BSI BS62UV1024STI Ultra low power/voltage cmos sram 128k x 8 bit Datasheet

BSI
Ultra Low Power/Voltage CMOS SRAM
128K X 8 bit
BS62UV1024
„ DESCRIPTION
„ FEATURES
• Ultra low operation voltage : 1.8V ~ 3.6V
• Ultra low power consumption :
Vcc = 2.0V C-grade : 10mA (Max.) operating current
I- grade : 15mA (Max.) operating current
0.01uA (Typ.) CMOS standby current
Vcc = 3.0V C-grade : 20mA (Max.) operating current
I- grade : 25mA (Max.) operating current
0.02uA (Typ.) CMOS standby current
• High speed access time :
-15
150ns (Max.) at Vcc = 2.0V
• Automatic power down when chip is deselected
• Three state outputs and TTL compatible
• Fully static operation
• Data retention supply voltage as low as 1.5V
• Easy expansion with CE2, CE1, and OE options
The BS62UV1024 is a high performance, ultra low power CMOS
Static Random Access Memory organized as 131,072 words by 8 bits
and operates from a wide range of 1.8V to 3.6V supply voltage.
Advanced CMOS technology and circuit techniques provide both high
speed and low power features with a typical CMOS standby current of
0.01uA and maximum access time of 150ns in 2V operation.
Easy memory expansion is provided by an active LOW chip
enable (CE1), an active HIGH chip enable (CE2), and active LOW
output enable (OE) and three-state output drivers.
The BS62UV1024 has an automatic power down feature, reducing the
power consumption significantly when chip is deselected.
The BS62UV1024 is available in the JEDEC standard 32 pin
450mil Plastic SOP, 8mmx13.4mm STSOP 300mil Plastic SOJ and
8mmx20mm TSOP.
„ PRODUCT FAMILY
PRODUCT
FAMILY
OPERATING
TEMPERATURE
BS62UV1024SC
BS62UV1024TC
BS62UV1024JC
BS62UV1024STC
BS62UV1024PC
BS62UV1024DC
BS62UV1024SI
BS62UV1024TI
BS62UV1024JI
BS62UV1024STI
BS62UV1024PI
BS62UV1024DI
Vcc
RANGE
1.8V ~ 3.6V
150
1.0uA
0.3uA
20mA
10mA
O
O
1.8V ~ 3.6V
150
1.5uA
1uA
25mA
15mA
•
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
BS62UV1024SC 27
BS62UV1024SI 26
BS62UV1024PC
25
BS62UV1024PI
24
BS62UV1024JC
BS62UV1024JI 23
22
21
20
19
18
17
•
A11
A9
A8
A13
WE
CE2
A15
VCC
NC
A16
A14
A12
A7
A6
A5
A4
PKG TYPE
(ICC, Max)
Vcc=
Vcc=
3.0V
2.0V
O
-40 C to +85 C
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
(ICCSB1, Max)
Vcc=
Vcc=
3.0V
2.0V
Vcc=
2.0V
O
+0 C to +70 C
BS62UV1024TC
BS62UV1024STC
BS62UV1024TI
BS62UV1024STI
SOP-32
TSOP-32
SOJ-32
STSOP -32
PDIP-32
DICE
SOP-32
TSOP-32
SOJ-32
STSOP -32
PDIP- 32
DICE
„ BLOCK DIAGRAM
„ PIN CONFIGURATIONS
NC
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
GND
POWER DISSIPATION
STANDBY
Operating
SPEED
(ns)
VCC
A15
CE2
WE
A13
A8
A9
A11
OE
A10
CE1
DQ7
DQ6
DQ5
DQ4
DQ3
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
A6
A7
A12
A14
A16
A15
A13
A8
A9
A11
Address
Input
Buffer
20
Row
1024
Memory Array
1024 x 1024
Decoder
1024
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
OE
A10
CE1
DQ7
DQ6
DQ5
DQ4
DQ3
GND
DQ2
DQ1
DQ0
A0
A1
A2
A3
CE2
CE1
WE
OE
Vdd
Gnd
8
8
Data
Input
Buffer
Data
Output
Buffer
Column I/O
8
8
Write Driver
Sense Amp
128
Column Decoder
14
Control
Address Input Buffer
A5 A4 A3 A2 A1 A0 A10
Brilliance Semiconductor Inc. reserves the right to modify document contents without notice.
