EM H4006501COB 13.56mhz 64 data bit read only contactless identification device Datasheet

H4006
EM MICROELECTRONIC-MARIN SA
13.56 MHz 64 Data bit Read Only
Contactless Identification Device
Features
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Operating frequency range 10 MHz to
15 MHz
RF interface optimized for 13.56 MHz
operation
Laser programmed memory array (64 data
bit + 16 CRC bit)
Modulator switch designed to preserve
supply voltage
Miller coding
Default data rate is 26484 Baud
Other data rates possible (mask
programmable)
On chip rectifier
On chip resonant capacitor
On chip supply buffer capacitor
Typical Operating Configuration
C1
H4006
L
C2
L: typical 1.4 µH for fo = 13.56 MHz
Figure 1
Applications
n Logistics automation
n Anticounterfeiting
n Access control
n Industrial transponder
VDD
TOUT
Pad Assignment
TESTn
The H4006 is a CMOS integrated circuit
intended for use in electronic Read Only
transponders.
The exited coil connected to the device
generates the power supply via a Graetz bridge
and an integrated decoupling capacitor. The
clock used for the logic is also extracted from the
coil. The logic is mainly composed by a miller
code generator and the LROM control. The
memory is factory programmed so that each IC is
unique.
VSS
Description
H4006
C1
C2
Figure 2
1
H4006
EM MICROELECTRONIC-MARIN SA
Absolute Maximum Ratings
Parameter
Maximum DC Current
forced on COIL1 and
COIL2
Power Supply
Storage Temperature
Operating Conditions
Symbol
I CMAX
Conditions
±30mA
VDD
-0.3V to 7.5V
Tst
-55 to +200°C
VESD
2000V
Electrostatic discharge
maximum to MIL-STD-883C
method 3015
Table 1
Stresses above these listed maximum ratings may
cause permanent damage to the device.
Exposure beyond specified operating conditions
may affect device reliability or cause
malfunction.
Parameter
Operating Temp.
Symbol Min.
Top
-40
Typ. Max.
+85
Maximum Coil
Current
I coil
-10
10
AC Voltage on
Coil
Vcoil
3
14*
Supply Frequency
f coil
10
13.56
Units
°C
mA
Vpp
15
MHz
Table 2
*) The AC Voltage on Coil is limited by the on
chip voltage limitation circuitry. This is
according to the parameter I coil .
Handling Procedures
This device has built-in protection against high
static voltages or electric fields; however due to
the unique properties of this device, anti-static
precautions should be taken as for any other
CMOS component.
System Principle
Transceiver
Oscillator
Transponder
Antenna
Driver
C1
H4006
Data
Decoder
Filter &
Gain
C2
Demodulator
Data received
from transponder
Signals on coils
Signal on
Transponder coil
Signal on
Transceiver coil
RF Carrier
Data
Figure 3
2
H4006
EM MICROELECTRONIC-MARIN SA
Electrical Characteristics
V DD = 2V, VSS = 0V, fC1 = 13.56MHz sine wave, VC1 = 1.0Vpp centered at (V DD - V SS)/2, Ta = 25°C
unless otherwise specified
Parameter
Symbol Test Conditions
Min.
Typ.
Max.
