SEMICONDUCTOR TECHNICAL DATA The MC10EL/100EL31 is a D flip-flop with set and reset. The device is functionally equivalent to the E131 device with higher performance capabilities. With propagation delays and output transition times significantly faster than the E131 the EL31 is ideally suited for those applications which require the ultimate in AC performance. Both set and reset inputs are asynchronous, level triggered signals. Data enters the master portion of the flip-flop when clock is LOW and is transferred to the slave, and thus the outputs, upon a positive transition of the clock. 8 1 • • • • 475ps Propagation Delay D SUFFIX PLASTIC SOIC PACKAGE CASE 751-05 2.8GHz Toggle Frequency 75kΩ Internal Input Pulldown Resistors >1000V ESD Protection LOGIC DIAGRAM AND PINOUT ASSIGNMENT S 1 8 VCC TRUTH TABLE S D 2 7 D Q Flip Flop CLK 3 6 Q 5 VEE R R 4 3–1 S R CLK Q L H X X X L L H L H L L L H H Z Z X X X L H H L Undef Z = LOW to HIGH Transition 12/93 Motorola, Inc. 1995 D REV 2 MC10EL31 MC100EL31 DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = GND) –40°C Symbol Characteristic Min IEE Power Supply Current 10EL 100EL VEE Power Supply Voltage 10EL 100EL IIH Input HIGH Current –4.75 –4.20 0°C Typ Max 27 27 32 32 –5.2 –4.5 –5.5 –5.5 Min –4.75 –4.20 25°C Typ Max 27 27 32 32 –5.2 –4.5 –5.5 –5.5 150 Min –4.75 –4.20 85°C Typ Max 27 27 32 32 –5.2 –4.5 –5.5 –5.5 150 Min –4.75 –4.20 Typ Max Unit 27 31 32 37 mA –5.2 –4.5 –5.5 –5.5 V 150 µA Max Unit 150 AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = GND) –40°C Symbol Characteristic Min Typ 2.0 2.5 315 295 465 455 0°C Max Min Typ 2.2 2.8 365 345 465 455 25°C Max Min Typ 2.2 2.8 375 355 475 465 85°C Max Min Typ 2.2 2.8 430 400 530 510 fMAX Maximum Toggle Frequency tPLH tPHL Propagation Delay to Output tS tH Setup Time Hold Time 150 250 0 100 150 250 0 100 150 250 0 100 150 250 0 100 ps tRR Set/Reset Recovery 400 200 400 200 400 200 400 200 ps tPW Minimum Pulse Width CLK, Set, Reset 400 tr tf Output Rise/Fall Times Q (20% – 80%) 100 MOTOROLA GHz ps CLK S, R 630 630 580 580 400 225 350 100 590 590 400 225 3–2 350 100 645 645 400 225 350 100 ps 225 350 ps ECLinPS and ECLinPS Lite DL140 — Rev 3 MC10EL31 MC100EL31 OUTLINE DIMENSIONS D SUFFIX PLASTIC SOIC PACKAGE CASE 751–05 ISSUE P –A– M 1 4 R 0.25 (0.010) 4X –B– X 45 _ B M 5 P 8 NOTES: 1. DIMENSIONS A AND B ARE DATUMS AND T IS A DATUM SURFACE. 2. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 3. DIMENSIONS ARE IN MILLIMETER. 4. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 6. DIMENSION D DOES NOT INCLUDE MOLD PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. J M_ C F G –T– K SEATING PLANE 8X D 0.25 (0.010) M T B S A S DIM A B C D F G J K M P R MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.18 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 Motorola reserves the right to make changes without further notice to any products herein. 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How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315 MFAX: [email protected] – TOUCHTONE 602–244–6609 INTERNET: http://Design–NET.com ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 ◊ ECLinPS and ECLinPS Lite DL140 — Rev 3 3–3 *MC10EL31/D* MC10EL31/D MOTOROLA