TI DRV604

DRV604
www.ti.com
SLOS659 – JANUARY 2010
DirectPath™ 2Vrms Line Driver and HP Amp With Adjustable Gain
Check for Samples: DRV604
FEATURES
APPLICATIONS
•
•
•
•
•
1
23
•
•
•
•
•
•
•
•
•
•
DirectPath™
– Eliminates Pop/Clicks
– Eliminate Output DC-Blocking Capacitors
3.0V to 3.7V Supply Voltage
Low Noise and THD
– SNR > 109dB
– Typical Vn < 7µVrms 20–20kHz
– THD+N < 0.002% at 10kΩ
Output Voltage into 5kΩ Load
– 2Vrms at 3.3V Supply Voltage
Stereo DirectPath™ Headphone:
– 40mW into 32Ω at 3.3V Supply Voltage
– 16Ω to ∞ Ω Stable Load Range
Differential Input
Power Sense UVP for Brown Out Protection
Short Circuit and Thermal Protection
±8kV IEC ESD Protection
Footprint Compatible with DRV602 and
DRV603
Supports Dual Line Driver Configuration
-
DAC
+
RIGHT
Line Driver
LEFT
-
DAC
+
DRV604
SOC
-
Headphone
DAC
+
LCD and PDP TV
Blu-ray Disc™, DVD Players
Mini/Micro Combo Systems
Soundcards
DESCRIPTION
The DRV604 is a 2Vrms Pop-Free stereo line driver
with stereo headphone output designed to allow the
removal of the output DC-blocking capacitors for
reduced component count and cost. The device is
ideal for single supply electronics where size and cost
are critical design parameters.
Designed
using
TI’s
patented
DirectPath™
technology, The DRV604 is capable of driving 2 Vrms
into a 5kΩ load. The headphone output can generate
a clean 40mW into 32Ω load from a 3.3V supply.. The
device has differential inputs and uses external gain
setting resistors that supports a gain range of -1V/V
to -10V/V. Headphone and line outputs have ±8kV
IEC ESD protection enabling a simple ESD protection
circuit. The DRV604 has built-in enable control for
pop-free on/off control. DRV604 can monitor an
external supply voltage using its built in comparator
enabling it to shut down during a brown out condition
before up stream audio DAC’s can produce click and
pop artifacts.
Using the DRV604 in audio products can reduce
component count considerably compared to
traditional methods of generating headphone output
and 2Vrms output. The DRV604 does not require a
power supply greater than 3.3V to generate its
5.6Vpp output, nor does it require a split rail power
supply. The DRV604 integrates its own charge pump
to generate a negative supply rail that provides a
clean, pop-free ground biased 2Vrms output.
The DRV604 is available in a 28-pin HTSSOP. For a
stereo line driver with no HP amp see DRV603.
-
DAC
+
1
2
3
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DirectPath, FilterPro are trademarks of Texas Instruments.
Blu-ray Disc is a trademark of Blu-ray Disc Association.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010, Texas Instruments Incorporated
DRV604
SLOS659 – JANUARY 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
DEVICE INFORMATION
PIN ASSIGNMENT
The DRV604 is available in the thermally enhanced package: 28-Pin HTSSOP package (PWP).
1
+LD_L
+LD_R
28
2
-LD_L
-LD_R
27
3
OUT_LDL
OUT_LDR
26
4
AGND
Ex_UVP
25
5
EN_LD
PGND
24
6
PVSS_LD
PVDD_LD
23
7
CN_LD
CP_LD
22
8
CN_HP
CP_HP
21
9
PVSS_HP
PVDD_ HP
20
10
EN_HP
PGND
19
11
AGND
NC
18
12
OUT_HPL
OUT_HPR
17
13
-HP_L
-HP_R
16
14
+HP_L
+HP_R
15
PIN FUNCTIONS
PIN
FUNCTION (1)
DESCRIPTION
NAME
PWP NO.
