ON MC14511BCP Bcd−to−seven segment latch/decoder/driver Datasheet

MC14511B
BCD−To−Seven Segment
Latch/Decoder/Driver
The MC14511B BCD−to−seven segment latch/decoder/driver is
constructed with complementary MOS (CMOS) enhancement mode
devices and NPN bipolar output drivers in a single monolithic structure.
The circuit provides the functions of a 4−bit storage latch, an 8421
BCD−to−seven segment decoder, and an output drive capability. Lamp
test (LT), blanking (BI), and latch enable (LE) inputs are used to test the
display, to turn−off or pulse modulate the brightness of the display, and
to store a BCD code, respectively. It can be used with seven−segment
light−emitting diodes (LED), incandescent, fluorescent, gas discharge,
or liquid crystal readouts either directly or indirectly.
Applications include instrument (e.g., counter, DVM, etc.) display
driver, computer/calculator display driver, cockpit display driver, and
various clock, watch, and timer uses.
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MARKING
DIAGRAMS
16
16
MC14511BCP
AWLYYWWG
PDIP−16
P SUFFIX
CASE 648
1
1
16
14511BG
AWLYWW
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
Low Logic Circuit Power Dissipation
High−Current Sourcing Outputs (Up to 25 mA)
Latch Storage of Code
Blanking Input
Lamp Test Provision
Readout Blanking on all Illegal Input Combinations
Lamp Intensity Modulation Capability
Time Share (Multiplexing) Facility
Supply Voltage Range = 3.0 V to 18 V
Capable of Driving Two Low−power TTL Loads, One Low−power
Schottky TTL Load, or Two HTL Loads Over the Rated Temperature
Range
Chip Complexity: 216 FETs or 54 Equivalent Gates
Triple Diode Protection on all Inputs
Pb−Free Packages are Available*
MAXIMUM RATINGS (Voltages Referenced to VSS) (Note 1)
Symbol
Parameter
Value
Unit
−0.5 to +18.0
V
VDD
DC Supply Voltage Range
Vin
Input Voltage Range, All Inputs
−0.5 to VDD + 0.5
V
I
DC Current Drain per Input Pin
10
mA
PD
Power Dissipation,
per Package (Note 2)
500
mW
TA
Operating Temperature Range
−55 to +125
°C
Tstg
Storage Temperature Range
−65 to +150
°C
IOHmax
Maximum Output Drive Current
(Source) per Output
25
mA
POHmax
Maximum Continuous Output Power
(Source) per Output (Note 3)
50
mA
SO−16
D SUFFIX
CASE 751B
1
16
14511B
AWLYYWWG
SO−16
DW SUFFIX
CASE 751G
1
16
SOEIAJ−16
F SUFFIX
CASE 966
A
WL, L
YY, Y
WW, W
G
MC14511B
ALYWG
1
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
1. Maximum Ratings are those values beyond which damage to the device
may occur.
2. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/°C From 65°C to 125°C
3. POHmax = IOH (VDD − VOH)
© Semiconductor Components Industries, LLC, 2006
September, 2006 − Rev. 8
1
Publication Order Number:
MC14511B/D
MC14511B
This device contains protection circuitry to protect the inputs against damage due to high static voltages or electric fields.
However, it is advised that normal precautions be taken to avoid application of any voltage higher than maximum rated voltages
to this high−impedance circuit. A destructive high current mode may occur if Vin and Vout are not constrained to the range
VSS v (Vin or Vout) v VDD.
Due to the sourcing capability of this circuit, damage can occur to the device if VDD is applied, and the outputs are shorted
to VSS and are at a logical 1 (See Maximum Ratings).
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD).
