OPA OPA320, OPA2320 OPA320S, OPA2320S 320 OP A2 OP A2 320 320S OP A2 320 www.ti.com SBOS513E – AUGUST 2010 – REVISED JUNE 2013 Precision, 20MHz, 0.9pA, Low-Noise, RRIO, CMOS Operational Amplifier with Shutdown Check for Samples: OPA320, OPA2320, OPA320S, OPA2320S FEATURES DESCRIPTION • The OPA320 (single) and OPA2320 (dual) are a new generation of precision, low-voltage CMOS operational amplifiers optimized for very low noise and wide bandwidth while operating on a low quiescent current of only 1.45mA. 1 23 • • • • • • • • • Precision with Zero-Crossover Distortion: – Low Offset Voltage: 150μV (max) – High CMRR: 114dB – Rail-to-Rail I/O Low Input Bias Current: 0.9pA (max) Low Noise: 7nV/√Hz at 10kHz Wide Bandwidth: 20MHz Slew Rate: 10V/μs Quiescent Current: 1.45mA/ch Single-Supply Voltage Range: 1.8V to 5.5V OPA320S, OPA2320S: – IQ in Shutdown Mode: 0.1μA Unity-Gain Stable Small Packages: – SOT23, MSOP, DFN APPLICATIONS • • • • • • • • High-Z Sensor Signal Conditioning Transimpedance Amplifiers Test and Measurement Equipment Programmable Logic Controllers (PLCs) Motor Control Loops Communications Input/Output ADC/DAC Buffers Active Filters The OPA320 series is ideal for low-power, singlesupply applications. Low-noise (7nV/√Hz) and highspeed operation also make them well-suited for driving sampling analog-to-digital converters (ADCs). Other applications include signal conditioning and sensor amplification. The OPA320 features a linear input stage with zerocrossover distortion that delivers excellent commonmode rejection ratio (CMRR) of typically 114dB over the full input range. The input common-mode range extends 100mV beyond the negative and positive supply rails. The output voltage typically swings within 10mV of the rails. In addition, the OPAx320 have a wide supply voltage range from 1.8V to 5.5V with excellent PSRR (106dB) over the entire supply range, making them suitable for precision, low-power applications that run directly from batteries without regulation. The OPA320 (single version) is available in a SOT235 package; the OPA320S shut-down single version is available in an SOT23-6 package. The dual OPA2320 is offered in SO-8, MSOP-8, and DFN-8 packages, and the OPA2320S (dual with shut-down) in an MSOP-10 package. 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. FilterPro is a trademark of Texas Instruments Incorporated. All other trademarks are the property of their respective owners. UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010–2013, Texas Instruments Incorporated OPA320, OPA2320 OPA320S, OPA2320S SBOS513E – AUGUST 2010 – REVISED JUNE 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION (1) (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or visit the device product folder at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range, unless otherwise noted. Supply voltage, VS = (V+) – (V–) Signal input pins Voltage (2) Current (2) OPA320, OPA320S, OPA2320, OPA2320S UNIT 6 V (V–) – 0.5 to (V+) + 0.5 V ±10 mA Output short-circuit current (3) Continuous mA Operating temperature, TA –40 to +150 °C Storage temperature, TSTG –65 to +150 °C Junction temperature, TJ ESD ratings (1) (2) (3) 2 +150 °C Human body model (HBM) 4000 V Charged device model (CDM) 1000 V Machine model (MM) 200 V Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current limited to 10mA or less. Short-circuit to ground, one amplifier per package. Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: OPA320 OPA2320 OPA320S OPA2320S OPA320, OPA2320 OPA320S, OPA2320S www.ti.com SBOS513E – AUGUST 2010 – REVISED JUNE 2013 ELECTRICAL CHARACTERISTICS: VS = +1.8V to +5.5V or ±0.9V to ±2.75V Boldface limits apply over the specified temperature range, TA = –40°C to +125°C. At TA = +25°C, RL = 10kΩ connected to VS/2, VCM = VS/2, VOUT = VS/2, and SHDN x = VS+, unless otherwise noted. OPA320, OPA320S, OPA2320, OPA2320S PARAMETER TEST CONDITIONS MIN TYP MAX UNIT OFFSET VOLTAGE Input offset voltage VOS vs Temperature dVOS/dT vs Power supply PSR VS = +5.5V Over temperature Channel separation 40 150 μV 1.5 5 μV/°C 20 μV/V VS = +1.8V to +5.5V 5 VS = +1.8V to +5.5V 15 μV/V At 1kHz 130 dB INPUT VOLTAGE Common-mode voltage range VCM Common-mode rejection ratio CMRR (V–) – 0.1 VS = 5.5V, (V–) – 0.1V < VCM < (V+) + 0.1V Over temperature 100 (V+) + 0.1 V 114 dB 96 dB INPUT BIAS CURRENT Input bias current IB Over temperature ±0.9 pA TA = –40°C to +85°C ±0.2 ±50 pA OPA2320, OPA2320S, TA = –40°C to +125°C ±400 pA ±600 pA OPA320, OPA320S, TA = –40°C to +125°C Input offset current IOS ±0.2 Over temperature ±0.9 pA TA = –40°C to +85°C ±50 pA TA = –40°C to +125°C ±400 pA NOISE f = 0.1Hz to 10Hz 2.8 μVPP f = 1kHz 8.5 nV/√Hz f = 10kHz 7 nV/√Hz f = 1kHz 0.6 fA/√Hz Differential 5 pF Common-mode 4 pF Input voltage noise Input voltage noise density en Input current noise density in INPUT CAPACITANCE OPEN-LOOP GAIN Open-loop voltage gain Phase margin AOL 0.1V < VO < (V+) – 0.1V, RL = 10kΩ 114 132 dB 0.1V < VO < (V+) – 0.1V, RL = 10kΩ 100 130 dB 0.2V < VO < (V+) – 0.2V, RL = 2kΩ 108 123 dB 0.2V < VO < (V+) – 0.2V, RL = 2kΩ 96 130 dB 47 Degrees 20 MHz PM VS = 5V, CL = 50pF FREQUENCY RESPONSE Gain bandwidth product Slew rate Settling time VS = 5.0V, CL = 50pF GBP Unity gain SR G = +1 10 V/μs To 0.1%, 2V step, G = +1 0.25 μs To 0.01%, 2V step, G = +1 0.32 μs To 0.0015%, 2V step, G = +1 (1) 0.5 μs VIN × G > VS 100 ns VO = 4VPP, G = +1, f = 10kHz, RL = 10kΩ 0.0005 % VO = 2VPP, G = +1, f = 10kHz, RL = 600Ω 0.0011 % tS Overload recovery time Total harmonic distortion + noise (2) (1) (2) THD+N Based on simulation. Third-order filter; bandwidth = 80kHz at –3dB. Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: OPA320 OPA2320 OPA320S OPA2320S 3 OPA320, OPA2320 OPA320S, OPA2320S SBOS513E – AUGUST 2010 – REVISED JUNE 2013 www.ti.com ELECTRICAL CHARACTERISTICS: VS = +1.8V to +5.5V or ±0.9V to ±2.75V (continued) Boldface limits apply over the specified temperature range, TA = –40°C to +125°C. At TA = +25°C, RL = 10kΩ connected to VS/2, VCM = VS/2, VOUT = VS/2, and SHDN x = VS+, unless otherwise noted. OPA320, OPA320S, OPA2320, OPA2320S PARAMETER TEST CONDITIONS MIN TYP MAX UNIT RL = 10kΩ 10 20 mV RL = 2kΩ 25 35 mV 30 mV 45 mV OUTPUT Voltage output swing from both rails VO RL = 10kΩ Over temperature RL = 2kΩ Short-circuit current ISC Capacitive load drive CL Open-loop output resistance RO VS = 5.5V ±65 mA See Typical Characteristics IO = 0mA, f = 1MHz 90 All amplifiers disabled, SHDN = V– 0.1 Ω SHUTDOWN (3) Quiescent current per amplifier IQSD OPA2320S only, SHDN A = VS–, SHDN B = VS+ OPA2320S only, SHDN A = VS+, SHDN B = VS– High-level input voltage VIH Amplifier enabled, VS– + 0.7 [(VS+) + |VS–|] Low-level input voltage VIL Amplifier disabled, VS– + 0.3 [(VS+) + |VS–|] Amplifier enable time (4) tON Amplifier disable time (4) tOFF SHDN pin input bias current (per pin) G = 1, VOUT = 0.1 × VS/2, full shutdown 0.5 1.6 1.6 0.7 × VS+ (5) mA 5.5 V 0.3 × VS+ V μs 20 OPA2320S only, partial shutdown (5) μA mA 6 G = 1, VOUT = 0.1 × VS/2 3 μs VIH = 5V 0.13 μA VIL = 0V 0.04 μA POWER SUPPLY Specified voltage range Quiescent current per amplifier VS 1.8 5.5 V IQ OPA320, OPA320S IO = 0mA, VS = +5.5V Over temperature IO = 0mA, VS = +5.5V OPA2320, OPA2320S IO = 0mA, VS = +5.5V Over temperature IO = 0mA, VS = +5.5V Power-on time 1.5 1.45 V+ = 0V to 5V, to 90% IQ level 1.75 mA 1.85 mA 1.6 mA 1.7 mA μs 28 TEMPERATURE Specified range –40 +125 °C Operating range –40 +150 °C (3) (4) (5) 4 Specified by design and characterization; not production tested. Disable time (tOFF) and enable time (tON) are defined as the time between the 50% point of the signal applied to the SHDN pin and the point at which the output voltage reaches the 10% (disable) or 90% (enable) level. Full shutdown refers to the dual OPA2320S having both A and B channels disabled (SHDN A = SHDN B = VS–). For partial shutdown, only one SHDN pin is exercised; in this mode, the internal biasing and oscillator remain operational and the enable time is shorter. Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: OPA320 OPA2320 OPA320S OPA2320S OPA320, OPA2320 OPA320S, OPA2320S www.ti.com SBOS513E – AUGUST 2010 – REVISED JUNE 2013 THERMAL INFORMATION: OPA320, OPA320S THERMAL METRIC (1) OPA320 OPA320S DBV (SOT23) DBV (SOT23) 5 PINS 6 PINS θJA Junction-to-ambient thermal resistance 219.3 177.5 θJC(top) Junction-to-case(top) thermal resistance 107.5 108.9 θJB Junction-to-board thermal resistance 57.5 27.4 ψJT Junction-to-top characterization parameter 7.4 13.3 ψJB Junction-to-board characterization parameter 56.9 26.9 θJC(bottom) Junction-to-case(bottom) thermal resistance N/A N/A (1) UNITS °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. THERMAL INFORMATION: OPA2320, OPA2320S OPA2320 THERMAL METRIC (1) OPA2320S D (SO) DGK (MSOP) DRG (DFN) DGS (MSOP) 8 PINS 8 PINS 8 PINS 10 PINS θJA Junction-to-ambient thermal resistance 122.6 174.8 50.6 171.5 θJC(top) Junction-to-case(top) thermal resistance 67.1 43.9 54.9 43.0 θJB Junction-to-board thermal resistance 64.0 95.0 25.2 91.4 ψJT Junction-to-top characterization parameter 13.2 2.0 0.6 1.9 ψJB Junction-to-board characterization parameter 63.4 93.5 25.3 89.9 θJC(bottom) Junction-to-case(bottom) thermal resistance N/A N/A 5.7 N/A (1) UNITS °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: OPA320 OPA2320 OPA320S OPA2320S 5 OPA320, OPA2320 OPA320S, OPA2320S SBOS513E – AUGUST 2010 – REVISED JUNE 2013 www.ti.com PIN CONFIGURATIONS DBV PACKAGE SOT23-5 (TOP VIEW) OUT 1 V- 2 +IN 3 DRG PACKAGE DFN-8 (TOP VIEW) V+ 5 4 OUT A 1 -IN A 2 +IN A 3 V- 4 -IN DBV PACKAGE SOT23-6 (TOP VIEW) VOUT 1 6 V+ V- 2 5 SHDN +IN 3 4 -IN DGS PACKAGE MSOP-10 (TOP VIEW) VOUT A 1 -IN A 2 Exposed Thermal Die Pad on Underside(2) 8 V+ 7 OUT B 6 -IN B 5 +IN B D, DGK PACKAGES SO-8, MSOP-8 (TOP VIEW) OUT A 1 8 V+ -IN A 2 7 OUT B +IN A 3 6 -IN B V- 4 5 +IN B 10 V+ 9 VOUT B 8 -IN B A +IN A 3 B 6 V- 4 7 +IN B SHDN A 5 6 SHDN B (1) No internal connection. (2) Connect thermal pad to V–. Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: OPA320 OPA2320 OPA320S OPA2320S OPA320, OPA2320 OPA320S, OPA2320S www.ti.com SBOS513E – AUGUST 2010 – REVISED JUNE 2013 TYPICAL CHARACTERISTICS At TA = +25°C, VCM = VOUT = mid-supply, and RL = 10kΩ, unless otherwise noted. OFFSET VOLTAGE PRODUCTION DISTRIBUTION OFFSET VOLTAGE DRIFT DISTRIBUTION 14 25 20 Number of Amplifiers Number of Amplifiers (%) 12 10 8 6 4 15 10 5 2 0 0 -130 -120 -110 -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 0.1 0.5 0.9 1.3 1.7 2.1 2.5 2.9 Offset Drift (mV/°C) Offset Voltage (mV) Figure 1. Figure 2. OFFSET VOLTAGE vs COMMON-MODE VOLTAGE OPEN-LOOP GAIN/PHASE vs FREQUENCY 0 160 80 140 60 120 40 VS = ±2.5V CL = 50pF -40 Gain (dB) 100 20 0 -20 -60 Phase 80 -80 60 -100 -120 40 -40 Gain 20 -60 Representative Units VS = ±2.75V -80 -3 -2.5 -2 -1.5 -1 -0.5 0 0.5 1 1.5 2 2.5 -140 -160 0 -100 3 -20 -20 Phase (°) Offset Voltage (mV) 100 1 10 100 1k Common-Mode Voltage (V) 10k 100k 1M 10M -180 100M Frequency (Hz) Figure 3. Figure 4. OPEN-LOOP GAIN vs TEMPERATURE QUIESCENT CURRENT vs SUPPLY VOLTAGE 1.5 140 +125°C 135 Quiescent Current (mA/Ch) Open-Loop Gain (dB) 10kW Load 130 125 2kW Load 120 115 110 1.45 +85°C 1.4 +25°C 1.35 -40°C 1.3 105 100 1.25 -50 -25 0 25 50 75 Temperature (°C) 100 125 150 1.5 2 2.5 3 Figure 5. Copyright © 2010–2013, Texas Instruments Incorporated 3.5 4 4.5 5 5.5 Supply Voltage (V) Figure 6. Submit Documentation Feedback Product Folder Links: OPA320 OPA2320 OPA320S OPA2320S 7 OPA320, OPA2320 OPA320S, OPA2320S SBOS513E – AUGUST 2010 – REVISED JUNE 2013 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C, VCM = VOUT = mid-supply, and RL = 10kΩ, unless otherwise noted. INPUT BIAS CURRENT vs COMMON-MODE VOLTAGE 6 0.8 5 4 0.6 Input Bias Current (pA) Input Bias Current (pA) INPUT BIAS CURRENT vs SUPPLY VOLTAGE 1 0.4 0.2 0 -0.2 -0.4 -0.6 -1 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 2 1 0 -1 -2 -3 IB+ IBIOS -4 IBIB+ -0.8 3 -5 -6 2.9 -3 -2.5 -2 -1.5 -1 -0.5 0 Supply Voltage (±V) Figure 7. INPUT BIAS CURRENT DISTRIBUTION Input Bias Current (pA) 30 25 20 15 10 5 1300 1200 1100 1000 900 800 700 600 500 400 300 200 100 0 -100 2 3 2.5 IOS IB+ IB- IB -50 0.25 0.2 0.15 0.1 0.05 0 -0.1 -0.05 -0.2 -0.15 -0.3 0 -0.25 1.5 INPUT BIAS CURRENT vs TEMPERATURE 35 -0.35 1 Figure 8. 40 Number of Amplifiers (%) 0.5 Common-Mode Voltage (V) -25 0 25 50 75 100 IOS 125 150 Temperature (°C) Input Bias Current (pA) Figure 9. Figure 10. CMRR AND PSRR vs FREQUENCY CMRR AND PSRR vs TEMPERATURE 130 Common-Mode Rejection Ratio (dB), Power-Supply Rejection Ratio (dB) Common-Mode Rejection Ratio (dB), Power-Supply Rejection Ratio (dB) 140 120 CMRR 100 80 60 40 PSRR 20 0 VS = 1.8V to 5.5V 125 120 115 110 105 100 PSRR CMRR 95 90 100 1k 10k 100k 1M 10M -50 -25 0 Frequency (Hz) Submit Documentation Feedback 50 75 100 125 150 Temperature (°C) Figure 11. 8 25 Figure 12. Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: OPA320 OPA2320 OPA320S OPA2320S OPA320, OPA2320 OPA320S, OPA2320S www.ti.com SBOS513E – AUGUST 2010 – REVISED JUNE 2013 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, VCM = VOUT = mid-supply, and RL = 10kΩ, unless otherwise noted. INPUT VOLTAGE NOISE SPECTRAL DENSITY vs FREQUENCY 0.1Hz TO 10Hz INPUT VOLTAGE NOISE 6 VS = 1.8V to 5.5V 5 4 3 100 Voltage (mV) Voltage Noise (nV/ÖHz) 1000 10 2 1 0 -1 -2 -3 1 -4 10 100 1k 10k 1M 100k 0 1 2 3 4 Frequency (Hz) Figure 13. CLOSED-LOOP GAIN vs FREQUENCY 8 10 9 CLOSED-LOOP GAIN vs FREQUENCY 20 G = +10V/V VS = +5.5V RL = 10kW CL = 50pF G = +100V/V 40 Gain (dB) Gain (dB) 7 60 VS = +1.8V RL = 10kW CL = 50pF G = +100V/V 0 6 Figure 14. 60 40 5 Time (1s/div) 20 G = +10V/V 0 G = +1V/V -20 G = +1V/V -20 10k 100k 1M 10M 10k 100M 100k Frequency (Hz) 1M 100M 10M Frequency (Hz) Figure 15. Figure 16. OUTPUT VOLTAGE SWING vs OUTPUT CURRENT (MSOP-8) MAXIMUM OUTPUT VOLTAGE vs FREQUENCY 6 3 5.5VS 2 4 Output Voltage (V) Output Voltage (VPP) 5 3.3VS 3 2 1 -40°C +25°C +125°C 0 -1 1.8VS 1 -2 RL = 10kW CL = 50pF VS = ±2.75 V 0 -3 10k 100k 1M Frequency (Hz) 10M 0 10 20 30 Figure 17. Copyright © 2010–2013, Texas Instruments Incorporated 40 50 60 70 80 Output Current (mA) Figure 18. Submit Documentation Feedback Product Folder Links: OPA320 OPA2320 OPA320S OPA2320S 9 OPA320, OPA2320 OPA320S, OPA2320S SBOS513E – AUGUST 2010 – REVISED JUNE 2013 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C, VCM = VOUT = mid-supply, and RL = 10kΩ, unless otherwise noted. OPEN-LOOP OUTPUT IMPEDANCE vs FREQUENCY SMALL-SIGNAL OVERSHOOT vs LOAD CAPACITANCE 1000 70 G = 1, VS = 1.8V VS = ±2.75V G = 1, VS = 5.5V G = 10, VS = 1.8V 50 Overshoot (%) Impedance (W) 60 100 G = 10, VS = 5.5V 40 30 20 10 0 10 1 10 100 1k 10k 100k 1M 10M 100M 500 0 1000 Frequency (Hz) 1500 Figure 19. 0.01 Load = 600W 0.001 Frequency = 10kHz VS = ±2.5V G = +1V/V Load = 10kW 0.1 0.1 0.01 Load = 600W 0.001 Load = 10kW 0.0001 10 1 Frequency = 10kHz VIN = 2VPP VS = ±2.5V G = +1V/V 10 100 1k Figure 21. CHANNEL SEPARATION vs FREQUENCY (for Dual) 0 Frequency = 10kHz VIN = 4VPP VS = ±2.5V G = +1V/V VS = ±2.75V -20 Channel Separation (dB) Total Harmonic Distortion and Noise (%) 100k Figure 22. THD+N vs FREQUENCY 10 10k Frequency (Hz) VIN (VPP) 0.01 Load = 600W 0.001 -40 -60 -80 -100 -120 Load = 10kW 0.0001 3000 THD+N vs FREQUENCY Total Harmonic Distortion and Noise (%) Total Harmonic Distortion and Noise (%) THD+N vs AMPLITUDE 0.1 2500 Figure 20. 0.1 0.0001 0.01 2000 Capacitive Load (pF) -140 10 100 1k 10k 100k 1k 10k 100k 1M Frequency (Hz) Frequency (Hz) Figure 23. Figure 24. Submit Documentation Feedback 10M 100M Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: OPA320 OPA2320 OPA320S OPA2320S OPA320, OPA2320 OPA320S, OPA2320S www.ti.com SBOS513E – AUGUST 2010 – REVISED JUNE 2013 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, VCM = VOUT = mid-supply, and RL = 10kΩ, unless otherwise noted. SLEW RATE vs SUPPLY VOLTAGE SMALL-SIGNAL STEP RESPONSE 12 0.1 CL = 50pF 0.075 11.5 Voltage (V) Slew Rate (V/ms) 0.05 11 Rise 10.5 Fall 10 Gain = +1 VS = ±2.75V VIN = 100mVPP 0.025 0 -0.025 -0.05 9.5 VOUT VIN -0.075 9 1.6 2 2.4 2.8 3.2 3.6 4 4.4 4.8 5.2 -0.1 -0.8 5.6 0 -0.4 0.4 Supply Voltage (V) Figure 25. SMALL-SIGNAL STEP RESPONSE LARGE-SIGNAL STEP RESPONSE vs TIME 1.5 0.075 VIN Gain = -1 VS = ±2.75V VIN = 100mVPP Voltage (V) Voltage (V) Gain = +1 VS = ±2.75V VIN = 2VPP 1 0.05 0 1.6 1.2 Figure 26. 