Everlight EHP-A09-SUG31-PU5-TR High power led - 0.5w Datasheet

EVERLIGHT ELECTRONICS CO.,LTD.
Technical Data Sheet
High Power LED – 0.5W
EHP-A09/SUG31-PU5/TR
Features
Feature of the device: small package with high efficiency
Typical view angle: 120°
ESD protection.
Soldering methods: SMT
Grouping parameter: luminous Intensity, wavelength, forward
voltage.
z Typical optical efficiency: 50 lm/W.
z Thermal resistance (junction to sink): 80 K/W
z The product itself will remain within RoHS compliant version.
z
z
z
z
z
Applications
z
z
z
Interior automotive lighting (e.g. dashboard backlighting)
backlighting (illuminated advertising, general lighting)
Signal and symbol luminaries
z
Marker lights (e.g. steps, exit ways, etc.)
Scanner
z
Materials
Items
Description
Reflector
Heat resistant polymer
Encapsulating Resin
Colorless clear resin
Electrodes
Ag plating
Die attach
Silver paste
Chip
InGaN
Everlight Electronics Co., Ltd.
http://www.everlight.com
Device No. : DSE-A09-003
Prepared date: Sept. 06, 2007
Rev. 1.0
Page: 1/10
Prepared by: Terry Hsu
EVERLIGHT ELECTRONICS CO.,LTD.
EHP-A09/SUG31-PU5/TR
Dimensions
N
A
N
N
C
N
Package mark
Notes: 1. Dimensions are in millimeters.
2. Tolerances unless dimensions ±0.25mm.
Everlight Electronics Co., Ltd.
http://www.everlight.com
Device No. : DSE-A09-003
Prepared date: Sept. 06, 2007
Rev. 1.0
Page: 2/10
Prepared by: Terry Hsu
EVERLIGHT ELECTRONICS CO.,LTD.
EHP-A09/SUG31-PU5/TR
Maximum Ratings (T Ambient=25ºC)
Parameter
Symbol
Rating
Unit
DC Operating Current
IF
150
mA
Pulsed Forward Current
IF
300
mA
ESD
2000
V
Junction Temperature
Tj
125
Operating Temperature
Topr
-40 ~ +100
°C
°C
Storage Temperature
Tstg
-40 ~ +100
°C
Power Dissipation
Pd
1
W
Junction To Heat-Sink Thermal Resistance
Rth
80
K/W
ESD Sensitivity
Electro-Optical Characteristics (TAmbient=25ºC)
Parameter
Luminous Intensity(1)
Wavelength(2)
Forward Voltage(3)
Bin
Min
Typ.
Max
C2
3550
----
4500
D1
4500
----
5600
5600
----
7100
E1
7100
----
9000
E2
9000
----
11200
G1
520
----
525
525
----
530
G3
530
----
535
V2
3.25
----
3.55
3.55
----
3.85
3.85
----
4.15
----
120
----
D2
G2
V3
Symbol
Iv
λd
VF
V4
Viewing Angle(4)
----
2θ1/2
Unit
Condition
mcd
nm
IF=150mA
V
deg
Note. 1. Luminous Intensity measurement tolerance: ±10%
2. Wavelength measurement tolerance : ±1nm
3. Forward Voltage measurement tolerance: ±0.1V
4. 2θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value.
Everlight Electronics Co., Ltd.
http://www.everlight.com
Device No. : DSE-A09-003
Prepared date: Sept. 06, 2007
Rev. 1.0
Page: 3/10
Prepared by: Terry Hsu
EVERLIGHT ELECTRONICS CO.,LTD.
EHP-A09/SUG31-PU5/TR
Typical Electro-Optical Characteristics Curves
Forward Voltage vs Forward Current,
T Ambient=25ºC
1.0
3.8
0.8
3.6
Forward Voltage (V)
Relative Luiminous Intensity
Relative Spectral Distribution,
IF=150mA, T Ambient=25ºC
0.6
0.4
0.2
3.4
3.2
3.0
2.8
0.0
400
450
500
550
600
650
0
700
50
100
Relative Luminous Intensity vs Forward
Current, T Ambient=25ºC
200
250
300
Ambient Temperature & Operating Current
Derating based on TJMAX = 125℃
1.6
250
Forward Current (mA)
Relative Luminous Intensity
150
Forward Current (mA)
Wavelength(nm)
1.4
1.2
1.0
0.8
0.6
0.4
200
150
100
50
0.2
0
50
100
150
200
250
300
0
Forward Current (mA)
Everlight Electronics Co., Ltd.
http://www.everlight.com
Device No. : DSE-A09-003
Prepared date: Sept. 06, 2007
20
40
60
80
100
120
Ambient Temperature (οC)
Rev. 1.0
140
Page: 4/10
Prepared by: Terry Hsu
160
EVERLIGHT ELECTRONICS CO.,LTD.
EHP-A09/SUG31-PU5/TR
Typical Representative Spatial Radiation Pattern
Relative Luminous Intensity
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
-80
-60
-40
-20
0
20
40
60
80
Degree (2θ)
Everlight Electronics Co., Ltd.
http://www.everlight.com
Device No. : DSE-A09-003
Prepared date: Sept. 06, 2007
Rev. 1.0
Page: 5/10
Prepared by: Terry Hsu
EVERLIGHT ELECTRONICS CO.,LTD.