R0201-BS62UV1024
1
Revision 2.2
April 2001
BSI
BS62UV1024
„ PIN DESCRIPTIONS
Name
Function
A0-A16 Address Input
These 17 address inputs select one of the 131,072 x 8-bit words in the RAM
CE1 Chip Enable 1 Input
CE2 Chip Enable 2 Input
CE1 is active LOW and CE2 is active HIGH. Both chip enables must be active when
data read from or write to the device. If either chip enable is not active, the device is
deselected and is in a standby power mode. The DQ pins will be in the high
impedance state when the device is deselected.
WE Write Enable Input
The write enable input is active LOW and controls read and write operations. With the
chip selected, when WE is HIGH and OE is LOW, output data will be present on the
DQ pins; when WE is LOW, the data present on the DQ pins will be written into the
selected memory location.
OE Output Enable Input
The output enable input is active LOW. If the output enable is active while the chip is
selected and the write enable is inactive, data will be present on the DQ pins and they
will be enabled. The DQ pins will be in the high impedance state when OE is inactive.
DQ0-DQ7 Data Input/Output
Ports
These 8 bi-directional ports are used to read data from or write data into the RAM.
Vcc
Power Supply
Gnd
Ground
„ TRUTH TABLE
MODE
WE
CE1
CE2
OE
I/O OPERATION
Vcc CURRENT
Not selected
(Power Down)
X
H
X
X
X
X
L
X
High Z
ICCSB , ICCSB1
Output Disabled
H
L
H
H
High Z
I CC
Read
H
L
W rite
L
L
H
L
D OUT
ICC
H
X
D IN
ICC
„ ABSOLUTE MAXIMUM RATINGS(1)
SYMBOL
PARAMETER
„ OPERATING RANGE
RATING
UNITS
-0.5 to
Vcc+0.5
V
V TERM
Terminal Voltage with
Respect to GND
T BIAS
Temperature Under Bias
-40 to +125
O
C
T STG
Storage Temperature
-60 to +150
O
C
PT
Power Dissipation
1.0
W
I OUT
DC Output Current
20
mA
RANGE
Commercial
Industrial
O
O
0 C to +70 C
O
O
-40 C to +85 C
Vcc
1.8V ~ 3.6V
1.8V ~ 3.6V
„ CAPACITANCE (1) (TA = 25oC, f = 1.0 MHz)
SYMBOL
1. Stresses greater than those listed under ABSOLUTE MAXIMUM
RATINGS may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these
or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
reliability.
R0201-BS62UV1024
AMBIENT
TEMPERATURE
2
CIN
CDQ
PARAMETER
Input
Capacitance
Input/Output
Capacitance
CONDITIONS
MAX.
UNIT
VIN=0V
6
pF
VI/O=0V
8
pF
1. This parameter is guaranteed and not tested.
Revision 2.2
April 2001
BSI
BS62UV1024
„ DC ELECTRICAL CHARACTERISTICS ( TA = 0oC to + 70oC )
PARAMETER
NAME
VIL
VIH
IIL
PARAMETER
MIN. TYP. (1) MAX.