0.1 0.025 0.8 Time (ms) -0.025 0.5 VOUT 0 -0.5 -0.05 -0.1 -1.6 -1 VOUT VIN -0.075 -1.2 -0.8 -0.4 0 0.4 0.8 -1.5 -0.4 0 0.4 Time (ms) 0.8 1.2 1.6 Time (ms) Figure 28. ENABLE STARTUP ENABLE STARTUP Voltage (1 V/div) Voltage (500 mV/div) Figure 27. G = 1 V/V VS = 1.8V VIN = 1.5V Output Pin Enable Pin G = 1 V/V VS = 5.5V VIN = 4V Output Pin Enable Pin Time (5 s/div) Time (2.5 s/div) C001 C001 Figure 29. Copyright © 2010–2013, Texas Instruments Incorporated Figure 30. Submit Documentation Feedback Product Folder Links: OPA320 OPA2320 OPA320S OPA2320S 11 OPA320, OPA2320 OPA320S, OPA2320S SBOS513E – AUGUST 2010 – REVISED JUNE 2013 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C, VCM = VOUT = mid-supply, and RL = 10kΩ, unless otherwise noted. ENABLE SHUTDOWN Voltage (1 V/div) Voltage (500 mV/div) ENABLE SHUTDOWN G = 1 V/V VS = 1.8V VIN = 1.5V Output Pin Enable Pin G = 1 V/V VS = 5.5V VIN = 4V Output Pin Enable Pin Time (5 s/div) Time (2.5 s/div) C001 C001 Figure 31. 12 Submit Documentation Feedback Figure 32. Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: OPA320 OPA2320 OPA320S OPA2320S OPA320, OPA2320 OPA320S, OPA2320S www.ti.com SBOS513E – AUGUST 2010 – REVISED JUNE 2013 APPLICATION INFORMATION RAIL-TO-RAIL INPUT OPERATING VOLTAGE The OPA320 series op amps are unity-gain stable and can operate on a single-supply voltage (1.8V to 5.5V), or a split supply voltage (±0.9V to ±2.75V), making them highly versatile and easy to use. The power-supply pins should have local bypass ceramic capacitors (typically 0.001μF to 0.1μF). The OPA320 amplifiers are fully specified from +1.8V to +5.5V and over the extended temperature range of –40°C to +125°C. Parameters that can exhibit variance with regard to operating voltage or temperature are presented in the Typical Characteristics. INPUT AND ESD PROTECTION The OPA320 incorporates internal electrostatic discharge (ESD) protection circuits on all pins. In the case of input and output pins, this protection primarily consists of current-steering diodes connected between the input and power-supply pins. These ESD protection diodes also provide in-circuit input overdrive protection, provided that the current is limited to 10mA as stated in the Absolute Maximum Ratings. Many input signals are inherently currentlimited to less than 10mA; therefore, a limiting resistor is not required. Figure 33 shows how a series input resistor (RS) may be added to the driven input to limit the input current. The added resistor contributes thermal noise at the amplifier input and the value should be kept to the minimum in noise-sensitive applications. The OPA320 product family features true rail-to-rail input operation, with supply voltages as low as ±0.9V (1.8V). The design of the OPA320 amplifiers include an internal charge-pump that powers the amplifier input stage with an internal supply rail at approximately 1.6V above the external supply (VS+). This internal supply rail allows the single differential input pair to operate and remain very linear over a very wide input common-mode range. A unique zerocrossover input topology eliminates the input offset transition region typical of many rail-to-rail, complementary input stage operational amplifiers. This topology allows the OPA320 to provide superior common-mode performance (CMRR > 110dB, typical) over the entire common-mode input range, which extends 100mV beyond both power-supply rails. When driving analog-to-digital converters (ADCs), the highly linear VCM range of the OPA320 assures maximum linearity and lowest distortion. PHASE REVERSAL The OPA320 op amps are designed to be immune to phase reversal when the input pins exceed the supply voltages, therefore providing further in-system stability and predictability. Figure 34 shows the input voltage exceeding the supply voltage without any phase reversal. 4 VIN VS = ±2.5V 3 IOVERLOAD 10mA, Max OPA320 VOUT VIN Voltage (V) 2 V+ VOUT 1 0 -1 -2 RS -3 Figure 33. Input Current Protection -4 -500 -250 0 250 500 750 1000 Time (ms) Figure 34. No Phase Reversal Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: OPA320 OPA2320 OPA320S OPA2320S 13 OPA320, OPA2320 OPA320S, OPA2320S SBOS513E – AUGUST 2010 – REVISED JUNE 2013 www.ti.com FEEDBACK CAPACITOR IMPROVES RESPONSE For optimum settling time and stability with highimpedance feedback networks, it may be necessary to add a feedback capacitor across the feedback resistor, RF, as shown in Figure 35. This capacitor compensates for the zero created by the feedback network impedance and the OPA320 input capacitance (and any parasitic layout capacitance). The effect becomes more significant with higher impedance networks. OUTPUT IMPEDANCE CF RIN RF VIN V+ CIN RIN ´ CIN = RF ´ CF OPA320 VOUT CL CIN NOTE: Where CIN is equal to the OPA320 input capacitance (approximately 9pF) plus any parasitic layout capacitance. Figure 35. Feedback Capacitor Improves Dynamic Performance It is suggested that a variable capacitor be used for the feedback capacitor because input capacitance may vary between op amps and layout capacitance is difficult to determine. For the circuit shown in Figure 35, the value of the variable feedback capacitor