Supply Voltage
VDD
Supply current
I DD
60
Rectifier Voltage Drop
VREC
I C1C2 = 1mA, modulator switch on
VREC = (V C1-VC2) - (VDD - V SS)
Modulator ON DC
voltage drop 2)
VON1
VON2
I VDD VSS = 1mA
I VDD VSS = 10mA
Power on reset
3)
f=10kHz
V
150
µA
1.8
V
1.9
2.4
2.3
2.8
2.8
3.3
V
V
1.2
0.1
1.4
0.25
1.7
0.5
V
V
92.6
94.5
96.4
pF
VR
VR - V MIN
Vcoil=100mVRMS
Units
1)
1.9
Coil1 - Coil2 Capacitance
C RES
Series resistance of CRES
RS
3
Ω
Power Supply Capacitor
C sup
140
pF
1)
Maximum voltage is defined by forcing 10 mA on C1 - C2
Measured between VDD and VSS
3)
According to Figure 7
Table 3
2)
Block Diagram
Clock extractor
Divider Chain
Sequencer
Miller Code
Generator
VDD
C1
CRES
C2
AC1
+
AC2
Power
on
Reset
CSUP
HF Rectifier
-
Modulator
VSS
LASER
ROM
Power Management
Figure 4
3
EM MICROELECTRONIC-MARIN SA
H4006
General description
Functional description
The transponder will be activated when
illuminated by a RF field of sufficient power and
at any frequency that is compatible with its
associated antenna and its internal power supply
circuit input characteristics. The chip will Poweron-Reset itself when powered by this incoming
energy that exceeds its reset threshold. After
resetting itself the chip will start to transmit its
memory contents as a stream of Miller code. The
memory contents is transmitted by modifying the
antenna matching impedance at its internal
clock rate, thereby causing varying amounts of
RF energy to be reflected from the antenna. This
impedance variation will be achieved by
connecting a modulating device across the
antenna terminals. When switched on the
modulating device will present a low impedance
to the antenna. This will cause a change in the
matching of the antenna and therefore in the
amount of RF energy reflected by the transponder
to the reader. This reflected signal combines with
the transmitted signal in the receiver to yield an
amplitude modulated signal representative of the
IC memory contents. The “ON” impedance of the
modulating device needs to be comparable to
about 100 Ohms to affect the matching of the
antenna and therefore its reflectivity.
The RF signal received from the transponder
antenna will serve several purposes :
• power the chip
• provide a global reset to the chip through its
POR (Power-On-Reset) function
• provide a carrier for the data transmission
• provide the input of the internal clock
generation circuit (frequency division)
Output Sequence
Transmission from the transponder will be
accomplished through variation of the antenna
load impedance by switching the modulating
device ON and OFF.
Output sequence is composed of cycles which
are repeated. Each cycle is composed of 82 bits
Standard Message Structure (STDMS) which is
Miller coded and a pause (LW) during which the
modulating device is OFF (see figure 6 for details
of Miller code).
The pause (LW) is 9bits length.
The 82 bit STDMS consists of 1 start bit, 64 data
bits, 16 CRC bits and 1 stop bit.
Start bit (1)
Data(64)
CRC
(16)
Stop bit
(1)
LW(9)
Table 4
Memory organisation
As already mentioned above the 82 bits are
stored in laser programmed ROM (LROM). The 82
bits of this LROM is partioned as
followed (see table 5):
Wafer Number
Factory reserved
IC name
Customer ID
Extended lot number
IC position
Cyclic redundancy check
Start and stop bits
5 bits
4 bits
10 bits
13 bits
18 bits
14 bits
16 bits
2 bits
First bit sent is bit 0.
4
H4006
EM MICROELECTRONIC-MARIN SA
Memory Map
0
1
2
3
4
5
start
Wafer Number
6
7
8
9
Factory Reserved
10
11
12
13
20
21
22
23
33
34
35
51
52
65
66
14 15 16
IC Name
17
18
19
24
25 26 27
Customer ID
28
29
36
37
38
53
54
55
56
61
67
68
69
70 71 72 73 74 75
Cyclic redundancy check
39
31
32
40 41 42 43 44
Extended lot number
45
46
62
63
64
76
77
78
57 58 59
IC position
60
30
47
48
49
79
80
81
stop
50
Table 5
Wafer number
Each wafer has a number between 1 and 25. This
5 bit wafer number contains the wafer number
where the IC was.
Factory reserved bits
These 4 bits are reserved. Default value is 0hex.
IC name bits
They contains the 3 first characters device name.
For this device, the value is 006hex.
Customer ID bits
This field contains a code which is defined by
EM Microelectronic-Marin S.A. For standard
version, the code is 0001hex.
IC position
These 14 bits give the precise position on the
processed wafer.
Cyclic redundancy check
The shift register is reset to all zero with each
Stop Bit.
CRC code is calculated on 64 data bits. The CRC
code is calculated according to CCITT / ISO
3309 - 1984 standarts. See figure 5 for principle
block schematic and generating polynomial of
the CRC code.
