Catalyst CAT25C64LE-1.8-GT3 64k-bit spi serial cmos eeprom Datasheet

Not recommended for new designs,
replace with CAT25640
CAT25C64
64K-Bit SPI Serial CMOS EEPROM
FEATURES
DESCRIPTION
■ 10 MHz SPI compatible
The CAT25C64 is a 64K-Bit SPI Serial CMOS EEPROM
internally organized as 8Kx8 bits. Catalyst’s advanced
CMOS Technology substantially reduces device power
requirements. The CAT25C64 features a 64-byte page
write buffer. The device operates via the SPI bus serial
interface and is enabled though a Chip Select (CS). In
addition to the Chip Select, the clock input (SCK), data
in (SI) and data out (SO) are required to access the
device. The HOLD pin may be used to suspend any
serial communication without resetting the serial sequence. The CAT25C64 is designed with software and
hardware write protection features including Block write
protection. The device is available in 8-pin DIP and
SOIC packages.
■ 1.8 to 5.5 volt operation
■ Hardware and software protection
■ Low power CMOS technology
■ SPI modes (0,0 &1,1)
■ Commercial, industrial and automotive
temperature ranges
■ 1,000,000 program/erase cycles
■ 100 year data tetention
■ Self-timed write cycle
■ 8-pin DIP and SOIC
■ 64-Byte page write buffer
■ Block write protection
– Protect 1/4, 1/2 or all of EEPROM array
PIN CONFIGURATION
FUNCTIONAL SYMBOL
VCC
PDIP (P, L)
SOIC (S, V)
CS
1
8
VCC
SO
2
7
HOLD
WP
3
6
SCK
VSS
4
5
SI
CS
CAT25C64
WP
SI
SO
HOLD
SCK
PIN FUNCTIONS
Pin Name
Function
SO
Serial Data Output
SCK
Serial Clock
WP
Write Protect
VCC
+1.8V to +5.5V Power Supply
VSS
Ground
CS
Chip Select
SI
Serial Data Input
HOLD
Suspends Serial Input
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
VSS
1
Doc. No. 1112, Rev. B
CAT25C64
ABSOLUTE MAXIMUM RATINGS*
*COMMENT
Temperature Under Bias ................. –55°C to +125°C
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation
of the device at these or any other conditions outside of
those listed in the operational sections of this specification is not implied. Exposure to any absolute maximum
rating for extended periods may affect device performance and reliability.
Storage Temperature ....................... –65°C to +150°C
Voltage on any Pin with
Respect to VSS(1) .................. –2.0V to +VCC +2.0V
VCC with Respect to VSS ................................ –2.0V to +7.0V
Package Power Dissipation
Capability (Ta = 25°C) ................................... 1.0W
Lead Soldering Temperature (10 secs) ............ 300°C
Output Short Circuit Current(2) ........................ 100 mA
RELIABILITY CHARACTERISTICS
Symbol
NEND
(3)
TDR(3)
Parameter
Min.
Endurance
Max.
Units
1,000,000
Cycles/Byte
100
Years
Data Retention
D.C. OPERATING CHARACTERISTICS
VCC = +1.8V to +5.5V, unless otherwise specified.
Limits
Symbol
Parameter
Min.
Typ.
Max.
Test Conditions
Units
ICC1
Power Supply Current
(Operating Write)
10
VCC = 5V @ 10MHz
SO = open; CS = Vss
mA
ICC2
Power Supply Current
(Operating Read)
2
VCC = 5.0V
FCLK = 10MHz
mA
ISB(4)
Power Supply Current
(Standby)
1
CS = VCC
VIN = VSS or VCC
µA
ILI
Input Leakage Current
2
ILO
Output Leakage Current
3
VIL(5)
Input Low Voltage
-1
VCC x 0.3
V
(5)
Input High Voltage
VCC x 0.7
VCC + 0.5
V
VIH
VOL1
Output Low Voltage
VOH1
Output High Voltage
VOL2
Output Low Voltage
VOH2
Output High Voltage
0.4
VCC - 0.8
0.2
VCC-0.2
µA
VOUT = 0V to VCC,
CS = 0V
2.7V ≤ VCC < 5.5V
IOL = 3.0mA
IOH = -1.6mA
1.8V ≤ VCC < 2.7V
IOL = 150µA
IOH = -100µA
µA
V
V
V
V
Note:
(1) The minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.0V for periods of less than 20 ns. Maximum DC
voltage on output pins is VCC +0.5V, which may overshoot to VCC +2.0V for periods of less than 20 ns.
