MMBD2837LT1, MMBD2838LT1 Monolithic Dual Switching Diodes Features http://onsemi.com • Pb−Free Packages are Available ANODE 1 3 CATHODE 2 ANODE MAXIMUM RATINGS (EACH DIODE) Rating Symbol Value Unit Peak Reverse Voltage VRM 75 Vdc D.C. Reverse Voltage VR MMBD2837LT1 MMBD2838LT1 Vdc 30 50 3 Peak Forward Current IFM 450 300 mAdc Average Rectified Current IO 150 100 mAdc SOT−23 (TO−236AB) CASE 318 STYLE 9 1 2 Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. MARKING DIAGRAM THERMAL CHARACTERISTICS xxx M Rating Symbol Value Unit Total Device Dissipation FR− 5 Board (Note 1) TA = 25°C Derate above 25°C PD 225 mW 1.8 mW/°C RJA 556 °C/W PD 300 mW 2.4 mW/°C RJA 417 °C/W TJ, Tstg −55 to +150 °C Thermal Resistance, Junction−to−Ambient Total Device Dissipation Alumina Substrate, (Note 2) TA = 25°C Derate above 25°C Thermal Resistance, Junction−to−Ambient Junction and Storage Temperature 1 xxx M ORDERING INFORMATION Device MMBD2837LT1 1. FR−5 = 1.0 0.75 0.062 in. 2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina. = Specific Device Code MMBD2837LT1 − A5 MMBD2838LT1 − MA6 = Date Code MMBD2837LT1G MMBD2838LT1 MMBD2838LT1G Package Shipping† SOT−23 3000 Tape & Reel SOT−23 (Pb−Free) 3000 Tape & Reel SOT−23 3000 Tape & Reel SOT−23 (Pb−Free) 3000 Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Semiconductor Components Industries, LLC, 2005 March, 2005 − Rev. 5 1 Publication Order Number: MMBD2837LT1/D MMBD2837LT1, MMBD2838LT1 ELECTRICAL CHARACTERISTICS (EACH DIODE) (TA = 25°C unless otherwise noted) Characteristic Symbol Min Max Unit V(BR) 35 75 − − Vdc − − 0.1 0.1 OFF CHARACTERISTICS Reverse Breakdown Voltage (I(BR) = 100 Adc) MMBD2837LT1 MMBD2838LT1 Reverse Voltage Leakage Current (Note 3.) (VR = 30 Vdc) (VR = 50 Vdc) Adc IR MMBD2837LT1 MMBD2838LT1 Diode Capacitance (VR = 0 V, f = 1.0 MHz) CT − 4.0 pF Forward Voltage (IF = 10 mAdc) Forward Voltage (IF = 50 mAdc) Forward Voltage (IF = 100 mAdc) VF − − − 1.0 1.0 1.2 Vdc Reverse Recovery Time (IF = IR = 10 mAdc, IR(REC) = 1.0 mAdc) (Figure 1) trr − 4.0 ns 3. For each individual diode while the second diode is unbiased. 820 +10 V 2.0 k 100 H tr 0.1 F IF tp t IF trr 10% t 0.1 F 90% DUT 50 OUTPUT PULSE GENERATOR 50 INPUT SAMPLING OSCILLOSCOPE VR IR INPUT SIGNAL iR(REC) = 1.0 mA OUTPUT PULSE (IF = IR = 10 mA; MEASURED at iR(REC) = 1.0 mA) Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA. Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA. Notes: 3. tp » trr Figure 1. Recovery Time Equivalent Test Circuit http://onsemi.com 2 MMBD2837LT1, MMBD2838LT1 CURVES APPLICABLE TO EACH CATHODE I F, FORWARD CURRENT (mA) 100 TA = 85°C TA = −40°C 10 TA = 25°C 1.0 0.1 0.2 0.4 0.6 0.8 1.0 1.2 40 50 VF, FORWARD VOLTAGE (VOLTS) Figure 2. Forward Voltage I R , REVERSE CURRENT ( A) 10 TA = 150°C TA = 125°C 1.0 TA = 85°C 0.1 TA = 55°C 0.01 0.001 TA = 25°C 0 10 20 30 VR, REVERSE VOLTAGE (VOLTS) Figure 3. Leakage Current CD, DIODE CAPACITANCE (pF) 1.0 0.9 0.8 0.7 0.6 0 2 4 6 VR, REVERSE VOLTAGE (VOLTS) Figure 4. Capacitance http://onsemi.com 3 8 MMBD2837LT1, MMBD2838LT1 PACKAGE DIMENSIONS SOT−23 (TO236) CASE 318−18 ISSUE AK A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 318−01 THRU −07 AND −09 OBSOLETE, NEW STANDARD 318−08. L 3 1 V B S 2 G DIM A B C D G H J K L S V C D H J K INCHES MIN MAX 0.1102 0.1197 0.0472 0.0551 0.0350 0.0440 0.0150 0.0200 0.0701 0.0807 0.0005 0.0040 0.0034 0.0070 0.0140 0.0285 0.0350 0.0401 0.0830 0.1039 0.0177 0.0236 MILLIMETERS MIN MAX 2.80 3.04 1.20 1.40 0.89 1.11 0.37 0.50 1.78 2.04 0.013 0.100 0.085 0.177 0.35 0.69 0.89 1.02 2.10 2.64 0.45 0.60 STYLE 9: PIN 1. ANODE 2. ANODE 3. CATHODE SOLDERING FOOTPRINT* 0.95 0.037 0.95 0.037 2.0 0.079 0.9 0.035 0.8 0.031 SCALE 10:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. 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