Cypress CY14B104LA-ZS25XIT 4-mbit (512 k ã 8/256 k ã 16) nvsram Datasheet

CY14B104LA, CY14B104NA
4-Mbit (512 K × 8/256 K × 16) nvSRAM
Features
■
Packages
❐ 44-/54-pin thin small outline package (TSOP II)
❐ 48-ball fine-pitch ball grid array (FBGA)
Pb-free and restriction of hazardous substances (RoHS)
compliant
■
20 ns, 25 ns, and 45 ns access times
■
Internally organized as 512 K × 8 (CY14B104LA) or 256 K ×
16 (CY14B104NA)
■
■
Hands off automatic STORE on power-down with only a small
capacitor
Functional Description
■
STORE to QuantumTrap nonvolatile elements initiated by
software, device pin, or AutoStore on power-down
■
RECALL to SRAM initiated by software or power-up
■
Infinite read, write, and recall cycles
■
1 million STORE cycles to QuantumTrap
■
20 year data retention
■
Single 3 V +20%, -10% operation
■
Industrial temperature
The Cypress CY14B104LA/CY14B104NA is a fast static RAM
(SRAM), with a nonvolatile element in each memory cell. The
memory is organized as 512 K bytes of 8 bits each or 256 K
words of 16 bits each. The embedded nonvolatile elements
incorporate QuantumTrap technology, producing the world’s
most reliable nonvolatile memory. The SRAM provides infinite
read and write cycles, while independent nonvolatile data
resides in the highly reliable QuantumTrap cell. Data transfers
from the SRAM to the nonvolatile elements (the STORE
operation) takes place automatically at power-down. On
power-up, data is restored to the SRAM (the RECALL operation)
from the nonvolatile memory. Both the STORE and RECALL
operations are also available under software control.
Logic Block Diagram[1, 2, 3]
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Notes
1. Address A0 - A18 for ×8 configuration and Address A0 - A17 for ×16 configuration.
2. Data DQ0 - DQ7 for ×8 configuration and Data DQ0 - DQ15 for ×16 configuration.
3. BHE and BLE are applicable for ×16 configuration only.
Cypress Semiconductor Corporation
Document #: 001-49918 Rev. *H
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised January 18, 2011
[+] Feedback
CY14B104LA, CY14B104NA
Contents
Pinouts .............................................................................. 3
Device Operation .............................................................. 5
SRAM Read ....................................................................... 5
SRAM Write ....................................................................... 5
AutoStore Operation ........................................................ 5
Hardware STORE Operation............................................ 5
Hardware RECALL (Power-Up) ....................................... 6
Software STORE ............................................................... 6
Software RECALL............................................................. 6
Preventing AutoStore....................................................... 7
Data Protection ................................................................. 7
Noise Considerations....................................................... 7
Best Practices................................................................... 8
Maximum Ratings............................................................. 9
Operating Range............................................................... 9
DC Electrical Characteristics .......................................... 9
AC Test Conditions ........................................................ 10
Data Retention and Endurance ..................................... 10
Capacitance .................................................................... 10
Thermal Resistance........................................................ 10
AC Switching Characteristics ....................................... 11
Switching Waveforms .................................................... 11
Document #: 001-49918 Rev. *H
AutoStore/Power-Up RECALL.......................................
Switching Waveforms ....................................................
Software Controlled STORE/RECALL Cycle................
Switching Waveforms ....................................................
Hardware STORE Cycle .................................................
Switching Waveforms ....................................................
Truth Table For SRAM Operations................................
For ×8 Configuration .................................................
For ×16 Configuration ...............................................
Ordering Information......................................................
Package Diagrams..........................................................
Acronyms ........................................................................
Document Conventions .............................................
Units of Measure .......................................................
Document History Page .................................................
Sales, Solutions, and Legal Information ......................
Worldwide Sales and Design Support.......................
Products ....................................................................
PSoC Solutions .........................................................
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14
15
15
16
16
17
17
17
18
20
22
22
22
23
24
24
24
24
Page 2 of 24
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CY14B104LA, CY14B104NA
Pinouts
Figure 1. Pin Diagram - 48-Ball FBGA
48 - FBGA
48 - FBGA
(×8)
Top View
(not to scale)
(×16)
Top View
(not to scale)
1
2
3
4
5
6
A
BLE
OE
A0
A1
A2
NC
A
NC
B
DQ8
BHE
A3
A4
CE
DQ0
B
NC
DQ4
C
DQ9 DQ10
A5
A6
DQ1
DQ2
C
A7
DQ5
VCC
D
VSS
A17
A7
DQ3
VCC
D
2
3
4
5
6
NC
OE
A0
A1
A2
NC
NC
NC
A3
A4
CE
DQ0
NC
A5
A6
VSS
DQ1
A17
1
DQ11
VCC
DQ2
VCAP
A16
DQ6
VSS
E
VCC DQ12
VCAP
A16
DQ4
VSS
E
DQ3
NC
A14
A15
NC
DQ7
F
DQ14 DQ13
A14
A15
DQ5
DQ6
F
NC
HSB
A12
A13
WE
NC
G
DQ15 HSB
A12
A13
WE
DQ7
G
A18
A8
A9
A10
A11
H
NC
A9
A10
A11
NC
H
44
43
42
41
40
39
38
37
36
35
34
33
32
31
A17
A16
A15
OE
BHE
NC
[4]
[4]
A8
Figure 2. Pin Diagram - 44-Pin TSOP II
(×16)[6]
(×8)
NC
[5]
NC
A0
A1
A2
A3
A4
CE
DQ0
DQ1
VCC
VSS
DQ2
DQ3
WE
A5
A6
A7
A8
A9
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44 - TSOP II
(×8)
Top View
(not to scale)
44
43
42
41
40
39
38
37
36
35
34
33
32
31
HSB
NC
[4]
NC
A18
A17
A16
A15
OE
DQ7
DQ6
VSS
VCC
DQ5
DQ4
30
29
28
27
26
25
24
23
VCAP
A14
A13
A12
A11
A10
NC
NC
A0
A1
A2
A3
A4
CE
DQ0
DQ1
DQ2
DQ3
VCC
VSS
DQ4
DQ5
DQ6
DQ7
WE
A5
A6
A7
A8
A9
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44 - TSOP II
(×16)
Top View
(not to scale)
