Sanken LC5547LF Single-stage power factor corrected off-line switching regulator ic Datasheet

LC5540LF Series
Single-Stage Power Factor Corrected
Off-Line Switching Regulator ICs
Features and Benefits
Description
• Integrated on-time control circuit (it realizes high power
factor by average current control)
• Integrated startup circuit (no external startup
circuit necessary)
• Integrated soft-start circuit (reduces power stress during
start-up on the incorporated power MOSFET and
output rectifier)
• Integrated bias assist circuit (improves startup
performance, suppresses VCC voltage droop during
operation, and allows use of low-rated ceramic capacitor
on VCC pin)
• Integrated Leading Edge Blanking (LEB) circuit
• Integrated maximum on-time limit circuit
• Protection features:
▫ Overcurrent protection (OCP): pulse-by-pulse
▫ Overvoltage protection (OVP): latched shutdown
▫ Overload protection (OLP): latched shutdown
▫ Thermal shutdown (TSD): latched shutdown
The LC5540LF series is the power IC for the isolated type
LED driver which has an incorporated power MOSFET,
designed for input capacitorless applications, and making it
possible for systems to comply with the harmonics standard
(IEC61000-3-2 class C), even during light load condition.
The controller adapts the average current control method
for realizing high power factors, and the quasi-resonant
topology contributes to high efficiency and low EMI noise.
The series is housed in TO-220 packages. The rich set of
protection features helps to realize low component counts,
and high performance-to-cost power supply.
Packages: 7-pin TO-220F
Not to scale
The incorporated MOSFET has a VDSS(min) rating from
650 V (LC5546LF and LC5547LF) to 800 V (LC5549LF).
The RDS(on)(max) is 1.1 Ω (LC5547LF) to 1.9 Ω
(LC5546LF). It is capable of a maximum output power of
80 W on 230 VAC supply to 55 W on universal input supply
(85 to 265VAC) (LC5547LF) based on the thermal rating.
Note that the maximum output power can be up to 120% to
140% of this value. However, it may be limited in applications with low output voltage or short duty cycle.
Applications
LF 3052
LF 3051
• LED lighting fixtures
• LED light bulbs
LF 3054
Typical Application
F1
VAC
L1
C11
D1
D2
D3
D4
T1
L2
C1
C8
D8
R5
R8 R10
PC2
C2
C9
Q1
C10
D5
R1
U1
LC554xLF
R9
PC1
R11
R12
C13
C4
DZ2
PC2
Controller
Chip
C17
D6
R14
R17
R15
R18
-
DZ1
C12
R6
LED
R13
D9
U2
+
C14
C15
R16
C16
R19 R20
D/ST S/GND VCC OCP FB NC OVP
1
2
3
4
5
C3
LC5540LF-DS
7
R7
C5
ROCP
6
R3
C6
R21
C18 DZ3
R4
PC1
D7
C7
SANKEN ELECTRIC CO., LTD.
http://www.sanken-ele.co.jp/en/
January 28, 2013
LC5540LF
Series
Single-Stage Power Factor Corrected
Off-Line Switching Regulator ICs
Selection Guide
MOSFET
VDSS(min)
(V)
Part
Number
LC5546LF
RDS(on)
(max)
(Ω)
650
LC5547LF
LC5549LF
800
PWM Operation
Frequency, fOSC(typ)
(kHz)
On-Time
tON(MAX)(typ)
(μs)
POUT*
(W)
230 VAC
85 to 265
VAC
60
40
1.9
1.1
40
17.5
1.7
80
55
60
40
*Based on the thermal rating; the allowable maximum output power can be up to 120% to 140% of
this value. However, maximum output power may be limited in such an application with low output
voltage or short duty cycle.
The polarity value for current specifies a sink as "+," and a source as “−,” referencing the IC.