should be chosen so that the input resistance times the input capacitance of the OPA320 (typically 9pF) plus the estimated parasitic layout capacitance equals the feedback capacitor times the feedback resistor: RIN × CIN = RF × CF Where: CIN is equal to the OPA320 input capacitance (sum of differential and common-mode) plus the layout capacitance. The capacitor value can be adjusted until optimum performance is obtained. EMI SUSCEPTIBILITY AND INPUT FILTERING Operational amplifiers vary in susceptibility to electromagnetic interference (EMI). If conducted EMI enters the operational amplifier, the dc offset observed at the amplifier output may shift from the nominal value while EMI is present. This shift is a 14 result of signal rectification associated with the internal semiconductor junctions. While all operational amplifier pin functions can be affected by EMI, the input pins are likely to be the most susceptible. The OPA320 operational amplifier family incorporates an internal input low-pass filter that reduces the amplifiers response to EMI. Both common-mode and differential mode filtering are provided by the input filter. The filter is designed for a cut-off frequency of approximately 580MHz (–3dB), with a roll-off of 20dB per decade. Submit Documentation Feedback The open-loop output impedance of the OPA320 common-source output stage is approximately 90Ω. When the op amp is connected with feedback, this value is reduced significantly by the loop gain. For example, with 130dB (typ) of open-loop gain, the output impedance is reduced in unity-gain to less than 0.03Ω. For each decade rise in the closed-loop gain, the loop gain is reduced by the same amount, which results in a ten-fold increase in effective output impedance. While the OPA320 output impedance remains very flat over a wide frequency range, at higher frequencies the output impedance rises as the open-loop gain of the op amp drops. However, at these frequencies the output also becomes capacitive as a result of parasitic capacitance. This in turn prevents the output impedance from becoming too high, which can cause stability problems when driving large capacitive loads. As mentioned previously, the OPA320 has excellent capacitive load drive capability for an op amp with its bandwidth. CAPACITIVE LOAD AND STABILITY The OPA320 is designed to be used in applications where driving a capacitive load is required. As with all op amps, there may be specific instances where the OPA320 can become unstable. The particular op amp circuit configuration, layout, gain, and output loading are some of the factors to consider when establishing whether an amplifier is stable in operation. An op amp in the unity-gain (+1V/V) buffer configuration and driving a capacitive load exhibits a greater tendency to become unstable than an amplifier operated at a higher noise gain. The capacitive load, in conjunction with the op amp output resistance, creates a pole within the feedback loop that degrades the phase margin. The degradation of the phase margin increases as the capacitive loading increases. When operating in the unity-gain configuration, the OPA320 remains stable with a pure capacitive load up to approximately 1nF. Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: OPA320 OPA2320 OPA320S OPA2320S OPA320, OPA2320 OPA320S, OPA2320S www.ti.com SBOS513E – AUGUST 2010 – REVISED JUNE 2013 This resistor significantly reduces the overshoot and ringing associated with large capacitive loads. A possible problem with this technique is that a voltage divider is created with the added series resistor and any resistor connected in parallel with the capacitive load. The voltage divider introduces a gain error at the output that reduces the output swing. The error contributed by the voltage divider may be insignificant. For instance, with a load resistance, RL = 10kΩ and RS = 20Ω, the gain error is only about 0.2%. However, when RL is decreased to 600Ω, which the OPA320 is able to drive, the error increases to 7.5%. OVERLOAD RECOVERY TIME Overload recovery time is the time it takes the output of the amplifier to come out of saturation and recover to the linear region. Overload recovery is particularly important in applications where small signals must be amplified in the presence of large transients. Figure 38 and Figure 39 show the positive and negative overload recovery times of the OPA320, respectively. In both cases, the time elapsed before the OPA320 comes out of saturation is less than 100ns. In addition, the symmetry between the positive and negative recovery times allows excellent signal rectification without distortion of the output signal. 3 VS = ±2.75V G = -10 2.5 Output 2 Voltage (V) The equivalent series resistance (ESR) of some very large capacitors (CL > 1µF) is sufficient to alter the phase characteristics in the feedback loop such that the amplifier remains stable. Increasing the amplifier closed-loop gain allows the amplifier to drive increasingly larger capacitance. This increased capability is evident when observing the overshoot response of the amplifier at higher voltage gains, as shown in Figure 37. One technique for increasing the capacitive load drive capability of the amplifier operating in unity gain is to insert a small resistor (RS), typically 10Ω to 20Ω, in series with the output, as shown in Figure 36. 