SEMICONDUCTOR TECHNICAL DATA The MC10E/100E164 is a 16:1 multiplexer with a differential output. The select inputs (SEL0, 1, 2, 3 ) control which one of the sixteen data inputs (A0 – A15) is propagated to the output. Special attention to the design layout results in a typical skew between the 16 inputs of only 50ps. • • • • 850ps Data Input to Output 16:1 MULTIPLEXER Differential Output Extended 100E VEE Range of – 4.2V to – 5.46V Internal 75kΩ Input Pulldown Resistors Pinout: 28-Lead PLCC (Top View) A10 A11 A12 A13 A14 A15 VCCO 25 24 23 22 21 20 FN SUFFIX PLASTIC PACKAGE CASE 776-02 19 A9 26 18 NC A8 27 17 NC SEL3 28 16 VCC VEE 1 15 Q SEL2 2 14 Q SEL0 3 13 VCCO SEL1 4 12 A0 5 6 7 8 9 10 11 A7 A6 A5 A4 A3 A2 A1 * All VCC and VCCO pins are tied together on the die. LOGIC DIAGRAM A0 A1 16:1 Q A14 A15 PIN NAMES Pin A0 – A15 SEL[0:3] Q, Q Function SEL0 Data Inputs Select Inputs Output SEL1 SEL2 SEL3 12/93 Motorola, Inc. 1996 2–1 Q REV 2 MC10E164 MC100E164 DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol Characteristic IIH Input HIGH Current IEE Power Supply Current 10E 100E min typ 25°C max min typ 150 85°C max min typ 150 max Unit 150 µA Condition mA 59 59 71 71 59 59 71 71 59 68 71 81 AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol Characteristic tPLH tPHL Propagation Delay to Output A Input SEL0 SEL1 SEL2 SEL3 tSKEW Within Device Skew tr tf Rise/Fall Times 20 - 80% 25°C 85°C min typ max min typ max min typ max 350 500 400 400 400 600 700 675 675 550 850 900 900 900 700 350 500 400 400 400 600 700 675 675 550 850 900 900 900 700 350 500 400 400 400 600 700 675 675 550 850 900 900 900 700 Unit Condition ps 50 50 50 ps 1 ps 275 400 550 275 400 550 275 400 550 1. Within Device skew is defined as the difference in the A to Q delay between the 16 different A inputs. FUNCTION TABLE SEL3 SEL2 SEL1 SEL0 Data L L L L L L L L H H H H H H H H L L L L H H H H L L L L H H H H L L H H L L H H L L H H L L H H L H L H L H L H L H L H L H L H A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 MOTOROLA 2–2 ECLinPS and ECLinPS Lite DL140 — Rev 4 MC10E164 MC100E164 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 776–02 ISSUE D 0.007 (0.180) B Y BRK -N- T L –M M U 0.007 (0.180) X G1 M S N T L –M S S N S D Z -L- -M- D W 28 V 1 C A 0.007 (0.180) M R 0.007 (0.180) M T L –M S T L –M S N S N S H S N S 0.007 (0.180) M T L –M N S S 0.004 (0.100) G J -T- K SEATING PLANE F VIEW S G1 T L –M S N 0.007 (0.180) M T L –M S N S VIEW S S NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). ECLinPS and ECLinPS Lite DL140 — Rev 4 T L –M K1 E S S VIEW D-D Z 0.010 (0.250) 0.010 (0.250) 2–3 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 — 0.025 — 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 — 0.020 2° 10° 0.410 0.430 0.040 — MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 — 0.64 — 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 — 0.50 2° 10° 10.42 10.92 1.02 — MOTOROLA MC10E164 MC100E164 Motorola reserves the right to make changes without further notice to any products herein. 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