ON MC74ACT20DR2G Dual 4−input nand gate Datasheet

MC74AC20, MC74ACT20
Dual 4−Input NAND Gate
Features
• Outputs Source/Sink 24 mA
• ′ACT20 Has TTL Compatible Inputs
• Pb−Free Packages are Available
VCC
A1
B1
NC
C1
D1
O1
14
13
12
11
10
9
8
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PDIP−14
N SUFFIX
CASE 646
14
1
SOIC−14
D SUFFIX
CASE 751A
14
1
2
3
4
5
6
7
A0
B0
NC
C0
D0
O0
GND
1
Figure 1. Pinout: 14-Lead Packages
(Top View)
14
1
SOEIAJ−14
M SUFFIX
CASE 965
PIN ASSIGNMENT
PIN
FUNCTION
An, Bn, Cn,
Dn
Inputs
On
Outputs
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
DC Supply Voltage (Referenced to GND)
VCC
−0.5 to
+7.0
V
DC Input Voltage (Referenced to GND)
Vin
−0.5 to
VCC + 0.5
V
DC Output Voltage (Referenced to GND)
Vout
−0.5 to
VCC + 0.5
V
DC Input Current, per Pin
Iin
± 20
mA
DC Output Sink/Source Current, per Pin
Iout
± 50
mA
DC VCC or GND Current per Output Pin
ICC
± 50
mA
Storage Temperature
Tstg
−65 to
+150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
© Semiconductor Components Industries, LLC, 2006
October, 2006 − Rev. 8
1
Publication Order Number:
MC74AC20/D
MC74AC20, MC74ACT20
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC
Supply Voltage
VREG
DC Regulated Power Voltage (Ref. to GND)
tr, tf
Input Rise and Fall Time (Note 1)
′AC Devices except Schmitt Inputs
Min
Typ
Min
Unit
′AC
2.0
5.0
6.0
′ACT
4.5
5.0
5.5
0
−
VCC
VCC @ 3.0 V
−
150
−
VCC @ 4.5 V
−
40
−
VCC @ 5.5 V
−
25
−
VCC @ 4.5 V
−
10
−
VCC @ 5.5 V
−
8.0
−
−
−
140
°C
−40
25
85
°C
V
V
ns/V
tr, tf
Input Rise and Fall Time (Note 2)
′ACT Devices except Schmitt Inputs
TJ
Junction Temperature (PDIP)
TA
Operating Ambient Temperature Range
IOH
Output Current − HIGH
−
−
−24
mA
IOL
Output Current − LOW
−
−
24
mA
ns/V
1. Vin from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.
2. Vin from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
DC CHARACTERISTICS
Symbol
Parameter
VCC
(V)
74AC
74AC
TA = +25°C
TA =
−40°C to
+85°C
Typ
Unit
Conditions
Guaranteed Limits
VIH
Minimum High Level
Input Voltage
3.0
4.5
5.5
1.5
2.25
2.75
2.1
3.15
3.85
2.1
3.15
3.85
V
VOUT = 0.1 V
or VCC − 0.1 V
VIL
Maximum Low Level
Input Voltage
3.0
4.5
5.5
1.5
2.25
2.75
0.9
1.35
1.65
0.9
1.35
1.65
V
VOUT = 0.1 V
or VCC − 0.1 V
VOH
Minimum Low Level
Output Voltage
3.0
4.5
5.5
2.99
4.49
5.49
2.9
4.4
5.4
2.9
4.4
5.4
V
3.0
4.5
5.5
−
−
−
2.56
3.86
4.86
2.46
3.76
4.76
3.0
4.5
5.5
0.002
0.001
0.001
0.1
0.1
0.1
0.1
0.1
0.1
3.0
4.5
5.5
−
−
−
0.36
0.36
0.36
0.44
0.44
0.44
5.5
−
±0.1
±1.0
mA
5.5
−
−
75
mA
VOLD = 1.65 V Max
5.5
−
−
−75
mA
VOHD = 3.85 V Min
5.5
−
4.0
40
mA
VOL
Maximum Low Level
Output Voltage
IIN
Maximum Input
Leakage Current
IOLD
†Minimum Dynamic
Output Current
IOHD
ICC
Maximum Quiescent
Supply Current
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V.
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2
V
V
V
IOUT = − 50 mA
*VIN = VIL or VIH
− 12 mA
IOH
− 24 mA
− 24 mA
IOUT = 50 mA
*VIN = VIL or VIH
12 mA
IOL
24 mA
24 mA
VI = VCC, GND
VIN = VCC or GND
MC74AC20, MC74ACT20
AC CHARACTERISTICS
Symbol
VCC*
(V)
Parameter
74AC
74AC
TA = +25°C
CL = 50 pF
TA = −40°C
to +85°C
CL = 50 pF
Unit
Min
Typ
Max
Min
Max
tPLH
Propagation Delay
3.3
5.0
2.0
1.5
6.0
5.0
8.5
7.0
1.5
1.0
10.0
8.0
ns
tPHL
Propagation Delay
3.3
5.0
1.5
1.5
5.0
4.0
7.0
6.0
1.0
1.0
9.0
7.0
ns
*Voltage Range 3.3 V is 3.3 V ±0.3 V.
Voltage Range 5.0 V is 5.0 V ±0.5 V.
