Bourns CI201210-3N3D Multi-layer chip inductor Datasheet

Features
Applications
■ 0805 size
■
■ Available in E12 Series
■
Mobil phones
Cellular phones
■ CTV, VCR, HIC, FDD
■ Automotive electronics
■ High frequency
■ Nickel barrier
CI201210 Series - Multi-Layer Chip Inductors
Electrical Specifications
Bourns Part No.
CI201210-1N0D
CI201210-1N2D
CI201210-1N5D
CI201210-1N8D
CI201210-2N2D
CI201210-2N7D
CI201210-3N3D
CI201210-3N9D
CI201210-4N7D
CI201210-5N6D
CI201210-6N8J
CI201210-8N2J
CI201210-10NJ
CI201210-12NJ
CI201210-15NJ
CI201210-18NJ
CI201210-22NJ
CI201210-27NJ
CI201210-33NJ
CI201210-39NJ
CI201210-47NJ
CI201210-56NJ
CI201210-68NJ
CI201210-82NJ
CI201210-R10J
CI201210-R12J
CI201210-R15J
CI201210-R18J
CI201210-R22J
CI201210-R27J
CI201210-R33J
CI201210-R39J
CI201210-R47J
Inductance
nH
Tol.%
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
±0.3nH
±0.3nH
±0.3nH
±0.3nH
±0.3nH
±0.3nH
±0.3nH
±0.3nH
±0.3nH
±0.3nH
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
Q
min.
Test Freq.
L,Q MHz
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
15
15
15
15
15
15
15
15
15
15
15
15
10
10
10
10
10
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
50
50
50
50
50
50
50
50
SRF MHz
min.
typ.
4000
4000
4000
4000
3800
3600
3400
3200
3000
2800
2600
2200
1800
1650
1350
1350
1100
1100
1000
900
850
750
400
600
500
450
400
350
330
300
270
220
180
12000
10000
10000
8000
8000
6000
6000
5400
4500
4000
3650
3000
2500
2450
2000
1750
1700
1550
1350
1300
1200
1150
1000
850
730
650
550
500
450
410
370
330
280
DCR
ohm max.
I rms
mA max.
0.10
0.10
0.10
0.10
0.10
0.10
0.13
0.15
0.20
0.23
0.25
0.28
0.30
0.35
0.40
0.45
0.50
0.55
0.60
0.65
0.70
0.75
0.80
0.90
1.00
1.30
1.50
1.80
2.00
2.50
3.00
3.50
4.00
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
250
250
250
250
250
250
250
250
General Specifications
Temperature Rise
....................20˚C max. at rated current
Operating Temperature ..-55°C to +125°C
Storage Temperature ....-55°C to +125°C
Reflow Soldering.....230°C, 10 sec. max.
Resistance to Soldering Heat
................................260˚C, 10 seconds
Materials
Base Material .............................Ceramic
Terminal Electrode ...................Ag, Ni, Sn
Packaging..................3,000 pcs. per reel
Product Dimensions
1.0 ± 0.2
(.039 ± .008)
.05
MAX.
(.002)
1.25 ± 0.2
(.049 ± .008)
2.0 ± 0.2
(.079 ± .008)
DIMENSIONS:
MM
(INCHES)
Recommended Layout
1.2
(.047)
REF.
1.8
(.071)
REF.
1.2
(.047)
REF.
0.8
REF.
(.031)
Packaging Specifications
2.0 ± 0.8
(.079 ± .031)
178.0
(7.00)
DIA.
21.0 ± 0.8
(.827 ± .031)
12.0
(.472)
13.0 ± 0.5
(.512 ± .020)
DIA.
50.0
(1.969)
13.0 ± 0.5
DIA.
(.512 ± .020)
9.0
(.354)
Specifications are subject to change without notice.
CI201210 Series - Multi-Layer Chip Inductors
Electrical Specifications
Q Characteristics
Inductance Characteristics
100
1000
Inductance (nH)
80
100
60
Q
22nH
40
10
10nH
6.8nH
4.7nH
10nH
20
22nH
1
10
100
1000
Frequency (MHz)
REV. 10/01
Specifications are subject to change without notice.
10000
0
10
100
1000
Frequency (MHz)
6.8nH
4.7nH
10000
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