT PARAMETERS
Quiescent Current
On Mode
Vin = [VO + 1] V, IO = 0 mA
Off Mode
On Mode SAT Vin = [VO – 0.5] V, IO = 0 mA, Note 2
Current Limit
mA
IQ
Vin = [VO + 1] V, VO shorted
ILIMIT
mA
ON/OFF INPUTS
On/Off Input Voltage
Logic “1” (Regulator On) Vout = VO ± 2%
Logic “0” (Regulator Off) Vout < 0.03V
Logic “0” (Regulator Off) Vout < 0.05V (1.8 V Option)
VCTRL
V
THERMAL SHUTDOWN
Thermal Shutdown
—
NOTE: 1. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
NOTE: 2. Quiescent Current is measured where the PNP pass transistor is in saturation. Vin = [VO – 0.5] V guarantees this condition.
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2
°C
MC33375
DEFINITIONS
difference between the input power (VCC X ICC) and the
output power (Vout X Iout) is increasing.
Depending on ambient temperature, it is possible to
calculate the maximum power dissipation and so the
maximum current as following:
Load Regulation – The change in output voltage for a
change in load current at constant chip temperature.
Dropout Voltage – The input/output differential at which
the regulator output no longer maintains regulation against
further reductions in input voltage. Measured when the
output drops 100 mV below its nominal value (which is
measured at 1.0 V differential), dropout voltage is affected
by junction temperature, load current and minimum input
supply requirements.
Output Noise Voltage – The RMS AC voltage at the
output with a constant load and no input ripple, measured
over a specified frequency range.
Maximum Power Dissipation – The maximum total
dissipation for which the regulator will operate within
specifications.
Quiescent Current – Current which is used to operate the
regulator chip and is not delivered to the load.
Line Regulation – The change in output voltage for a
change in the input voltage. The measurement is made under
conditions of low dissipation or by using pulse techniques
such that the average chip temperature is not significantly
affected.
Maximum Package Power Dissipation – The maximum
package power dissipation is the power dissipation level at
which the junction temperature reaches its maximum value
i.e. 150°C. The junction temperature is rising while the
Pd
+ TRJ – TA
qJA
The maximum operating junction temperature TJ is
specified at 150°C, if TA = 25°C, then PD can be found. By
neglecting the quiescent current, the maximum power
dissipation can be expressed as:
I out
+V
P
D
– Vout
CC
The thermal resistance of the whole circuit can be
evaluated by deliberately activating the thermal shutdown
of the circuit (by increasing the output current or raising the
input voltage for example).
Then you can calculate the power dissipation by
subtracting the output power from the input power. All
variables are then well known: power dissipation, thermal
shutdown temperature (150°C for MC33375) and ambient
temperature.
R
T –T
J A
+
qJA
P
D
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3
MC33375
Figure 1. Line Transient Response
Figure 2. Line Transient Response
7
150
TA = 25° C
6 CL = 33 mF
IL = 10 mA
5 Vout = 3.3 V
100
4
50
3
0
2
Vout
–50
1
0
0
20
40
60
80
100
120
140
160
70
60
Vin
40
4
30
3
20
10
2
0
1
Vout
0
50
100
Figure 4. Load Transient Response
1.0
300
–100
0.2
–200
0
0
50
–0.2
Vout CHANGE
–0.4
–0.6
–0.8
100
150
200
250
300
350
LOAD CURRENT (mA)
LOAD CURRENT (mA)
0.4
150
LOAD CURRENT
–50
0.04
–150
–0.01
–250
–350
CL = 33.0 mF
Vout = 3.3 V
TA = 25° C
Vin = 4.3 V
Vout CHANGE
–450
–550
–650
–750
–1.0
400
–0.06
–0.11
–0.16
0
50
100
TIME (mS)
150
200
250
300
TIME (mS)
Figure 5. Output Voltage versus Input Voltage
Figure 6. Dropout Voltage versus Output Current