PIN ASSIGNMENT
B
1
16
VDD
C
2
15
f
LT
3
14
g
BI
4
13
a
LE
5
12
b
D
6
11
c
A
7
10
d
VSS
8
9
e
a
f
g
e
b
c
d
DISPLAY
0
1
2
3
4
5
6
7
8
9
TRUTH TABLE
LE BI LT
X X 0
X 0 1
0
1 1
0
1 1
0
1 1
0
1 1
0
1 1
0
1 1
0
1 1
0
1 1
0
1 1
0
1 1
0
1 1
0
1 1
0
1 1
0
1 1
0
1 1
0
1 1
1
1 1
Inputs
D
C
X
X
X
X
0
0
0
0
0
0
0
0
0
1
0
1
0
1
0
1
1
0
1
0
1
0
1
0
1
1
1
1
1
1
1
1
X
X
B
X
X
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
X
A
X
X
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
X
a
1
0
1
0
1
1
0
1
0
1
1
1
0
0
0
0
0
0
b
1
0
1
1
1
1
1
0
0
1
1
1
0
0
0
0
0
0
c
1
0
1
1
0
1
1
1
1
1
1
1
0
0
0
0
0
0
d
1
0
1
0
1
1
0
1
1
0
1
0
0
0
0
0
0
0
*
Outputs
e
f
1
1
0
0
1
1
0
0
1
0
0
0
0
1
0
1
1
1
0
0
1
1
0
1
0
0
0
0
0
0
0
0
0
0
0
0
X = Don’t Care
* Depends upon the BCD code previously applied when LE = 0
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2
g
1
0
0
0
1
1
1
1
1
0
1
1
0
0
0
0
0
0
Display
8
Blank
0
1
2
3
4
5
6
7
8
9
Blank
Blank
Blank
Blank
Blank
Blank
*
MC14511B
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
− 55°C
25°C
VDD
125°C
Symbol
Vdc
Min
Max
Min
Typ
(Note 4)
“0” Level
VOL
5.0
10
15
−
−
−
0.05
0.05
0.05
−
−
−
0
0
0
0.05
0.05
0.05
−
−
−
0.05
0.05
0.05
Vdc
“1” Level
VOH
5.0
10
15
4.1
9.1
14.1
−
−
−
4.1
9.1
14.1
4.57
9.58
14.59
−
−
−
4.1
9.1
14.1
−
−
−
Vdc
Input Voltage #
“0” Level
(VO = 3.8 or 0.5 Vdc)
(VO = 8.8 or 1.0 Vdc)
(VO = 13.8 or 1.5 Vdc)
VIL
5.0
10
15
−
−
−
1.5
3.0
4.0
−
−
−
2.25
4.50
6.75
1.5
3.0
4.0
−
−
−
1.5
3.0
4.0
“1” Level
VIH
5.0
10
15
3.5
7.0
11
−
−
−
3.5
7.0
11
2.75
5.50
8.25
−
−
−
3.5
7.0
11
−
−
−
5.0
4.1
−
3.9
−
3.4
−
−
−
−
−
−
−
4.1
−
3.9
−
3.4
−
4.57
4.24
4.12
3.94
3.70
3.54
−
−
−
−
−
−
4.1
−
3.5
−
3.0
−
−
−
−
−
−
−
(IOH = 0 mA)
(IOH = 5.0 mA)
(IOH = 10 mA)
(IOH = 15 mA)
(IOH = 20 mA)
(IOH = 25 mA)
10
9.1
−
9.0
−
8.6
−
−
−
−
−
−
−
9.1
−
9.0
−
8.6
−
9.58
9.26
9.17
9.04
8.90
8.70
−
−
−
−
−
−
9.1
−
8.6
−
8.2
−
−
−
−
−
−
−
Vdc
(IOH = 0 mA)
(IOH = 5.0 mA)
(IOH = 10 mA)
(IOH = 15 mA)
(IOH = 20 mA)
(IOH = 25 mA)
15
14.1
−
14
−
13.6
−
−
−
−
−
−
−
14.1
−
14
−
13.6
−
14.59
14.27
14.18
14.07
13.95
13.70
−
−
−
−
−
−
14.1
−
13.6
−
13.2
−
−
−
−
−
−
−
Vdc
5.0
10
15
0.64
1.6
4.2
−
−
−
0.51
1.3
3.4
0.88
2.25
8.8
−
−
−
0.36
0.9
2.4
−
−
−
15
−
± 0.1
−
± 0.00001
± 0.1
−
± 1.0
Characteristic
Output Voltage
Vin = VDD or 0
Vin = 0 or VDD
(VO = 0.5 or 3.8 Vdc)
(VO = 1.0 or 8.8 Vdc)
(VO = 1.5 or 13.8 Vdc)
Output Drive Voltage
(IOH = 0 mA)
(IOH = 5.0 mA)
(IOH = 10 mA)
(IOH = 15 mA)
(IOH = 20 mA)
(IOH = 25 mA)
Output Drive Current
(VOL = 0.4 V)
(VOL = 0.5 V)
(VOL = 1.5 V)
Source
Sink
Input Current
VOH
IOL
Iin
Max
Min
Max
Unit
Vdc
Vdc
Vdc
mAdc
mAdc
Input Capacitance
Cin
−
−
−
−
5.0
7.5
−
−
pF
Quiescent Current
(Per Package) Vin = 0 or VDD,
Iout = 0 mA
IDD
5.0
10
15
−
−
−
5.0
10
20
−
−
−
0.005
0.010
0.015
5.0
10
20
−
−
−
150
300
600
mAdc
Total Supply Current (Notes 5 & 6)