30
29
28
27
26
25
24
23
BLE
DQ15
DQ14
DQ13
DQ12
VSS
VCC
DQ11
DQ10
DQ9
DQ8
VCAP
A14
A13
A12
A11
A10
Notes
4. Address expansion for 8 Mbit. NC pin not connected to die.
5. Address expansion for 16 Mbit. NC pin not connected to die.
6. HSB pin is not available in 44-TSOP II (×16) package.
Document #: 001-49918 Rev. *H
Page 3 of 24
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CY14B104LA, CY14B104NA
Pinouts
(continued)
Figure 3. Pin Diagram - 54-Pin TSOP II (×16)
NC
[5]
NC
A0
A1
A2
A3
A4
CE
DQ0
DQ1
DQ2
DQ3
VCC
VSS
DQ4
DQ5
DQ6
DQ7
WE
A5
A6
A7
A8
A9
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
54
53
52
51
50
49
54 - TSOP II
(×16)
Top View
(not to scale)
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
HSB
NC [4]
A17
A16
A15
OE
BHE
BLE
DQ15
DQ14
DQ13
DQ12
VSS
VCC
DQ11
DQ10
DQ9
DQ8
VCAP
A14
A13
A12
A11
A10
NC
NC
NC
Table 1. Pin Definitions
Pin Name
A0 – A18
A0 – A17
DQ0 – DQ7
I/O Type
Input
Input/Output
DQ0 – DQ15
WE
Input
CE
OE
Input
Input
BHE
BLE
VSS
VCC
HSB[7]
Input
Input
Ground
Power supply
Input/Output
VCAP
Power supply
NC
No connect
Description
Address inputs. Used to select one of the 524,288 bytes of the nvSRAM for x8 Configuration.
Address inputs. Used to Select one of the 262,144 words of the nvSRAM for x16 Configuration.
Bidirectional data I/O lines for ×8 configuration. Used as input or output lines depending on
operation.
Bidirectional data I/O lines for ×16 configuration. Used as input or output lines depending on
operation.
Write Enable input, Active LOW. When selected LOW, data on the I/O pins is written to the specific
address location.
Chip Enable input, Active LOW. When LOW, selects the chip. When HIGH, deselects the chip.
Output Enable, Active LOW. The active LOW OE input enables the data output buffers during read
cycles. I/O pins are tristated on deasserting OE HIGH.
Byte High Enable, Active LOW. Controls DQ15 - DQ8.
Byte Low Enable, Active LOW. Controls DQ7 - DQ0.
Ground for the device. Must be connected to the ground of the system.
Power supply inputs to the device.
Hardware STORE Busy (HSB). When LOW this output indicates that a Hardware STORE is in
progress. When pulled LOW external to the chip it initiates a nonvolatile STORE operation. After each
Hardware and Software STORE operation, HSB is driven HIGH for a short time (tHHHD) with standard
output high current, and then a weak internal pull-up resistor keeps this pin HIGH (external pull-up
resistor connection optional).
AutoStore Capacitor. Supplies power to the nvSRAM during power loss to store data from SRAM to
nonvolatile elements.
No Connect. This pin is not connected to the die.
Note
7. HSB pin is not available in 44-TSOP II (×16) package.
Document #: 001-49918 Rev. *H
Page 4 of 24
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CY14B104LA, CY14B104NA
The CY14B104LA/CY14B104NA nvSRAM is made up of two
functional components paired in the same physical cell. They are
a SRAM memory cell and a nonvolatile QuantumTrap cell. The
SRAM memory cell operates as a standard fast static RAM. Data
in the SRAM is transferred to the nonvolatile cell (the STORE
operation), or from the nonvolatile cell to the SRAM (the RECALL
operation). Using this unique architecture, all cells are stored and
recalled in parallel. During the STORE and RECALL operations,
SRAM read and write operations are inhibited. The
CY14B104LA/CY14B104NA supports infinite reads and writes
similar to a typical SRAM. In addition, it provides infinite RECALL
operations from the nonvolatile cells and up to 1 million STORE
operations. Refer to the Truth Table For SRAM Operations on
page 17 for a complete description of read and write modes.
SRAM Read
The CY14B104LA/CY14B104NA performs a read cycle when
CE and OE are LOW and WE and HSB are HIGH. The address
specified on pins A0-18 or A0-17 determines which of the 524,288
data bytes or 262,144 words of 16 bits each are accessed. Byte
enables (BHE, BLE) determine which bytes are enabled to the
output, in the case of 16-bit words. When the read is initiated by
an address transition, the outputs are valid after a delay of tAA
(read cycle 1). If the read is initiated by CE or OE, the outputs
are valid at tACE or at tDOE, whichever is later (read cycle 2). The
data output repeatedly responds to address changes within the
tAA access time without the need for transitions on any control
input pins. This remains valid until another address change or
until CE or OE is brought HIGH, or WE or HSB is brought LOW.
SRAM Write
A write cycle is performed when CE and WE are LOW and HSB
is HIGH. The address inputs must be stable before entering the
write cycle and must remain stable until CE or WE goes HIGH at
the end of the cycle. The data on the common I/O pins DQ0–15
are written into the memory if the data is valid (tSD time) before
the end of a WE controlled write or before the end of an CE
controlled write. The Byte Enable inputs (BHE, BLE) determine
which bytes are written, in the case of 16-bit words. It is recommended that OE be kept HIGH during the entire write cycle to
avoid data bus contention on common I/O lines. If OE is left LOW,
internal circuitry turns off the output buffers tHZWE after WE goes
LOW.
AutoStore Operation
The CY14B104LA/CY14B104NA stores data to the nvSRAM
using one of the following three storage operations: Hardware
STORE activated by the HSB; Software STORE activated by an
address sequence; AutoStore on device power-down. The
AutoStore operation is a unique feature of QuantumTrap
technology
and
is
enabled
by
default
on
the
CY14B104LA/CY14B104NA.