Absolute Maximum Ratings Unless specifically noted, TA is 25°C
Characteristic
Symbol
Notes
Pins
LC5546LF
Drain
Current1
IDPeak
LC5547LF
Single pulse
1–2
LC5549LF
LC5549LF
ILPeak = 2.8 A, VDD = 99 V, L = 20 mH
A
10.5
A
mJ
mJ
92
mJ
VCC
3–2
35
V
VOCP
4–2
−2.0 to 5.0
V
FB Pin Voltage
VFB
5–2
−0.3 to 7.0
V
OVP Pin Voltage
VOVP
7–2
−0.3 to 5.0
V
20.2
W
23.6
W
1.8
W
OCP Pin Voltage
ILPeak = 4.4 A, VDD = 99 V, L = 20 mH
13.0
99
Control Part Input Voltage
ILPeak = 2.9 A, VDD = 99 V, L = 20 mH
A
233
EAS
LC5547LF
Unit
9.2
1–2
Single Pulse Avalanche Energy2
LC5546LF
Rating
LC5546LF
Allowable Power Dissipation of
MOSFET3
PD1
LC5547LF
With infinite heatsink
LC5549LF
1–2
Without heatsink
Internal Frame Temperature in
Operation
TF
―
−20 to 115
°C
Operating Ambient Temperature
TOP
―
−55 to 115
°C
Storage Temperature
Tstg
―
−55 to 125
°C
Channel Temperature
Tch
―
150
°C
1Refer
to MOSFET Safe Operating Area Curve.
to MOSFET Avalanche Energy Derating Coefficient Curve.
3Refer to MOSFET Temperature versus Power Dissipation Curve.
2Refer
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January 28, 2013
LC5540LF
Series
Single-Stage Power Factor Corrected
Off-Line Switching Regulator ICs
Electrical Characteristics of Control Part Unless specifically noted, TA is 25°C, VCC = 20 V
Characteristic
Symbol
Test Conditions
Pins
Min.
Typ.
Max.
Unit
Power Supply Startup Operation
Operation Start Voltage
VCC(ON)
3–2
13.8
15.1
17.3
V
Operation Stop Voltage*
VCC(OFF)
3–2
8.4
9.4
10.7
V
ICC(ON)
3–2
–
–
4.7
mA
VSTARTUP
1–2
18
21
24
V
3–2
−8.5
−4.0
−1.5
mA
VCC(BIAS)
3–2
9.5
11.0
12.5
V
fOSC
1–2
33
40
47
kHz
Maximum On-Time
tON(MAX)
1–2
14
17.5
21
μs
FB Pin Control Minimum Voltage
VFB(MIN)
5–2
0.50
0.85
1.20
V
Circuit Current in Operation
Startup Circuit Operation Voltage
Startup Current
Startup Current Threshold Biasing
Voltage*
ICC(STARTUP) VCC = 13 V
Normal Operation
PWM Operation Frequency
Maximum Feedback Current
IFB(MAX)
5–2
–40
–25
–10
μA
Leading Edge Blanking Time
tON(LEB)
4–2
−
600
−
ns
Quasi-Resonant Operation Threshold
Voltage-1
VBD(TH1)
4–2
0.14
0.24
0.34
V
Quasi-Resonant Operation Threshold
Voltage-2
VBD(TH2)
4–2
0.11
0.16
0.21
V
OCP Pin Overcurrent Protection
(OCP) Threshold Voltage
VOCP
4–2
−0.66
−0.60
−0.54
V
OCP Pin Source Current
Protection Operation
IOCP
4–2
−120
−40
−10
μA
OCP Pin Overvoltage Protection
(OVP) Operation Voltage
VBD(OVP)
4–2
2.2
2.6
3.0
V
Overload Protection (OLP) Threshold
Voltage
VFB(OLP)
5–2
4.1
4.5
4.9
V
OVP Pin OVP Threshold Voltage
VOVP(OVP)
7–2
1.6
2.0
2.4
V
VCC Pin OVP Threshold Voltage
VCC(OVP)
3–2
28.5
31.5
34.0
V
TJ(TSD)
―
135
–
–
°C
Thermal Shutdown Activating
Temperature
*VCC(BIAS) > VCC(OFF) always.