+LD_L
1
I
Positive input, Line driver Left
–LD_L
2
I
Negative input, Line driver Left
OUT_LDL
3
O
Output, Line driver Left
AGND
4
P
Analog Ground
EN_LD
5
I
Enable for Line driver, active high
PVSS_LD
6
O
Charge Pump Negative Supply Voltage Output for Line Driver
CN_LD
7
I/O
Charge Pump Flying Capacitor Negative connection, Line Driver
CN_HP
8
I/O
Charge Pump Flying Capacitor Negative connection, Headphone
PVSS_HP
9
O
Headphone, Charge Pump Negative Supply Voltage Output
EN_HP
10
I
Enable for Headphone, active high
AGND
11
P
Analog Ground
OUT_HPL
12
O
Output, Headphone Left
–HP_L
13
I
Negative input, Headphone Left
+HP_L
14
I
Positive input, Headphone Left
+HP_R
15
I
Positive input, Headphone Right
(1)
2
I = input, O = output, P = power
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s) :DRV604
DRV604
www.ti.com
SLOS659 – JANUARY 2010
PIN FUNCTIONS (continued)
PIN
FUNCTION (1)
DESCRIPTION
NAME
PWP NO.
–HP_R
16
I
Negative input, Headphone Right
OUT_HPR
17
O
Output, Headphone Right
NC
18
PGND
19
P
Charge Pump Power Ground, Headphone
PVDD_HP
20
P
Headphone Supply Voltage, connect to positive supply, internally connected to pin 23
CP_HP
21
I/O
Charge Pump Flying Capacitor Positive connection, Headphone
CP_LD
22
I/O
Charge Pump Flying Capacitor Positive connection, Line Driver
PVDD_LD
23
P
Line Driver Supply Voltage, connect to positive supply, internally connected to pin 20
PGND
24
P
Charge Pump Power Ground, Line Driver
Ex_UVP
25
I
External Under Voltage Protection
OUT_LDR
26
O
Output, Line Driver Right
–LD_R
27
I
Negative input, Line driver Right
+LD_R
28
I
Positive input, Line driver Right
No connect
SYSTEM BLOCK DIAGRAM
Short-Circuit
Protection
OpAmp
LD
OpAmp
LD
Click & Pop
Suppression
Charge
Pump LD
Enable
Control LD
Internal
UVP
Thermal
Protection
External
UVP
Charge
Pump HP
Enable
Control HP
Click & Pop
Suppression
OpAmp
HP
OpAmp
HP
Short-Circuit
Protection
ORDERING INFORMATION (1)
(1)
TA
PACKAGE
DESCRIPTION
–40°C–85°C
DRV604PWP
28-Pin
For the most current package and ordering information, see the
Package Option Addendum at the end of this document, or see the
TI Web site at www.ti.com.
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s) :DRV604
3
DRV604
SLOS659 – JANUARY 2010
www.ti.com
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
PVDD to GND
Input voltage, VI
DRV604PWP
UNIT
–0.3 to 4.5
V
PVSS–0.3 to PVDD+0.3
V
1000
Ω
Minimum load impedance – line outputs
8
Ω
EN_LD to GND
–0.3 to PVDD+0.3
V
EN_HP to GND
–0.3 to PVDD+0.3
V
Maximum operating junction temperature range, TJ
–40 to 150
°C
Storage temperature
–40 to 150
°C
Minimum load impedance – headphone outputs
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
DISSIPATION RATINGS (1)
PACKAGE
RqJP(°C/W)
RqJA(°C/W)
RyJT(°C/W)
DRV604PWP
0.72
28
0.45
(1)
PowerPAD soldered to TI recommended board.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
PVDD
Power supply
RL (HP)
RL (LD)
DC supply voltage
Load impedance
MIN
NOM
MAX
3.0
3.3
3.7
32
32
UNIT
V
Ω
5
10
VIL
Low level input voltage
EN_LD, EN_HP
38
40
43
%PVDD
VIH
High level input voltage
EN_LD, EN_HP
57
60
66
%PVDD
TA
Free-air temperature
–40
25
85
°C
4
Submit Documentation Feedback
kΩ
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s) :DRV604
DRV604
www.ti.com
SLOS659 – JANUARY 2010
ELECTRICAL CHARACTERISTICS
PVDD_LD = PVDD_HP = 3.3 V, RLD = 5 kΩ, RHP = 32 Ω, RFB = 20 kΩ, RIN = 10 kΩ, TA = 25°C, Charge pump: CCP_LD =
CCP_HP = 1.0 µF (unless otherwise noted)
PARAMETER
DRV604
TEST CONDITIONS
MIN
TYP
70
80
Output offset voltage
PSRR
Power supply rejection ratio
VOH
High level output voltage
PVDD = 3.3 V
VOL
Low level output voltage
PVDD = 3.3 V
Vuvp_on
PVDD, undervoltage detection
Internal under-voltage detection.