(2) Output shorted for no more than one second. No more than one output shorted at a time.
(3) These parameter are tested initially and after a design or process change that affects the parameter according to appropriate AEC-Q100
and JEDEC test methods.
(4) Maximum standby current (ISB ) = 10µA for the Automotive and Extended Automotive temperature range.
(5) VIL min and VIH max are reference values only and are not tested.
Doc. No. 1112, Rev. B
2
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
CAT25C64
PIN CAPACITANCE (1)
Applicable over recommended operating range from TA=25˚C, f=1.0 MHz, VCC=+5.0V (unless otherwise noted).
Symbol
Test Conditions
Max.
Conditions
Units
COUT
Output Capacitance (SO)
8
VOUT=0V
pF
CIN
Input Capacitance (CS, SCK, SI, WP, HOLD)
6
VIN=0V
pF
A.C. CHARACTERISTICS
CAT25C64-1.8
SYMBOL PARAMETER
CAT25C64
VCC =
1.8V - 5.5V
VCC =
2.5V - 5.5V
Min.
Min.
Max.
Max.
VCC =
4.5V - 5.5V
Min.
Max.
Test
Conditions UNITS
tSU
Data Setup Time
50
50
20
ns
tH
Data Hold Time
50
50
20
ns
tWH
SCK High Time
250
125
40
ns
tWL
SCK Low Time
250
125
40
ns
fSCK
Clock Frequency
DC
tLZ
HOLD to Output Low Z
50
tRI(1)
Input Rise Time
tFI(1)
Input Fall Time
tHD
HOLD Setup Time
100
100
40
ns
tCD
HOLD Hold Time
100
100
40
ns
tWC(3)
Write Cycle Time
1
DC
10
MHz
50
50
ns
2
2
2
µs
2
2
2
µs
10
3
DC
10
250
CL = 50pF
ms
40
(2)
ns
tV
Output Valid from Clock Low
tHO
Output Hold Time
tDIS
Output Disable Time
250
250
75
ns
tHZ
HOLD to Output High Z
150
100
50
ns
tCS
CS High Time
500
250
100
ns
tCSS
CS Setup Time
500
250
100
ns
tCSH
CS Hold Time
500
250
100
ns
0
125
5
0
0
ns
Power-Up Timing(4)(5)
Symbol
Parameter
Max.
Units
tPUR
Power-up to Read Operation
1
ms
tPUW
Power-up to Write Operation
1
ms
Note:
(1) This parameter is tested initially and after a design or process change that affects the parameter.
(2) AC Test Conditions:
Input Pulse Voltages: 0.3VCC to 0.7VCC
Input rise and fall times: ≤10ns
Input and output reference voltages: 0.5VCC
Output load: current source IOL max/IOH max; CL=50pF
(3) tWC is the time from the rising edge of CS after a valid write sequence to the end of the internal write cycle.
(4) This parameter is tested initially and after a design or process change that affects the parameter.
(5) tPUR and tPUW are the delays required from the time VCC is stable until the specified operation can be initiated.
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
3
Doc. No. 1112, Rev. B
CAT25C64
FUNCTIONAL DESCRIPTION
PIN DESCRIPTION
The CAT25C64 supports the SPI bus data transmission
protocol. The synchronous Serial Peripheral Interface
(SPI) helps the CAT25C64 to interface directly with
many of today’s popular microcontrollers. The CAT25C64
contains an 8-bit instruction register. (The instruction
set and the operation codes are detailed in the instruction
set table)
SI: Serial Input
SI is the serial data input pin. This pin is used to input all
opcodes, byte addresses, and data to be written to the
25C64. Input data is latched on the rising edge of the
serial clock.
SO: Serial Output
SO is the serial data output pin. This pin is used to
transfer data out of the 25C64. During a read cycle, data
is shifted out on the falling edge of the serial clock.