TEST CONDITIONS
Guaranteed Input Low
Voltage(2)
Guaranteed Input High
Voltage(2)
Vcc=2.0V
Vcc=3.0V
UNITS
-0.5
--
0.6
0.8
V
1.4
2.0
--
Vcc+0.2
V
Vcc=2.0V
Vcc=3.0V
Input Leakage Current
Vcc = Max, V IN = 0V to Vcc
--
--
1
uA
IOL
Output Leakage Current
Vcc = Max, CE1= V IH, CE2= V IL, or
OE = V IH , V I/O = 0V to Vcc
--
--
1
uA
VOL
Output Low Voltage
Vcc = Max, IOL = 1mA
--
--
0.4
V
VOH
Output High Voltage
Vcc = Min, I OH = -0.5mA
--
--
V
ICC
Operating Power Supply
Current
CE1 = V IL, or CE2 = VIH,
I DQ = 0mA, F = Fmax(3)
Vcc=3.0V
ICCSB
Standby Current-TTL
CE1 = V IH , or CE2 = VIL,
I DQ = 0mA, F = Fmax(3)
Vcc=3.0V
ICCSB1
Standby Current-CMOS
CE1ЊVcc-0.2V, CE2Љ0.2V,
V INЊVcc-0.2V or V INЉ0.2V
----0.01
0.02
10
20
0.5
1
0.3
1
Vcc=2.0V
Vcc=3.0V
1.6
2.4
-------
Vcc=2.0V
Vcc=3.0V
Vcc=2.0V
Vcc=2.0V
Vcc=2.0V
Vcc=3.0V
mA
mA
uA
1. Typical characteristics are at TA = 25oC.
2. These are absolute values with respect to device ground and all overshoots due to system or tester notice are included.
3. Fmax = 1/tRC .
„ DATA RETENTION CHARACTERISTICS ( TA = 0oC to + 70oC )
SYMBOL
PARAMETER
TEST CONDITIONS
MIN.
TYP. (1)
MAX.
UNITS
VDR
Vcc for Data Retention
CE1 Њ Vcc - 0.2V, CE2 Љ 0.2V,
VIN Њ Vcc - 0.2V or VIN Љ 0.2V
1.5
--
--
V
ICCDR
Data Retention Current
CE1 Њ Vcc - 0.2V, CE2 Љ 0.2V,
VIN Њ Vcc - 0.2V or VIN Љ 0.2V
--
0.02
0.3
uA
tCDR
Chip Deselect to Data
Retention Time
0
--
--
ns
TRC (2)
--
--
ns
tR
See Retention Waveform
Operation Recovery Time
1. Vcc = 1.5V, TA = + 25OC
2. tRC = Read Cycle Time
„ LOW VCC DATA RETENTION WAVEFORM (1)
( CE1 Controlled )
Data Retention Mode
Vcc
VDR ≥ 1.5V
Vcc
Vcc
tR
t CDR
CE1
VIH
„ LOW VCC DATA RETENTION WAVEFORM (2)
CE1 ≥ Vcc - 0.2V
VIH
( CE2 Controlled )
Data Retention Mode
Vcc
VDR Њ 1.5V
Vcc
CE2
R0201-BS62UV1024
VIL
Vcc
tR
t CDR
CE2 Љ 0.2V
3
VIL
Revision 2.2
April 2001
BSI
BS62UV1024
„ KEY TO SWITCHING WAVEFORMS
„ AC TEST CONDITIONS
Input Pulse Levels
Input Rise and Fall Times
Input and Output
Timing Reference Level
Vcc/0V
5ns
WAVEFORM
0.5Vcc
„ AC TEST LOADS AND WAVEFORMS
1333 Ω
2V
1333 Ω
2V
OUTPUT
OUTPUT
5PF
INCLUDING
JIG AND
SCOPE
2000 Ω
2000 Ω
FIGURE 1A
FIGURE 1B