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
IT
5.0
10
15
IT = (1.9 mA/kHz) f + IDD
IT = (3.8 mA/kHz) f + IDD
IT = (5.7 mA/kHz) f + IDD
4. Noise immunity specified for worst−case input combination.
Noise Margin for both “1” and “0” level =
1.0 Vdc min @ VDD = 5.0 Vdc
2.0 Vdc min @ VDD = 10 Vdc
2.5 Vdc min @ VDD = 15 Vdc
5. The formulas given are for the typical characteristics only at 25°C.
6. To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + 3.5 x 10–3 (CL – 50) VDDf
where: IT is in mA (per package), CL in pF, VDD in Vdc, and f in kHz is input frequency.
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3
mAdc
MC14511B
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
SWITCHING CHARACTERISTICS (Note 7) (CL = 50 pF, TA = 25°C)
VDD
Vdc
Min
Typ
Max
5.0
10
15
−
−
−
40
30
25
80
60
50
5.0
10
15
−
−
−
125
75
65
250
150
130
5.0
10
15
−
−
−
640
250
175
1280
500
350
5.0
10
15
−
−
−
720
290
200
1440
580
400
5.0
10
15
−
−
−
600
200
150
750
300
220
5.0
10
15
−
−
−
485
200
160
970
400
320
5.0
10
15
−
−
−
313
125
90
625
250
180
tPHL
5.0
10
15
−
−
−
313
125
90
625
250
180
Setup Time
tsu
5.0
10
15
100
40
30
−
−
−
−
−
−
ns
Hold Time
th
5.0
10
15
60
40
30
−
−
−
−
−
−
ns
tWL
5.0
10
15
520
220
130
260
110
65
−
−
−
ns
Characteristic
Symbol
Output Rise Time
tTLH = (0.40 ns/pF) CL + 20 ns
tTLH = (0.25 ns/pF) CL + 17.5 ns
tTLH = (0.20 ns/pF) CL + 15 ns
tTLH
Output Fall Time
tTHL = (1.5 ns/pF) CL + 50 ns
tTHL = (0.75 ns/pF) CL + 37.5 ns
tTHL = (0.55 ns/pF) CL + 37.5 ns
tTHL
Data Propagation Delay Time
tPLH = (0.40 ns/pF) CL + 620 ns
tPLH = (0.25 ns/pF) CL + 237.5 ns
tPLH = (0.20 ns/pF) CL + 165 ns
tPHL = (1.3 ns/pF) CL + 655 ns
tPHL = (0.60 ns/pF) CL + 260 ns
tPHL = (0.35 ns/pF) CL + 182.5 ns
tPLH
Blank Propagation Delay Time
tPLH = (0.30 ns/pF) CL + 585 ns
tPLH = (0.25 ns/pF) CL + 187.5 ns
tPLH = (0.15 ns/pF) CL + 142.5 ns
tPHL = (0.85 ns/pF) CL + 442.5 ns
tPHL = (0.45 ns/pF) CL + 177.5 ns
tPHL = (0.35 ns/pF) CL + 142.5 ns
tPLH
Lamp Test Propagation Delay Time
tPLH = (0.45 ns/pF) CL + 290.5 ns
tPLH = (0.25 ns/pF) CL + 112.5 ns
tPLH = (0.20 ns/pF) CL + 80 ns
tPHL = (1.3 ns/pF) CL + 248 ns
tPHL = (0.45 ns/pF) CL + 102.5 ns
tPHL = (0.35 ns/pF) CL + 72.5 ns
tPLH
tPHL
tPHL
Latch Enable Pulse Width
7. The formulas given are for the typical characteristics only.
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4
Unit
ns
ns
ns
ns
ns
MC14511B
Input LE low, and Inputs D, BI and LT high.
f in respect to a system clock.
All outputs connected to respective CL loads.
20 ns
20 ns
90%
50%
1
2f
A, B, AND C
VDD
10%
VSS
50% DUTY CYCLE
VOH
50%
ANY OUTPUT
VOL
Figure 1. Dynamic Power Dissipation Signal Waveforms
20 ns
20 ns
20 ns
VDD
90%
50%
10%
INPUT C
10%
th
VDD
VOH
90%
INPUT C
50%
50%
OUTPUT g
VSS
tsu
VSS
tPHL
tPLH
LE
VDD
90%
50%
VSS
10%
VOL
VOH
OUTPUT g
tTHL
tTLH
VOL
(b) Input D low,
Inputs A, B, BI and LT high.