After the device is selected with CS going low, the first
byte will be received. The part is accessed via the SI pin,
with data being clocked in on the rising edge of SCK.
The first byte contains one of the six op-codes that define
the operation to be performed.
SCK: Serial Clock
SCK is the serial clock pin. This pin is used to synchronize
Figure 1. Sychronous Data Timing
tCS
VIH
CS
VIL
tCSS
tCSH
VIH
tWH
SCK
VIL
tH
tSU
VIH
tWL
VALID IN
SI
VIL
tRI
tFI
tV
VOH
SO
tHO
tDIS
HI-Z
HI-Z
VOL
Note: Dashed Line= mode (1, 1) — — — —
INSTRUCTION SET
Instruction
Opcode
Operation
WREN
0000 0110
Enable Write Operations
WRDI
0000 0100
Disable Write Operations
RDSR
0000 0101
Read Status Register
WRSR
0000 0001
Write Status Register
READ
0000 0011
Read Data from Memory
WRITE
0000 0010
Write Data to Memory
Doc. No. 1112, Rev. B
4
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
CAT25C64
will interrupt a write to the status register. If the internal
write cycle has already been initiated, WP going low will
have no effect on any write operation to the status
register. The WP pin function is blocked when the WPEN
bit is set to 0.
the communication between the microcontroller and the
25C64. Opcodes, byte addresses, or data present on
the SI pin are latched on the rising edge of the SCK. Data
on the SO pin is updated on the falling edge of the SCK.
CS
CS: Chip Select
CS is the Chip select pin. CS low enables the CAT25C64
and CS high disables the CAT25C64. CS high takes the
SO output pin to high impedance and forces the devices
into a Standby Mode (unless an internal write operation
is underway). The CAT25C64 draws ZERO current in
the Standby mode. A high to low transition on CS is
required prior to any sequence being initiated. A low to
high transition on CS after a valid write sequence is what
initiates an internal write cycle.
HOLD
HOLD: Hold
The HOLD pin is used to pause transmission to the
CAT25C64 while in the middle of a serial sequence
without having to re-transmit entire sequence at a later
time. To pause, HOLD must be brought low while SCK
is low. The SO pin is in a high impedance state during the
time the part is paused, and transitions on the SI pins will
be ignored. To resume communication, HOLD is brought
high, while SCK is low. (HOLD should be held high any
time this function is not being used.) HOLD may be tied
high directly to Vcc or tied to Vcc through a resistor.
Figure 9 illustrates hold timing sequence.
WP
WP: Write Protect
WP is the Write Protect pin. The Write Protect pin will
allow normal read/write operations when held high.
When WP is tied low and the WPEN bit in the status
register is set to “1”, all write operations to the status
register are inhibited. WP going low while CS is still low
STATUS REGISTER
7
6
5
4
3
2
1
0
WPEN
X
X
X
BP1
BP0
WEL
RDY
BLOCK PROTECTION BITS
Status Register Bits
BP1
BP0
Array Address
Protected
Protection
0
0
None
No Protection
0
1
1800-1FFF
Quarter Array Protection
1
0
1000-1FFF
Half Array Protection
1
1
0000-1FFF
Full Array Protection
WRITE PROTECT ENABLE OPERATION
WPEN
WP
WEL
Protected
Blocks
0
X
0
Protected
Protected
Protected
0
X
1
Protected
Writable
Writable
1
Low
0
Protected
Protected
Protected
1
Low
1
Protected
Writable
Protected
X
High
0
Protected
Protected
Protected
X
High
1
Protected
Writable
Writable
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
5
Unprotected
Blocks
Status
Register
Doc. No. 1112, Rev. B
CAT25C64
The WPEN (Write Protect Enable) is an enable bit for the
WP pin. The WP pin and WPEN bit in the status register
control the programmable hardware write protect feature.
Hardware write protection is enabled when WP is low and
WPEN bit is set to high. The user cannot write to the status
register (including the block protect bits and the WPEN
bit) and the block protected sections in the memory array
when the chip is hardware write protected. Only the
sections of the memory array that are not block protected
can be written. Hardware write protection is disabled
when either WP pin is high or the WPEN bit is zero.
STATUS REGISTER
The Status Register indicates the status of the device.