During a normal operation, the device draws current from VCC to
charge a capacitor connected to the VCAP pin. This stored
charge is used by the chip to perform a single STORE operation.
If the voltage on the VCC pin drops below VSWITCH, the part
automatically disconnects the VCAP pin from VCC. A STORE
operation is initiated with power provided by the VCAP capacitor.
Note If the capacitor is not connected to VCAP pin, AutoStore
must be disabled using the soft sequence specified in Preventing
AutoStore on page 7. In case AutoStore is enabled without a
capacitor on VCAP pin, the device attempts an AutoStore
operation without sufficient charge to complete the Store. This
corrupts the data stored in nvSRAM.
Figure 4 shows the proper connection of the storage capacitor
(VCAP) for automatic store operation. Refer to DC Electrical
Characteristics on page 9 for the size of VCAP. The voltage on
the VCAP pin is driven to VCC by a regulator on the chip. A pull-up
should be placed on WE to hold it inactive during power-up. This
pull-up is effective only if the WE signal is tristate during
power-up. Many MPUs tristate their controls on power-up. This
should be verified when using the pull-up. When the nvSRAM
comes out of power-on-RECALL, the MPU must be active or the
WE held inactive until the MPU comes out of reset.
To reduce unnecessary nonvolatile stores, AutoStore and
hardware STORE operations are ignored unless at least one
write operation has taken place since the most recent STORE or
RECALL cycle. Software initiated STORE cycles are performed
regardless of whether a write operation has taken place. The
HSB signal is monitored by the system to detect if an AutoStore
cycle is in progress.
Figure 4. AutoStore Mode
VCC
0.1 uF
10 kOhm
Device Operation
VCC
WE
VCAP
VSS
VCAP
Hardware STORE Operation
The CY14B104LA/CY14B104NA provides the HSB[8] pin to
control and acknowledge the STORE operations. The HSB pin
is used to request a hardware STORE cycle. When the HSB pin
is driven LOW, the CY14B104LA/CY14B104NA conditionally
initiates a STORE operation after tDELAY. An actual STORE cycle
only begins if a write to the SRAM has taken place since the last
STORE or RECALL cycle. The HSB pin also acts as an open
drain driver (internal 100 kΩ weak pull-up resistor) that is internally driven LOW to indicate a busy condition when the STORE
(initiated by any means) is in progress.
Note After each Hardware and Software STORE operation HSB
is driven HIGH for a short time (tHHHD) with standard output high
current and then remains HIGH by internal 100 kΩ pull-up
resistor.
Note
8. HSB pin is not available in 44-TSOP II (x16) package.
Document #: 001-49918 Rev. *H
Page 5 of 24
[+] Feedback
CY14B104LA, CY14B104NA
SRAM write operations that are in progress when HSB is driven
LOW by any means are given time (tDELAY) to complete before
the STORE operation is initiated. However, any SRAM write
cycles requested after HSB goes LOW are inhibited until HSB
returns HIGH. In case the write latch is not set, HSB is not driven
LOW by the CY14B104LA/CY14B104NA. But any SRAM read
and write cycles are inhibited until HSB is returned HIGH by MPU
or other external source.
During any STORE operation, regardless of how it is initiated,
the CY14B104LA/CY14B104NA continues to drive the HSB pin
LOW, releasing it only when the STORE is complete. Upon
completion of the STORE operation, the nvSRAM memory
access is inhibited for tLZHSB time after HSB pin returns HIGH.
Leave the HSB unconnected if it is not used.
1. Read address 0x4E38 Valid READ
2. Read address 0xB1C7 Valid READ
3. Read address 0x83E0 Valid READ
4. Read address 0x7C1F Valid READ
5. Read address 0x703F Valid READ
6. Read address 0x8FC0 Initiate STORE cycle
The software sequence may be clocked with CE controlled reads
or OE controlled reads, with WE kept HIGH for all the six READ
sequences. After the sixth address in the sequence is entered,
the STORE cycle commences and the chip is disabled. HSB is
driven LOW. After the tSTORE cycle time is fulfilled, the SRAM is
activated again for the read and write operation.
Software RECALL
Hardware RECALL (Power-Up)
During power-up or after any low power condition
(VCC< VSWITCH), an internal RECALL request is latched. When
VCC again exceeds the VSWITCH on powerup, a RECALL cycle
is automatically initiated and takes tHRECALL to complete. During
this time, the HSB pin is driven LOW by the HSB driver and all
reads and writes to nvSRAM are inhibited.
Software STORE
Data is transferred from the SRAM to the nonvolatile memory by
a software address sequence. The CY14B104LA/CY14B104NA
software STORE cycle is initiated by executing sequential CE or
OE controlled read cycles from six specific address locations in
exact order. During the STORE cycle an erase of the previous
nonvolatile data is first performed, followed by a program of the
nonvolatile elements. After a STORE cycle is initiated, further
input and output are disabled until the cycle is completed.
Because a sequence of reads from specific addresses is used
for STORE initiation, it is important that no other read or write
accesses intervene in the sequence, or the sequence is aborted
and no STORE or RECALL takes place.
Data is transferred from the nonvolatile memory to the SRAM by
a software address sequence. A software RECALL cycle is
initiated with a sequence of read operations in a manner similar
to the software STORE initiation. To initiate the RECALL cycle,
perform the following sequence of CE or OE controlled read
operations must be performed.
1. Read address 0x4E38 Valid READ
2. Read address 0xB1C7 Valid READ
3. Read address 0x83E0 Valid READ
4. Read address 0x7C1F Valid READ
5. Read address 0x703F Valid READ
6. Read address 0x4C63 Initiate RECALL cycle
Internally, RECALL is a two step procedure. First, the SRAM data
is cleared; then, the nonvolatile information is transferred into the
SRAM cells. After the tRECALL cycle time, the SRAM is again
ready for read and write operations. The RECALL operation
does not alter the data in the nonvolatile elements.
To initiate the software STORE cycle, the following read
sequence must be performed.