1.5 1 0.5 0 Input -0.5 -1 9.75 10 10.25 10.5 10.75 11 Time (250ns/div) V+ Figure 38. Positive Recovery Time RS VOUT OPA320 VIN 10W to 20W RL 1 CL 0.5 Input Figure 36. Improving Capacitive Load Drive 70 G = 1, VS = 1.8V 60 Overshoot (%) -0.5 -1 -1.5 -2 G = 1, VS = 5.5V Output G = 10, VS = 1.8V 50 Voltage (V) 0 G = 10, VS = 5.5V 40 VS = ±2.75V G = -10 -2.5 -3 9.75 10 10.25 10.5 10.75 11 Time (250ns/div) 30 Figure 39. Negative Recovery Time 20 10 0 0 500 1000 1500 2000 2500 3000 Capacitive Load (pF) Figure 37. Small-Signal Overshoot versus Capacitive Load (100mVPPoutput step) Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: OPA320 OPA2320 OPA320S OPA2320S 15 OPA320, OPA2320 OPA320S, OPA2320S SBOS513E – AUGUST 2010 – REVISED JUNE 2013 GENERAL LAYOUT GUIDELINES The OPA320 is a wideband amplifier. To realize the full operational performance of the device, good highfrequency printed circuit board (PCB) layout practices are required. The bypass capacitors must be connected between each supply pin and ground as close to the device as possible. The bypass capacitor traces should be designed for minimum inductance. LEADLESS DFN PACKAGE www.ti.com The key elements to a transimpedance design, as shown in Figure 40, are the expected diode capacitance (CD), which should include the parasitic input common-mode and differential-mode input capacitance (4pF + 5pF for the OPA320); the desired transimpedance gain (RF); and the gain-bandwidth (GBW) for the OPA320 (20MHz). With these three variables set, the feedback capacitor value (CF) can be set to control the frequency response. CF includes the stray capacitance of RF, which is 0.2pF for a typical surface-mount resistor. The OPA320 series uses the DFN style package (also known as SON), which is a QFN with contacts on only two sides of the package bottom. This leadless package maximizes PCB space and offers enhanced thermal and electrical characteristics through an exposed pad. One of the primary advantages of the DFN package is its low height (0.8mm). DFN packages are physically small, have a smaller routing area, improved thermal performance, reduced electrical parasitics, and a pinout scheme that is consistent with other commonly-used packages (such as SO and MSOP). Additionally, the absence of external leads eliminates bent-lead issues. The DFN package can easily be mounted using standard PCB assembly techniques. See Application Report, QFN/SON PCB Attachment (SLUA271) and Application Report, Quad Flatpack No-Lead Logic Packages (SCBA017), both available for download at www.ti.com. The exposed leadframe die pad on the bottom of the DFN package should be connected to the most negative potential (V–). APPLICATION EXAMPLES TRANSIMPEDANCE AMPLIFIER Wide gain bandwidth, low input bias current, low input voltage, and current noise make the OPA320 an ideal wideband photodiode transimpedance amplifier. Lowvoltage noise is important because photodiode capacitance causes the effective noise gain of the circuit to increase at high frequency. 16 Submit Documentation Feedback (1) CF < 1pF RF 10MW V+ l CD OPA320 VOUT V- (1) CF is optional to prevent gain peaking. It includes the stray capacitance of RF. Figure 40. Dual-Supply Transimpedance Amplifier To achieve a maximally-flat, second-order Butterworth frequency response, the feedback pole should be set to: 1 = 2pRFCF GBW 4pRFCD (1) Bandwidth is calculated by: f-3dB = GBW 2pRFCD (Hz) (2) For even higher transimpedance bandwidth, consider the high-speed CMOS OPA380 (90MHz GBW), OPA354 (100MHz GBW), OPA300 (180MHz GBW), OPA355 (200MHz GBW), or OPA656/57 (400MHz GBW). Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: OPA320 OPA2320 OPA320S OPA2320S OPA320, OPA2320 OPA320S, OPA2320S www.ti.com SBOS513E – AUGUST 2010 – REVISED JUNE 2013 For single-supply applications, the +IN input can be biased with a positive dc voltage to allow the output to reach true zero when the photodiode is not exposed to any light, and respond without the added delay that results from coming out of the negative rail; this configuration is shown in Figure 41. This bias voltage also appears across the photodiode, providing a reverse bias for faster operation. (1) CF < 1pF RF 10MW photodiode can significantly reduce its capacitance. Smaller photodiodes have lower capacitance. Use optics to concentrate light on a small photodiode. 3. Noise increases with increased bandwidth. Limit the circuit bandwidth to only that required. Use a capacitor across the RF to limit bandwidth, even if not required for stability. 4. Circuit board leakage can degrade the performance of an otherwise well-designed amplifier. Clean the circuit board carefully. A circuit board guard trace that encircles the summing junction and is driven at the same voltage can help control leakage. For additional information, refer to the Application Bulletins Noise Analysis of FET Transimpedance Amplifiers (SBOA060), and Noise Analysis for HighSpeed Op Amps (SBOA066), available for download at the TI web site. V+ l OPA320 VOUT +VBIAS (1) CF is optional to prevent gain peaking. It includes the stray capacitance of RF. Figure 41. Single-Supply Transimpedance Amplifier For additional information, refer to Application Bulletin (SBOA055), Compensate Transimpedance Amplifiers Intuitively, available for download at www.ti.com. OPTIMIZING THE TRANSIMPEDANCE CIRCUIT To achieve the best performance, components should be selected according to the following guidelines: 1. For lowest noise, select RF to create the total required gain. Using a lower value for RF and adding gain after the transimpedance amplifier generally produces poorer noise performance. The noise produced by RF increases with the square-root of RF, whereas the signal increases linearly. Therefore, signal-to-noise ratio improves when all the required gain is placed in the transimpedance stage. 