NLAS2066 Ultra−Small Dual Single Pole, Single Throw Analog Switch with Over Voltage Tolerance http://onsemi.com The NLAS2066 is a Dual SPST (Single Pole, Single Throw) Analog Switch high performance version of the popular NLAS323. Packaged in the ultra−small US8 package. It is designed as a general analog/digital switch and can also be used to isolate USB ports. MARKING DIAGRAM 8 Features • • • • • • • • • • • Same Pinout as the Popular NLAS323 Excellent Performance – Maximum RDSON 15 at 3.0 V Matching Between the Switches 1.5 at 3.0 V 1.65 V to 5.5 V Operating Range Lower Threshold Voltages for LVTTL/CMOS Levels Ultra−Low Charge Injection 4.8 pC at 3.0 V Low Standby Power – ICC = 1.0 nA (max) @ TA = 25°C CMOS Level Compatibility OVT* (Pins 1, 3, 5, and 7) These Pins may be Subjected to 0 to +7.0 V, Regardless of Operating Voltage Allows a Short from USB Line without Damage to the Device Pb−Free Packages are Available** Typical Applications • • • • USB Isolation Cell Phones PDAs MP3s Digital Still Cameras 8 AH D 1 AH = Device Code D = Date Code 1 NO1 1 8 VCC COM1 2 7 IN1 IN2 3 6 COM2 GND 4 5 NO2 PIN ASSIGNMENT Important Information • ESD Protection: • US8 US SUFFIX CASE 493 Human Body Model; > 2000 V Machine Model; > 200 V Latch−Up Maximum Rating: 200 mA *Over Voltage Tolerance (OVT) enables pins to function outside (higher) of their operating voltages, with no damage to the devices or to signal integrity. **For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Pin Function OVT 1 NO1 Yes 2 COM1 − 3 IN2 Yes 4 GND − 5 NO2 Yes 6 COM2 − 7 IN1 Yes 8 VCC − FUNCTION TABLE On/Off Enable Input State of Analog Switch L H Off On ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet. Semiconductor Components Industries, LLC, 2004 April, 2004 − Rev. 5 1 Publication Order Number: NLAS2066/D NLAS2066 MAXIMUM RATINGS Symbol Rating Value Unit 0.5 to 7.0 V 0.5 to 7.0 −0.5 to VCC V 0.5 to 7.0 V VI < GND 50 mA VO < GND 50 mA VCC DC Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK DC Input Diode Current IOK DC Output Diode Current IO DC Output Sink Current 50 mA ICC DC Supply Current per Supply Pin 100 mA IGND DC Ground Current per Ground Pin 100 mA TSTG Storage Temperature Range 65 to 150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature under Bias 150 °C JA Thermal Resistance (Note 1) 250 °C/W PD Power Dissipation in Still Air at 85°C 250 mW MSL Moisture Sensitivity Level 1 − FR Flammability Rating UL 94 V−0 @ 0.125 in − VESD ESD Withstand Voltage > 2000 > 200 N/A V Pins 1, 3, 5, 7 Pins 2, 6 Oxygen Index: 28 to 34 Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow 2. Tested to EIA/JESD22−A114−A 3. Tested to EIA/JESD22−A115−A 4. Tested to JESD22−C101−A RECOMMENDED OPERATING CONDITIONS Symbol Characteristics Min Max Unit 5.5 V VCC Positive DC Supply Voltage 1.65 VIN Digital Input Voltage (Enable) GND 5.5 V VIO Static or Dynamic Voltage Across an Off Switch GND VCC V VIS Analog Input Voltage GND GND VCC 5.5 V TA Operating Temperature Range, All Package Types −55 +125 °C tr, tf Input Rise or Fall Time (Enable Input) 0 0 100 20 ns/V NO COM VCC = 3.3 V + 0.3 V VCC = 5.0 V + 0.5 V http://onsemi.com 2 NLAS2066 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 TJ = 80°C 117.8 419,300 TJ = 90°C 1,032,200 90 TJ = 100°C 80 TJ = 110°C Time, Years TJ = 120°C Time, Hours FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR TJ = 130°C Junction Temperature C NORMALIZED FAILURE RATE DEVICE JUNCTION TEMPERATURE VS. TIME TO 0.1% BOND FAILURES 1 1 10 100 1000 TIME, YEARS Figure 1. Failure Rate vs. Time Junction Temperature DC CHARACTERISTICS − Digital Section (Voltages Referenced to GND) Guaranteed Max Limit Symbol Parameter Condition VCC 25C −40 to 85C −55 to <125C Unit VIH Minimum High− Level Input Voltage, Enable Inputs 2.3 10% 2.7 10% 3.0 10% 5.0 10% VCC x 0.55 VCC x 0.55 VCC x 0.55 VCC x 0.55 VCC x 0.55 VCC x 0.55 VCC x 0.55 VCC x 0.55 VCC x 0.55 VCC x 0.55 VCC x 0.55 VCC x 0.55 V VIL Maximum Low− Level Input Voltage, Enable Inputs 2.3 10% 2.7 10% 3.0 10% 5.0 10% VCC x 0.30 VCC x 0.30 VCC x 0.30 VCC x 0.30 VCC x 0.30 VCC x 0.30 VCC x 0.30 VCC x 0.30 VCC x 0.30 VCC x 0.30 VCC x 0.30 VCC x 0.30 V IIN Maximum Input Leakage Current, Enable Inputs VIN = 5.5 V or GND 0 V to 5.5 V +0.1 +1.0 +1.0 A ICC Maximum Quiescent Supply Current (per package) Enable and VIS = VCC or GND 5.5 1.0 1.0 2.0 A http://onsemi.com 3 NLAS2066 DC ELECTRICAL CHARACTERISTICS − Analog Section Guaranteed Max Limit Symbol Parameter Condition VCC 25C −40 to 85C −55 to <125C Unit RON Maximum On Resistance VIN = VIH Is = 8 mA VIS = VCC to GND Is = 8 mA Is = 24 mA Is = 32 mA (Figures 2 and 3) 2.3 2.7 3.0 4.5 50 20 15 7 54 24 19 11 54 24 19 11 RFLAT(ON) On Resistance Flatness VIN = VIH VIS = 0 to VCC Is = 8 mA Is = 8 mA Is = 24 mA Is = 32 mA 2.3 2.7 3.0 4.5 60 24 13.5 3.0 60 24 13.5 3.0 60 24 13.5 3.0 RON On Resistance Match Between Channels VIS = 1.4 V VIS = 1.6 V VIS = 1.8 V VIS = 2.7 V (Figures 4, 5 and 6) 2.3 2.7 3.0 4.5 1.3 1.4 1.5 2.0 1.3 1.4 1.5 2.0 1.3 1.4 1.5 2.0 INO(OFF) Off Leakage Current VIN = VIL VNO = 1.0 V, VCOM = 4.5 V or VCOM = 1.0 V and VNO 4.5 V 5.5 1.0 10 100 nA ICOM(OFF) Off Leakage Current VIN = VIL VNO = 4.5 V or 1.0 V VCOM = 1.0 V or 4.5 V 5.5 1.0 10 100 nA (Figure 5) AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) Guaranteed Max Limit VCC Symbol Parameter Condition (V) 25C Min −40 to 85C Typ Max Min Typ Max −55 to <125C Min Typ Max Unit tON Turn−On Time RL = 300 CL = 35 pF (Figures 7, 14 and 15) 2.3 2.7 3.0 4.5 8 4 3 2 9 5 4 3 10 7 6 5 10 7 6 5 ns tOFF Turn−Off Time RL = 300 CL = 35 pF (Figures 7, 14 and 15) 2.3 2.7 3.0 4.5 8 6 5 4 10 8 7 6 11 9 8 7 11 9 8 7 ns CIN CNO or CNC CCOM(OFF) CCOM(ON) Maximum Input Capacitance, Select Input Analog I/O (Switch Off) Common I/O (Switch Off) Feedthrough (Switch Off) http://onsemi.com 4 Typical @ 25C, VCC = 5.0 V Unit 3.0 10 10 10 pF NLAS2066 ADDITIONAL APPLICATIONS CHARACTERISTICS (Voltage Reference to GND Unless Noted) Parameter Condition VCC (V) Typical 25C Unit BW Maximum On−Channel −3.0 dB Bandwidth or Minimum Frequency Response VIS = 0 dBm (Figure 8 and 9) 2.3 2.7 3.0 4.5 102 175 180 186 MHz VONL Maximum Feed−Through On Loss VIS = 0 dBm @ 10 kHz (Figure 8 and 9) 2.3 2.7 3.0 4.5 −2.2 −0.9 −0.8 −0.4 dB VISO Off−Channel Isolation f = 100 kHz VIS = 1.0 V RMS (Figure 10 and 11) 2.3 2.7 3.0 4.5 −73 −74 −74 −75 dB Q Charge Injection Enable Input to Common I/O VIS = VCC to GND, FIS = 20 kHz (Figure 12) 3.0 5.5 4.8 7.4 pC THD Total Harmonic Distortion TDH + Noise FIS = 10 Hz to 100 kHz, RL = Rgen = 600 , CL = 50 pF (Figure 13) 3.0 5.5 0.19 0.06 Symbol http://onsemi.com 5 % NLAS2066 160 200 −40°C 140 25°C VCC = 2.0 150 85°C 100 RON () RON () 120 80 VCC = 2.5 60 40 100 125°C 50 VCC = 3.0 20 VCC = 