Vuvp_hysteresis
PVDD, undervoltage detection,
hysteresis
200
mV
Vuvp
External undervoltage detection
1.25
V
IHys
External undervoltage detection
hysteresis current
5
µA
Fcp
Charge pump switching frequency
700
kHz
|IIH|
High level input current
PVDD = 3.3 V, VIH = PVDD, EN_HP, EN_LD
1
µA
|IIL|
low level input current
PVDD = 3.3 V, VIL = 0 V, EN_HP, EN_LD
1
µA
Supply current, no load
PVDD, EN_LD, EN_HP = 3.3 V
Supply current, line driver, no load
PVDD, EN_LD = 3.3 V, EN_HP = GND
12
Supply current, headphone, no load
PVDD, EN_LD = GND, EN_HP = 3.3 V
13
Supply current, disabled
PVDD = 3.3 V, EN_LD, EN_HP = GND,
Ex_UVP = GND
2.5
Tsd
1
UNIT
|Vos|
I(PVDD)
PVDD = 3.3 V
MAX
dB
3.1
V
260
15
Thermal shutdown
Thermal shutdown hysteresis
mV
25
–3.05
V
2.8
V
35
mA
5
150
°C
15
°C
ELECTRICAL CHARACTERISTICS, LINE DRIVER
PVDD_LD = PVDD_HP = 3.3 V, Rload = 5 kΩ, RFB = 20 kΩ, RIN = 10 kΩ, TA = 25°C, Charge pump: CCP_LD = CCP_HP = 1.0 µF
(unless otherwise noted)
DRV604
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
VO
Output voltage, outputs in phase
1% THD+N, f = 1 kHz, 10 kΩ load
THD+N
Total harmonic distortion plus noise
f = 1 kHz, 10 kΩ load, VO = 2 Vrms
SNR
Signal-to-noise ratio
A-weighted, AES17 filter, 2 Vrms ref
109
dB
DNR
Dynamic range
A-weighted, AES17 filter, 2 Vrms ref
109
dB
Vn
Noise voltage
A-weighted, AES17 filter
Slew rate
GBW
Unity gain bandwidth
Crosstalk – Line L-R & R-L
10 kΩ load, VO = 2 Vrms
2.1
UNIT
0.001%
7
V/µS
8
MHz
-100
dB
V
Positive common-mode input voltage
+2.0
Vincm_neg
Negative common-mode input voltage
-3.0
Ilimit
Current limit
Maximum capacitive load
Product Folder Link(s) :DRV604
V
60
mA
220
pF
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
uV
4.5
Vincm_pos
PVDD = 3.3 V
Vrms
5
DRV604
SLOS659 – JANUARY 2010
www.ti.com
ELECTRICAL CHARACTERISTICS, HEADPHONE
PVDD_LD = PVDD_HP = 3.3 V, RHP = 32 Ω, TA = 25°C, Charge pump: CCP_LD = CCP_HP = 1.0 µF (unless otherwise noted)
PARAMETER
TAS5630
TEST CONDITIONS
MIN
TYP
MAX
UNIT
PO
Output power, outputs in phase
THD+N = 1%, f = 1 kHz, 32 Ω load
40
mW
VO
Output voltage, outputs in phase
THD+N = 1%, f = 1 kHz, 32 Ω load
1.45
Vrms
THD+N
Total harmonic distortion plus noise
SNR
Signal-to-noise ratio
DNR
Dynamic range
Vn
Noise voltage
f = 1 kHz, 32 Ω load, PO = 40 mW
0.02%
f = 1 kHz, 5 kΩ load, VO = 2 Vrms
0.001%
A-weighted, AES17 filter, 1.45 Vrms ref
(66 mW into 32 Ω)
106
A-weighted, AES17 filter, 2 Vrms ref 5 kΩ load
109
A-weighted, AES17 filter, 1.45 Vrms ref
(66 mW into 32 Ω)
106
A-weighted, AES17 filter, 2 Vrms ref 5 kΩ load
109