THEVENIN EQUIVALENT
800 Ω
OUTPUT
OUTPUTS
MUST BE
STEADY
MUST BE
STEADY
MAY CHANGE
FROM H TO L
WILL BE
CHANGE
FROM H TO L
MAY CHANGE
FROM L TO H
WILL BE
CHANGE
FROM L TO H
,
100PF
INCLUDING
JIG AND
SCOPE
INPUTS
DON T CARE:
ANY CHANGE
PERMITTED
CHANGE :
STATE
UNKNOWN
DOES NOT
APPLY
CENTER
LINE IS HIGH
IMPEDANCE
”OFF ”STATE
1.2V
ALL INPUT PULSES
Vcc
GND
10%
→
90% 90%
→
←
10%
← 5ns
„ AC ELECTRICAL CHARACTERISTICS ( TA = 0oC to + 70oC, Vcc=2.0V )
READ CYCLE
JEDEC
PARAMETER
NAME
PARAMETER
NAME
tAVAX
tAVQV
t E1LQV
t E2HOV
tGLQV
t E1LQX
t E2HOX
tGLQX
tE1HQZ
tE2HQZ
tGHQZ
tRC
tAA
t ACS1
t ACS2
tOE
t CLZ1
t CLZ2
tOLZ
t CHZ1
t CHZ2
tOHZ
tAXOX
tOH
R0201-BS62UV1024
BS62UV1024-15
MIN. TYP. MAX.
DESCRIPTION
Read Cycle Time
UNIT
150
--
--
ns
--
--
150
ns
Chip Select Access Time
(CE1)
--
--
150
ns
Chip Select Access Time
(CE2)
--
--
150
ns
--
--
100
ns
Address Access Time
Output Enable to Output Valid
Chip Select to Output Low Z
(CE1)
10
--
--
ns
Chip Select to Output Low Z
(CE2)
10
--
--
ns
10
--
--
ns
Chip Deselect to Output in High Z
(CE1)
0
--
40
ns
Chip Deselect to Output in High Z
(CE2)
0
Output Enable to Output in Low Z
Output Disable to Output in High Z
Output Disable to Output Address Change
4
40
0
--
35
ns
10
--
--
ns
Revision 2.2
April 2001
BSI
BS62UV1024
„ SWITCHING WAVEFORMS (READ CYCLE)
READ CYCLE1 (1,2,4)
t RC
ADDRESS
t
t
t OH
AA
OH
D OUT
READ CYCLE2 (1,3,4)
CE1
CE2
t
t
ACS1
t
ACS2
t
(5)
(5)
CHZ1,
t
CHZ2
CLZ
D OUT
READ CYCLE3 (1,4)
t RC
ADDRESS
t
AA
OE
t
t
CE1
t
CE2
(5)
t
OH
OLZ
t ACS1
CLZ1
t
t
OE
t OHZ (5)
(1,5)
t CHZ1
ACS2
t
(5)
(2,5)
CHZ2
CLZ2
D OUT
NOTES:
1. WE is high in read Cycle.
2. Device is continuously selected when CE1 = VIL and CE2= VIH.
3. Address valid prior to or coincident with CE1 transition low and/or CE2 transition high.
4. OE = VIL .
5. Transition is measured ± 500mV from steady state with CL = 5pF as shown in Figure 1B.
The parameter is guaranteed but not 100% tested.
R0201-BS62UV1024
5
Revision 2.2
April 2001
BSI
BS62UV1024
„ AC ELECTRICAL CHARACTERISTICS ( TA = 0oC to + 70oC, Vcc=2.0V )
WRITE CYCLE
JEDEC
PARAMETER
NAME
PARAMETER
NAME
BS62UV1024-15
MIN. TYP. MAX.