4.5 0 0 0 1 2 3 4 0.5 0 5 1.0 1.5 VIS (VOLTS) VIS (VOLTS) Figure 2. RON vs. VCOM and VCC (@25C) Figure 3. RON vs. VCOM and Temperature, VCC = 2.0 V 30 2.0 12 −40°C −40°C 25°C 25 10 85°C 8 15 RON () RON () 20 125°C 10 4 5 2 0 0 1.0 2.0 85°C 125°C 0 3.0 0 1.0 2.0 3.0 VIS (VOLTS) VIS (VOLTS) Figure 4. RON vs. VCOM and Temperature, VCC = 2.5 V Figure 5. RON vs. VCOM and Temperature, VCC = 3.0 V 4.0 35.0 6 5 85°C −40°C 25°C 30.0 25.0 TIME (nS) 4 RON () 25°C 6 3 125°C 20.0 15.0 tON 2 10.0 1 5.0 tOFF 0.0 2.0 0 0 1.0 2.0 3.0 4.0 5.0 3.0 4.5 5.0 5.5 VCC (V) VIS (VOLTS) Figure 6. RON vs. VCOM and Temperature, VCC = 4.5 V Figure 7. Switching Time vs. Supply Voltage, T = 25C http://onsemi.com 6 NLAS2066 BANDWIDTH (dB/Div) Bandwidth (On − Loss) 0 Phase (Degrees) −1 Bandwidth (On − Loss) BANDWIDTH (dB/Div) −1 −10 VCC = 3.0 V TA = 25°C 0.001 0.01 0.1 1.0 10 100 300 0 Phase (Degrees) 0.001 0.01 0.1 −10 OFF ISOLATION (dB/Div) −10 OFF ISOLATION (dB/Div) 0 Off Isolation, Pin 5 and 6 100 300 Crosstalk VCC = 3.0 V TA = 25°C 10 100 300 Off Isolation, Pin 1 and 2 Crosstalk VCC = 5.0 V TA = 25°C 0.01 0.1 FREQUENCY (MHz) 1 10 100 300 FREQUENCY (MHz) Figure 10. Off Isolation and Crosstalk Figure 11. Off Isolation and Crosstalk 10 1.0 8 VCC = 5.0 V VCC = 3.0 V VPP = 3.1 V DISTORTION (%) 6 4 Q (pC) 10 Figure 9. ON Channel Bandwidth and Phase Shift Over Frequency 0 1 1.0 FREQUENCY (MHz) Figure 8. ON Channel Bandwidth and Phase Shift Over Frequency 0.1 −10 VCC = 5.0 V TA = 25°C FREQUENCY (MHz) 0.01 PHASE (Degrees) 0 PHASE (Degrees) 0 2 0 VCC = 3.0 V −2 0.1 VCC = 5.5 V VPP = 5.0 V −4 −6 0 1 2 3 4 0.01 0.01 5 VCOM (V) Figure 12. Charge Injection vs. VCOM 0.1 1.0 FREQUENCY (MHZ) 10 Figure 13. THD vs. Frequency http://onsemi.com 7 100 NLAS2066 TIMING INFORMATION VCC DUT VCC Input NO 50% 50% 0V COM VOUT 0.1 F 300 VOH 35 pF 90% 90% Output VOL Input tON tOFF Figure 14. tON/tOFF VCC VCC Input DUT 300 NO COM 50% 50% 0V VOUT VOH 35 pF Output 10% 10% VOL Input tOFF Figure 15. tON/tOFF VCC VMI 2.0 V 1.0 V 3.0 V 1.5 V 4.5 V 1.5 V http://onsemi.com 8 tON NLAS2066 DEVICE ORDERING INFORMATION Device Nomenclature Circuit Indicator Technology Device Function Package Suffix Package Type Shipping† NLAS2066US NL AS 2066 US US8 3,000 / Tape & Reel NLAS2066USG NL AS 2066 US US8 (Pb−Free) 3,000 / Tape & Reel NLAS2066UST3 NL AS 2066 UST3 US8 10,000 / Tape & Reel NLAS2066UST3G NL AS 2066 UST3 US8 (Pb−Free) 10,000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 9 NLAS2066 PACKAGE DIMENSIONS US8 US SUFFIX CASE 493−02 ISSUE A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION “A” DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM (0.0055”) PER SIDE. 4. DIMENSION “B” DOES NOT INCLUDE INTER−LEAD FLASH OR PROTRUSION. INTER−LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055”) PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076−0.0203 MM. (300−800 “). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED ±0.0508 (0.0002 “). −X− A 8 J −Y− 5 DETAIL E B L 1 4 R S G P U C −T− SEATING PLANE H 0.10 (0.004) T K D N 0.10 (0.004) M T X Y R 0.10 TYP V M F DETAIL E DIM A B C D F G H J K L M N P R S U V MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0 6 5 10 0.23 0.34 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.126 0 6 5 10 0.010 0.013 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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