ONSEMI CM2020-01TR

HDMI Transmitter Port Protection and
Interface Device
CM2020-01TR
Features
Product Description
•
•
The CM2020-01TR HDMI Transmitter Port Protection
and Interface Device is specifically designed for next
generation HDMI Source interface protection.
An integrated package provides all ESD, level shift,
overcurrent output protection and backdrive
protection for an HDMI port in a single 38-Pin TSSOP
package.
The CM2020-01TR part is specifically designed to
complement the CM2021 protection part in HDMI
receivers (displays, DTV, CE devices, etc.).
The CM2020-01TR also incorporates a silicon
overcurrent protection device for +5V supply voltage
output to the connector.
•
•
•
•
•
•
•
HDMI 1.3 compliant
0.05pF matching capacitance between the TMDS
intra-pair
Overcurrent output protection
Level shifting/isolation circuitry
±8kV ESD protection on all external lines
Matched 0.5mm trace spacing (TSSOP)
Simplified layout for HDMI connectors
Backdrive protection
RoHS-compliant, lead-free packaging
Applications
•
•
•
•
PC
Consumer electronics
Set top box
DVD/RW players
©2010 SCILLC. All rights reserved.
May 2010 – Rev. 4
Publication Order Number:
CM2020-01TR/D
CM2020-01TR
Rev. 4 | Page 2 of 12 | www.onsemi.com
CM2020-01TR
PIN DESCRIPTIONS
PINS
NAME
ESD Level
4, 35
TMDS_D2+
8kV
2
TMDS 0.9pF ESD protection.
1
6, 33
TMDS_D2–
8kV
2
TMDS 0.9pF ESD protection.
1
7, 32
TMDS_D1+
8kV
2
TMDS 0.9pF ESD protection.
1
9, 30
TMDS_D1–
8kV
2
TMDS 0.9pF ESD protection.
1
10, 29
TMDS_D0+
8kV
2
TMDS 0.9pF ESD protection.
1
12, 27
TMDS_D0–
8kV
2
TMDS 0.9pF ESD protection.
1
13, 26
TMDS_CK+
8kV
2
TMDS 0.9pF ESD protection.
1
15, 24
TMDS_CK–
8kV
2
TMDS 0.9pF ESD protection.
1
16
CE_REMOTE_IN
2kV
3
LV_SUPPLY referenced logic level into ASIC.
23
CE_REMOTE_OUT
8kV
2
5V_SUPPLY referenced logic level out plus 3.5pF ESD to
connector.
17
DDC_CLK_IN
2kV
3
LV_SUPPLY referenced logic level into ASIC.
5V_SUPPLY referenced logic level out plus 3.5pF ESD to
connector.
DESCRIPTION
22
DDC_CLK_OUT
8kV
2
18
DDC_DAT_IN
2kV
3
LV_SUPPLY referenced logic level into ASIC.
21
DDC_DAT_OUT
8kV
2
5V_SUPPLY referenced logic level out plus 3.5pF ESD to
connector.
19
HOTPLUG_DET_IN
2kV
3
LV_SUPPLY referenced logic level into ASIC.
20
HOTPLUG_DET_OUT
8kV
2
5V_SUPPLY referenced logic level out plus 3.5pF ESD to
connector.
2
LV_SUPPLY
2kV
3
Bias for CE / DDC / HOTPLUG level shifters.
1
5V_SUPPLY
2kV
3
Current source for 5V_OUT.
38
5V_OUT
8kV
2
55mA minimum overcurrent protected 5V output. This output must
be bypassed with a 0.1 F ceramic capacitor.
37
ESD_BYP
2kV
3
This pin may be connected to a 0.1 F ceramic capacitor, but it is not
necessary.
3, 36
GND
N/A
5, 34, 8, 31,
11, 28, 14,
25
TMDS_GND
N/A
Supply GND reference.
TMDS ESD and Parasitic GND return.
4
Note 1: These 2 pins need to be connected together in-line on the PCB.
Note 2: Standard IEC 61000-4-2, CDISCHARGE=150pF, RDISCHARGE=330Ω, 5V_SUPPLY and LV_SUPPLY within recommended
operating conditions, GND=0V, 5V_OUT (pin 38), each bypassed with a 0.1µF ceramic capacitor connected to GND.
Note 3: Human Body Model per MIL-STD-883, Method 3015, CDISCHARGE=100pF, RDISCHARGE=1.5kΩ, 5V_SUPPLY and LV_SUPPLY
within recommended operating conditions, GND=0V and 5V_OUT (pin 38), and each bypassed with a 0.1µF ceramic
capacitor connected to GND.
Note 4: These pins should be routed directly to the associated GND pins on the HDMI connector with single point ground vias at
the connector.