A-weighted, AES17 filter
Slew rate
GBW
Unity gain bandwidth
Crosstalk
Channel to channel
Vincm_pos
Positive common-mode input voltage
Vincm_neg
Ilimit
6
7
dB
dB
µV
4.5
V/µS
8
MHz
75
dB
2.0
V
Negative common-mode input
voltage
–3.0
V
Output current limit
190
mA
Maximum capacitive load
220
pF
f = 1 kHz, Rload = 32 Ω, PO = 40 mW
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s) :DRV604
DRV604
www.ti.com
SLOS659 – JANUARY 2010
TYPICAL CHARACTERISTICS, LINE DRIVER
THD+N vs OUTPUT VOLTAGE
THD+N vs OUTPUT VOLTAGE, LINEAR SCALE
10
10
Load = 5 kW to 100 kW,
Output in Phase = 1 kHz
1
0.1
0.01
0.001
0.0001
40m
VI = 3.3 V,
THD+N - Total Harmonic Distortion + Noise - %
THD+N - Total Harmonic Distortion + Noise - %
VI = 3.3 V,
Load = 5 kW,
Linear Scale = 1 kHz,
Outputs in Phase = 1 kHz
1
0.1
0.01
0.001
0.0001
100m
200m
500m
1
VO - Output Voltage - V
2
1
4
1.5
2
VO - Output Voltage - V
Figure 1.
3
Figure 2.
THD+N vs FREQUENCY
CHANNEL SEPARATION
0
10
VI = 3.3 V,
THD+N - Total Harmonic Distortion + Noise - %
2.5
VI = 3.3 V,
Load = 5 kW,
2 Vrms
-20
Load = 5 kW,
2 Vrms
1
Amplitude - dBr
-40
0.1
0.01
-60
-80
L to R
R to L
-100
0.001
-120
0.0001
20
50
100
200
500
1k
2k
f - Frequency - Hz
5k
20
20k
50
100
Figure 3.
200
500
1k
2k
f - Frequency - Hz
5k
20k
Figure 4.
HP TO LD CROSSTALK
AC PSRR, Ksvr
0
0
VI = 3.3 V,
Line Load = 5 kW,
32 W HP Load, 40 mW
200 mV Vpp supply ripple = 70 mV Vrms
-20
Amplitude - dBr
Amplitude - dBr
-20
-40
-60
HP to line left
-40
VI = 3.3 V,
200 mV Vpp Ripple on PSU,
Line Load = 5 kW, 32 W HP Load
Amplifier output - relative to 70 mV
-60
HP to line right
-80
-80
-100
20
50
100
200
500
1k
2k
f - Frequency - Hz
5k
20k
-100
20
Figure 5.
50
100
200
500
1k
2k
f - Frequency - Hz
5k
20k
Figure 6.
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s) :DRV604
7
DRV604
SLOS659 – JANUARY 2010
www.ti.com
TYPICAL CHARACTERISTICS, HEADPHONE
THD+N vs OUTPUT POWER
THD+N vs OUTPUT POWER, LINEAR SCALE
10
THD+N - Total Harmonic Distortion + Noise - %
THD+N - Total Harmonic Distortion + Noise - %
10
3.3 V, 32W, 1 kHz
In phase
1
Out of phase
0.1
0.01
3.3 V, 32W, 1 kHz
In phase
Out of phase
1
0.1
0.01
0.001
0.001
100u
5m 10m
2m
PO - Output Power - W
500u
50m
50
100
PO - Output Power - mW
200m
Figure 7.
Figure 8.
CHANNEL SEPARATION
LD TO HP CROSSTALK
0
0
3.3 V, LD 2 Vrms into 5 kW,
32 W HP Load No Signal
40 mW into 32W
-20
Amplitude - dBr
Amplitude - dBr
-20
-40
-60
-80
-100
20
8
150
-40
-60
-80
-100
50
100
200
500
1k
2k
f - Frequency - Hz
5k
20k
-120
20
50
100
200
500
1k
2k
f - Frequency - Hz
Figure 9.
Figure 10.