(a) Inputs D and LE low, and
Inputs A, B, BI and LT high.
20 ns
20 ns
LE
VDD
90%
50%
10%
tWL
(c) Data DCBA strobed into latches.
Figure 2. Dynamic Signal Waveforms
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5
VSS
MC14511B
CONNECTIONS TO VARIOUS DISPLAY READOUTS
LIGHT EMITTING DIODE (LED) READOUT
VDD
VDD
COMMON
ANODE LED
COMMON
CATHODE LED
≈ 1.7 V
≈ 1.7 V
VSS
VSS
INCANDESCENT READOUT
VDD
FLUORESCENT READOUT
VDD
VDD
**
DIRECT
(LOW BRIGHTNESS)
FILAMENT
SUPPLY
VSS
VSS
VSS OR APPROPRIATE
VOLTAGE BELOW VSS.
(CAUTION: Maximum working voltage = 18.0 V)
GAS DISCHARGE READOUT
VDD
LIQUID CRYSTAL (LCD) READOUT
APPROPRIATE
VOLTAGE
EXCITATION
(SQUARE WAVE,
VSS TO VDD)
VDD
1/4 OF MC14070B
VSS
VSS
** A filament pre−warm resistor is recommended to reduce filament
thermal shock and increase the effective cold resistance of the
filament.
Direct DC drive of LCD’s not recommended for life of
LCD readouts.
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6
MC14511B
BI4
13a
A7
12b
11c
B1
10d
9e
15f
C2
14g
LT3
D6
VDD = PIN 16
VSS = PIN 8
LE5
Figure 3. Logic Diagram
ORDERING INFORMATION
Package
Shipping†
MC14511BCP
PDIP−16
500 / Tape & Ammo Box
MC14511BCPG
PDIP−16
(Pb−Free)
500 / Tape & Ammo Box
SO−16
48 Units / Rail
MC14511BDG
SO−16
(Pb−Free)
48 Units / Rail
MC14511BDW
SO−16
47 Units / Rail
MC14511BDWR2
SO−16 WB
1000 / Tape & Reel
MC14511BDWR2G
SO−16 WB
(Pb−Free)
1000 / Tape & Reel
MC14511BF
SOEIAJ−16
50 Units / Rail
MC14511BFG
SOEIAJ−16
(Pb−Free)
50 Units / Rail
MC14511BFEL
SOEIAJ−16
2000 / Tape & Reel
MC14511BFELG
SOEIAJ−16
(Pb−Free)
2000 / Tape & Reel
Device
MC14511BD
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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7
MC14511B
PACKAGE DIMENSIONS
PDIP−16
CASE 648−08
ISSUE T
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
−A−
16
9
1
8
B
F
C
L
DIM
A
B
C
D
F
G
H
J
K
L
M
S
S
SEATING
PLANE
−T−
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
T A
M
INCHES
MIN
MAX
0.740 0.770
0.250 0.270
0.145 0.175
0.015 0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008 0.015
0.110 0.130
0.295 0.305
0_
10 _
0.020 0.040
MILLIMETERS
MIN
MAX
18.80 19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
SO−16
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B−05
ISSUE J
−A−
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
−B−
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
−T−
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
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8
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
MC14511B
PACKAGE DIMENSIONS
SO−16 WB
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751G−03
ISSUE C
A
D
9
1
8
h X 45 _
H
E
0.25
8X
M
B
M
16
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN
EXCESS OF THE B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
q
16X
M
B
B
T A
B
S
S
e
SEATING
PLANE
A1
14X
L
A
0.25
MILLIMETERS
DIM MIN
MAX
A
2.35
2.65
A1 0.10
0.25
B
0.35
0.49
C
0.23
0.32
D 10.15 10.45
E
7.40
7.60
e
1.27 BSC
H 10.05 10.55
h
0.25
0.75
L
0.50
0.90
q
0_
7_
C
T
SOEIAJ−16
CASE 966−01
ISSUE A
16
LE
9
Q1
E HE
1
M_
L
8
Z
DETAIL P
D
e
VIEW P
A
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
A1
b
0.13 (0.005)
c
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
0.10 (0.004)
http://onsemi.com
9
MILLIMETERS
MIN
MAX
−−−
2.05
0.05
0.20
0.35
0.50
0.10
0.20
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
−−−
0.78
INCHES
MIN
MAX
−−−
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
−−−
0.031
MC14511B
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