Rev. 4 | Page 3 of 12 | www.onsemi.com
CM2020-01TR
Backdrive Protection
Below, two scenarios are discussed to illustrate what can happen when a powered device is connected to an
unpowered device via an HDMI interface, substantiating the need for backdrive protection on this type of
interface.
In the first example a DVD player is connected to a TV via an HDMI interface. If the DVD player is switched off
and the TV is left on, there is a possibility of reverse current flow back into the main power supply rail of the
DVD player. Typically, the DVD’s power supply has some form of bulk supply capacitance associated with it.
Because all CMOS logic exhibits a very high impedance on the power rail node when “off,” if there may be very
little parasitic shunt resistance, and even with as little as a few milliamps of “backdrive” current flowing into the
power rail, it is possible over time to charge that bulk supply capacitance to some intermediate level. If this level
rises above the power-on-reset (POR) voltage level of some of the integrated circuits in the DVD player, these
devices may not reset properly when the DVD player is turned back on.
In a more serious scenario, if any SOC devices are incorporated in the design which have built-in level shifter
and DRC diodes for ESD protection, there is even a risk for permanent damage. In this case, if there is a pullup
resistor (such as with DDC) on the other end of the cable, that resistance will pull the SOC chips “output” up to a
high level. This will forward bias the upper ESD diode in the DRC and charge the bulk capacitance in a similar
fashion as described in the first example. If this current flow is high enough, even as little as a few milliamps, it
could destroy one of the SOC chip’s internal DRC diodes as they are not designed for passing DC.
To avoid either of these situations, the CM2020-01TR was designed to block backdrive current, guaranteeing no
more than 5mA on any I/O pin when the I/O pin voltage is greater than the CM2020-01TR supply voltage.
Figure 1. Backdrive Protection Diagram
Rev. 4 | Page 4 of 12 | www.onsemi.com
CM2020-01TR
Ordering Information
PART NUMBERING INFORMATION
Lead-free Finish
Pins
Package
Ordering Part Number
Part Marking
38
TSSOP-38
CM2020-01TR
CM2020-01TR
1
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
VCC5V, VCCLV
6.0
V
DC Voltage at any Channel Input
6.0
V
–65 to +150
°C
Storage Temperature Range
STANDARD (RECOMMENDED) OPERATING CONDITIONS
SYMBOL
PARAMETER
MIN
TYP
MAX
UNITS
5V_SUPPLY
Operating Supply Voltage
GND
5
5.5
V
LV_SUPPLY
Bias Supply Voltage
1
3.3
5.5
V
85
°C
Operating Temperature Range
Rev. 4 | Page 5 of 12 | www.onsemi.com
–40
CM2020-01TR
ELECTRICAL OPERATING CHARACTERISTICS (1)
SYMBOL
PARAMETER
CONDITIONS
ICC5V
Operating Supply Current
ICCLV
TYP
MAX
UNITS
5V_SUPPLY = 5.0V
110
130
µA
Bias Supply Current
LV_SUPPLY = 3.3V
1
5
µA
VDROP
5V_OUT Overcurrent Output
Drop
5V_SUPPLY= 5.0V,
IOUT=55mA
65
100
mV
ISC
5V_OUT Short Circuit Current
Limit
5V_SUPPLY= 5.0V,
5V_OUT = GND
135
175
mA
IOFF
OFF state leakage current,
level shifting NFET
LV_SUPPLY=0V
0.1
5
µA
IBACKDRIVE
Current conducted from
output pins to V_SUPPLY
rails when powered down
5V_SUPPLY < VCH_OUT;
Signal pins: TMDS_D[2:0]+/–,
TMDS_CK+/–, CE_REMOTE_OUT,
DDC_DAT_OUT, DDC_CLK_OUT,
HOTPLUG_DET_OUT, 5V_OUT
Only
0.1
5
µA
IBACKDRIVE, CEC
Current through
CE-REMOTE_OUT when
powered down
CE-REMOTE_IN = CE_SUPPLY <
CE_REMOTE_OUT
0.1
1
µA
VON
VOLTAGE drop across level
shifting NFET when ON
LV_SUPPLY = 2.5V, VS = GND,
IDS = 3mA
75
95
140
mV
VF
Diode Forward Voltage
Top Diode
Bottom Diode
IF = 8mA, TA = 25°C
0.6
0.6
0.85
0.85
0.95
0.95
V
V
VESD
ESD Withstand Voltage:
Contact discharge per
IEC 610004-2 Standard
Pins 4, 7, 10, 13, 20, 21, 22, 23, 24,
27, 30, 33, 38;
Note 2
VCL
Channel Clamp Voltage
Positive Transients
Negative Transients
TA = 25°C, IPP = 1A, tP = 8/20µs;
Note 3
Dynamic Resistance
Positive Transients
Negative Transients
TA = 25°C, IPP = 1A, tP = 8/20µs;
Notes 3
TMDS Channel Leakage
Current
TA = 25°C
0.01
1
µA
TMDS Channel Input
Capacitance
5V_SUPPLY= 5.0V,
Measured at 1MHz,
VBIAS=2.5V
0.9
1.2
pF
RDYN
ILEAK
CIN, TMDS
Rev. 4 | Page 6 of 12 | www.onsemi.com
MIN
90
kV
±8
11.0
–2.0
V
V
1.2
0.9
Ω
Ω
CM2020-01TR
SYMBOL
PARAMETER
CONDITIONS
TMDS Channel Input
Capacitance Matching
5V_SUPPLY= 5.0V,
Measured at 1MHz,
VBIAS=2.5V;
Note 4
0.05
CIN, DDC
Level Shifting Input
Capacitance, Capacitance to
GND
5V_SUPPLY= 5V,
Measured at 100KHz,
VBIAS=2.5V
3.5
4
pF
CIN, CEC
Level Shifting Input
Capacitance, Capacitance to
GND
5V_SUPPLY= 5V,
Measured at 100KHz,
VBIAS=2.5V
3.5
4
pF
CIN, HP
Level Shifting Input
Capacitance, Capacitance to
GND
5V_SUPPLY= 5V,
Measured at 100KHz,
VBIAS=2.5V
3.5
4
pF
∆C
IN,
TMDS
MIN
TYP
MAX
UNITS
pF
Note 1: Operating Characteristics are over Standard Operating Conditions unless otherwise specified.