Table 2. Mode Selection
CE
WE
OE
BHE, BLE[9]
A15 - A0[10]
Mode
I/O
Power
H
X
X
X
X
Not selected
Output high-Z
Standby
L
H
L
L
X
Read SRAM
Output data
Active
L
L
X
L
X
Write SRAM
Input data
Active
L
H
L
X
0x4E38
0xB1C7
0x83E0
0x7C1F
0x703F
0x8B45
Read SRAM
Read SRAM
Read SRAM
Read SRAM
Read SRAM
AutoStore
Disable
Output data
Output data
Output data
Output data
Output data
Output data
Active[11]
Notes
9. BHE and BLE are applicable for x16 configuration only.
10. While there are 19 address lines on the CY14B104LA (18 address lines on the CY14B104NA), only 13 address lines (A14 - A2) are used to control software modes.
The remaining address lines are don’t care.
11. The six consecutive address locations must be in the order listed. WE must be HIGH during all six cycles to enable a nonvolatile cycle.
Document #: 001-49918 Rev. *H
Page 6 of 24
[+] Feedback
CY14B104LA, CY14B104NA
Table 2. Mode Selection (continued)
CE
WE
OE
BHE, BLE[9]
A15 - A0[10]
Mode
I/O
Power
L
H
L
X
0x4E38
0xB1C7
0x83E0
0x7C1F
0x703F
0x4B46
Read SRAM
Read SRAM
Read SRAM
Read SRAM
Read SRAM
AutoStore
Enable
Output data
Output data
Output data
Output data
Output data
Output data
Active[11]
L
H
L
X
0x4E38
0xB1C7
0x83E0
0x7C1F
0x703F
0x8FC0
Read SRAM
Read SRAM
Read SRAM
Read SRAM
Read SRAM
Nonvolatile
STORE
Output data
Output data
Output data
Output data
Output data
Output high-Z
Active ICC2[11]
L
H
L
X
0x4E38
0xB1C7
0x83E0
0x7C1F
0x703F
0x4C63
Read SRAM
Read SRAM
Read SRAM
Read SRAM
Read SRAM
Nonvolatile
RECALL
Output data
Output data
Output data
Output data
Output data
Output high-Z
Active[11]
Preventing AutoStore
Data Protection
The AutoStore function is disabled by initiating an AutoStore
disable sequence. A sequence of read operations is performed
in a manner similar to the software STORE initiation. To initiate
the AutoStore disable sequence, the following sequence of CE
or OE controlled read operations must be performed:
1. Read address 0x4E38 Valid READ
2. Read address 0xB1C7 Valid READ
3. Read address 0x83E0 Valid READ
4. Read address 0x7C1F Valid READ
5. Read address 0x703F Valid READ
6. Read address 0x8B45 AutoStore Disable
The CY14B104LA/CY14B104NA protects data from corruption
during low voltage conditions by inhibiting all externally initiated
STORE and write operations. The low voltage condition is
detected
when
VCC
<
VSWITCH.
If
the
CY14B104LA/CY14B104NA is in a write mode (both CE and WE
are LOW) at power-up, after a RECALL or STORE, the write is
inhibited until the SRAM is enabled after tLZHSB (HSB to output
active). This protects against inadvertent writes during power-up
or brown out conditions.
Noise Considerations
Refer to CY application note AN1064.
The AutoStore is re-enabled by initiating an AutoStore enable
sequence. A sequence of read operations is performed in a
manner similar to the software RECALL initiation. To initiate the
AutoStore enable sequence, the following sequence of CE or OE
controlled read operations must be performed:
1. Read address 0x4E38 Valid READ
2. Read address 0xB1C7 Valid READ
3. Read address 0x83E0 Valid READ
4. Read address 0x7C1F Valid READ
5. Read address 0x703F Valid READ
6. Read address 0x4B46 AutoStore Enable
If the AutoStore function is disabled or re-enabled, a manual
STORE operation (hardware or software) must be issued to save
the AutoStore state through subsequent power-down cycles.
The part comes from the factory with AutoStore enabled.
Document #: 001-49918 Rev. *H
Page 7 of 24
[+] Feedback
CY14B104LA, CY14B104NA
Best Practices
■
power-up boot firmware routines should rewrite the nvSRAM
into the desired state (for example, AutoStore enabled). While
the nvSRAM is shipped in a preset state, best practice is to
again rewrite the nvSRAM into the desired state as a safeguard
against events that might flip the bit inadvertently such as
program bugs and incoming inspection routines.
■
The VCAP value specified in this datasheet includes a minimum
and a maximum value size. Best practice is to meet this
requirement and not exceed the maximum VCAPvalue because
the nvSRAM internal algorithm calculates VCAP charge and
discharge time based on this maximum VCAP value. Customers
that want to use a larger VCAP value to make sure there is extra
store charge and store time should discuss their VCAP size
selection with Cypress to understand any impact on the VCAP
voltage level at the end of a tRECALL period.
nvSRAM products have been used effectively for over 27 years.
While ease-of-use is one of the product’s main system values,
experience gained working with hundreds of applications has
resulted in the following suggestions as best practices:
■
The nonvolatile cells in this nvSRAM product are delivered from
Cypress with 0x00 written in all cells. Incoming inspection
routines at customer or contract manufacturer’s sites
sometimes reprogram these values. Final NV patterns are
typically repeating patterns of AA, 55, 00, FF, A5, or 5A. End
product’s firmware should not assume an NV array is in a set
programmed state. Routines that check memory content
values to determine first time system configuration, cold or
warm boot status, and so on should always program a unique
NV pattern (that is, complex 4-byte pattern of 46 E6 49 53 hex
or more random bytes) as part of the final system manufacturing test to ensure these system routines work consistently.
Document #: 001-49918 Rev. *H
Page 8 of 24
[+] Feedback
CY14B104LA, CY14B104NA
Maximum Ratings
Exceeding maximum ratings may impair the useful life of the
device. These user guidelines are not tested.