The RDY (Ready) bit indicates whether the CAT25C64
is busy with a write operation. When set to 1 a write
cycle is in progress and when set to 0 the device
indicates it is ready. This bit is read only.
The WEL (Write Enable) bit indicates the status of the
write enable latch . When set to 1, the device is in a
Write Enable state and when set to 0 the device is in a
Write Disable state. The WEL bit can only be set by the
WREN instruction and can be reset by the WRDI
instruction.
DEVICE OPERATION
Write Enable and Disable
The CAT25C64 contains a write enable latch. This latch
must be set before any write operation. The device
powers up in a write disable state when Vcc is applied.
WREN instruction will enable writes (set the latch) to
thedevice. WRDI instruction will disable writes (reset the
latch) to the device. Disabling writes will protect the
device against inadvertent writes.
The BP0 and BP1 (Block Protect) bits indicate which
blocks are currently protected. These bits are set by the
user issuing the WRSR instruction. The user is allowed
to protect quarter of the memory, half of the memory or
the entire memory by setting these bits. Once protected
the user may only read from the protected portion of the
array. These bits are non-volatile.
Figure 2. WREN Instruction Timing
CS
SCK
SI
0
0
0
0
0
1
1
0
HIGH IMPEDANCE
SO
Note: Dashed Line= mode (1, 1) — — — —
Figure 3. WRDI Instruction Timing
CS
SCK
SI
SO
Note: Dashed Line= mode (1, 1) — — — —
Doc. No. 1112, Rev. B
0
0
0
0
0
1
0
0
HIGH IMPEDANCE
6
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
CAT25C64
READ Sequence
The part is selected by pulling CS low. The 8-bit read
instruction is transmitted to the CAT25C64, followed by
the 16-bit address(the three Most Significant Bits are
don’t care.
To read the status register, RDSR instruction should be
sent. The contents of the status register are shifted out on
the SO line. The status register may be read at any time
even during a write cycle. Read sequece is illustrated in
Figure 4. Reading status register is illustrated in Figure 5.
After the correct read instruction and address are sent,
the data stored in the memory at the selected address
is shifted out on the SO pin. The data stored in the
memory at the next address can be read sequentially
by continuing to provide clock pulses. The internal
address pointer is automatically incremented to the
next higher address after each byte of data is shifted
out. When the highest address (1FFFh) is reached, the
address counter rolls over to 0000h allowing the read
cycle to be continued indefinitely. The readoperation is
terminated by pulling the CS high.
WRITE Sequence
The CAT25C64 powers up in a Write Disable state. Prior to
any write instructions, the WREN instruction must be sent
to CAT25C64. The device goes into Write enable state by
pulling the CS low and then clocking the WREN instruction
into CAT25C64. The CS must be brought high after the
WREN instruction to enable writes to the device. If the write
operation is initiated immediately after the WREN instruction without CS being brought high, the data will not be
written to thearray because the write enable latch will not
have been properly set. Also, for a successful write operation the address of the memory location(s) to be programmed must be outside the protected address field
Figure 4. Read Instruction Timing
CS
0
1
2
3
4
5
6
7
8
9
10
20
21
22
23
24
25
26
27
28
29
30
2
1
SCK
OPCODE
SI
0
0
0
0
0
0
1
BYTE ADDRESS*
1
DATA OUT
HIGH IMPEDANCE
SO
7
6
5
4
3
0
MSB
*Please check the instruction set table for address
Note: Dashed Line= mode (1, 1) — — — —
Figure 5. RDSR Instruction Timing
CS
0
1
2
3
4
5
6
7
1
0
1
8
9
10
11
7
6
5
4
12
13
14
2
1
SCK
OPCODE
SI
0
0
0
0
0
DATA OUT
SO
HIGH IMPEDANCE
0
MSB
Note: Dashed Line= mode (1, 1) — — — —
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
3
7
Doc. No. 1112, Rev. B
CAT25C64
to 64 bytes of data to the CAT25C64. After each byte of data
is received, six lower order address bits are internally
incremented by one; the high order bits of address will
remain constant. The only restriction is that the 64 bytes
must reside on the same page. If the address counter
reaches the end of the page and clock continues, the
counter will “roll over” to the first address of the page and
overwrite any data that may have been written. The
CAT25C64 is automatically returned to the write disable
state at the completion of the write cycle. Figure 8 illustrates
the page write sequence.
location selected by the block protection level.