2. Minimize photodiode capacitance and stray capacitance at the summing junction (inverting input). This capacitance causes the voltage noise of the op amp to be amplified (increasing amplification at high frequency). Using a lownoise voltage source to reverse-bias a Copyright © 2010–2013, Texas Instruments Incorporated HIGH-IMPEDANCE SENSOR INTERFACE Many sensors have high source impedances that may range up to 10MΩ, or even higher. The output signal of sensors often must be amplified or otherwise conditioned by means of an amplifier. The input bias current of this amplifier can load the sensor output and cause a voltage drop across the source resistance, as shown in Figure 42, where (VIN+ = VS – IBIAS × RS). The last term, IBIAS × RS, shows the voltage drop across RS. To prevent errors introduced to the system as a result of this voltage, an op amp with very low input bias current must be used with high impedance sensors. This low current keeps the error contribution by IBIAS × RS less than the input voltage noise of the amplifier, so that it does not become the dominant noise factor. The OPA320 series of op amps feature very low input bias current (typically 200fA), and are therefore ideal choices for such applications. RS 100kW IB VIN+ V+ VOUT OPA320 V- RF RG Figure 42. Noise as a Result of IBIAS Submit Documentation Feedback Product Folder Links: OPA320 OPA2320 OPA320S OPA2320S 17 OPA320, OPA2320 OPA320S, OPA2320S SBOS513E – AUGUST 2010 – REVISED JUNE 2013 www.ti.com DRIVING ADCS The OPA320 can be used to buffer the ADC switched input capacitance and resulting charge injection while providing signal gain. Figure 44 shows the OPA320 configured to drive the ADS8326. The OPA320 series op amps are well-suited for driving sampling analog-to-digital converters (ADCs) with sampling speeds up to 1MSPS. The zerocrossover distortion input stage topology allows the OPA320 to drive ADCs without degradation of differential linearity and THD. +5V 50kW (2.5V) 8 RG REF1004-2.5 R1 100kW 4 R2 25kW +5V +5V R4 100kW R3 25kW 1/2 OPA2320 1/2 OPA2320 G=5+ VOUT RL 10kW 200kW RG Figure 43. Two Op Amp Instrumentation Amplifier with Improved High-Frequency Common-Mode Rejection +5V C1 100nF +5V (1) R1 100W V+ +IN OPA320 (1) C3 1nF VVIN 0 to 4.096V -IN ADS8326 16-Bit 250kSPS REF IN Optional R2 50kW (2) +5V SD1 BAS40 -5V C2 100nF REF3240 4.096V C4 100nF (1) Suggested value; may require adjustment based on specific application. (2) Single-supply applications lose a small number of ADC codes near ground as a result of op amp output swing limitation. If a negative power supply is available, this simple circuit creates a –0.3V supply to allow output swing to true ground potential. Figure 44. Driving the ADS8326 18 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: OPA320 OPA2320 OPA320S OPA2320S OPA320, OPA2320 OPA320S, OPA2320S www.ti.com SBOS513E – AUGUST 2010 – REVISED JUNE 2013 ACTIVE FILTER The OPA320 is well-suited for active filter applications that require a wide bandwidth, fast slew rate, lownoise, single-supply operational amplifier. Figure 45 shows a 500kHz, second-order, low-pass filter using the multiple−feedback (MFB) topology. The components have been selected to provide a maximally-flat Butterworth response. Beyond the cutoff frequency, roll-off is –40dB/dec. The Butterworth response is ideal for applications requiring predictable gain characteristics, such as the anti-aliasing filter used in front of an ADC. MFB and Sallen-Key, low-pass and high-pass filter synthesis is quickly accomplished using TI’s FilterPro™ program. This software is available as a free download at www.ti.com. R3 549W C2 150pF R1 549W One point to observe when considering the MFB filter is that the output is inverted, relative to the input. If this inversion is not required, or not desired, a noninverting output can be achieved through one of these options: 1. adding an inverting amplifier; 2. adding an additional second-order MFB stage; or 3. using a noninverting filter topology, such as the Sallen-Key (shown in Figure 46). V+ R2 1.24kW VIN OPA320 C1 1nF VOUT V- Figure 45. Second-Order Butterworth 500kHz Low-Pass Filter 220pF V+ 1.8kW 19.5kW 150kW VIN = 1VRMS 3.3nF 47pF VOUT OPA320 V- Figure 46. OPA320 Configured as a Three-Pole, 20kHz, Sallen-Key Filter Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: OPA320 OPA2320 OPA320S OPA2320S 19 OPA320, OPA2320 OPA320S, OPA2320S SBOS513E – AUGUST 2010 – REVISED JUNE 2013 www.ti.com REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (November 2011) to Revision E Page • Deleted Ordering Information table ....................................................................................................................................... 2 • Changed Shutdown, VIH and VIL parameters in Electrical Characteristics table .................................................................. 