Transient voltage (<20 ns) on
any pin to ground potential .................. –2.0 V to VCC + 2.0 V
Storage temperature ................................ –65 °C to +150 °C
Package power dissipation
capability (TA = 25 °C) ................................................. .1.0 W
Maximum accumulated storage time
At 150 °C ambient temperature..........................1000 h
At 85 °C ambient temperature.................... .. 20 Years
Ambient temperature with
power applied ........................................... –55 °C to +150 °C
Supply voltage on VCC relative to VSS ............–0.5 V to 4.1 V
Voltage applied to outputs
in high-Z state...................................... –0.5 V to VCC + 0.5 V
Input voltage .........................................–0.5 V to Vcc + 0.5 V
Surface mount Pb soldering
temperature (3 Seconds).......................................... +260 °C
DC output current (1 output at a time, 1s duration) ..... 15 mA
Static discharge voltage.......................................... > 2001 V
(per MIL-STD-883, Method 3015)
Latch up current..................................................... > 200 mA
Operating Range
Range
Industrial
Ambient Temperature
VCC
–40 °C to +85 °C
2.7 V to 3.6 V
DC Electrical Characteristics
Over the Operating Range (VCC = 2.7 V to 3.6 V)
Parameter
Description
Test Conditions
Min
VCC
Power supply
2.7
ICC1
Average VCC current tRC = 20 ns
–
tRC = 25 ns
tRC = 45 ns
Values obtained without output loads (IOUT = 0 mA)
ICC2
Average VCC current All inputs don’t care, VCC = Max
–
during STORE
Average current for duration tSTORE
ICC3
–
Average VCC current All inputs cycling at CMOS levels.
at tRC= 200 ns,
Values obtained without output loads (IOUT = 0 mA).
VCC (Typ), 25 °C
All inputs don’t care. Average current for duration tSTORE
ICC4
Average VCAP
–
current during
AutoStore cycle
VCC standby current CE > (VCC – 0.2 V). VIN < 0.2 V or > (VCC – 0.2 V).
–
ISB
Standby current level after nonvolatile cycle is complete.
Inputs are static. f = 0 MHz.
Input leakage current VCC = Max, VSS < VIN < VCC
–1
IIX[13]
(except HSB)
Input leakage current VCC = Max, VSS < VIN < VCC
–100
(for HSB)
IOZ
Off-state output
VCC = Max, VSS < VOUT < VCC, CE or OE > VIH or BHE/BLE
–1
leakage current
> VIH or WE < VIL
VIH
Input HIGH voltage
2.0
VIL
Input LOW voltage
Vss – 0.5
Output HIGH voltage IOUT = –2 mA
2.4
VOH
Output LOW voltage IOUT = 4 mA
–
VOL
VCAP
Storage capacitor
Between VCAP pin and VSS, 5 V rated
61
Typ[12]
3.0
–
Max
3.6
70
70
52
Unit
V
mA
mA
mA
–
10
mA
35
–
mA
–
5
mA
–
5
mA
–
+1
μA
–
+1
μA
–
+1
μA
–
–
–
–
68
VCC + 0.5
0.8
–
0.4
180
V
V
V
V
μF
Notes
12. Typical values are at 25°C, VCC= VCC (Typ). Not 100% tested.
13. The HSB pin has IOUT = -2 uA for VOH of 2.4 V when both active HIGH and LOW drivers are disabled. When they are enabled standard VOH and VOL are valid. This
parameter is characterized but not tested.
Document #: 001-49918 Rev. *H
Page 9 of 24
[+] Feedback
CY14B104LA, CY14B104NA
Data Retention and Endurance
Parameter
Description
DATAR
Data retention
NVC
Nonvolatile STORE operations
Min
Unit
20
Years
1,000
K
Capacitance
In the following table, the capacitance parameters are listed.[14]
Parameter
CIN
Description
Test Conditions
Max
Unit
7
pF
8
pF
Output capacitance (except HSB)
7
pF
Output capacitance (for HSB)
8
pF
TA = 25 °C, f = 1 MHz,
VCC = VCC (Typ)
Input capacitance (except BHE, BLE and HSB)
Input capacitance (for BHE, BLE and HSB)
COUT
Thermal Resistance
In the following table, the thermal resistance parameters are listed. [14]
Parameter
Description
ΘJA
Thermal resistance
(Junction to ambient)
ΘJC
Thermal resistance
(Junction to case)
Test Conditions
48-FBGA
44-TSOP II 54-TSOP II
Unit
Test conditions follow standard test methods
and procedures for measuring thermal
impedance, in accordance with EIA/JESD51.
28.82
31.11
30.73
°C/W
7.84
5.56
6.08
°C/W
Figure 5. AC Test Loads
577 Ω
3.0 V
577 Ω
3.0 V
R1
for tristate specs
R1
OUTPUT
OUTPUT
30 pF
R2
789 Ω
5 pF
R2
789 Ω
AC Test Conditions
Input pulse levels.................................................... 0 V to 3 V