DESCRIPTION
UNIT
t AVAX
t WC
Write Cycle Time
150
--
--
ns
t E1LWH
t CW
Chip Select to End of Write
150
--
--
ns
t AVWL
t AS
Address Set up Time
0
--
--
ns
t AVWH
t AW
Address Valid to End of Write
150
--
--
ns
t WLWH
t WP
Write Pulse Width
80
--
--
ns
t WHAX
t WR1
Write Recovery Time
(CE1 , WE)
0
--
--
ns
t E2LAX
t WR2
Write Recovery Time
(CE2)
0
--
--
ns
t WLOZ
t WHZ
Write to Output in High Z
--
--
40
ns
t DVWH
t DW
Data to Write Time Overlap
50
--
--
ns
t WHDX
t DH
Data Hold from Write Time
0
--
--
ns
t GHOZ
t OHZ
Output Disable to Output in High Z
0
--
40
ns
t WHQX
t OW
End of Write to Output Active
5
--
--
ns
„ SWITCHING WAVEFORMS (WRITE CYCLE)
t WC
WRITE CYCLE1 (1)
ADDRESS
t
(3)
WR1
OE
(11)
t CW
(5)
CE1
(5)
CE2
t CW
t
WE
(11)
t WR2
AW
t
t AS
(3)
WP
(2)
(4,10)
t OHZ
D OUT
t DH
t DW
D IN
R0201-BS62UV1024
6
Revision 2.2
April 2001
BSI
BS62UV1024
WRITE CYCLE2 (1,6)
t WC
ADDRESS
(11)
t
(5)
CW
CE1
CE2
(5)
(11)
t
t CW
AW
t WR2
t WP
(3)
(2)
WE
t
t AS
DH
(4,10)
t WHZ
D OUT
(7)
(8)
t DW
t
DH
(8,9)
D IN
NOTES:
1. WE must be high during address transitions.
2. The internal write time of the memory is defined by the overlap of CE1 and CE2 active and WE low.
All signals must be active to initiate a write and any one signal can terminate a write by going
inactive. The data input setup and hold timing should be referenced to the second transition edge
of the signal that terminates the write.
3. TWR is measured from the earlier of CE1 or WE going high or CE2 going low at the end of write
cycle.
4. During this period, DQ pins are in the output state so that the input signals of opposite phase to the
outputs must not be applied.
5. If the CE1 low transition or the CE2 high transition occurs simultaneously with the WE low
transitions or after the WE transition, output remain in a high impedance state.
6. OE is continuously low (OE = VIL ).
7. DOUT is the same phase of write data of this write cycle.
8. DOUT is the read data of next address.
9. If CE1 is low and CE2 is high during this period, DQ pins are in the output state. Then the data input
signals of opposite phase to the outputs must not be applied to them.
10. Transition is measured ± 500mV from steady state with CL = 5pF as shown in Figure 1B. The
parameter is guaranteed but not 100% tested.
11. TCW is measured from the later of CE1 going low or CE2 going high to the end of write.
R0201-BS62UV1024
7
Revision 2.2
April 2001
BSI
BS62UV1024
„ ORDERING INFORMATION
BS62UV1024
X X
ˀˀ Y Y
SPEED
15: 150ns
GRADE
C: +0oC ~ +70oC
I: -40oC ~ +85oC
PACKAGE
S: SOP
T: TSOP (8mm x 20mm)
ST: Small TSOP (8mm x 13.4mm)
J : SOJ
P: PDIP
D : DICE
„ PACKAGE DIMENSIONS
WITH PLATING
b
c c1
BASE METAL
b1
SECTION A-A
SOP -32
R0201-BS62UV1024
8
Revision 2.2
April 2001
BSI
BS62UV1024
„ PACKAGE DIMENSIONS (continued)
STSOP - 32
TSOP - 32
R0201-BS62UV1024
9
Revision 2.2
April 2001
BSI
BS62UV1024
„ PACKAGE DIMENSIONS (continued)
SOJ - 32
PDIP - 32
R0201-BS62UV1024
10
Revision 2.2
April 2001
BSI
BS62UV1024
REVISION HISTORY
Revision
Description
Date
2.2
2001 Data Sheet release
Apr. 15, 2001
R0201-BS62UV1024
11
Note
Revision 2.2
April 2001
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