Byte Write
Once the device is in a Write Enable state, the user
may proceed with a write sequence by setting the CS
low, issuing a write instruction via the SI line, followed
by the 16-bit address (the three Most Significant Bits
are don’t care), and then the data to be written.
Programming will start after the CS is brought high.
Figure 6 illustrates byte write sequence.
During an internal write cycle, all commands will be
ignored except the RDSR (Read Status Register)
instruction.
To write to the status register, the WRSR instruction should
be sent. Only Bit 2, Bit 3 and Bit 7 of the status register can
be written using the WRSR instruction. Figure 7 illustrates
the sequence of writing to status register.
The Status Register can be read to determine if the
write cycle is still in progress. If Bit 0 of the Status
Register is set at 1, write cycle is in progress. If Bit 0
is set at 0, the device is ready for the next instruction.
DESIGN CONSIDERATIONS
The CAT25C64 powers up in a write disable state and in a
low power standby mode. A WREN instruction must be
issued to perform any writes to the device after power up.
Also,on power up CS should be brought low to enter a ready
Page Write
The CAT25C64 features page write capability. After
the first initial byte the host may continue to write up
Figure 6. Write Instruction Timing
CS
0
1
2
3
4
5
6
7
8
21
22
23
24
25
26
27
28
29
30
31
SCK
OPCODE
SI
0
0
0
0
0
DATA IN
0
1
0
D7 D6 D5 D4 D3 D2 D1 D0
ADDRESS
HIGH IMPEDANCE
SO
Note: Dashed Line= mode (1, 1) – – – –
Figure 7. WRSR Instruction Timing
CS
0
1
2
3
4
5
6
7
8
9
10
11
1
7
6
5
4
12
13
14
15
2
1
0
SCK
OPCODE
SI
0
0
0
0
0
DATA IN
0
0
3
MSB
SO
HIGH IMPEDANCE
Note: Dashed Line= mode (1, 1) — — — —
Doc. No. 1112, Rev. B
8
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
CAT25C64
state and receive an instruction. After a successful byte/
page write or status register write the CAT25C64 goes into
a write disable mode. CS must be set high after the proper
number of clock cycles to start an internal write cycle.
Access to the array during an internal write cycle is
ignored and program-ming is continued. On power up,
SO is in a high impedance.
When powering down, the supply should be taken down
to 0V, so that the CAT25C64 will be reset when power
is ramped back up. If this is not possible, then, following
a brown-out episode, the CAT25C64 can be reset by
refreshing the contents of the Status Register (See
Application Note AN10).
Figure 8. Page Write Instruction Timing
CS
0
1
2
3
4
5
6
7
8
21
22
23 24-31
32-39
24+(N-1)x8-1..24+(N-1)x8 24+Nx8-1
SCK
DATA IN
OPCODE
SI
0
0
0
0
0
0
1
0
ADDRESS
Data
Byte 1
Data
Byte 2
Data
Byte 3
Data Byte N
0
7..1
HIGH IMPEDANCE
SO
Note: Dashed Line = mode (1, 1) – – – –
Figure 9. HOLD Timing
CS
tCD
tCD
SCK
tHD
tHD
HOLD
tHZ
HIGH IMPEDANCE
SO
tLZ
Note: Dashed Line= mode (1, 1) — — — —
Figure 10. WP Timing
tWPS
tWPH
CS
tCSH
SCK
WP
WP
Note: Dashed Line= mode (1, 1) — — — —
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
9
Doc. No. 1112, Rev. B
CAT25C64
PACKAGE INFORMATION
8-LEAD 300 MIL WIDE PLASTIC DIP (P, L)
E1
E
D
A2
A
A1
L
e
eB
b2
b
SYMBOL
MIN
A
A1
A2
b
b2
D
D2
E
E1
e
eB
L
0.120
0.015
0.115
0.014
0.045
0.355
0.300
0.300
0.240
0.115
NOM
MAX
0.210
0.130
0.018
0.060
0.365
0.310
0.250
0.100 BSC
0.130
0.195
0.022
0.070
0.400
0.325
0.325
0.280
0.430
0.150
Notes:
