ONSEMI 7WB3126MUTAG

7WB3126
2-Bit Bus Switch
The 7WB3126 is an advanced high−speed low−power 2−bit bus
switch in ultra−small footprints.
Features
•
•
•
•
•
•
•
High Speed: tPD = 0.25 ns (Max) @ VCC = 4.5 V
3 W Switch Connection Between 2 Ports
Power Down Protection Provided on Inputs
Zero Bounce
TTL−Compatible Control Inputs
Ultra−Small Pb−Free Packages
These are Pb−Free Devices
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MARKING
DIAGRAMS
ALM
G
1
ULLGA8
1.45 x 1.0
CASE 613AA
M
G
1
ULLGA8
1.6 x 1.0
CASE 613AB
AUM
G
1
ULLGA8
1.95 x 1.0
CASE 613AC
AUM
G
D
1
UDFN8
MU SUFFIX
CASE 517AJ
8
8
Micro8]
DM SUFFIX
CASE 846A
3126
AYWG
G
1
A
Y
W
M
G
= Assembly Location
= Year
= Work Week
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
© Semiconductor Components Industries, LLC, 2010
April, 2010 − Rev. 0
1
Publication Order Number:
7WB3126/D
7WB3126
OE1
A1
1
8
2
7
VCC
OE2
B2
3
6
B1
GND
4
5
A2
OE1
1
8
VCC
A1
2
7
OE2
B2
3
6
B1
GND
4
5
A2
Figure 2. Micro8
(Top View)
Figure 1. ULLGA8/UDFN8
(Top Thru−View)
A1
B1
FUNCTION TABLE
OE1
A2
B2
OE2
Figure 3. Logic Diagram
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2
Input OEn
Function
L
Disconnect
H
Bn = An
7WB3126
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
Parameter
−0.5 to +7.0
V
VIN
Control Pin Input Voltage
−0.5 to +7.0
V
VI/O
Switch Input / Output Voltage
−0.5 to +7.0
V
IIK
Control Pin DC Input Diode Current
VIN < GND
−50
mA
IOK
Switch I/O Port DC Diode Current
VI/O < GND
−50
mA
IO
ON−State Switch Current
$128
mA
Continuous Current Through VCC or GND
$150
mA
ICC
DC Supply Current Per Supply Pin
$150
mA
IGND
DC Ground Current per Ground Pin
$150
mA
TSTG
Storage Temperature Range
−65 to +150
°C
260
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
TJ
Junction Temperature Under Bias
qJA
Thermal Resistance
PD
Power Dissipation in Still Air at 85°C
MSL
FR
VESD
ILATCHUP
150
°C
UDFN8 (Note 1)
ULLGA8
Micro8
111
455
392
°C/W
UDFN8
ULLGA8
Micro8
1127
274
319
mW
Moisture Sensitivity
Level 1
Flammability Rating Oxygen Index: 28 to 34
ESD Withstand Voltage
UL 94 V−0 @ 0.125 in
Human Body Mode (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
> 2000
> 200
N/A
V
$200
mA
Latchup Performance Above VCC and Below GND at 125°C (Note 5)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA / JESD22−A114−A.
3. Tested to EIA / JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA / JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
4.0
5.5
V
VCC
Positive DC Supply Voltage
VIN
Control Pin Input Voltage
0
5.5
V
VI/O
Switch Input / Output Voltage
0
5.5
V
−55
+125
°C
0
0
5
DC
nS/V
TA
Operating Free−Air Temperature
Dt/DV
Input Transition Rise or Fall Rate
Control Input
Switch I/O
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3
7WB3126
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
VCC
(V)
Conditions
Min
Typ
4.5
Max
Min
−1.2
Max
Unit
−1.2
V
VIK
Clamp Diode Voltage
VIH
High−Level Input Voltage
(Control)
4.0 to
5.5
VIL
Low−Level Input Voltage
(Control)
4.0 to
5.5
0.8
0.8
V
VOH
Output Voltage High
See Figure 4
Input Leakage Current
0 v VIN v 5.5 V
5.5
$0.1
$1.0
mA
IOFF
Power Off Leakage Current
VI/O = 0 to 5.5 V
0
$0.1
$1.0
mA
ICC
Quiescent Supply Current
IO = 0,
VIN = VCC or 0 V
5.5
$0.1
$1.0
mA
DICC
Increase in Supply Current
(Control Pin)
One input at 3.4 V;