Input rise and fall times (10% - 90%) ........................... <3 ns
Input and output timing reference levels ....................... 1.5 V
Note
14. These parameters are guaranteed by design but not tested.
Document #: 001-49918 Rev. *H
Page 10 of 24
[+] Feedback
CY14B104LA, CY14B104NA
AC Switching Characteristics
Parameters
Cypress
Alt
Parameter
Parameter
SRAM Read Cycle
tACE
tACS
tRC[15]
tAA[16]
tDOE
tOHA[16]
tLZCE[17, 18]
tHZCE[17, 18]
tLZOE[17, 18]
tHZOE[17, 18]
tRC
tAA
tOE
tOH
tLZ
tHZ
tOLZ
tOHZ
tPU[17]
tPA
[17]
tPD
tPS
tDBE
[17]
tLZBE
tHZBE[17]
SRAM Write Cycle
tWC
tWC
tPWE
tWP
tSCE
tCW
tSD
tDW
tHD
tDH
tAW
tAW
tSA
tAS
tHA
tWR
[17, 18,19]
tHZWE
tWZ
tOW
tLZWE[17, 18]
tBW
-
Switching Waveforms
20 ns
Description
25 ns
45 ns
Unit
Min
Max
Min
Max
Min
Max
Chip enable access time
Read cycle time
Address access time
Output enable to data valid
Output hold after address change
Chip enable to output active
Chip disable to output inactive
Output enable to output active
–
20
–
–
3
3
–
0
20
–
20
10
–
–
8
–
–
25
–
–
3
3
–
0
25
–
25
12
–
–
10
–
–
45
–
–
3
3
–
0
45
–
45
20
–
–
15
–
ns
ns
ns
ns
ns
ns
ns
ns
Output disable to output inactive
Chip enable to power active
Chip disable to power standby
Byte enable to data valid
Byte enable to output active
Byte disable to output inactive
–
0
–
–
0
–
8
–
20
10
–
8
–
0
–
–
0
–
10
–
25
12
–
10
–
0
–
–
0
–
15
–
45
20
–
15
ns
ns
ns
ns
ns
ns
Write cycle time
Write pulse width
Chip enable to end of write
Data setup to end of write
Data hold after end of write
Address setup to end of write
Address setup to start of write
Address hold after end of write
Write enable to output disable
Output active after end of write
Byte enable to end of write
20
15
15
8
0
15
0
0
–
3
15
–
–
–
–
–
–
–
–
8
–
–
25
20
20
10
0
20
0
0
–
3
20
–
–
–
–
–
–
–
–
10
–
–
45
30
30
15
0
30
0
0
–
3
30
–
–
–
–
–
–
–
–
15
–
–
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Figure 6. SRAM Read Cycle #1: Address Controlled[15, 16, 20]
tRC
Address
Address Valid
tAA
Data Output
Previous Data Valid
Output Data Valid
tOHA
Notes
15. WE must be HIGH during SRAM read cycles.
16. Device is continuously selected with CE, OE and BHE / BLE LOW.
17. These parameters are guaranteed by design but not tested.
18. Measured ±200 mV from steady state output voltage.
19. If WE is LOW when CE goes LOW, the outputs remain in the high impedance state.
20. HSB must remain HIGH during read and write cycles.
Document #: 001-49918 Rev. *H
Page 11 of 24
[+] Feedback
CY14B104LA, CY14B104NA
Figure 7. SRAM Read Cycle #2: CE and OE Controlled[21, 22, 23]
Address
Address Valid
tRC
tHZCE
tACE
CE
tAA
tLZCE
tHZOE
tDOE
OE
tHZBE
tLZOE
tDBE
BHE, BLE
tLZBE
Data Output
ICC
High Impedance
Output Data Valid
tPU
tPD
Active
Standby
Figure 8. SRAM Write Cycle #1: WE Controlled[21, 23, 24, 25]
tWC
Address
Address Valid
tSCE
tHA
CE
tBW
BHE, BLE
tAW
tPWE
WE
tSA
tSD
Data Input
Input Data Valid
tHZWE
Data Output
tHD
Previous Data
tLZWE
High Impedance
Notes
21. BHE and BLE are applicable for ×16 configuration only.
22. WE must be HIGH during SRAM read cycles.
23. HSB must remain HIGH during read and write cycles.
24. If WE is LOW when CE goes LOW, the outputs remain in the high impedance state.
25. CE or WE must be >VIH during address transitions.
Document #: 001-49918 Rev. *H
Page 12 of 24
[+] Feedback
CY14B104LA, CY14B104NA
Figure 9. SRAM Write Cycle #2: CE Controlled[26, 27, 28, 29]
tWC
Address Valid
Address
tSA
tSCE
tHA
CE
tBW
BHE, BLE
tPWE
WE
tHD
tSD
Input Data Valid
Data Input
High Impedance
Data Output
Figure 10. SRAM Write Cycle #3: BHE and BLE Controlled[26, 27, 28, 29]
tWC
Address
Address Valid
tSCE
CE
tSA
tHA
tBW
BHE, BLE
tAW
tPWE
WE
tSD
Data Input
tHD
Input Data Valid
High Impedance
Data Output
Notes
26. BHE and BLE are applicable for ×16 configuration only.
27. If WE is LOW when CE goes LOW, the outputs remain in the high impedance state.
28. HSB must remain HIGH during read and write cycles.
29. CE or WE must be >VIH during address transitions.
Document #: 001-49918 Rev. *H
Page 13 of 24
[+] Feedback
CY14B104LA, CY14B104NA
AutoStore/Power-Up RECALL
Parameter
tHRECALL [30]
tSTORE [31]
tDELAY [32]
VSWITCH
tVCCRISE[14]
VHDIS[14]
tLZHSB[14]
tHHHD[14]
20 ns
Description
Min
–
–
–
–
150
–
–
–
Power-Up RECALL duration
STORE cycle duration
Time allowed to complete SRAM write cycle
Low voltage trigger level
VCC rise time
HSB output disable voltage
HSB to output active time
HSB high active time
Switching Waveforms
25 ns
Max
20
8
20
2.65
–
1.9
5
500
Min
–
–
–
–
150
–
–
–
45 ns
Max
20
8
25
2.65
–
1.9
5
500
Min
–
–
–
–
150
–
–
–
Max
20
8
25
2.65
–
1.9
5
500
Unit
ms
ms
ns
V
μs
V
μs
ns
Figure 11. AutoStore or Power-Up RECALL[33]
VCC
VSWITCH
VHDIS
t VCCRISE
tHHHD
Note
31
Note31
tSTORE
tHHHD
34
Note
HSB OUT
tSTORE
Note
34
tDELAY
tLZHSB
AutoStore
tLZHSB
tDELAY
POWERUP
RECALL
Read & Write
Inhibited
(RWI)
tHRECALL
POWER-UP
RECALL
Read & Write
tHRECALL
BROWN
OUT
AutoStore
POWER-UP
RECALL
Read & Write
POWER
DOWN
AutoStore
Notes
30. tHRECALL starts from the time VCC rises above VSWITCH.
