Radiation Hardened Quad Differential Line Receiver HS-26C32RH, HS-26C32EH Features The Intersil HS-26C32RH, HS-26C32EH are differential line receivers designed for digital data transmission over balanced lines and meets the requirements of EIA Standard RS-422. Radiation hardened CMOS processing assures low power consumption, high speed, and reliable operation in the most severe radiation environments. • Electrically screened to SMD #5962-95689 The HS-26C32RH, HS-26C32EH have an input sensitivity typically of 200mV over the common mode input voltage range of ±7V. The receivers are also equipped with input fail safe circuitry, which causes the outputs to go to a logic “1” when the inputs are open. Enable and Disable functions are common to all four receivers. • EIA RS-422 compatible inputs Specifications for Rad Hard QML devices are controlled by the Defense Logistics Agency Land and Maritime (DLA). The SMD numbers listed in the “Ordering Information” table must be used when ordering. Detailed Electrical Specifications for these devices are contained in SMD 5962-95689. A “hot-link” is provided on our homepage for downloading • QML qualified per MIL-PRF-38535 requirements • 1.2 micron radiation hardened CMOS - Total dose . . . . . . . . . . . . . . . . . . . . . . . . 300 krad(Si) (max) • Latch-up free • CMOS compatible outputs • Input fail safe circuitry • High impedance inputs when disabled or powered down • Low power dissipation 138mW standby (max) • Single 5V supply • Full -55°C to +125°C military temperature range Applications • Line receiver for MIL-STD-1553 serial data bus Ordering Information ORDERING NUMBER (Note 1) INTERNAL MKT. NUMBER PART MARKING TEMP. RANGE (°C) PACKAGE (Pb-free) PKG. DWG. # 5962F9568901QEC HS1-26C32RH-8 Q 5962F95 68901QEC -55 to +125 16 Ld SBDIP D16.3 5962F9568901QXC HS9-26C32RH-8 Q 5962F95 68901QXC -55 to +125 16 Ld FLATPACK K16.A 5962F9568901V9A HS0-26C32RH-Q -55 to +125 Die HS0-26C32RH/SAMPLE HS0-26C32RH/SAMPLE -55 to +125 Die 5962F9568901VEC HS1-26C32RH-Q Q 5962F95 68901VEC -55 to +125 16 Ld SBDIP D16.3 5962F9568901VXC HS9-26C32RH-Q Q 5962F95 68901VXC -55 to +125 16 Ld FLATPACK K16.A HS1-26C32RH/PROTO HS1-26C32RH/PROTO HS1- 26C32RH /PROTO -55 to +125 16 Ld SBDIP D16.3 HS9-26C32RH/PROTO HS9-26C32RH/PROTO HS9- 26C32RH /PROTO -55 to +125 16 Ld FLATPACK K16.A 5962F9568903VEC HS1-26C32EH-Q Q 5962F95 68903VEC -55 to +125 16 Ld SBDIP D16.3 5962F9568903VXC HS9-26C32EH-Q Q 5962F95 68903VXC -55 to +125 16 Ld FLATPACK K16.A 5962F9568903V9A HS0-26C32EH-Q Q 5962F95 68903V9A -55 to +125 Die 5962F9568901VYC HS9G-26C32RH-Q (Note 2) Q 5962F95 68901VYC -55 to +125 16 Ld FLATPACK K16.A HS9G-26C32RH/PROTO HS9G-26C32RH/PROTO (Note 2) HS9G-26C32RH/PROTO -55 to +125 16 Ld FLATPACK K16.A NOTES: 1. These Intersil Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. 2. The lid of these packages are connected to the ground pin of the device. May 28, 2013 FN3402.5 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2012, 2013. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners. HS-26C32RH, HS-26C32EH Logic Diagram ENABLE ENABLE DIN DIN + - CIN CIN BIN BIN AIN AIN + + + DOUT - COUT - BOUT - AOUT Pin Configurations HS9-26C32RH, HS9-26C32EH (16 LD FLATPACK) MIL-STD-1835: CDFP4-F16 TOP VIEW HS1-26C32RH, HS1-26C32EH (16 LD SBDIP) MIL-STD-1835: CDIP2-T16 TOP VIEW AIN 1 AIN 2 16 VDD AIN 1 16 VDD 15 BIN AIN 2 15 BIN AOUT 3 14 BIN ENABLE 4 13 BOUT COUT 5 12 ENABLE CIN 6 11 DOUT CIN 7 10 DIN GND 8 9 DIN 14 BIN AOUT 3 13 BOUT ENABLE 4 COUT 5 12 ENABLE CIN 6 11 DOUT CIN 7 10 DIN GND 8 9 DIN Propagation Delay Timing Diagram Three-State Low Timing Diagram VIH VS -VIN +2.5V INPUT VSS 0V +VIN = 0V tPZL -2.5V VS = 50% tPLZ VOZ tPHL tPLH VOH INPUT VT OUTPUT VW VOL OUTPUT VOL 2 FN3402.5 May 28, 2013 HS-26C32RH, HS-26C32EH Propagation Delay Load Circuit Three-State Low Load Circuit VDD TEST POINT DUT CL RL TEST POINT DUT RL CL CL = 50pF CL = 50pF RL = 1000Ω RL = 1000Ω TABLE 2. THREE-STATE HIGH VOLTAGE LEVELS Three-State High Timing Diagrams VIH VS INPUT VSS tPZH HS-26C32RH HS-26C32EH UNITS VDD 4.50 V VIH 4.50 V VS 2.25 V VT 50 % VW VOH - 0.5 V 0 V PARAMETER GND tPHZ VOH VT OUTPUT VW VOZ Three-State High Load Circuit TEST POINT DUT TABLE 1. THREE-STATE LOW VOLTAGE LEVELS CL HS-26C32RH HS-26C32EH UNITS VDD 4.50 V CL = 50pF VIH 4.50 V RL = 1000Ω VS 2.25 V VT 50 % VW VOL + 0.5 V 0 V PARAMETER GND RL For additional products, see www.intersil.com/en/products.html Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 3 FN3402.5 May 28, 2013 HS-26C32RH, HS-26C32EH Die Characteristics Top Metallization: M1: Mo/Tiw Thickness: 5800Å M2: Al/Si/Cu Thickness: 5800Å DIE DIMENSIONS: 78 mils x 123 mils (1970µm x 3120µm) INTERFACE MATERIALS: Worst Case Current Density: <2.0 x 105A/cm2 Glassivation: Bond Pad Size: Type: SiO2 Thickness: 10kÅ ± 1kÅ 110µm x 100µm Metallization Mask Layout HS-26C32RH, HS-26C32EH AIN (1) VDD (16) BIN (15) (14) BIN AIN (2) (13) BOUT AOUT (3) ENAB (4) (12) ENAB COUT (5) (11) DOUT (10) DIN CIN (6) (7) CIN 4 (8) GND (9) DIN FN3402.5 May 28, 2013