Other inputs at
VCC or GND
5.5
2.5
mA
RON
Switch ON Resistance
VI/O = 0,
II/O = 64 mA
II/O = 30 mA
4.5
IIN
II/O = −18 mA
TA =
−555C to +1255C
TA = 255C
2.0
VI/O = 2.4,
II/O = 15 mA
VI/O = 2.4,
II/O = 15 mA
4.0
2.0
V
3
3
7
7
7
7
6
15
15
10
20
20
W
AC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
VCC
(V)
Test Condition
TA =
−555C to +1255C
TA = 25 5C
Min
Typ
Max
Min
Unit
0.25
ns
ns
tPD
Propagation Delay,
Bus to Bus
See Figure 5
4.0 to
5.5
tEN
Output Enable Time
See Figure 5
4.5 to
5.5
0.8
2.5
4.2
0.8
4.2
4.0
0.8
3.0
4.6
0.8
4.6
4.5 to
5.5
0.8
3.0
4.8
0.8
4.8
4.0
0.8
2.9
4.4
0.8
4.4
tDIS
CIN
Output Disable Time
0.25
Max
ns
Control Input Capacitance
VIN = 5 or 0 V
5.0
2.5
pF
CIO(ON)
Switch On Capacitance
Switch ON
5.0
10
pF
CIO(OFF)
Switch Off Capacitance
Switch OFF
5.0
5
pF
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4
7WB3126
TYPICAL DC CHARACTERISTICS
4.50
VOH, HIGH LEVEL OUTPUT
VOLTAGE (V)
4.25
−6 mA
4.00
−12 mA
3.75
IOH =
−0.1 mA
3.50
3.25
−24 mA
3.00
2.75
TA = +85°C
VIN = VCC
2.50
2.25
4.00
4.25
4.75
5.25
5.00
5.50
5.75
5.60
VCC, SUPPLY VOLTAGE (V)
4.50
VOH, HIGH LEVEL OUTPUT
VOLTAGE (V)
4.25
−6 mA
−12 mA
4.00
3.75
IOH =
−0.1 mA
3.50
3.25
−24 mA
3.00
2.75
TA = +25°C
VIN = VCC
2.50
2.25
4.00
4.25
4.75
5.25
5.00
5.50
5.75
5.60
VCC, SUPPLY VOLTAGE (V)
4.50
VOH, HIGH LEVEL OUTPUT
VOLTAGE (V)
4.25
−6 mA
4.00
−12 mA
3.75
IOH =
−0.1 mA
3.50
3.25
−24 mA
3.00
2.75
TA = −40°C
VIN = VCC
2.50
2.25
4.00
4.25
4.75
5.25
5.00
5.50
5.75
5.60
VCC, SUPPLY VOLTAGE (V)
Figure 4. Output Voltage High vs Supply Voltage
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5
7WB3126
AC LOADING AND WAVEFORMS
Parameter Measurement Information
From Output
Under Test
500 W
S1
7V
Test
S1
tPD
Open
tPLZ/tPZL
7V
tPHZ/tPZH
Open
Open
GND
CL = 50 pF*
500 W
*CL includes probes and jig capacitance.
3V
1.5 V
1.5 V
Output
Control
Input
tPHL
VOH
1.5 V
Output
1.5 V
1.5 V
Output
Waveform 2
S1 at Open
(Note 6)
VOL
Voltage Waveforms
Propagation Delay Times
1.5 V
3V
0V
tPLZ
tPZL
Output
Waveform 1
S1 at 7 V
(Note 6)
tPZH
0V
tPLH
1.5 V
1.5 V
3.5 V
VOL + 0.3 V
VOL
tPHZ
VOH
VOH − 0.3 V
0V
Voltage Waveforms
Enable and Disable Times
6. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control
7. All input pulses are supplied by generators having the following characteristics: PRR v 10 MHz, ZO = 50 W, tr v 2.5 ns, tf v 2.5 ns.
8. The outputs are measured one at a time, with one transition per measurement.
9. tPLZ and tPHZ are the same as tDIS.
10. tPZL and tPZH are the same as tEN.
11. tPHL and tPLH are the same as tPD.
Figure 5. tPD, tEN, tDIS Loading and Waveforms
ORDERING INFORMATION
Package
Shipping†
UDFN8
(Pb−Free)
3000 / Tape & Reel
7WB3126AMX1TCG
ULLGA8 – 0.5 mm Pitch
(Pb−Free)
3000 / Tape & Reel
7WB3126BMX1TCG
ULLGA8 – 0.4 mm Pitch
(Pb−Free)
3000 / Tape & Reel
7WB3126CMX1TCG
ULLGA8 – 0.35 mm Pitch
(Pb−Free)
3000 / Tape & Reel
Micro8
(Pb−Free)
4000 / Tape & Reel
Device
7WB3126MUTAG
7WB3126DMR2G
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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6
7WB3126
PACKAGE DIMENSIONS
UDFN8 1.8 x 1.2, 0.4P
CASE 517AJ−01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 mm FROM TERMINAL TIP.
4. MOLD FLASH ALLOWED ON TERMINALS
ALONG EDGE OF PACKAGE. FLASH MAY
NOT EXCEED 0.03 ONTO BOTTOM
SURFACE OF TERMINALS.