31. If an SRAM write has not taken place since the last nonvolatile cycle, no AutoStore or Hardware STORE takes place.
32. On a Hardware STORE and AutoStore initiation, SRAM write operation continues to be enabled for time tDELAY.
33. Read and write cycles are ignored during STORE, RECALL, and while VCC is below VSWITCH.
34. During power-up and power-down, HSB glitches when HSB pin is pulled up through an external resistor.
Document #: 001-49918 Rev. *H
Page 14 of 24
[+] Feedback
CY14B104LA, CY14B104NA
Software Controlled STORE/RECALL Cycle
In the following table, the software controlled STORE and RECALL cycle parameters are listed.[35, 36]
Parameter
tRC
tSA
tCW
tHA
tRECALL
20 ns
Min
Max
20
–
0
–
15
–
0
–
–
200
Description
STORE/RECALL initiation cycle time
Address setup time
Clock pulse width
Address hold time
RECALL duration
25 ns
Min
Max
25
–
0
–
20
–
0
–
–
200
45 ns
Min
Max
45
–
0
–
30
–
0
–
–
200
Unit
ns
ns
ns
ns
μs
Switching Waveforms
Figure 12. CE and OE Controlled Software STORE/RECALL Cycle[36]
tRC
Address
tRC
Address #1
tSA
Address #6
tCW
tCW
CE
tHA
tSA
tHA
tHA
tHA
OE
tHHHD
HSB (STORE only)
tHZCE
tLZCE
t DELAY
37
Note
tLZHSB
High Impedance
tSTORE/tRECALL
DQ (DATA)
RWI
Figure 13. AutoStore Enable/Disable Cycle
Address
tSA
CE
tRC
tRC
Address #1
Address #6
tCW
tCW
tHA
tSA
tHA
tHA
tHA
OE
tLZCE
tHZCE
tSS
37
Note
t DELAY
DQ (DATA)
Notes
35. The software sequence is clocked with CE controlled or OE controlled reads.
36. The six consecutive addresses must be read in the order listed in Table 2 on page 6. WE must be HIGH during all six consecutive cycles.
37. DQ output data at the sixth read may be invalid since the output is disabled at tDELAY time.
Document #: 001-49918 Rev. *H
Page 15 of 24
[+] Feedback
CY14B104LA, CY14B104NA
Hardware STORE Cycle
Parameter
20 ns
Description
25 ns
45 ns
Min
Max
Min
Max
Min
Max
20
–
25
–
25
Unit
tDHSB
HSB to output active time when write latch not set
–
tPHSB
Hardware STORE pulse width
15
–
15
–
15
–
ns
tSS [38, 39]
Soft sequence processing time
–
100
–
100
–
100
μs
Switching Waveforms
ns
Figure 14. Hardware STORE Cycle[40]
Write latch set
tPHSB
HSB (IN)
tSTORE
tHHHD
tDELAY
HSB (OUT)
tLZHSB
DQ (Data Out)
RWI
Write latch not set
tPHSB
HSB pin is driven high to VCC only by Internal
100 kOhm resistor,
HSB driver is disabled
SRAM is disabled as long as HSB (IN) is driven low.
HSB (IN)
HSB (OUT)
tDELAY
tDHSB
tDHSB
RWI
Figure 15. Soft Sequence Processing[38, 39]
Soft Sequence
Command
Address
Address #1
tSA
Address #6
tCW
tSS
Soft Sequence
Command
Address #1
tSS
Address #6
tCW
CE
VCC
Notes
38. This is the amount of time it takes to take action on a soft sequence command. Vcc power must remain HIGH to effectively register command.
39. Commands such as STORE and RECALL lock out I/O until operation is complete which further increases this time. See the specific command.
40. If an SRAM write has not taken place since the last nonvolatile cycle, no AutoStore or Hardware STORE takes place.
Document #: 001-49918 Rev. *H
Page 16 of 24
[+] Feedback
CY14B104LA, CY14B104NA
Truth Table For SRAM Operations
HSB should remain HIGH for SRAM Operations.
For x8 Configuration
Inputs/Outputs[41]
CE
WE
OE
H
X
X
High-Z
Deselect/Power-down
Mode
Standby
Power
L
H
L
Data out (DQ0–DQ7);
Read
Active
L
H
H
High-Z
Output disabled
Active
L
L
X
Data in (DQ0–DQ7);
Write
Active
For x16 Configuration
BHE[42] BLE[42]
Inputs/Outputs[41]
CE
WE
OE
Mode
Power
H
X
X
X
X
High-Z
Deselect/Power-down
Standby
L
X
X
H
H
High-Z
Output disabled
Active
L
H
L
L
L
Data out (DQ0–DQ15)
Read
Active
L
H
L
H
L
Data out (DQ0–DQ7);
DQ8–DQ15 in High Z
Read
Active
L
H
L
L
H
Data out (DQ8–DQ15);
DQ0–DQ7 in High Z
Read
Active
L
H
H
L
L
High-Z
Output disabled
Active
L
H
H
H
L
High-Z
Output disabled
Active
L
H
H
L
H
High-Z
Output disabled
Active
L
L
X
L
L
Data in (DQ0–DQ15)
Write
Active
L
L
X
H
L
Data in (DQ0–DQ7);
DQ8–DQ15 in High Z
Write
Active
L
L
X
L
H
Data in (DQ8–DQ15);