DC CHARACTERISTICS
Symbol
Parameter
VCC
(V)
74ACT
74ACT
TA = +25°C
TA =
−40°C to
+85°C
Typ
Guaranteed Limits
Unit
Conditions
VIH
Minimum High Level
Input Voltage
4.5
5.5
1.5
1.5
2.0
2.0
2.0
2.0
V
VOUT = 0.1 V
or VCC − 0.1 V
VIL
Maximum Low Level
Input Voltage
4.5
5.5
1.5
1.5
0.8
0.8
0.8
0.8
V
VOUT = 0.1 V
or VCC − 0.1 V
VOH
Minimum High Level
Output Voltage
4.5
5.5
4.49
5.49
4.4
5.4
4.4
5.4
V
4.5
5.5
−
−
3.86
4.86
3.76
4.76
4.5
5.5
0.001
0.001
0.1
0.1
0.1
0.1
4.5
5.5
−
−
0.36
0.36
0.44
0.44
V
VOL
Maximum Low Level
Output Voltage
V
V
IOUT = − 50 mA
*VIN = VIL or VIH
− 24 mA
IOH
− 24 mA
IOUT = 50 mA
*VIN = VIL or VIH
24 mA
IOH
24 mA
IIN
Maximum Input
Leakage Current
5.5
−
±0.1
±1.0
mA
DICCT
Additional Max. ICC/Input
5.5
0.6
−
1.5
mA
VI = VCC − 2.1 V
IOLD
†Minimum Dynamic
Output Current
5.5
−
−
75
mA
VOLD = 1.65 V Max
5.5
−
−
−75
mA
VOHD = 3.85 V Min
5.5
−
4.0
40
mA
IOHD
ICC
Maximum Quiescent
Supply Current
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
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3
VI = VCC, GND
VIN = VCC or GND
MC74AC20, MC74ACT20
AC CHARACTERISTICS
Symbol
VCC*
(V)
Parameter
tPLH
Propagation Delay
tPHL
Propagation Delay
74ACT
74ACT
TA = +25°C
CL = 50 pF
TA = −40°C
to +85°C
CL = 50 pF
Unit
Min
Typ
Max
Min
Max
5.0
2.0
6.5
9.0
1.5
10.5
ns
5.0
2.0
5.5
9.0
1.5
10.5
ns
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
CAPACITANCE
Symbol
Parameter
Value
Typ
Unit
Test Conditions
CIN
Input Capacitance
4.5
pF
VCC = 5.0 V
CPD
Power Dissipation Capacitance
40
pF
VCC = 5.0 V
ORDERING INFORMATION
Device
Package
MC74AC20N
PDIP−14
MC74AC20NG
PDIP−14
(Pb−Free)
MC74ACT20N
PDIP−14
MC74ACT20NG
PDIP−14
(Pb−Free)
MC74AC20D
SOIC−14
MC74AC20DG
SOIC−14
(Pb−Free)
MC74AC20DR2
SOIC−14
MC74AC20DR2G
SOIC−14
(Pb−Free)
MC74ACT20D
SOIC−14
MC74ACT20DG
SOIC−14
(Pb−Free)
MC74ACT20DR2
SOIC−14
MC74ACT20DR2G
SOIC−14
(Pb−Free)
MC74AC20M
SOEIAJ−14
MC74AC20MG
SOEIAJ−14
(Pb−Free)
MC74AC20MEL
SOEIAJ−14
MC74AC20MELG
SOEIAJ−14
(Pb−Free)
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4
Shipping†
25 Units/Rail
55 Units/Rail
2500/Tape & Reel
55 Units/Rail
2500/Tape & Reel
50 Units/Rail
2000/Tape & Reel
MC74AC20, MC74ACT20
MARKING DIAGRAMS
PDIP−14
SOIC−14
14
14
MC74AC20N
AWLYYWWG
1
14
74AC20
ALYW
AC20G
AWLYWW
1
1
14
14
MC74ACT20N
AWLYYWWG
1
SOEIAJ−14
14
ACT20G
AWLYWW
1
74ACT20
ALYW
1
A
WL, L
YY, Y
WW, W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
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5
MC74AC20, MC74ACT20
PACKAGE DIMENSIONS
PDIP−14
CASE 646−06
ISSUE P
14
8
1
7
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
B
A
F
L
N
C
−T−
SEATING
PLANE
H
G
D 14 PL
J
K
0.13 (0.005)
M
M
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6
DIM
A
B
C
D
F
G
H
J
K
L
M
N
INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.290
0.310
−−−
10 _
0.015
0.039
MILLIMETERS
MIN
MAX
18.16
19.56
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.37
7.87
−−−
10 _
0.38
1.01
MC74AC20, MC74ACT20
PACKAGE DIMENSIONS
SOIC−14
CASE 751A−03
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
−A−
14
8
−B−
P 7 PL
0.25 (0.010)
M
7
1
G
−T−
D 14 PL
0.25 (0.010)
T B
S
A
DIM
A
B
C
D
F
G
J
K
M
P
R
J
M
K
M
F
R X 45 _
C
SEATING
PLANE
B
M
S
SOLDERING FOOTPRINT*
7X
7.04
14X
1.52
1
14X
0.58
1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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7
MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337 0.344
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
0_
7_
0.228 0.244
0.010 0.019
MC74AC20, MC74ACT20
PACKAGE DIMENSIONS
SOEIAJ−14
CASE 965−01
ISSUE A
14
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
LE
8
Q1
E HE
M_
L
7
1
DETAIL P
Z
D
VIEW P
A
e
A1
b
0.13 (0.005)
c
M
0.10 (0.004)
DIM
A
A1
b
c
D
E
e
HE
0.50
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
−−−
2.05
0.05
0.20
0.35
0.50
0.10
0.20
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
−−−
1.42
INCHES
MIN
MAX
−−− 0.081
0.002
0.008
0.014
0.020
0.004
0.008
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
−−− 0.056
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