5. DETAIL A SHOWS OPTIONAL
CONSTRUCTION FOR TERMINALS.
A B
D
0.10 C
PIN ONE
REFERENCE
ÉÉ
ÉÉ
0.10 C
L1
E
DETAIL A
NOTE 5
TOP VIEW
(A3)
0.05 C
DIM
A
A1
A3
b
b2
D
E
e
L
L1
L2
A
0.05 C
SIDE VIEW
e/2
A1
e
(b2)
1
C
SEATING
PLANE
DETAIL A
8X
L
4
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.15
0.25
0.30 REF
1.80 BSC
1.20 BSC
0.40 BSC
0.45
0.55
0.00
0.03
0.40 REF
MOUNTING FOOTPRINT*
SOLDERMASK DEFINED
(L2)
8
5
BOTTOM VIEW
8X
8X b
0.10
M
C A B
0.05
M
C
0.66
7X
0.22
NOTE 3
1.50
1
0.32
0.40 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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7
7WB3126
PACKAGE DIMENSIONS
ULLGA8 1.45x1.0, 0.35P
CASE 613AA−01
ISSUE A
ÉÉÉ
ÉÉÉ
ÉÉÉ
PIN ONE
REFERENCE
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.10 C
0.05 C
A
8X
0.05 C
SEATING
PLANE
SIDE VIEW
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
C
A1
MILLIMETERS
MIN
MAX
−−−
0.40
0.00
0.05
0.15
0.25
1.45 BSC
1.00 BSC
0.35 BSC
0.25
0.35
0.30
0.40
7X
0.48
8X
0.22
e/2
e
1
7X
L
NOTE 4
4
1.18
L1
0.53
8
5
8X
b
0.05 C
PKG
OUTLINE
0.35
PITCH
DIMENSIONS: MILLIMETERS
0.10 C A B
BOTTOM VIEW
1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOTE 3
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8
7WB3126
PACKAGE DIMENSIONS
ULLGA8 1.6x1.0, 0.4P
CASE 613AB−01
ISSUE A
PIN ONE
REFERENCE
0.10 C
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
ÉÉÉ
ÉÉÉ
ÉÉÉ
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.05 C
A
8X
0.05 C
SEATING
PLANE
SIDE VIEW
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
C
A1
MILLIMETERS
MIN
MAX
−−−
0.40
0.00
0.05
0.15
0.25
1.60 BSC
1.00 BSC
0.40 BSC
0.25
0.35
0.30
0.40
7X
0.49
e/2
e
1
4
8
5
7X
L
NOTE 4
1.24
L1
0.53
8X
b
0.05 C
1
PKG
OUTLINE
0.40
PITCH
DIMENSIONS: MILLIMETERS
0.10 C A B
BOTTOM VIEW
8X
0.26
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOTE 3
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9
7WB3126
PACKAGE DIMENSIONS
ULLGA8 1.95x1.0, 0.5P
CASE 613AC−01
ISSUE A
PIN ONE
REFERENCE
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.10 C
0.05 C
MILLIMETERS
MIN
MAX
−−−
0.40
0.00
0.05
0.15
0.25
1.95 BSC
1.00 BSC
0.50 BSC
0.25
0.35
0.30
0.40
A
8X
0.05 C
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
SEATING
PLANE
SIDE VIEW
7X
C
A1
0.49
8X
0.30
e/2
e
7X
L
NOTE 4
4
1
1.24
L1
0.53
8
5
BOTTOM VIEW
8X
b
0.10 C A B
0.05 C
1
PKG
OUTLINE
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOTE 3
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10
7WB3126
PACKAGE DIMENSIONS
Micro8t
CASE 846A−02
ISSUE H
D
HE
PIN 1 ID
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.
E
e
b 8 PL
0.08 (0.003)
M
T B
S
A
S
SEATING
−T− PLANE
0.038 (0.0015)
A
A1
MILLIMETERS
NOM
MAX
−−
1.10
0.08
0.15
0.33
0.40
0.18
0.23
3.00
3.10
3.00
3.10
0.65 BSC
0.40
0.55
0.70
4.75
4.90
5.05
DIM
A
A1
b
c
D
E
e
L
HE
MIN
−−
0.05
0.25
0.13
2.90
2.90
INCHES
NOM
−−
0.003
0.013
0.007
0.118
0.118
0.026 BSC
0.016
0.021
0.187
0.193
MIN
−−
0.002
0.010
0.005
0.114
0.114
MAX
0.043
0.006
0.016
0.009
0.122
0.122
0.028
0.199
L
c
SOLDERING FOOTPRINT*
8X
1.04
0.041
0.38
0.015
3.20
0.126
6X
8X
4.24
0.167
0.65
0.0256
5.28
0.208
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Micro8 is a trademark of International Rectifier.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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11
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
7WB3126/D