ONSEMI MC10E143

SEMICONDUCTOR TECHNICAL DATA
The MC10E/100E143 is a 9-bit holding register, designed with
byte-parity applications in mind. The E143 holds current data or loads
new data, with the nine inputs D0 – D8 accepting parallel input data.
•
•
•
•
•
•
700MHz Min. Operating Frequency
9-Bit for Byte-Parity Applications
9-BIT HOLD
REGISTER
Asynchronous Master Reset
Dual Clocks
Extended 100E VEE Range of – 4.2V to – 5.46V
75kΩ Input Pulldown Resistors
The SEL (Select) input pin is used to switch between the two modes of
operation — HOLD and LOAD. Input data is accepted by the registers a
set-up time before the positive going edge of CLK1 or CLK2. A HIGH on
the Master Reset pin (MR) asynchronously resets all the registers to zero.
Pinout: 28-Lead PLCC (Top View)
SEL
D8
D7
D6
D5
VCCO
Q8
25
24
23
22
21
20
19
MR
26
18
Q7
CLK1
27
17
Q6
CLK2
28
16
VCC
VEE
1
15
Q5
FN SUFFIX
PLASTIC PACKAGE
CASE 776-02
LOGIC DIAGRAM
D0
NC
2
14
VCCO
D0
3
13
Q4
D1
4
12
5
6
7
8
9
10
11
D1
MUX
MUX
D
Q0
R
Q1
D
R
Q3
D2
MUX
D
Q2
R
D2
D3
D4 VCCO Q0
Q1
Q2
* All VCC and VCCO pins are tied together on the die.
D3
MUX
Q3
D
R
PIN NAMES
Pin
D0 – D8
SEL
CLK1, CLK2
MR
Q0 – Q8
NC
Function
Parallel Data Inputs
Mode Select Input
Clock Inputs
Master Reset
Data Outputs
No Connection
MUX
D8
SEL
FUNCTIONS
SEL
L
H
Mode
CLK1
CLK2
MR
Load
Hold
12/93
 Motorola, Inc. 1996
2–1
REV 2
Q8
D
R
MC10E143 MC100E143
DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0°C
Symbol
Characteristic
IIH
Input HIGH Current
IEE
Power Supply Current
10E
100E
min
typ
25°C
max
min
typ
85°C
max
150
min
typ
150
max
Unit
150
µA
Condition
mA
120
120
145
145
120
120
145
145
120
138
145
165
AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0°C
Symbol
Characteristic
min
typ
fMAX
Max. Toggle Frequency
700
900
tPLH
tPHL
Propagation Delay to Output
Clk
MR
600
600
800
800
ts
Setup Time
D
SEL
50
300
Hold Time
D
SEL
tRR
tPW
th
25°C
min
typ
700
900
600
600
800
800
–100
150
50
300
300
75
100
–150
Reset Recovery Time
900
700
Minimum Pulse Width
Clk, MR
400
tSKEW
Within-Device Skew
tr
tf
Rise/Fall Times
20 - 80%
max
85°C
max
min
typ
700
900
600
600
800
800
–100
150
50
300
–100
150
300
75
100
–150
300
75
100
–150
900
700
900
700
max
Unit
Condition
MHz
ps
1000
1000
1000
1000
1000
1000
ps
ps
ps
ps
400
75
400
75
75
ps
1
ps
300
525
800
300
525
800
300
525
800
1. Within-device skew is defined as identical transitions on similar paths through a device.
MOTOROLA
2–2
ECLinPS and ECLinPS Lite
DL140 — Rev 4
MC10E143 MC100E143
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE D
0.007 (0.180)
B
Y BRK
-N-
T L –M
M
U
0.007 (0.180)
X
G1
M
S
N
T L –M
S
S
N
S
D
Z
-L-
-M-
D
W
28
V
1
C
A
0.007 (0.180)
M
R
0.007 (0.180)
M
T L –M
S
T L –M
S
N
S
N
S
H
S
N
S
0.007 (0.180)
M
T L –M
N
S
S
0.004 (0.100)
G
J
-T-
K
SEATING
PLANE
F
VIEW S
G1
T L –M
S
N
0.007 (0.180)
M
T L –M
S
N
S
VIEW S
S
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIM G1, TRUE POSITION TO BE MEASURED
AT DATUM -T-, SEATING PLANE.
3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
ECLinPS and ECLinPS Lite
DL140 — Rev 4
T L –M
K1
E
S
S
VIEW D-D
Z
0.010 (0.250)
0.010 (0.250)
2–3
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.485 0.495
0.485 0.495
0.165 0.180
0.090 0.110
0.013 0.019
0.050 BSC
0.026 0.032
0.020
—
0.025
—
0.450 0.456
0.450 0.456
0.042 0.048
0.042 0.048
0.042 0.056
—
0.020
2°
10°
0.410 0.430
0.040
—
MILLIMETERS
MIN
MAX
12.32 12.57
12.32 12.57
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
—
0.64
—
11.43
11.58
11.43
11.58
1.07
1.21
1.07
1.21
1.07
1.42
—
0.50
2°
10°
10.42 10.92
1.02
—
MOTOROLA
MC10E143 MC100E143
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
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applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
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and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
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51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298
◊
MOTOROLA
2–4
*MC10E143/D*
MC10E143/D
ECLinPS and ECLinPS Lite
DL140 — Rev 4