Note 2: Standard IEC 61000-4-2, CDISCHARGE=150pF, RDISCHARGE=330Ω, 5V_SUPPLY and LV_SUPPLY within recommended
operating conditions, GND=0V, 5V_OUT (pin 38), each bypassed with a 0.1µF ceramic capacitor connected to GND.
Note 3: These measurements performed with no external capacitor on ESD_BYP.
Note 4: Intra-pair matching, each TMDS pair (i.e. D+, D–).
Rev. 4 | Page 7 of 12 | www.onsemi.com
CM2020-01TR
Performance Information
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 2. Insertion Loss vs. Frequency (TMDS_D1- to GND)
Rev. 4 | Page 8 of 12 | www.onsemi.com
CM2020-01TR
Application Information
Figure 3. Typical Application for CM2020-01TR
Rev. 4 | Page 9 of 12 | www.onsemi.com
CM2020-01TR
Application Information (cont’d)
Design Considerations
5V Overcurrent Output
Maximum Overcurrent Protection output drop at 55mA on 5V_OUT is 100mV. To meet HDMI output
requirements of 4.8-5.3V, an input of greater than 4.9V should be used (i.e. 5.1V ±4%). A 0.1 F ceramic bypass
capacitor on this output is also recommended.
Hotplug Detect Input
To meet the requirements of HDMI CTS TID7-12, the following pullup/pulldown configuration is recommended
for a 3.3V ±10% internal VCC rail (See Figure 4 below). A 0.1µF ceramic capacitor is recommended for
additional edge debounce and ESD bypass.
DUT On vs. DUT Off
Many HDMI CTS tests require a power off condition on the System Under Test. Many Dual Rail Clamp (DRC)
ESD diode configurations will be forward biased when their VDD rail is lower than the I/O pin bias, thereby
exhibiting extremely high apparent capacitance measurements, for example. The MediaGuard™ backdrive
isolation circuitry limits this current to <5µA, and will help ensure compliance.
Figure 4. Design Example
Rev. 4 | Page 10 of 12 | www.onsemi.com
CM2020-01TR
Mechanical Details
TSSOP-38 Mechanical Specifications
CM2020-01TR devices are supplied in 38-pin TSSOP packages. Dimensions are presented below.
For complete information on the TSSOP-38, see the California Micro Devices TSSOP Package Information
document.
PACKAGE DIMENSIONS
Package
TSSOP
JEDEC No.
MO-153 (Variation BD-1)
Pins
38
Dimensions
Millimeters
Inches
Min
Max
Min
Max
A
—
1.20
—
0.047
A1
0.05
0.15
0.002
0.006
b
0.17
0.27
0.007
0.011
c
0.09
0.20
0.004
0.008
D
9.60
9.80
0.378
0.386
E
E1
e
L
# per tape
and reel
6.40 BSC
4.30
0.252 BSC
4.50
0.50 BSC
0.45
0.169
0.177
0.020 BSC
0.75
0.018
0.030
2500 pieces
Package Dimensions for TSSOP-38
Controlling dimension: millimeters
Rev. 4 | Page 11 of 12 | www.onsemi.com
CM2020-01TR
Tape and Reel Specifications
PART NUMBER
PACKAGE SIZE
(mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CM2020-01TR
9.70 X 6.40 X 1.20
10.20 X 6.90 X 1.80
16mm
330mm (13")
2500
4mm
12mm
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further
notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC
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consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and
actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts.
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Rev. 4 | Page 12 of 12 | www.onsemi.com
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