300
3.5
3.0
IL = 1 mA
DROPOUT VOLTAGE (mV)
OUTPUT VOLTAGE (V)
0.09
50
OUTPUT VOLTAGE CHANGE (V)
0
0.14
250
0.6
LOAD CURRENT
OUTPUT VOLTAGE CHANGE (V)
200
–700
350
0.8
–400 CL = 1.0 mF
Vout = 3.3 V
–500 TA = 25° C
–600 Vin = 4.3 V
–20
200
150
TIME (mS)
Figure 3. Load Transient Response
–300
–10
0
–100
180 200
TIME (mS)
100
50
Vin , INPUT VOLTAGE (V)
Vin
200
OUTPUT VOLTAGE CHANGE (mV)
TA = 25° C
6 CL = 0.47 mF
IL = 10 mA
5 Vout = 3.3 V
OUTPUT VOLTAGE CHANGE (mV)
Vin , INPUT VOLTAGE (V)
7
2.5
IL = 250 mA
2.0
1.5
1.0
250
200
150
100
50
0.5
0
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
1
4.5 5.0
10
100
IO, OUTPUT CURRENT (mA)
INPUT VOLTAGE (V)
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4
1000
MC33375
Figure 8. Ground Pin Current versus
Input Voltage
Figure 7. Dropout Voltage versus Temperature
12
250
10
IL = 300 mA
8
200
Ignd (mA)
DROPOUT VOLTAGE (mV)
300
IL = 250 mA
150
IL = 100 mA
100
IL = 300 mA
6
4
IL = 100 mA
50
2
IL = 10 mA
0
–40
0
IL = 50 mA
25
0
85
0
1
2
3
TEMPERATURE (°C)
Figure 9. Ground Pin Current versus
Ambient Temperature
2.5
8
7
4
5
6
7
8
Vin (VOLTS)
Figure 10. Output Voltage versus Ambient
Temperature (Vin = Vout + 1V)
IO = 0
2.495
IL = 250 mA
Vout (VOLTS)
Ignd (mA)
6
5
4
3
2.49
IO = 250 mA
2.485
IL = 100 mA
2.48
IL = 50 mA
2.475
2
1
0
–40
–20
0
20
40
60
80
100
120
2.47
–40
140
0
25
TEMPERATURE (°C)
TA (°C)
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5
85
MC33375
Figure 11. Output Voltage versus Ambient
Temperature (Vin = 12 V)
2.5
IO = 0
2.495
Vout (VOLTS)
2.49
IO = 250 mA
2.485
2.48
2.475
2.47
2.465
–40
0
25
85
TEMPERATURE (°C)
Figure 12. Ripple Rejection
Figure 13. Ripple Rejection
70
70
60
60
IL = 100 mA
IL = 10 mA
50
50
IL = 250 mA
dB
40
30
30
20
20
10
10
0
0.1
1
10
0
0.1
100
1
10
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 14. Enable Transient
5
ENABLE
4.5
4
VOLTAGE (V)
dB
IL = 1 mA
40
3.5
CL = 1.0 mF
3
2.5
CL = 33 mF
2
1.5
1
0.5
0
0
100
200
300
TIME (mS)
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6
400
500
100
MC33375
1.8 V Option
Figure 15. Output Voltage versus Temperature
Figure 16. Output Voltage versus Input Voltage
1.85
2.0
ILOAD = 100 mA
1.8
VOUT, OUTPUT VOLTAGE (V)
VOUT , OUTPUT VOLTAGE (V)
1.84
1.83
1.82
1.81
1.80
1.79
1.78
1.77
1.76
1.75
–40
12
1.2
1.0
0.8
0.6
0.4
TA = 25° C
ILOAD = 0 mA
0.2
0
–20
0
20
40
60
80
100
120
1
0
3
2
5
4
6
TA, AMBIENT TEMPERATURE (°C)
VCC, (V)
Figure 17. Ground Current versus Load
Current
Figure 18. Quiescent Current versus Input Voltage
140
120
10
100
TA = 25° C
VCC = 3 V
IQ (m A)
8
Ignd , (mA)
1.6
1.4
6
4
80
60
40
2
TA = 25° C
ILOAD = 0 mA
20
0
0
0
50
100
150
200
250
300
350
0
1
3
2
ILOAD, (mA)
5
4
6
VCC, (V)
Figure 19. PSRR versus Frequency
Figure 20. Enable Response
80
VCC = 3 V
ILOAD = 1 mA
TA = 25°C
COUT = 1 mF
70
PSRR (dB)
60
ENABLE
2V
50
VOUT
40
30
20
0V
10
0
0.1
1
10
100
0
1000
5
10
15
20
25
30
t, TIME (ms)
f, FREQUENCY (kHz)
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7
35
40
45
50
MC33375
Figure 21. Load Transient Response
VCC = 3 V
ILOAD = 1 mA to 100 mA
TA = 25°C
1.82 V
1.80 V
1.78 V
100 mA
1 mA
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
t, TIME (ms)
APPLICATIONS INFORMATION
Figure 22. Typical Application Circuit
ON/OFF
Vout
Vin
MC33375–xx
Cin
Cout
LOAD
GND
frequencies. A 0.33 mF or larger tantalum, mylar, ceramic,
or other capacitor having low internal impedance at high
frequencies should be chosen. The bypass capacitor should
be mounted with shortest possible lead or track length
directly across the regulator’s input terminals. Figure 16
shows the ESR that allows the LDO to remain stable for
various load currents.