1. Complies with JEDEC Standard MS001.
2. All dimensions are in inches.
3. Dimensioning and tolerancing per ANSI Y14.5M-1982
Doc. No. 1112, Rev. B
10
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
CAT25C64
8-LEAD 150 MIL WIDE SOIC (S, V)
E1
E
D
C
A
θ1
e
A1
L
b
SYMBOL
MIN
A1
A2
b
C
D
E
E1
e
f
θ1
0.0040
0.0532
0.013
0.0075
0.1890
02284
0.149
NOM
MAX
0.0098
0.0688
0.020
0.0098
0.1968
0.2440
0.1574
0.050 BSC
0.0099
0°
0.0196
8°
Notes:
1. Complies with JEDEC specification MS-012 dimensions.
2. All linear dimensions in millimeters.
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
11
Doc. No. 1112, Rev. B
CAT25C64
TAPE AND REEL
Direction of Feed
Device Orientation
SPROKET HOLE
TOP COVER
TAPE THICKNESS (t1)
0.10mm (0.004) MAX THICK
DEVICE ORIENTATION
EMBOSSED
CARRIER
PIN 1
EMBOSSMENT
PIN 1
TDFN
PIN 1
SOIC
TSSOP
(1)
Reel Dimensions
T
40mm (1.575) MIN.
ACCESS HOLE
AT SLOT LOCATION
B*
A
D*
C
FULL RADIUS*
N
TAPE SLOT IN CORE
FOR TAPE START.
2.5mm (0.098) MIN WIDTH
10mm (0.394) MIN DEPTH
* DRIVE SPOKES OPTIONAL, IF USED
ASTERISKED DIMENSIONS APPLY.
G (MEASURED AT HUB)
Embossed Carrier Dimensions
TAPE
SIZE
12MM
A
MAX
QTY/REEL
B MIN
C
D* MIN
330
(13.00)
3000
1.5
(0.059)
12.80 (0.504)
13.20 (0.5200)
N MIN
20.2
50
(0.795) (1.969)
G
T MAX
12.4 (0.488)
14.4 (0.558)
_18.4_
(0.724)
Component/Tape Size Cross-Reference
Component
Package Type
Tape Size (W)
Part Pitch (P)
8L SOIC
S, V
12mm
8mm
Notes:
(1) Metric dimensions will govern; English measurements rounded, for reference only and in parentheses.
Doc. No. 1112, Rev. B
12
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
CAT25C64
Embossed Carrier Dimensions (12 Pape Only)
K
D
10 PITCHES
CUMULATIVE TOLERANCE
ON TAPE 0.2mm( 0.008)
P0
T
P2
TOP
COVER
TAPE
E
(2)
A0
F
W
(2)
K0
B1
B0
P
CENTER LINES
OF CAVITY
EMBOSSMENT
FOR MACHINE REFERENCE ONLY
INCLUDING DRAFT AND RADII
CONCENTRIC ABOUT B0
D1
FOR COMPONENTS
2.0mm X 1.2mm
AND LARGER
USER DIRECTION OF FEED
Embossed Tape—Constant Dimensions(1)
Tape Sizes
D
E
P0
T Max.
D1 Min.
12mm
1.5 (0.059)
1.6 (0.063)
1.65 (0.065)
1.85 (0.073)
3.9 (0.153)
4.1 (0.161)
400
(0.016)
1.5
(0.059)
A0 B0 K0(2)
Embossed Tape—Variable Dimensions(1)
Tape Sizes
B1 Max.
F
K Max.
P2
R Min.
W
P
12mm
8.2
(0.0323)
5.45 (0.0215)
5.55 (0.0219)
4.5
(0.177)
1.95 (0.077)
2.05 (0.081)
30
(1.181)
11.7 (0.460)
12.3 (0.484)
7.9 (0.275)
8.1 (0.355)
Note:
(1) Metric dimensions will govern; English measurements rounded, for reference only and in parentheses.
(2) A0 B0 K0 are determined by component size. The clearance between the component and the cavity must be within 0.05 (0.002) min. to
0.65 (0.026) max. for 12mm tape, 0.05 (0.002) min. to 0.90 (0.035) max. for 16mm tape, and 0.05 (0.002) min. to 1.00 (0.039) max. for
24mm tape and larger. The component cannot rotate more than 20° within the determined cavity, see Component Rotation.
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
13
Doc. No. 1112, Rev. B
CAT25C64
ORDERING INFORMATION
Prefix
Device #
CAT
Optional
Company ID
25C64
Product
Number
Suffix
S
-1.8 – GT3
I
Temperature Range
Blank = Commercial (0°C to +70°C)
I = Industrial (-40°C to +85°C)
A = Automotive (-40°C to +105°C)
E = Extended (-40°C to +125°C)
Package
P: PDIP
S: SOIC
L: PDIP (Lead-free, Halogen-free)
V: SOIC, JEDEC (Lead-free, Halogen-free)
Operating Voltage
Blank = 2.5 to 5.5V
1.8 = 1.8 to 5.5V
Lead Finish/Tape & Reel
G: NiPdAu Lead Plating
T: Tape & Reel
3: 3000/Reel
Notes:
(1) The device used in the above example is a 25C64SI-1.8GT3 (SOIC, Industrial Temperature, 1.8 Volt to 5.5 Volt Operating Voltage,
Tape & Reel)
Doc. No. 1112, Rev. B
14
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
CAT25C64
PACKAGE MARKING
8-Lead PDIP
8-Lead SOIC
VV
25C64LI
YYWWC
VV
25C64VI
YYWWC
CSI = Catalyst Semiconductor, Inc.
VV = Voltage Range
1.8V - 5.5V = 18
2.5V - 5.5V = Blank
25C64L = Device Code
I = Temperature Range
YY = Production Year
WW = Production Week
C = Product Revision
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
CSI = Catalyst Semiconductor, Inc.
VV = Voltage Range
1.8V - 5.5V = 18
2.5V - 5.5V = Blank
25C64V = Device Code
I = Temperature Range
YY = Production Year
WW = Production Week
C = Product Revision
15
Doc. No. 1112, Rev. B
REVISION HISTORY
Date
12/22/2005
03/21/06
Rev.
A
B
Reason
Initial Issue
Update D.C. Operating Characteristics
Update A.C. Characteristics
Update Pin Description
Copyrights, Trademarks and Patents
Trademarks and registered trademarks of Catalyst Semiconductor include each of the following:
DPP ™
AE2 ™
MiniPot™
Catalyst Semiconductor has been issued U.S. and foreign patents and has patent applications pending that protect its products.
CATALYST SEMICONDUCTOR MAKES NO WARRANTY, REPRESENTATION OR GUARANTEE, EXPRESS OR IMPLIED, REGARDING THE SUITABILITY OF ITS
PRODUCTS FOR ANY PARTICULAR PURPOSE, NOR THAT THE USE OF ITS PRODUCTS WILL NOT INFRINGE ITS INTELLECTUAL PROPERTY RIGHTS OR THE
RIGHTS OF THIRD PARTIES WITH RESPECT TO ANY PARTICULAR USE OR APPLICATION AND SPECIFICALLY DISCLAIMS ANY AND ALL LIABILITY ARISING
OUT OF ANY SUCH USE OR APPLICATION, INCLUDING BUT NOT LIMITED TO, CONSEQUENTIAL OR INCIDENTAL DAMAGES.
Catalyst Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or
other applications intended to support or sustain life, or for any other application in which the failure of the Catalyst Semiconductor product could create a
situation where personal injury or death may occur.
Catalyst Semiconductor reserves the right to make changes to or discontinue any product or service described herein without notice. Products with data sheets
labeled "Advance Information" or "Preliminary" and other products described herein may not be in production or offered for sale.
Catalyst Semiconductor advises customers to obtain the current version of the relevant product information before placing orders. Circuit diagrams illustrate
typical semiconductor applications and may not be complete.
Catalyst Semiconductor, Inc.
Corporate Headquarters
1250 Borregas Avenue
Sunnyvale, CA 94089
Phone: 408.542.1000
Fax: 408.542.1200
www.catsemi.com
Publication #:
Revison:
Issue date:
1112
B
03/21/06
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