LC5540LF-DS
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January 28, 2013
LC5540LF
Series
Single-Stage Power Factor Corrected
Off-Line Switching Regulator ICs
Electrical Characteristics of MOSFET Unless specifically noted, TA is 25°C
Characteristic
Drain-to-Source Breakdown Voltage
Symbol
VDSS
Test Conditions
LC5546LF
LC5547LF
Pins
1–2
LC5549LF
Drain Leakage Current
1–2
IDSS
LC5546LF
On-Resistance
RDS(ON)
LC5547LF
1–2
LC5549LF
Switching Time
tf
LC5546LF
LC5547LF
1–2
LC5549LF
LC5546LF
Thermal Resistance*
Rθch-F
LC5547LF
LC5549LF
―
Min.
Typ.
Max.
Unit
650
―
―
V
800
―
―
V
―
―
300
μA
―
―
1.9
Ω
―
―
1.1
Ω
―
―
1.7
Ω
―
―
400
ns
―
―
300
ns
―
―
3.1
°C/W
―
―
2.2
°C/W
*The thermal resistance between the channels of the MOSFET and the internal frame.
LC5540LF-DS
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January 28, 2013
LC5540LF
Series
Single-Stage Power Factor Corrected
Off-Line Switching Regulator ICs
Characteristic Performance
LC5546LF
MOSFET Safe Operating Area Curve
10
0.1 ms
100
Drain current limited
by on-resistance
80
Drain Current, ID (A)
Safe Operating Area
Temperature Derating Coefficient (%)
S. O. A. Temperature Derating Coefficient Curve
60
40
20
0
0
25
50
75
100
125
1
1 ms
TA = 25°C, single pulse
0.1
150
To use this graph, apply the S.O.A
temperature derating coefficient
taken from the graph at the left
Channel Temperature, Tch (°C)
0.01
10
100
1000
Drain-to-Source Voltage, VDS (V)
MOSFET Temperature versus Power Dissipation Curve
80
60
40
20
0
25
50
75
100
125
150
30
25
20.2
20
With infinite
heatsink
15
10
5
Without
heatsink
1.8
0
0
Channel Temperature, Tch (°C)
25
50
115
100
Allowable Power Dissipation, PD1 (W)
EAS
Temperature Derating Coefficient (%)
MOSFET Avalanche Energy Derating Coefficient Curve
75
100
125
150
Ambient Temperature, TA (°C)
Transient Thermal Resistance, Rθch-c (°C/W)
Transient Thermal Resistance Curve
10
1
0.1
0.01
0.001
10-6
10-5
10-4
10-3
10-2
10-1
Time (s)
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January 28, 2013
LC5540LF
Series
Single-Stage Power Factor Corrected
Off-Line Switching Regulator ICs
Characteristic Performance
LC5547LF
MOSFET Safe Operating Area Curve
100
TA = 25°C, single pulse
Drain current limited
by on-resistance
100
0.1 ms
10
80
Drain Current, ID (A)
Safe Operating Area
Temperature Derating Coefficient (%)
S. O. A. Temperature Derating Coefficient Curve
60
40
20
1 ms
1
0.1
0
0
25
50
75
100
125
150
To use this graph, apply the S.O.A
temperature derating coefficient
taken from the graph at the left
Channel Temperature, Tch (°C)
0.01
1
10
100
1000
Drain-to-Source Voltage, VDS (V)
MOSFET Temperature versus Power Dissipation Curve
80
60
40
20
0
25
50
75
100
125
150
25
23.6
20
With infinite
heatsink
15
10
5
Without
heatsink
1.8
115
100
Allowable Power Dissipation, PD1 (W)
EAS
Temperature Derating Coefficient (%)
MOSFET Avalanche Energy Derating Coefficient Curve
0
0
Channel Temperature, Tch (°C)
25
50
75
100
125
150
Ambient Temperature, TA (°C)