The MC33375 regulators are designed with internal
current limiting and thermal shutdown making them
user–friendly. Figure 15 is a typical application circuit. The
output capability of the regulator is in excess of 300 mA,
with a typical dropout voltage of less than 260 mV. Internal
protective features include current and thermal limiting.
EXTERNAL CAPACITORS
These regulators require only a 0.33 mF (or greater)
capacitance between the output and ground for stability for
1.8 V, 2.5 V, 3.0 V, and 3.3 V output voltage options. Output
voltage options of 5.0 V require only 0.22 mF for stability.
The output capacitor must be mounted as close as possible
to the MC33375. If the output capacitor must be mounted
further than two centimeters away from the MC33375, then
a larger value of output capacitor may be required for
stability. A value of 0.68 mF or larger is recommended. Most
type of aluminum, tantalum, or multilayer ceramic will
perform adequately. Solid tantalums or appropriate
multilayer ceramic capacitors are recommended for
operation below 25°C. An input bypass capacitor is
recommended to improve transient response or if the
regulator is connected to the supply input filter with long
wire lengths, more than 4 inches. This will reduce the
circuit’s sensitivity to the input line impedance at high
Figure 23. ESR for Vout = 3.0V
100
ESR (ohm)
Vout = 3.0 V
Cout = 1.0 mF
Cin = 1.0 mF
10
Stable Region
1.0
0.1
0
50
100
150
200
250
300
LOAD CURRENT (mA)
Applications should be tested over all operating
conditions to insure stability.
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MC33375
THERMAL PROTECTION
The internal current limit will typically limit current to
450 mA. If during current limit the junction exceeds 150°C,
the thermal protection will protect the device also. Current
limit is not a substitute for proper heatsinking.
Internal thermal limiting circuitry is provided to protect
the integrated circuit in the event that the maximum junction
temperature is exceeded. When activated, typically at
150°C, the output is disabled. There is no hysteresis built
into the thermal protection. As a result the output will appear
to be oscillating during thermal limit. The output will turn
off until the temperature drops below the 150°C then the
output turns on again. The process will repeat if the junction
increases above the threshold. This will continue until the
existing conditions allow the junction to operate below the
temperature threshold.
OUTPUT NOISE
In many applications it is desirable to reduce the noise
present at the output. Reducing the regulator bandwidth by
increasing the size of the output capacitor will reduce the
noise on the MC33375.
ON/OFF PIN
When this pin is pulled low, the MC33375 is off. This pin
should not be left floating. The pin should be pulled high for
the MC33375 to operate.
Thermal limit is not a substitute for proper
heatsinking.
2.50
R θ JA, THERMAL RESISTANCE
JUNCTION-TO-AIR (°C/W)
280
Free Air
Mounted
Vertically
240
PD(max) for TA = 50°C
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
200
Minimum
Size Pad
160
1.25
2.0 oz. Copper
L
L
120
80
0.83
0.63
0.50
0.42
RθJA
0.35
40
0
5.0
10
15
20
25
30
R θ JA, THERMAL RESISTANCE, JUNCTION-TO-AIR (°C/W)
L, LENGTH OF COPPER (mm)
Figure 25. SOP–8 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
3.2
170
150
2.8
PD(max) for TA = 50°C
130
2.4
110
Graph Represents Symmetrical Layout 2.0
90
L
70
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
2.0 oz.
