LCD and Camera EMI Filter Array with ESD Protection CM1452 Features Product Description • The CM1452 family of pi-style EMI filter arrays with ESD protection, integrates four, six and eight filters (C-L-C) in CSP form factor with 0.40mm pitch. Each EMI filter channel of the CM1452 is implemented as a 3-pole L-C filter where the component values are 20pF-17nH-20pF. The CM1452 roll-off frequency at 6dB attenuation is 330MHz and can be used in applications where the data rates are as high as 132Mbps and provide greater than 30dB over the 800MHz to 2.7GHz frequency range. The ESD diodes on every I/O pin provide a very high level of ESD protection for sensitive electronic components. The ESD protection diodes connected to the filter ports are designed and characterized to safely dissipate ESD strikes of ±15kV, beyond the maximum requirement of the IEC61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. • • • • • • Four, six and eight channels of EMI filtering with integrated ESD protection ±15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) ±30kV ESD protection on each channel (HBM) Greater than 30dB attenuation (typical) at 1 GHz Chip Scale Package (CSP) with 0.40mm pitch and 0.25mm CSP solder ball which features extremely low parasitic inductance for optimum filter and ESD performance OptiGuardTM Coating for improved reliability at assembly RoHS-compliant, lead-free finishing Applications • • • • • • LCD and Camera data lines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. Wireless handsets Handheld PCs/PDAs LCD and camera modules The CM1452 incorporates OptiGuardTM which results in improved reliability at assembly. The CM1452 is manufactured with a 0.40mm pitch and 0.25mm CSP solder ball to provide up to 28% board space savings vs. competing CSP devices with 0.50mm pitch and 0.30mm CSP solder ball. Electrical Schematic A1 - An m . . C1 B1 - Bn . . L . . C1 - Cn C1 . . CM1452 schematic diagram of 3-pole L-C filter array with ESD. ©2010 SCILLC. All rights reserved. April 2010 Rev. 2 Publication Order Number: CM1452/D CM1452 Rev. 2 | Page 2 of 16 | www.onsemi.com CM1452 Pin Descriptions PIN DESCRIPTIONS PIN NUMBER -04 -06 -08 A1 A1 A1 A2 A2 A3 A4 PIN DESCRIPTION PIN NUMBER PIN DESCRIPTION -04 -06 -08 Filter #1 C1 C1 C1 Filter #1 A2 Filter #2 C2 C2 C2 Filter #2 A3 A3 Filter #3 C3 C3 C3 Filter #3 A4 A4 Filter #4 C4 C4 C4 Filter #4 A5 A5 Filter #5 C5 C5 Filter #5 A6 A6 Filter #6 C6 C6 Filter #6 A7 Filter #7 C7 Filter #7 A8 Filter #8 C8 Filter #8 B1 B1 B1 GND B2 B2 B2 GND B3 B3 GND B4 GND Ordering Information PART NUMBERING INFORMATION Lead-free Finish # of Channels Leads Package Ordering Part Number1 Part Marking 4 10 CSP CM1452-04CP 52 6 15 CSP CM1452-06CP L526 8 20 CSP CM1452-08CP L528 Note 1: Parts are shipped in Tape and Reel form unless otherwise specified. Rev. 2 | Page 3 of 16 | www.onsemi.com CM1452 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS Operating Temperature Range –40 to +85 °C Storage Temperature Range –65 to +150 °C STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range Rev. 2 | Page 4 of 16 | www.onsemi.com RATING UNITS –40 to +85 °C CM1452 ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1) SYMBOL PARAMETER CONDITIONS LCHAN Channel Inductance CTOT Total Channel Capacitance at 2.5Vdc; 1MHz, 30mVac 2.5V dc; 1MHz, 30mV ac C1 Capacitance C1 at 2.5V dc; 1MHz, 30mV ac 2.5V dc; 1MHz, 30mV ac fC fR MAX 24 30 UNITS nH 36 pF 15 pF Cut-off Frequency, ZSOURCE = 50Ω, ZLOAD = 50Ω 148 MHz Roll-off Frequency at -6dB Attenuation, ZSOURCE = 50Ω, ZLOAD = 50Ω 330 MHz Stand-off Voltage, I = 10mA ILEAK Diode Leakage at 3.3V reverse bias voltage VSIG Signal Clamp Voltage: Positive Clamp Negative Clamp RDYN TYP 17 VST VESD MIN 5.5 ILOAD = 10mA ILOAD = -10mA In-system ESD withstand voltage*: a) Human Body Model, MIL-STD883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 5.6 -1.5 V 0.1 1.0 µA 6.8 -0.8 9.0 -0.4 V V Notes 2 and 3 Dynamic Resistance Channel Positive Transients Channel Negative Transients ±30 kV ±15 kV 2.3 0.9 Ω Ω AL Current per Inductor: 30 mA DC DC Package Power Rating: 30 W Note 1: All parameters specified at TA = –40°C to +85°C unless otherwise noted. Note 2: ESD applied to input/output pins with respect to GND, one at a time. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin (i.e. if ESD is applied to pin A1 then clamping voltage is measured at pin C1). Note 3: Unused pins are left open. Rev. 2 | Page 5 of 16 | www.onsemi.com CM1452 Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50Ω environment) Figure 1. Insertional Loss vs. Frequency (Filter 1: CM1452-04, -06, -08) Figure 2. Insertional Loss vs. Frequency (Filter 2: CM1452-04, -06, -08) Rev. 2 | Page 6 of 16 | www.onsemi.com CM1452 Performance Information (Con’td) Typical Filter Performance (nominal conditions unless specified otherwise, 50Ω environment) Figure 3. Insertional Loss vs. Frequency (Filter 3: CM1452-04, -06, -08) Figure 4. Insertional Loss vs. Frequency (Filter 4: CM1452-04, -06, -08) Rev. 2 | Page 7 of 16 | www.onsemi.com CM1452 Performance Information (Con’td) Typical Filter Performance (nominal conditions unless specified otherwise, 50Ω environment) Figure 5. Insertional Loss vs. Frequency (Filter 5: CM1452-06, -08) Figure 6. Insertional Loss vs. Frequency (Filter 6: CM1452-06, -08) Rev. 2 | Page 8 of 16 | www.onsemi.com CM1452 Performance Information (Con’td) Typical Filter Performance (nominal conditions unless specified otherwise, 50Ω environment) Figure 7. Insertional Loss vs. Frequency (Filter 7: CM1452-08) Figure 8. Insertional Loss vs. Frequency (Filter 8: CM1452-08) Rev. 2 | Page 9 of 16 | www.onsemi.com CM1452 Performance Information (Con’td) Figure 9. CM1452 Typical Diode Capacitance vs. Input Voltage (Normalized to 2.5Vdc) Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. See http://www.wlcspforum.org/documents/pdf/ap-217.pdf for download. Rev. 2 | Page 10 of 16 | www.onsemi.com CM1452 Mechanical Specifications CM1452-04CP devices are packaged in custom Chip Scale Packages (CSP). PACKAGE DIMENSIONS Package Custom CSP Bumps 10 Millimeters Inches Dim Min Nom Max Min Nom Max A1 1.627 1.672 1.717 0.0641 0.0658 0.0676 A2 1.068 1.113 1.158 0.0420 0.0438 0.0456 B1 0.395 0.400 0.405 0.0156 0.0157 0.0159 B2 0.195 0.200 0.205 0.0077 0.0079 0.0081 B3 0.342 0.347 0.352 0.0135 0.0137 0.0139 B4 0.342 0.347 0.352 0.0135 0.0137 0.0139 C1 0.186 0.236 0.286 0.0073 0.0093 0.0113 C2 0.160 0.210 0.260 0.0063 0.0082 0.0102 D1 0.545 0.615 0.685 0.0215 0.0242 0.0270 D2 0.378 0.419 0.460 0.0149 0.0165 0.0181 # per tape and reel Package Dimensions for CM1452-04CP Chip Scale Package 3500 pieces Controlling dimension: millimeters Rev. 2 | Page 11 of 16 | www.onsemi.com CM1452 CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1452-04CP 1.67 X 1.11 X 0.615 1.73 X 1.23 X 0.83 8mm 178mm (7") 3500 4mm 4mm + + + Rev. 2 | Page 12 of 16 | www.onsemi.com CM1452 Mechanical Specifications CM1452-06CP devices are packaged in custom Chip Scale Packages (CSP). PACKAGE DIMENSIONS Package Custom CSP Bumps 15 Millimeters Inches Dim Min Nom Max Min Nom Max A1 2.427 2.472 2.517 0.0956 0.0973 0.0991 A2 1.068 1.113 1.158 0.0420 0.0438 0.0456 B1 0.395 0.400 0.405 0.0156 0.0157 0.0159 B2 0.195 0.200 0.205 0.0077 0.0079 0.0081 B3 0.342 0.347 0.352 0.0135 0.0137 0.0139 B4 0.342 0.347 0.352 0.0135 0.0137 0.0139 C1 0.186 0.236 0.286 0.0073 0.0093 0.0113 C2 0.160 0.210 0.260 0.0063 0.0082 0.0102 D1 0.545 0.615 0.685 0.0215 0.0242 0.0270 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel Package Dimensions for CM1452-06CP Chip Scale Package 3500 pieces Controlling dimension: millimeters Rev. 2 | Page 13 of 16 | www.onsemi.com CM1452 CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1452-06 2.47 X 1.11X 0.615 2.59 X 1.27 X 0.73 8mm 178mm (7") 3500 4mm 4mm + + + Rev. 2 | Page 14 of 16 | www.onsemi.com CM1452 Mechanical Specifications CM1452-08CP devices are packaged in custom Chip Scale Packages (CSP). PACKAGE DIMENSIONS Package Custom CSP Bumps 20 Millimeters Inches Dim Min Nom Max Min Nom Max A1 3.227 3.272 3.317 0.1270 0.1288 0.1306 A2 1.068 1.113 1.158 0.0420 0.0438 0.0456 B1 0.395 0.400 0.405 0.0156 0.0157 0.0159 B2 0.195 0.200 0.205 0.0077 0.0079 0.0081 B3 0.342 0.347 0.352 0.0135 0.0137 0.0139 B4 0.342 0.347 0.352 0.0135 0.0137 0.0139 C1 0.186 0.236 0.286 0.0073 0.0093 0.0113 C2 0.160 0.210 0.260 0.0063 0.0082 0.0102 D1 0.545 0.615 0.685 0.0215 0.0242 0.0270 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel Package Dimensions for CM1452-08CP Chip Scale Package 3500 pieces Controlling dimension: millimeters Rev. 2 | Page 15 of 16 | www.onsemi.com CM1452 CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1452-08CP 3.27 X 1.11X 0.615 3.40 X 1.19 X 0.74 12mm 330mm (13") 3500 4mm 4mm + + + ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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