START
STOP
Figure 11.
Figure 12.
Submit Documentation Feedback
5k
20k
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s) :DRV604
DRV604
www.ti.com
SLOS659 – JANUARY 2010
APPLICATION INFORMATION
LINE DRIVER AMPLIFIERS
Single-supply headphone and line driver amplifiers typically require dc-blocking capacitors. The top drawing in
Figure 13 illustrates the conventional line driver amplifier connection to the load and output signal.
DC blocking capacitors for headphone amps are often large in value, and a mute circuit is needed during power
up to minimize click and pop for both headphone and line driver. The output capacitors and mute circuits
consume PCB area and increase cost of assembly, and can reduce the fidelity of the audio output signal.
Conventional Solution
9-12 V
VDD
+
Mute Circuit
Co
+
+
OPAMP
Output
VDD/2
GND
MUTE
DRV604 Solution
3.3 V
DirectPath
VDD
+
Mute Circuit
DRV604
Output
GND
VSS
MUTE
Figure 13. Conventional and DirectPath HP and Line Driver
The DirectPath™ amplifier architecture operates from a single supply but makes use of an internal charge pump
to provide a negative voltage rail.
Combining the user provided positive rail and the negative rail generated by the IC, the device operates in what
is effectively a split supply mode.
The output voltages are now centered at zero volts with the capability to swing to the positive rail or negative rail,
combining this with the build in click and pop reduction circuit, the DirectPath™ amplifier requires no output dc
blocking capacitors.
The bottom block diagram and waveform of Figure 13 illustrate the ground-referenced headphone and line driver
architecture. This is the architecture of the DRV604.
COMPONENT SELECTION
Charge Pump
The charge pump flying capacitor serves to transfer charge during the generation of the negative supply voltage.
The PVSS capacitor must be at least equal to the charge pump capacitor in order to allow maximum charge
transfer. Low ESR capacitors are an ideal selection, and a value of 1µF is typical. Capacitor values that are
smaller than 1µF can not be recommended for the HP section as it will limit the negative voltage swing in low
impedance loads.
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s) :DRV604
9
DRV604
SLOS659 – JANUARY 2010
www.ti.com
Decoupling Capacitors
The DRV604 is a DirectPath™ amplifier that requires adequate power supply decoupling to ensure that the noise
and total harmonic distortion (THD) are low. A good low equivalent-series-resistance (ESR) ceramic capacitor,
typically 1µF, placed as close as possible to the device PVDD leads works best. Placing this decoupling
capacitor close to the DRV604 is important for the performance of the amplifier. For filtering lower frequency
noise signals, a 10µF or greater capacitor placed near the audio power amplifier would also help, but it is not
required in most applications because of the high PSRR of this device.
Gain Setting Resistors Ranges
The gain setting resistors, Rin and Rfb, must be chosen so that noise, stability and input capacitor size of the
DRV604 is kept within acceptable limits. Voltage gain is defined as Rfb divided by Rin. Selecting values that are
too low demands a large input ac-coupling capacitor, CIN. Selecting values that are too high increases the noise
of the amplifier. Table 1 lists the recommended resistor values for different gain settings.
Table 1. Recommended Resistor Values
INPUT RESISTOR
VALUE, Rin
FEEDBACK RESISTOR
VALUE, Rfb
DIFFERENTIAL
INPUT GAIN
INVERTING INPUT
GAIN
NON INVERTING
INPUT GAIN
10 kΩ
10 kΩ
1.0 V/V
–1.0 V/V
2.0 V/V
10 kΩ
15 kΩ
1.5 V/V
–1.5 V/V
2.5 V/V
10 kΩ
20 kΩ
2.0 V/V
–2.0 V/V
3.0 V/V
4.7 kΩ
47 kΩ
10.0 V/V
–10.0 V/V
11.0 V/V
Cin
Cin
Rin
- In
Rin
- In
Rfb
Rfb
-
Differential
Input
Inverting
+
+
+ In
Cin
Rin
Rfb
Cx
Rin
Rfb
-
Non
Inverting
+
+ In
Cin
Rx
Figure 14. Differential, Inverting and Non-inverting Gain Configuration
Internal and External Under Voltage Detection and RESET Output
The DRV604 contains an internal precision band gap reference voltage and 2 comparators, one is used to
monitor the supply voltages, PVDD_LD and PVDD_HP, and the other to monitor an external user selectable
voltage on pin 25. The internal PVDD monitor is set at 2.8 V with 200 mV hysteresis.