Transient Thermal Resistance, Rθch-c (°C/W)
Transient Thermal Resistance Curve
10
1
0.1
0.01
0.001
10-6
10-5
10-4
10-3
10-2
10-1
Time (s)
LC5540LF-DS
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January 28, 2013
LC5540LF
Series
Single-Stage Power Factor Corrected
Off-Line Switching Regulator ICs
Characteristic Performance
LC5549LF
MOSFET Safe Operating Area Curve
100
TA = 25°C, single pulse
100
Drain current limited
by on-resistance
80
Drain Current, ID (A)
Safe Operating Area
Temperature Derating Coefficient (%)
S. O. A. Temperature Derating Coefficient Curve
60
40
20
0
0
25
50
75
100
125
10
0.1 ms
1 ms
1
150
To use this graph, apply the S.O.A
temperature derating coefficient
taken from the graph at the left
Channel Temperature, Tch (°C)
0.1
10
100
1000
Drain-to-Source Voltage, VDS (V)
MOSFET Temperature versus Power Dissipation Curve
80
60
40
20
0
25
50
75
100
125
150
30
25
23.6
With infinite
heatsink
20
15
10
5
1.8
0
0
Channel Temperature, Tch (°C)
Without
heatsink
25
50
115
100
Allowable Power Dissipation, PD1 (W)
EAS
Temperature Derating Coefficient (%)
MOSFET Avalanche Energy Derating Coefficient Curve
75
100
125
150
Ambient Temperature, TA (°C)
Transient Thermal Resistance, Rθch-c (°C/W)
Transient Thermal Resistance Curve
10
1
0.1
0.01
0.001
10-6
10-5
10-4
10-3
10-2
10-1
Time (s)
LC5540LF-DS
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January 28, 2013
LC5540LF
Series
Single-Stage Power Factor Corrected
Off-Line Switching Regulator ICs
Functional Block Diagram
VCC
③
Control Part
① D/ST
START UP
TSD
UVLO
Reg
Drv
Bias
OVP
7
OVP ⑥
② S/GND
S
RQ
OCP ④
Bottom
Detection
NC ⑥
OCP
OSC
OLP
LEB
Feedback
Control
⑤ FB
Reg
Pin List Table
Number
Name
Function
1
D/ST
MOSFET drain pin and input of the startup current
2
S/GND
MOSFET source and GND pin for the Control Part
3
VCC
Supply voltage input and Overvoltage protection (OVP) signal input
4
OCP
Overcurrent Protection, quasi-resonant signal input pin, and
Overvoltage Protection (OVP) signal input
5
FB
Feedback signal input and Overload Protection (OLP) signal input
6
NC
No connection
7
OVP
Overvoltage Protection (OVP) signal input
Pin-out Diagrams
D/ST
S/GND
2
VCC
3
OCP
4
FB
NC
OVP
LC5540LF-DS
D/ST
1
S/GND
(LF 3051)
5
6
7
1
2
VCC
OCP
3
4
FB
NC
OVP
(LF 3052)
5
6
7
SANKEN ELECTRIC CO., LTD.
1
D/ST
2
S/GND
3
VCC
4
OCP
5
FB
6
NC
7
OVP
(LF 3054)
8
January 28, 2013
LC5540LF
Series
Single-Stage Power Factor Corrected
Off-Line Switching Regulator ICs
Package Outline Drawing
Leadframe 3051
2.6 ±0.2
15 ±0.3
(5.6)
Gate burr
Ø3.2 ±0.2
4.2 ±0.2
2.8 +0.2
10 ±0.2
LC
(1.1)
a
2.6 ±0.1
(At base of pin)
10.4 ±0.5
7-0.62 ±0.15
+0.2
7-0.55 -0.1
R-end
R-end
+0.2
0.45 -0.1
5×P1.17±0.15
=5.85±0.15
2 ±0.15
5±0.5
5±0.5
b
(At base of pin)
5.08±0.6
2.54±0.6
(At tip of pin)
(At tip of pin)
2
1
4
3
6
5
7
0.5
0.5
Front view
Unit: mm
Package: TO-220F-7L
Note: "Gate Burr" shows area
where 0.3 mm (max) gate burr
may be present.
Pin treatment Pb-free. Device composition
compliant with the RoHS directive.