Copper
3.0 mm
L
RθJA
50
1.6
1.2
0.8
0.4
30
0
10
20
30
L, LENGTH OF COPPER (mm)
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9
40
50
PD, MAXIMUM POWER DISSIPATION (W)
Figure 24. SOT–223 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
MC33375
ORDERING INFORMATION
MC33375ST–1.8T3
1.8 V (Fixed V)
318E
SOT–223
MC33375ST–2.5T3
2.5 V
(Fixed Voltage)
318E
SOT–223
751–5
SOP–8
MC33375D–2.5R2
MC33375ST–3.0T3
MC33375D–3.0R2
MC33375ST–3.3T3
MC33375D–3.3R2
MC33375ST–5.0T3
MC33375D–5.0R2
3.0 V
(Fixed Voltage)
1% Tolerance
at TA = 25°C
3.3 V
(Fixed Voltage)
2% Tolerance at
TJ from –40 to +125°C
5.0 V
(Fixed Voltage)
318E
SOT–223
751–5
SOP–8
318E
SOT–223
751–5
SOP–8
318E
SOT–223
751–5
SOP–8
DEVICE MARKING
Device
Version
Marking (1st line)
MC33375
1.8V
37518
MC33375
2.5V
37525
MC33375
3.0V
37530
MC33375
3.3V
37533
MC33375
5.0V
37550
TAPE AND REEL SPECIFICATIONS
Device
Reel Size
Tape Width
Quantity
MC33375D
13”
12mm embossed tape
2500 units
MC33375ST
13”
8mm embossed tape
4000 units
MAXIMUM RATINGS (TA = 25°C, for min/max values TJ = –40°C to +125°C)
Rating
Symbol
Value
Unit
VCC
13
Vdc
PD
Internally Limited
W
RθJA
RθJC
160
25
°C/W
°C/W
RθJA
RθJC
245
15
°C/W
°C/W
Output Current
IO
300
mA
Maximum Junction Temperature
TJ
150
°C
Operating Junction Temperature Range
TJ
– 40 to +125
°C
Storage Temperature Range
Tstg
– 65 to +150
°C
Input Voltage
Power Dissipation and Thermal Characteristics
TA = 25°C
Maximum Power Dissipation
Case 751 (SOP–8) D Suffix
Thermal Resistance, Junction–to–Ambient
Thermal Resistance, Junction–to–Case
Case 318E (SOT–223) ST Suffix
Thermal Resistance, Junction–to–Air
Thermal Resistance, Junction–to–Case
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10
MC33375
PACKAGE DIMENSIONS
ST SUFFIX
PLASTIC PACKAGE
CASE 318E–04
(SOT–223)
ISSUE J
A
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
4
S
B
1
2
3
D
L
G
J
C
0.08 (0003)
M
H
INCHES
DIM MIN
MAX
A
0.249
0.263
B
0.130
0.145
C
0.060
0.068
D
0.024
0.035
F
0.115
0.126
G
0.087
0.094
H 0.0008 0.0040
J
0.009
0.014
K
0.060
0.078
L
0.033
0.041
M
0_
10 _
S
0.264
0.287
MILLIMETERS
MIN
MAX
6.30
6.70
3.30
3.70
1.50
1.75
0.60
0.89
2.90
3.20
2.20
2.40
0.020
0.100
0.24
0.35
1.50
2.00
0.85
1.05
0_
10 _
6.70
7.30
K
D SUFFIX
PLASTIC PACKAGE
CASE 751–06
(SOP–8)
ISSUE T
D
A
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETER.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
C
5
0.25
H
E
M
B
M
1
4
h
B
e
X 45 _
q
A
C
SEATING
PLANE
L
0.10
A1
B
0.25
M
C B
S
A
S
DIM
A
A1
B
C
D
E
e
H
h
L
q
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11
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.35
0.49
0.19
0.25
4.80
5.00
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
MC33375
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or
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attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
NORTH AMERICA Literature Fulfillment:
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Toll Free from Hong Kong & Singapore:
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For additional information, please contact your local
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http://onsemi.com
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