NSI45020AT1G Constant Current Regulator & LED Driver 45 V, 20 mA + 10%, 460 mW Package The linear constant current regulator (CCR) is a simple, economical and robust device designed to provide a cost−effective solution for regulating current in LEDs. The CCR is based on patent-pending Self-Biased Transistor (SBT) technology and regulates current over a wide voltage range. It is designed with a negative temperature coefficient to protect LEDs from thermal runaway at extreme voltages and currents. The CCR turns on immediately and is at 25% of regulation with only 0.5 V Vak. It requires no external components allowing it to be designed as a high or low−side regulator. The high anode-cathode voltage rating withstands surges common in Automotive, Industrial and Commercial Signage applications. The CCR comes in thermally robust packages and is qualified to AEC-Q101 standard. http://onsemi.com Ireg(SS) = 20 mA @ Vak = 7.5 V Anode 2 Features • • • • • • • • Cathode 1 Robust Power Package: 460 mW Wide Operating Voltage Range Immediate Turn-On Voltage Surge Suppressing − Protecting LEDs AEC-Q101 Qualified SBT (Self−Biased Transistor) Technology Negative Temperature Coefficient These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 2 1 SOD−123 CASE 425 STYLE 1 MARKING DIAGRAM Applications • Automobile: Chevron Side Mirror Markers, Cluster, Display & • • • • Instrument Backlighting, CHMSL, Map Light AC Lighting Panels, Display Signage, Decorative Lighting, Channel Lettering Switch Contact Wetting Application Note AND8391/D − Power Dissipation Considerations Application Note AND8349/D − Automotive CHMSL Anode−Cathode Voltage Reverse Voltage Operating and Storage Junction Temperature Range ESD Rating: Human Body Model Machine Model AD M G AD M G G = Device Code = Date Code = Pb−Free Package (Note: Microdot may be in either location) Symbol Value Unit Device Package Vak Max 45 V NSI45020AT1G VR 500 mV SOD−123 (Pb−Free) TJ, Tstg −55 to +150 °C ESD 2 ORDERING INFORMATION MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Rating 1 Class 1C Class B Shipping† 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. © Semiconductor Components Industries, LLC, 2009 November, 2009 − Rev. 4 1 Publication Order Number: NSI45020A/D NSI45020AT1G ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Steady State Current @ Vak = 7.5 V (Note 1) Voltage Overhead (Note 2) 1. 2. 3. 4. Symbol Min Typ Max Unit Ireg(SS) 18 20 22 mA Voverhead 1.8 19.85 22.5 V Pulse Current @ Vak = 7.5 V (Note 3) Ireg(P) Capacitance @ Vak = 7.5 V (Note 4) C 2.5 25.15 mA pF Capacitance @ Vak = 0 V (Note 4) C 5.7 pF Ireg(SS) steady state is the voltage (Vak) applied for a time duration ≥ 10 sec, using FR−4 @ 300 mm2 1 oz. Copper traces, in still air. Voverhead = Vin − VLEDs. Voverhead is typical value for 85% Ireg(SS). Ireg(P) non−repetitive pulse test. Pulse width t ≤ 300 msec. f = 1 MHz, 0.02 V RMS. THERMAL CHARACTERISTICS Characteristic Total Device Dissipation (Note 5) TA = 25°C Derate above 25°C Thermal Resistance, Junction−to−Ambient (Note 5) Symbol Max Unit PD 208 1.66 mW mW/°C RθJA 600 °C/W Thermal Reference, Lead−to−Ambient (Note 5) RψLA 404 °C/W Thermal Reference, Junction−to−Cathode Lead (Note 5) RψJL 196 °C/W PD 227 1.8 mW mW/°C Thermal Resistance, Junction−to−Ambient (Note 6) RθJA 550 °C/W Thermal Reference, Lead−to−Ambient (Note 6) RψLA 390 °C/W Thermal Reference, Junction−to−Cathode Lead (Note 6) RψJL 160 °C/W PD 347 2.8 mW mW/°C Thermal Resistance, Junction−to−Ambient (Note 7) RθJA 360 °C/W Thermal Reference, Lead−to−Ambient (Note 7) RψLA 200 °C/W Thermal Reference, Junction−to−Cathode Lead (Note 7) RψJL 160 °C/W PD 368 2.9 mW mW/°C Thermal Resistance, Junction−to−Ambient (Note 8) RθJA 340 °C/W Thermal Reference, Lead−to−Ambient (Note 8) RψLA 208 °C/W Thermal Reference, Junction−to−Cathode Lead (Note 8) RψJL 132 °C/W PD 436 3.5 mW mW/°C Thermal Resistance, Junction−to−Ambient (Note 9) RθJA 287 °C/W Thermal Reference, Lead−to−Ambient (Note 9) RψLA 139 °C/W Thermal Reference, Junction−to−Cathode Lead (Note 9) RψJL 148 °C/W PD 463 3.7 mW mW/°C Thermal Resistance, Junction−to−Ambient (Note 10) RθJA 270 °C/W Thermal Reference, Lead−to−Ambient (Note 10) RψLA 150 °C/W RψJL 120 °C/W TJ, Tstg −55 to +150 °C Total Device Dissipation (Note 6) TA = 25°C Derate above 25°C Total Device Dissipation (Note 7) TA = 25°C Derate above 25°C Total Device Dissipation (Note 8) TA = 25°C Derate above 25°C Total Device Dissipation (Note 9) TA = 25°C Derate above 25°C Total Device Dissipation (Note 10) TA = 25°C Derate above 25°C Thermal Reference, Junction−to−Cathode Lead (Note 10) Junction and Storage Temperature Range mm2, mm2, mm2, mm2, mm2, mm2, 5. FR−4 @ 100 1 oz. copper traces, still air. 2 oz. copper traces, still air. 6. FR−4 @ 100 1 oz. copper traces, still air. 7. FR−4 @ 300 2 oz. copper traces, still air. 8. FR−4 @ 300 1 oz. copper traces, still air. 9. FR−4 @ 500 2 oz. copper traces, still air. 10. FR−4 @ 500 NOTE: Lead measurements are made by non−contact methods such as IR with treated surface to increase emissivity to 0.9. Lead temperature measurement by attaching a T/C may yield values as high as 30% higher °C/W values based upon empirical measurements and method of attachment. http://onsemi.com 2 NSI45020AT1G TYPICAL PERFORMANCE CURVES Minimum FR−4 @ 300 mm2, 1 oz Copper Trace, Still Air 50 40 30 20 VR 10 0 −10 −20 −10 0 10 20 30 50 40 60 TA = −40°C 20 TA = 85°C 15 10 5 0 DC Test Steady State, Still Air 0 1 2 4 5 6 7 8 9 Figure 1. General Performance Curve for CCR Figure 2. Steady State Current (Ireg(SS)) vs. Anode−Cathode Voltage (Vak) Ireg(SS), STEADY STATE CURRENT (mA) TA = 25°C 22.0 21.5 21.0 20.5 20.0 3.0 Non−Repetitive Pulse Test 4.0 5.0 6.0 7.0 8.0 9.0 10 Vak @ 7.5 V TA = 25°C 21 20 19 18 19 21 20 22 23 25 24 26 Ireg(P), PULSE CURRENT (mA) Figure 3. Pulse Current (Ireg(P)) vs. Anode−Cathode Voltage (Vak) Figure 4. Steady State Current vs. Pulse Current Testing 800 23 PD, POWER DISSIPATION (mW) Vak @ 7.5 V TA = 25°C 22 21 20 0 5 10 15 20 25 30 700 500 mm2/2 oz 600 500 500 mm2/1 oz 400 300 mm2/1 300 mm2/2 oz oz 300 200 100 mm2/2 oz 100 100 −40 35 mm2/1 −20 oz 0 20 40 60 80 TIME (s) TA, AMBIENT TEMPERATURE (°C) Figure 5. Current Regulation vs. Time Figure 6. Power Dissipation vs. Ambient Temperature @ TJ = 1505C http://onsemi.com 3 10 22 Vak, ANODE−CATHODE VOLTAGE (V) Ireg, CURRENT REGULATION (mA) 3 Vak, ANODE−CATHODE VOLTAGE (V) 22.5 19 [ −0.052 mA/°C typ @ Vak = 7.5 V [ −0.044 mA/°C typ @ Vak = 7.5 V TA = 25°C Vak, ANODE−CATHODE VOLTAGE (V) 23.0 Ireg(P), PULSE CURRENT (mA) 25 Ireg(SS), STEADY STATE CURRENT (mA) Ireg, CURRENT REGULATION (mA) 60 NSI45020AT1G APPLICATIONS D1 Anode D1 Q1 Q2 Qx LED LED LED Anode Cathode + − Vin Q1 Q2 Qx Cathode HF3−R5570 HF3−R5570 + − HF3−R5570 Vin LED HF3−R5570 LED HF3−R5570 LED HF3−R5570 LED HF3−R5570 LED HF3−R5570 LED LED HF3−R5570 HF3−R5570 LED LED HF3−R5570 HF3−R5570 Figure 7. Typical Application Circuit (20 mA each LED String) Figure 8. Typical Application Circuit (60 mA each LED String) Number of LED’s that can be connected is determined by: D1 is a reverse battery protection diode LED’s = ((Vin − QX VF + D1 VF)/LED VF) Example: Vin = 12 Vdc, QX VF = 3.5 Vdc, D1VF = 0.7 V LED VF = 2.2 Vdc @ 20 mA (12 Vdc − 4.2 Vdc)/2.2 Vdc = 3 LEDs in series. Number of LED’s that can be connected is determined by: D1 is a reverse battery protection diode Example: Vin = 12 Vdc, QX VF = 3.5 Vdc, D1VF = 0.7 V LED VF = 2.6 Vdc @ 60 mA (12 Vdc − (3.5 + 0.7 Vdc))/2.6 Vdc = 3 LEDs in series. Number of Drivers = LED current/20 mA 60 mA/20 mA = 3 Drivers (Q1, Q2, Q3) http://onsemi.com 4 NSI45020AT1G Comparison of LED Circuit using CCR vs. Resistor Biasing ON Semiconductor CCR Design Resistor Biased Design Constant brightness over full Automotive Supply Voltage (more efficient), see Figure 9 Large variations in brightness over full Automotive Supply Voltage Little variation of power in LEDs, see Figure 10 Large variations of current (power) in LEDs Constant current extends LED strings lifetime, see Figure 9 High Supply Voltage/ Higher Current in LED strings limits lifetime Current decreases as voltage increases, see Figure 9 Current increases as voltage increases Current supplied to LED string decreases as temperature increases (self-limiting), see Figure 2 LED current decreases as temperature increases No resistors needed Requires costly inventory (need for several resistor values to match LED intensity) Fewer components, less board space required More components, more board space required Surface mount component Through-hole components 30 160 TA = 25°C 140 Pd LEDs (mW) I (mA) 25 Circuit Current with CCR Device 20 Circuit Current with 375 W 15 Representative Test Data for Figure 7 Circuit, Current of LEDs, FR−4 @ 300 mm2, 1 oz Copper Area 10 5 9 10 11 TA = 25°C 12 13 14 15 LED Power with CCR Device 120 100 LED Power with 375 W 80 Representative Test Data for Figure 7 Circuit, Pd of LEDs, FR−4 @ 300 mm2, 1 oz Copper Area 60 40 16 9 10 11 12 13 14 Vin (V) Vin (V) Figure 9. Series Circuit Current Figure 10. LED Power Current Regulation: Pulse Mode (Ireg(P)) vs DC Steady-State (Ireg(SS)) 15 16 Ireg(SS) for stated board material, size, copper area and copper thickness. Ireg(P) will always be greater than Ireg(SS) due to the die temperature rising during Ireg(SS). This heating effect can be minimized during circuit design with the correct selection of board material, metal trace size and weight, for the operating current, voltage, board operating temperature (TA) and package. (Refer to Thermal Characteristics table). There are two methods to measure current regulation: Pulse mode (Ireg(P)) testing is applicable for factory and incoming inspection of a CCR where test times are a minimum. (t < 300 ms). DC Steady-State (Ireg(SS)) testing is applicable for application verification where the CCR will be operational for seconds, minutes, or even hours. ON Semiconductor has correlated the difference in Ireg(P) to http://onsemi.com 5 NSI45020AT1G PACKAGE DIMENSIONS SOD−123 CASE 425−04 ISSUE E D ÂÂÂÂ ÂÂÂÂ A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. A1 1 HE MILLIMETERS DIM MIN NOM MAX A 0.94 1.17 1.35 A1 0.00 0.05 0.10 b 0.51 0.61 0.71 ----c 0.15 D 1.40 1.60 1.80 E 2.54 2.69 2.84 HE 3.56 3.68 3.86 ----L 0.25 STYLE 1: PIN 1. CATHODE 2. ANODE E L 2 MIN 0.037 0.000 0.020 --0.055 0.100 0.140 0.010 INCHES NOM 0.046 0.002 0.024 --0.063 0.106 0.145 --- MAX 0.053 0.004 0.028 0.006 0.071 0.112 0.152 --- C b SOLDERING FOOTPRINT* ÉÉ ÉÉ ÉÉ 0.91 0.036 2.36 0.093 4.19 0.165 ÉÉ ÉÉ ÉÉ SCALE 10:1 1.22 0.048 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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