LC5540LF-DS
0.5
0.5
Side view
a: Part # 55xxF
b: Lot number
st
1 letter: Last digit of year
nd
2 letter: Month
Jan to September: Numeric
October: O
November: N
December: D
rd
th
3 and 4 letter: Date
01 to 31: Numeric
th
5 letter: Sanken control number
SANKEN ELECTRIC CO., LTD.
9
January 28, 2013
LC5540LF
Series
Single-Stage Power Factor Corrected
Off-Line Switching Regulator ICs
Package Outline Drawing
Leadframe 3052
2.6 ±0.2
LC
15 ±0.3
(5.6)
Gate burr
Ø3.2 ±0.2
4.2 ±0.2
2.8 +0.2
10 ±0.2
a
(1.1)
2.6 ±0.1
(At base of pin)
5±0.5
b
10.4 ±0.5
7-0.62 ±0.15
+0.2
7-0.55 -0.1
0.45 +0.2
-0.1
5×P1.17±0.15
=5.85±0.15
2 ±0.15
R-end
5.08±0.6
(At base of pin)
(At tip of pin)
0.5
0.5
Front View
1
0.5
0.5
Side View
2 3 4 5 6 7
Unit: mm
Package: TO-220F-7L
a: Part # 55xxLF
b: Lot number
st
1 letter: Last digit of year
nd
2 letter: Month
Jan to September: Numeric
October: O
November: N
December: D
rd
th
3 and 4 letter: Date
01 to 31: Numeric
th
5 letter: Sanken control number
"Gate Burr" shows area
where 0.3 mm (max) gate
burr may be present
Pin treatment Pb-free. Device composition
compliant with the RoHS directive.
LC5540LF-DS
SANKEN ELECTRIC CO., LTD.
10
January 28, 2013
LC5540LF
Series
Single-Stage Power Factor Corrected
Off-Line Switching Regulator ICs
2.8 ±0.2
Package Outline Drawing
Leadframe 3054
2.6 ±0.2
a
b
2.8 ±0.5
(At tip of pin)
2.5 ±0.5
LC
15 ±0.3
(5.6)
Gate burr
4.2±0.2
Ø3.2 ±0.2
10 ±0.2
(1.1)
3-( R1)
2.6 ±0.1
(At base of pin)
(At base of pin)
0.5
(At tip of pin)
5×P 1.17 ±0.15
= 5.85 ±0.15
2 ±0.15
+0.2
0.45 -0.1
7-0.55 +0.2
-0.1
5 ±0.5
7-0.62 ±0.15
3.8 ±0.5
0.5
Plan View
1
0.5
0.5
Side View
2 3 4 5 6 7
Unit: mm
Package: TO-220F-7L
a: Part # 55xxLF
b: Lot number
st
1 letter: Last digit of year
nd
2 letter: Month
Jan to September: Numeric
October: O
November: N
December: D
rd
th
3 and 4 letter: Date
01 to 31: Numeric
th
5 letter: Sanken control number
"Gate Burr" shows area
where 0.3 mm (max) gate
burr may be present
Pin treatment Pb-free. Device composition
compliant with the RoHS directive.
LC5540LF-DS
SANKEN ELECTRIC CO., LTD.
11
January 28, 2013
LC5540LF
Series
Single-Stage Power Factor Corrected
Off-Line Switching Regulator ICs
Because reliability can be affected adversely by improper storage
environments and handling methods, please observe the following
cautions.
Cautions for Storage
•
Ensure that storage conditions comply with the standard
temperature (5°C to 35°C) and the standard relative humidity
(around 40% to 75%); avoid storage locations that experience
extreme changes in temperature or humidity.
•
Avoid locations where dust or harmful gases are present and
avoid direct sunlight.
•
Reinspect for rust on leads and solderability of the products that
have been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and other
standard test periods, protect the products from power surges
from the testing device, shorts between the product pins, and
wrong connections. Ensure all test parameters are within the
ratings specified by Sanken for the products.
Remarks About Using Silicone Grease with a Heatsink
• When silicone grease is used in mounting the products on a
heatsink, it shall be applied evenly and thinly. If more silicone
grease than required is applied, it may produce excess stress.