The external under voltage detection can be used to shutdown the DRV604 before an input device can make a
pop. The shutdown threshold at the Ex_UVP pin is 1.25 V. A resistor divider is used to obtain the shutdown
threshold and hysteresis desired for the application.
10
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s) :DRV604
DRV604
www.ti.com
SLOS659 – JANUARY 2010
Comparator
Ex_UVP
25
AMP Enable
1.25 V
Bandgap
PVDD_LD
23
PVDD_HP
20
Comparator
Internal PVDD
The selected thresholds can be determined as follows:
(R11 + R12 )
VUVP = 1.25 V ´
R12
(1)
æ R11 ö
VHysteresis = 5 μA × R13 × ç
+1÷
è R12 ø
(2)
With the condition R13 >> R11||R12
For example, to obtain VUVP = 4.5 V and 400 mV hysteresis, use R11 = 10 kΩ, R12 = 3 kΩ and R13 = 22kΩ.
To filter supply spikes and noise a capacitor across R12 can be added.
External
Sense
Voltage
DRV604
5 mA
R11
R13
Comparator
Ex_UVP
25
R12
1.25 V
Bandgap
Input-Blocking Capacitors
DC input-blocking capacitors are required to be added in series with the audio signal into the input pins of the
DRV604. These capacitors block the DC portion of the audio source and allow the DRV604 inputs to be properly
biased to provide maximum performance. The input blocking capacitors also limit the DC gain to 1, limiting the
DC-offset voltage at the output.
These capacitors form a high-pass filter with the input resistor, Rin. The cutoff frequency is calculated using
Equation 1. For this calculation, the capacitance used is the input-blocking capacitor and the resistance is the
input resistor chosen from Table 1, then the frequency and/or capacitance can be determined when one of the
two values are given.
1
1
fc in =
Cin =
2p ´ Rin ´ Cin
2p ´ fc in ´ Rin
(3)
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s) :DRV604
11
DRV604
SLOS659 – JANUARY 2010
www.ti.com
Using the DRV604 as a 2nd order filter
Several audio DACs used today require an external low-pass filter to remove out of band noise. This is possible
with the DRV604 as it can be used like a standard OPAMP. Several filter topologies can be implemented both
single ended and differential. In the figure below a Multi Feed Back (MFB), with differential input and single
ended input is shown.
An AC-coupling capacitor to remove dc-content from the source is shown, it serves to block any dc content from
the source and lowers the dc-gain to 1 helping reducing the output dc-offset to minimum.
The component values can be calculated with the help of the TI FilterPro™ program available on the TI website
at:
http://focus.ti.com/docs/toolsw/folders/print/filterpro.html
Inverting Input
Differential Input
R2
C3
R1
R2
C3
C1
R3
R1
R3
C1
- In
- In
DRV604
+
C2
DRV604
+
C2
+ In
C3
R1
R3
C1
R2
Figure 15. 2nd Order Active Low Pass Filter
The resistor values should have a low value for obtaining low noise, but should also have a high enough value to
get a small size ac-coupling cap. C2 can be split in two with the midpoint connected to GND, this can increase
the common-mode attenuation.
Pop-Free Power Up
Pop-free power up is ensured by keeping the EN_LD and EN_HP and/or Ex_UVP low during power supply ramp
up and down. The pins should be kept low until the input AC-coupling capacitors are fully charged before
asserting the EN_xx pins high, this way proper pre-charge of the ac-coupling is performed and pop-less
power-up is achieved. Figure 16 illustrates the preferred sequence.
Supply
Supply Ramp
EN_xx
Time for ac-coupling
capacitors to charge
Figure 16. Power-Up/Down Sequence
12
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s) :DRV604
DRV604
www.ti.com
SLOS659 – JANUARY 2010
Dual Stereo Line Driver
The DRV604 Headphone stereo amplifier can also be used as Line Driver and has the same high output voltage
capability as the Line amp when driving 5kΩ load impedances. This makes the DRV604 ideal for applications like
dual SCART outputs on LCD TV, or for multiple line outputs like in DVD or Blue-Ray players where 2x DRV604
can give a very space effective solution for a 8ch line output.