4 • Added Figure 29 and Figure 30 .......................................................................................................................................... 11 • Added Figure 31 and Figure 32 .......................................................................................................................................... 11 Changes from Revision C (August 2011) to Revision D • Page Changed status of OPA2320 SO-8 (D) to production data from product preview. ............................................................... 2 Changes from Revision B (March 2010) to Revision C Page • Added SHDN value to Electrical Characteristics condition line ............................................................................................ 3 • Added new test condition row for Input Bias Current Over Temperature parameter ........................................................... 3 • Changed test condition for Phase Margin parameter in Electrical Characteristics ............................................................... 3 • Added test condition to Short-Circuit Current parameter in Electrical Characteristics ......................................................... 4 • Changed Shutdown subsection of Electrical Characteristics along with associated notes .................................................. 4 • Changed Power Supply subsection of Electrical Characteristics ......................................................................................... 4 • Added values to Thermal Information tables, moved to new page, and updated format ..................................................... 5 • Removed D (SO-8) package pinout drawing from Pin Configurations section ..................................................................... 6 • Changed names of pins 2 and 6 for DGS (MSOP-10) package .......................................................................................... 6 • Changed Figure 4 ................................................................................................................................................................. 7 • Changed Figure 18 ............................................................................................................................................................... 9 • Changed 100µs to 100ns in first paragraph of Overload Recovery Time section .............................................................. 15 • Changed Figure 38 ............................................................................................................................................................. 15 • Changed Figure 39 ............................................................................................................................................................. 15 • Changed R2 value in Figure 44 from 500Ω to 50kΩ ........................................................................................................... 18 20 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: OPA320 OPA2320 OPA320S OPA2320S PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) OPA2320AID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 O2320A OPA2320AIDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-2-260C-1 YEAR -40 to 125 OCLQ OPA2320AIDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-2-260C-1 YEAR -40 to 125 OCLQ OPA2320AIDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 O2320A OPA2320AIDRGR ACTIVE SON DRG 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OCMQ OPA2320AIDRGT ACTIVE SON DRG 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OCMQ OPA2320SAIDGSR ACTIVE VSSOP DGS 10 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPAI OPA2320SAIDGST ACTIVE VSSOP DGS 10 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPAI OPA320AIDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 RAC OPA320AIDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 RAC OPA320SAIDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 RAE OPA320SAIDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 RAE (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 28-Feb-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant OPA2320AIDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2320AIDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2320AIDGKT VSSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2320AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA2320AIDRGR SON DRG 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 OPA2320AIDRGT SON DRG 8 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 OPA2320SAIDGSR VSSOP DGS 10 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2320SAIDGST VSSOP DGS 10 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA320AIDBVT SOT-23 DBV 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 28-Feb-2014 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) OPA2320AIDGKR VSSOP DGK 8 2500 367.0 367.0 35.0 OPA2320AIDGKR VSSOP DGK 8 2500 366.0 364.0 50.0 OPA2320AIDGKT VSSOP DGK 8 250 210.0 185.0 35.0 OPA2320AIDR SOIC D 8 2500 367.0 367.0 35.0 OPA2320AIDRGR SON DRG 8 3000 367.0 367.0 35.0 OPA2320AIDRGT SON DRG 8 250 210.0 185.0 35.0 OPA2320SAIDGSR VSSOP DGS 10 2500 367.0 367.0 35.0 OPA2320SAIDGST VSSOP DGS 10 250 210.0 185.0 35.0 OPA320AIDBVT SOT-23 DBV 5 250 195.0 200.0 45.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2014, Texas Instruments Incorporated