• Volatile-type silicone greases may crack after long periods of
time, resulting in reduced heat radiation effect. Silicone greases
with low consistency (hard grease) may cause cracks in the mold
resin when screwing the products to a heatsink.
Our recommended silicone greases for heat radiation purposes,
which will not cause any adverse effect on the product life, are
indicated below:
recommended screw torque. For mounting the products, the mounting
surface flatness should be 0.05 mm or less.
• Please select suitable screws for the product shape. Do not use
a flat-head machine screw because of the stress to the products.
Self-tapping screws are not recommended. When using self-tapping
screws, the screw may enter the hole diagonally, not vertically,
depending on the conditions of hole before threading or the work
situation. That may stress the products and may cause failures.
• Recommended screw torque: 0.588 to 0.785 N●m (6 to 8 kgf●cm).
• For tightening screws, if a tightening tool (such as a driver) hits the
products, the package may crack, and internal stress fractures may
occur, which shorten the lifetime of the electrical elements and can
cause catastrophic failure. Tightening with an air driver makes a
substantial impact. In addition, a screw torque higher than the set
torque can be applied and the package may be damaged. Therefore,
an electric driver is recommended.
When the package is tightened at two or more places, first pre-tighten
with a lower torque at all places, then tighten with the specified torque.
When using a power driver, torque control is mandatory.
Soldering
•
When soldering the products, please be sure to minimize the
working time, within the following limits:
260±5°C 10±1 s
(Flow, 2 times)
380±10°C 3.5±0.5 s (Soldering iron, 1 time)
• Soldering should be at a distance of at least 2.0 mm from the
body of the products.
Electrostatic Discharge
•
When handling the products, the operator must be grounded.
Grounded wrist straps worn should have at least 1 MΩ of
resistance from the operator to ground to prevent shock hazard,
and it should be placed near the operator.
•
Workbenches where the products are handled should be
grounded and be provided with conductive table and floor mats.
•
When using measuring equipment such as a curve tracer, the
equipment should be grounded.
•
When soldering the products, the head of soldering irons or the
solder bath must be grounded in order to prevent leak voltages
generated by them from being applied to the products.
•
The products should always be stored and transported in Sanken
shipping containers or conductive containers, or be wrapped in
aluminum foil.
Type
Suppliers
G746
Shin-Etsu Chemical Co., Ltd.
YG6260
Momentive Performance Materials Inc.
SC102
Dow Corning Toray Co., Ltd.
Cautions for Mounting to a Heatsink
• When the flatness around the screw hole is insufficient, such as when
mounting the products to a heatsink that has an extruded (burred)
screw hole, the products can be damaged, even with a lower than
LC5540LF-DS
SANKEN ELECTRIC CO., LTD.
12
January 28, 2013
LC5540LF
Series
Single-Stage Power Factor Corrected
Off-Line Switching Regulator ICs
• The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the
latest revision of the document before use.
• Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or
any other rights of Sanken or any third party which may result from its use. Unless otherwise agreed in writing by Sanken, Sanken
makes no warranties of any kind, whether express or implied, as to the products, including product merchantability, and fitness for a
particular purpose and special environment, and the information, including its accuracy, usefulness, and reliability, included in this
document.
• Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures
including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device
failure or malfunction.
• Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.).
When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and
its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever
long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales
representative to discuss, prior to the use of the products herein.
The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required
(aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited.
• In the case that you use Sanken products or design your products by using Sanken products, the reliability largely depends on the
degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the
load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general,
derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such
as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. For these stresses,
instantaneous values, maximum values and minimum values must be taken into consideration.
In addition, it should be noted that since power devices or IC's including power devices have large self-heating value, the degree of
derating of junction temperature affects the reliability significantly.
• When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically
or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance
and proceed therewith at your own responsibility.
• Anti radioactive ray design is not considered for the products listed herein.
• Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken's distribution network.
• The contents in this document must not be transcribed or copied without Sanken's written consent.
LC5540LF-DS
SANKEN ELECTRIC CO., LTD.
13
January 28, 2013
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