EHP-A09/SUG31-PU5/TR
Label explanation
CPN: Customer’s Production Number
P/N : Production Number
QTY: Packing Quantity
CAT: Ranks
HUE: Domain Wavelength
REF: Reference
LOT No: Lot Number
MADE IN TAIWAN: Production Place
Reel Dimensions
Note: 1. Dimensions are in millimeters.
2. The tolerances unless mentioned is ±0.1mm.
Everlight Electronics Co., Ltd.
http://www.everlight.com
Device No. : DSE-A09-003
Prepared date: Sept. 06, 2007
Rev. 1.0
Page: 6/10
Prepared by: Terry Hsu
EVERLIGHT ELECTRONICS CO.,LTD.
EHP-A09/SUG31-PU5/TR
Carrier Tape Dimensions: Loaded quantity 1000 PCS per reel
Package mark
Note:
1. Dimensions are in millimeters.
2. The tolerances unless mentioned is ±0.1mm.
Moisture Resistant Packaging
Label
Aluminum moisture-proof bag
Everlight Electronics Co., Ltd.
http://www.everlight.com
Device No. : DSE-A09-003
Prepared date: Sept. 06, 2007
Desiccant
Rev. 1.0
Label
Page: 7/10
Prepared by: Terry Hsu
EVERLIGHT ELECTRONICS CO.,LTD.
EHP-A09/SUG31-PU5/TR
Reliability Test Items
Stress Test
Stress Condition
Stress Duration
Reflow
Tsol=260°C, 10sec, 6min(total)
2 times
DC Operating Life
Ta=25°C , IF=150mA
1000 hours
High Temperature Storage
Ta=100°C
1000 hours
High Temperature Operation Life #1
Ta=55°C, IF=150mA
1000 hours
High Temperature Operation Life #2
Ta=85℃, IF=120mA
1000hours
Low Temperature Storage
Ta=-40°C
1000 hours
High Temperature/
Humidity Reverse Bias
Ta=85℃ , RH=85%
1000hours
High Temperature/
Humidity Operation Life
Ta=85°C , RH=60%, IF=120mA
1000 hours
H:+100°C
Temperature Cycle
Shock
15min.
1000 Cycles
'∫ 5min.
'L:-40°C
15min.
H:+110°C
Thermal
300 Cycles
'∫ 5min.
'L:-40°C
15min.
H:+85°C
Power Temperature Cycle
15min.
5min.
300 Cycles
Pulse Test
'∫ 10sec.
'L:-40°C
5min.
Ta=25℃, IF=1000mA
30mS on/ 2500mS off
30000 times
ESD Human Body Model
2000V, Interval:0.5sec
3 times
ESD Machine Model
200V, Interval:0.5sec
3 times
*lm: Brightness attenuate difference(1000hrs)<50%
*VF: Forward voltage difference<20%
Notes: All reliability items are tested under superior thermal management with 1.5 x 1.5 cm2 MCPCB.
Everlight Electronics Co., Ltd.
http://www.everlight.com
Device No. : DSE-A09-003
Prepared date: Sept. 06, 2007
Rev. 1.0
Page: 8/10
Prepared by: Terry Hsu
EVERLIGHT ELECTRONICS CO.,LTD.
EHP-A09/SUG31-PU5/TR
Precautions For Use
1. Over-current-proof
Though EHP-A09 has conducted ESD protection mechanism, customers must not use the device in
reverse and should apply resistors for extra protection. Otherwise, slight voltage difference may cause
enormous current shift and burn out failure would happen.
2. Storage
i.
Do not open the moisture proof bag before the devices are ready to use.
ii.
Before the package is opened, LEDs should be stored at temperature less than 30℃and humidity
less than 90%.
iii.
LEDs should be used within a year.
iv.
After the package is opened, LEDs should be stored at temperature less than 30℃and humidity
less than 70%.
v.
LEDs should be used within 168 hours (7 days) after the package is opened.
vi.
If the moisture absorbent material (silicone gel) has faded away or LEDs have exceeded the
storage time, baking treatment should be implemented based on the following the conditions:
pre-curing at 60±5℃ for 24 hours.
3. Thermal Management
i.
For maintaining the high flux output and achieving reliability, EHP-A09 series LEDs should be
mounted on a metal core printed circuit board (MCPCB) or other kinds of heat sink with proper
thermal connection to dissipate approximate 0.5W of thermal energy at 150mA operation.
ii.
Special thermal designs are also recommended to take in heat dissipation management, such as
FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive adhesive,
etc.
iii.
Sufficient thermal management must be implemented. Otherwise, the junction temperature of dies
might be over the limit at high current driving condition and LEDs’ lifetime might be decreases
dramatically.
iv.
For further thermal management suggestions, please consult Everlight Design Guide or local
representatives for assistance.
Everlight Electronics Co., Ltd.
http://www.everlight.com
Device No. : DSE-A09-003
Prepared date: Sept. 06, 2007
Rev. 1.0
Page: 9/10
Prepared by: Terry Hsu
EVERLIGHT ELECTRONICS CO.,LTD.
EHP-A09/SUG31-PU5/TR
4. Soldering Condition
4-1. For Reflow process
i.
EHP-A09 series are suitable for SMT process.
ii.
Lead reflow soldering temperature profile
iii.
Reflow soldering should not be done more than two times.
iv.
In soldering process, stress on the LEDs during heating should be avoided.
v.
After soldering, do not warp the circuit board.
Everlight Electronics Co., Ltd.
http://www.everlight.com
Device No. : DSE-A09-003
Prepared date: Sept. 06, 2007
Rev. 1.0
Page: 10/10
Prepared by: Terry Hsu
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