DQ0–DQ7 in High Z
Write
Active
Notes
41. Data DQ0 - DQ7 for ×8 configuration and Data DQ0 - DQ15 for ×16 configuration.
42. BHE and BLE are applicable for ×16 configuration only.
Document #: 001-49918 Rev. *H
Page 17 of 24
[+] Feedback
CY14B104LA, CY14B104NA
Ordering Information
Speed
(ns)
20
25
45
Ordering Code
Package
Diagram
Package Type
CY14B104LA-ZS20XIT
51-85087
44-pin TSOP II
CY14B104LA-ZS20XI
51-85087
44-pin TSOP II
CY14B104NA-ZS20XIT
51-85087
44-pin TSOP II
CY14B104NA-ZS20XI
51-85087
44-pin TSOP II
CY14B104NA-BA20XIT
51-85128
48-ball FBGA
CY14B104NA-BA20XI
51-85128
48-ball FBGA
CY14B104LA-ZS25XIT
51-85087
44-pin TSOP II
CY14B104LA-ZS25XI
51-85087
44-pin TSOP II
CY14B104LA-BA25XIT
51-85128
48-ball FBGA
CY14B104LA-BA25XI
51-85128
48-ball FBGA
CY14B104NA-ZS25XIT
51-85087
44-pin TSOP II
CY14B104NA-ZS25XI
51-85087
44-pin TSOP II
CY14B104NA-BA25XIT
51-85128
48-ball FBGA
CY14B104NA-BA25XI
51-85128
48-ball FBGA
CY14B104NA-BA25I
51-85128
48-ball FBGA
CY14B104NA-ZSP25XIT
51-85160
54-pin TSOP II
CY14B104NA-ZSP25XI
51-85160
54-pin TSOP II
CY14B104LA-ZS45XIT
51-85087
44-pin TSOP II
CY14B104LA-ZS45XI
51-85087
44-pin TSOP II
CY14B104LA-BA45XIT
51-85128
48-ball FBGA
CY14B104LA-BA45XI
51-85128
48-ball FBGA
CY14B104NA-ZS45XIT
51-85087
44-pin TSOP II
CY14B104NA-ZS45XI
51-85087
44-pin TSOP II
CY14B104NA-BA45XIT
51-85128
48-ball FBGA
CY14B104NA-BA45XI
51-85128
48-ball FBGA
CY14B104NA-ZSP45XIT
51-85160
54-pin TSOP II
CY14B104NA-ZSP45XI
51-85160
54-pin TSOP II
Document #: 001-49918 Rev. *H
Operating
Range
Industrial
Page 18 of 24
[+] Feedback
CY14B104LA, CY14B104NA
Ordering Code Definition
CY 14 B 104 L A -ZS 20 X I T
Option:
T - Tape & Reel
Blank - Std.
X - Pb-free
Blank - Sn Pb
Die Revision:
Blank - No Rev
A - 1st Rev
Voltage:
B - 3.0 V
Temperature:
I - Industrial (–40 to 85 °C)
Package:
BAP - 48 FBGA
ZSP - 44 TSOP II
ZSP - 54 TSOP II
Data Bus:
L - x8
N - x16
Speed:
20 - 20 ns
25 - 25 ns
45 - 45 ns
Density:
104 - 4 Mb
14 - nvSRAM
Cypress
Document #: 001-49918 Rev. *H
Page 19 of 24
[+] Feedback
CY14B104LA, CY14B104NA
Package Diagrams
Figure 16. 44-Pin TSOP II (51-85087)
51-85087 *C
Document #: 001-49918 Rev. *H
Page 20 of 24
[+] Feedback
CY14B104LA, CY14B104NA
Package Diagrams
(continued)
Figure 17. 48-Ball FBGA - 6 mm x 10 mm x 1.2 mm
51-85128 *E
51-85128 *E
Document #: 001-49918 Rev. *H
Page 21 of 24
[+] Feedback
CY14B104LA, CY14B104NA
Package Diagrams
(continued)
Figure 18. 54-Pin TSOP II (51-85160)
51-85160 *A
Document Conventions
Acronyms
Description
Units of Measure
nvSRAM
nonvolatile static random access memory
Symbol
TSOP II
thin small outline package
°C
degrees celsius
FBGA
fine-pitch ball grid array
Hz
hertz
RoHS
restriction of hazardous substances
kbit
1024 bits
I/O
input/output
kHz
kilohertz
CMOS
complementary metal oxide semiconductor
KΩ
kilo ohms
EIA
electronic industries alliance
μA
microamperes
RWI
read and write inhibited
mA
milliampere
μF
microfarads
MHz
megahertz
μs
microseconds
ms
millisecond
ns
nanoseconds
pF
picofarads
V
volts
Ω
ohms
W
watts
Acronym
Document #: 001-49918 Rev. *H
Unit of Measure
Page 22 of 24
[+] Feedback
CY14B104LA, CY14B104NA
Document History Page
Document Title: CY14B104LA, CY14B104NA 4-Mbit (512 K × 8/256 K × 16) nvSRAM
Document Number: 001-49918
Rev.
ECN No.
Orig. of Change
Submission
Date
**
2606696
GVCH/PYRS
11/13/08
New Datasheet
*A
2672700
GVCH/PYRS
03/12/09
Added best practices
Added CY14B104NA-BA25I part number
Added footnote12 for HZ/LZ parameters
*B
2710274
GVCH/AESA
05/22/09
Moved datasheet status from Preliminary to Final
Updated AutoStore operation
Updated ISB test condition
Updated footnote 9
Referenced footnote 12 to VCCRISE, tHHHD and tLZHSB parameters
Updated VHDIS parameter description
Updated figure 12
*C
2738586
GVCH
07/15/09
Page 4: Updated Hardware STORE Operation description
Page 5: Updated Software STORE description
Updated tDELAY parameter description
Updated footnote 20
Added footnote 25
referenced footnote 25 to figure 12 and figure 13
*D
2758397
GVCH/AESA
09/01/09
Removed commercial temperature related specifications
Description of Change
*E
2773362
GVCH
10/06/09
Ordering Information: Added 20 ns part in a 48-FBGA package
*F
2826364
GVCH/PYRS
12/11/09
Changed STORE cycles to QuantumTrap from 200K to 1 Million
*G
2923475
GVCH/AESA
04/27/2010
Table 1: Added more clarity on HSB pin operation
Hardware STORE Operation: Added more clarity on HSB pin operation
Table 2: Added more clarity on BHE/BLE pin opeartion
Updated HSB pin operation in Figure 11
Updated footnote 22
Updated Package Diagrams and Sales, Solutions, and Legal Information.
*H
3132368
GVCH
01/10/2011
48-ball FBGA package: 16 Mb address expansion is not supported
Updated input capacitance for BHE and BLE pin
Updated input and output capacitance for HSB pin
Fixed typo in Figure 11
Added Acronyms table and Document Conventions table.
Document #: 001-49918 Rev. *H
Page 23 of 24
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CY14B104LA, CY14B104NA
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Document #: 001-49918 Rev. *H
Revised January 18, 2011
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