Capacitive Load
The DRV604 has the ability to drive a high capacitive load up to 220pF directly, higher capacitive loads can be
accepted by adding an output series resistor of 47Ω or larger for the line driver output.
Layout Recommendations
A proposed layout for the DRV604 can be seen in the DRV604EVM user's guide, SLOU288, and the Gerber files
can be downloaded on www.ti.com, open the DRV604 product folder and look in the Tools and Software folder.
The gain setting resistors, Rin and Rfb, must be placed close to the input pins to minimize the capacitive loading
on these input pins and to ensure maximum stability of the DRV604.
Ground traces are recommended to be routed as a star ground to minimize hum interference.
PVDD, PVSS decoupling capacitors and the charge pump capacitors should be connected with short traces.
Footprint Compatible with the DRV603
The DRV604 stereo line driver section is pin compatible with the DRV603. A single PCB layout can therefore be
used with stuffing options for different output configurations.
1
DRV604
DRV603
1
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s) :DRV604
13
DRV604
SLOS659 – JANUARY 2010
www.ti.com
APPLICATION CIRCUIT
C11
C1
2
2
2
28
2
33.0k
2
-LD_R
-LD_L
27
C13
3
2
1
2
33.0k
C16
22pF
OUT_LDL
OUT_LDR
26
1
330pF
R16
GND
2
1
1
+LD_R
GND
1
R12
33.0k
+LD_L
R15
33.0k
22pF
LD_L_OUT
1
2
330pF
R13
1
LD_L_IN
R14
10.0k
C15
2
1
1
C12
1
1
10uF
U1
2
R11
10.0k
LD_L_OUT
C14
1
1uF
2
10uF
2
2
1
1
LD_L_IN
R3
Ex_UVP
AGND
25
1
VSUP
2
2
4
R1
22k
GND
1
2
6
PVSS_LD
PVDD_LD
23
GND
C9
470pF
2
1
R2
3.90k
2
C5
1uF
C3
2
PGND
EN_LD
24
11
10k
5
1
EN_LD
1uF
GND
CP_LD
CN_HP
CP_HP
22
GND
21
C4
PVDD_HP
PVSS_HP
20
C6
1uF
1uF
GND
10
PGND
EN_HP
19
2
EN_HP
1R
C7
10uF
C8
1uF
2
9
1
2
2
1
1
+3.3V
R4
2
1
8
CN_LD
1
7
GND
GND
GND
11
18
C21
1
1
2
R25
30.0k
R26
2
1
2
-HP_L
16
33.0k
C25
14
+HP_R
+HP_L
15
1
2
2
1
C22
330pF
-HP_R
R23
330pF
GND
1
R21
10.0k
HP_R_OUT
C26
22pF
2
2
17
2
10uF
R24
10.0k
GND
PDRV604
C2
1
1
33.0k
13
OUT_HPR
OUT_HPL
1
C23
22pF
2
1
2
1
2
30.0k
R22
12
1
GND
HP_L_OUT
HP_L_IN
NC
AGND
2
2.2uF
C24
2
1
HP_R_IN
10uF
Single-Ended Input and Output with 3.3x Gain in the Line Section, 3x Gain in the Headphone Section.
AC-Coupling Input with a High Pass Pole of 1.6Hz, 2nd Order Low Pass Filter at 50kHz.
14
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s) :DRV604
PACKAGE OPTION ADDENDUM
www.ti.com
25-Jan-2010
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
DRV604PWP
ACTIVE
HTSSOP
PWP
28
DRV604PWPR
ACTIVE
HTSSOP
PWP
28
50
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DLP® Products
www.dlp.com
Communications and
Telecom
www.ti.com/communications
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
www.ti.com/clocks
Consumer Electronics
www.ti.com/consumer-apps
Interface
interface.ti.com
Energy
www.ti.com/energy
Logic
logic.ti.com
Industrial
www.ti.com/industrial
Power Mgmt
power.ti.com
Medical
www.ti.com/medical
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
www.ti.com/video
Wireless
www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated