Fujitsu FTR-B2NA4.5Z 4 pole (2 form c 2 form a) signal relay for central switching/ data transmission Datasheet

4 POLE (2 FORM C+ 2 FORM A) SIGNAL
RELAY FOR CENTRAL SWITCHING/
DATA TRANSMISSION
RoHS Compliant
FTR-B2 Series
N
■ FEATURES
O
4 POLE MINIATURE RELAY
Mounting space of 175mm2 with 4 pole relay, suitable for high
density mounting.
●
SAFETY STANDARD
- UL/CSA recognized
- Conforms to Bellcore specification & FCC part 68
- Conforms to IEC 60950 / UL1950 / EN60950 spacing
and high breakdown voltage
Clearance:
1.0mm
Creepage:
1.6mm
●
HIGH RELIABILITY
Bifurcated gold overlay silver alloy
●
HIGH HEAT RESISTANCE, FLAMMABILITY
Flammability grade of 94V-0 materials employed
●
AIR TIGHT CONSTRUCTION
Air tight construction allows high resistance to various
environments and to clean the relay
●
SMT VERSION
Surface mount type available on request
● RoHS compliant since date code: 0430B8
Please see page 7 for more information
●
T
FO
R
N
EW
D
■ ORDERING INFORMATION
[Example]
FTR-B2
(a)
ES
M A 012 Z – **
(b) (c) (d) (e) (f )
(a) Series Name
FTR-B2
(b) Contact Arrangement
M : 2 Form C + 2 Form A - through hole
N: 2 Form C + 2 Form A - SMT
(c) Coil Type
A : Standard (400mW)
(d) Coil Nominal Voltage
4.5: 4.5VDC
012: 12VDC
(e) Contact Material
Z : Gold overlay silver alloy
(f)
Special Number for Customized Products
Custom Designation
Remarks: Actual marking on relay would not carry code FTR and be as below:
Ordering code
Actual marking
FTR-B2MA012Z
→
B2MA012Z
IG
N
1
FTR-B2 Series
■ SAFETY STANDARD AND FILE NUMBERS
UL508, 1950 (File No. E63615)
C22.2 No. 14, No. 950 (File No. LR40304)
Please request when the approval markings are required on the cover.
Nominal voltage
Contact rating
0.2 A
1A
0.3 A
4.5 to 12 VDC
N
125 VAC
30 VDC
110 VDC
Clearance
Creepage
1.0mm
coil a- contacts
1.6mm
coil - contacts
O
T
■ COIL DATA CHART
Remarks
- working voltage: 150V
- relay inside and outside
- pollution degree "2"
FO
MODEL
Nominal
Voltage
FTR-B2 ( ) A4.5Z
4.5VDC
FTR-B2 ( ) A012Z
12VDC
resistive
R
Coil
Resistance
Operate Voltage
50Ω
3.38VDC
0.45VDC
400mw
355Ω
9.0VDC
1.2VDC
400mw
N
EW
Release Voltage Nominal Power
D
ES
IG
N
2
FTR-B2 Series
■ SPECIFICATIONS
Item
FTR-B2 Series
Contact
N
Arrangement
2 Form C + 2 Form A
Material
Gold overlay Silver alloy
Resistance (initial)
Maximum 75mΩ (at 1A 6VDC)
Rating (resistive)
30VDC 1A / 125VAC 0.2A
Maximum Switching Power
30W / 25VA
Maximum Switching Voltage
110VDC / 125VAC
Maximum Switching Current
1A
O
T
FO
Maximum Carrying Current
Time Value
1.25A
Operate Time (at nominal voltage) Maximum 10ms
R
Release Time (at nominal voltage) Maximum 5ms
Coil
Operating Temperature
Insulation
Resistance (at 500VDC)
Dielectric Strength
Life
Vibration
Mechanical
-40° C to +85° C (no frost)
N
Minimum 1,000 MΩ
EW
750 VAC 1 Min. (open contacts)
500 VAC 1 Min. (adjacent contacts)
1,500 VAC 1 Min. (coil-contacts)
10 x 106 operations minimum
D
Electrical
50 x 103 operations minimum at 30VDC 1A
100 x 103 operations minimum at 125VDC 0.2A
Misoperation
10-55 Hz (double amplitude of 1.5mm)
Endurance
10-55 Hz (double amplitude of 1.5mm)
Misoperation
100m/s2 (11±1ms)
Endurance
500m/s2 (6±1ms)
Shock
Weight
ES
Approximately 3.9g
IG
N
3
,
FTR-B2 Series
10
Time (ms)
8
6
N
4
2
0
Operation time
O
Release
0
0.2
T
0.4
0.6
80
60
40
c
ct
Co
n
Co
0.2
AC Resistive
5
10
30 50
0.6
0.8
2.4
2.2
Co
2.0
nta
1.8
Co
ct
ca
rry
nta
1.6
ct c
arr
1.4
ing
yin
gc
cu
rre
urr
nt:
0A
ent
: 1A
1.2
Operating Voltage
(hot coil)
1.0
0.8
Operating Voltage
(cool coil)
0.6
0
20
40
60
80
R
50
30
20
10
N
0
100 200
EW
30 VDC Resistive
125 VAC Resistive
0.2
0.4
0.6
0.8
1.0
Contact Current (A)
D
1.2
 €{~ {~
€
~
{
Contact Voltage (V)
ES
■ REFERENCE DATA
Distribution of Operate
and Release Voltage
80
60
40
20
100
60
40
0
10 20 30 40 50 60 70 80 90 100
80
FBR-B2MA4.5Z
n=100
Break
Make
60
40
20
20
Nominal Voltage Multiplying Factor (%)
N
100
FTR-B2MA4.5Z
n=100
Operate
Release
80
IG
Distribution of Contact Resistance
Distribution (%)
FTR-B2MA4.5Z
n=100
Operate
Release
Distribution of Operate
and Release Time
Distribution (%)
Distribution (%)
100
100
Ambient Temperature (˚C)
Life Curve
5
1
0.4
(maximum applied voltage,
operating voltage characteristics)
100
0.2
0.1
e
urr
gc
yin
arr
0A
Coil Power (W)
Operation (x104)
Contact Current (A)
0.5
0.4
0.3
nt:
tc
tac
20
0
FO
1
n
ryi
nta
0.8
DC Resistive
ren
ar
Maximum Switching Power
2
A
t: 1
ur
gc
Coil Power (W)
3
Ambient Temperature
Coil Temperature Rise
Nominal Voltage Multiplying Factor (%)
Operation
(return time characteristics)
Coil Temperature Rise (˚C)
■ CHARACTERISTIC DATA
0
1
2
3
4
Time (ms)
5
6
0
10
20
30
40
50
60
70
Contact Resistance (mΩ)
4
FTR-B2 Series
Operating Voltage
3.0
2.0
Release Voltage
1.0
0
500
200
100
50
20
10
5
2
FBR-B2MA4.5Z
n=10
1200 operations/min.
N
Initial1
O
5 10
Make
Break
T
50 100
500 1000
4.0
Operating Voltage
3.0
2.0
● Dimensions
Through hole type
Release Voltage
1.0
FBR-B2MA4.5Z
n=10
30 operations/min.
125 VAC 0.2A
(resistive load)
0
500
200
100
50
20
10
5
2
Operation (x104)
■ DIMENSIONS
Make
Break
Electrical Life Test
4.0
Operating Voltage
3.0
2.0
Release Voltage
1.0
FBR-B2MA4.5Z
n=10
30 operations/min.
30 VDC 1A (resistive load)
0
500
200
100
50
20
10
5
2
Make
Break
Operation
5
Initial
10
Initial
Operation (x104)
(x104)
FO
R
● Schematics
(BOTTOM VIEW)
● PC board mounting
hole layout
(BOTTOM VIEW)
N
EW
Orientation mark
● Dimensions
Nominal Voltage
Multiplying Factor (%)
4.0
Electrical Life Test
Contact
Resistance (m‰)
Nominal Voltage
Multiplying Factor (%)
Mechanical Life Test
Contact
Resistance (m‰)
Contact
Nominal Voltage
Resistance (m‰) Multiplying Factor (%)
■ REFERENCE DATA
● Schematics
(TOP VIEW)
Surface mount type
D
ES
● PC board mounting
hole layout
(TOP VIEW)
IG
N
Orientation mark
5
FTR-B2 Series
■ RECOMMENDED CONDITION (Temperature Profile)
soldering
T3
T 3 = 245°C max.
T 2 = 200°C max.
cooling T 1 = 165°C max.
T2
preheating
N
O
0
T
T3
cooling
T2
T 3 = 200°C maximum
T 2 = 165°C maximum
T 1 = 100°C maximum
preheating
T1
30 sec
Max.
120 sec maximum
Note:
215°C maximum soldering
0
60 sec Max.
60 sec Max.
90 sec Max.
1.Temperature profiles show the temperature of PC board surface.
2.Please perform soldering test with your actual PC board before
mass production, since the temperatures of PC board surfaces
vary according to the size of PC board, status of parts mounting
and heating method.
FO
R
■ PACKAGING
Tape dimensions
ø 1.55
ø 2.2
2
4
EW
0.4
32
28.4
14.2
16
N
17.9
T1
Temperature (°C)
VPS (Vapor Phase Soldering)
1.75
Temperature (°C)
IRS (Infrared Reflow Soldering)
ES
10.7
11.7
D
IG
Tape feeding
N
ø 380
Reel Dimensions
Top cover tape
Embossed carrying tape
Perforation
Parts box
ø 13
Dimensions: mm
General tolerance: ±0.2
Quantity of one reel: 250 pieces
6
FTR-B2 Series
RoHS Compliance and Lead Free Relay Information
1. General Information
Relays produced after the specific date code that is indicated on each data sheet are lead-free
now. Most of our signal and power relays are lead-free. Please refer to Lead-Free Status Info.
(http://www.fcai.fujitsu.com/pdf/LeadFreeLetter.pdf)
●
Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu. From February 2005 forward
Sn-3.0Cu-Ni will be used for FTRB3 and FTR-B4 series relays.
●
Most signal and some power relays also comply with RoHS. Please refer to individual data
sheets. Relays that are RoHS compliant do not contain the 6 hazardous materials that
are restricted by RoHS directive (lead, mercury, cadmium, chromium IV, PBB, PBDE).
●
It has been verified that using lead-free relays in leaded assembly process will not cause any
problems (compatible).
●
“LF” is marked on each outer and inner carton. (No marking on individual relays).
●
To avoid leaded relays (for lead-free sample, etc.) please consult with area sales office.
We will ship leaded relays as long as the leaded relay inventory exists.
●
N
O
T
FO
2. Recommended Lead Free Solder Profile
●
Recommended solder paste Sn-3.0Ag-0.5Cu and Sn-3.0 Cu-Ni (only FTR-B3 and FTR-B4 from February 2005)
Reflow Solder condtion
R
Flow Solder condtion:
N
Pre-heating:
Soldering:
Peak Temp.: max. 250˚C
Soldering
EW
temperature (˚C)
250
220
130
90~120 sec.
max. 120 sec.
Solder by Soldering Iron:
Cooling
Pre-heating
170
20~30 sec.
maximum 120˚C
dip within 5 sec. at
260˚C soler bath
D
Soldering Iron
Temperature: maximum 360˚C
Duration:
maximum 3 sec.
ES
(duration)
IG
N
We highly recommend that you confirm your actual solder conditions
3. Moisture Sensitivity
●
Moisture Sensitivity Level standard is not applicable to electromechanical realys.
4. Tin Whisker
●
SnAgCu solder is known as low riskof tin whisker. No considerable length whisker was found by our in-house
test.
5. Solid State Relays
Each lead terminal will be changed from solder plating to Sn plating and Nickel plating. A layer of Nickel plating
is between the terminal and the Sn plating to avoid whisker.
●
7
FTR-B2 Series
Fujitsu Components
International
Headquarter
Offices
N
O
T
Japan
Fujitsu Component Limited
Gotanda-Chuo Building
3-5, Higashigotanda 2-chome, Shinagawa-ku
Tokyo 141, Japan
Tel: (81-3) 5449-7010
Fax: (81-3) 5449-2626
Email: [email protected]
Web: www.fcl.fujitsu.com
Europe
Fujitsu Components Europe B.V.
Diamantlaan 25
2132 WV Hoofddorp
Netherlands
Tel: (31-23) 5560910
Fax: (31-23) 5560950
Email: [email protected]
Web: www.fceu.fujitsu.com
North and South America
Fujitsu Components America, Inc.
250 E. Caribbean Drive
Sunnyvale, CA 94089 U.S.A.
Tel: (1-408) 745-4900
Fax: (1-408) 745-4970
Email: [email protected]
Web: www.fcai.fujitsu.com
Asia Pacific
Fujitsu Components Asia Ltd.
102E Pasir Panjang Road
#04-01 Citilink Warehouse Complex
Singapore 118529
Tel: (65) 6375-8560
Fax: (65) 6273-3021
Email: [email protected]
www.fcal.fujitsu.com
© 2005 Fujitsu Components America, Inc. All company and product names are trademarks or registered trademarks
of their respective owners. Rev. 06/07/2005.
FO
R
N
EW
D
ES
IG
N
8
Similar pages