Start and stop bits
Start bit is set to logic 1 and stop bit is set to logic
0.
Extended lot number
The code on the chips is unique and reflects the
production lot number system of EM
Microelectronic. This numbering allows full
traceability of each chip.
5
H4006
EM MICROELECTRONIC-MARIN SA
CRC Block Diagram
SERIAL QUOTIENT
X5
X12
X16
FEEDBACK
BEFORE
SHIFT
15 14 13 12 11
10
9
8
7
6
5
4
MSB
3
2
1
0
LSB
BCC REGISTER
x
= BCC(Block Check Characters) REGISTER STAGE
data input
= EXCLUSIVE - OR
CRC-CCITT GENERATING POLYNOMIAL = X16 + X12 + X5 + X0
Figure 5
6
H4006
EM MICROELECTRONIC-MARIN SA
RF Interface
Resonant capacitor, Rectifier, Limiter and
Modulator Switch form the unit which is
interfacing to the incoming RF signal. These
blocks are interdependent so they are developed
as unit. They interface to the antenna which
typical characteristics are:
Ls ≈ 1400 nH
Rs ≈ 3 Ohms
30 < Q < 40 at 13.56 MHz.
Modulator Switch
Due to the low impedance of the antenna and
resonant capacitor the Modulator Switch has to
present low RF impedance when switched ON
(about 100 ohms).
The minimum time period with the Modulator
Switch ON is 38 µs. At lower data rates this time
is even much longer. The current consumption of
divider chain running at 13 MHz is near 60 µA.
Putting together this two figures it is clear that it is
not possible to supply the IC during the time the
Modulator Switch is ON from the integrated
Supply Buffer Capacitor which value is
approximately 140 pF. The IC has to get power
from the RF field also during the time the
Modulator Switch is ON.
This problem is solved by putting the Modulator
Switch on the output of the Rectifier (between
VDD and VSS) and regulating its ON resistance in
function of supply voltage. When the supply
voltage is high the ON impedance is low. When
the supply voltage drops near the region where
the operation of the IC at 13.56 MHz is not
guaranteed the ON impedance is increased in
order to prevent further drop.
Resonant Capacitor
The capacitor value is adjusted by laser fusing. It
can be trimmed in factory by 1pF steps to
achieve the absolute value of 94.5pF typically.
This option, which is available on request, allows
a smaller capacitor tolerance over the whole
production.
Rectifier and Limiter
A full wave rectifier (Graetz Bridge) is used to
provide supply voltage to the IC. The reverse
breakdown of the diodes is also used to protect
the IC from overvoltages.
1
0
1
1
0
0
0
1
1
0
1
NRZ-L
STREAM
DM-M
CODED
Bit i-1 Bit i
x
1
0
0
1
0
no transition at the beginning of Bit i,
transition at the beginning of Bit i,
no transition at the beginning of Bit i,
transition in the middle of Bit i
no transition in the middle of Bit i
no transition in the middle of Bit i
Figure 6
7
EM MICROELECTRONIC-MARIN SA
Power Supply Management
For a correct operation, the device must be
initialised. When the transponder is put in the RF
field, the supply voltage increases until it achieves Vr
limit (see Figure 7). During this time and for an
additionnal 64 bit period, the modulator switch is on
and the device initialises its internal logic.
supply voltage
VDD
H4006
At this point, the data transmission starts and runs
while the supply voltage is higher than Vmin. If the
supply voltage decreases under this limit, the device
is again in an initialising state and the modulator is on.
chip operating voltage range : from Vmin to Vmax
Vmax (voltage clipping)
chip on board supply voltage
Vr (Read wake up)
Vmin
ε
time
modulator
ON/OFF ON
READ
64 bits
period
OFF
time
Figure 7
8
EM MICROELECTRONIC-MARIN SA
Miller Encoder
The input to Miller encoder is NRZ data coming
from LROM. The output is coded according to
Miller format and is driving the modulator Switch.
See figure 6 for example of Miller code.
Clock Generation
The clock of the logic is extracted from the RF
signal. The clock extracted from RF signal is
driving the divider chain consisting of toggle flipflops. The output of this divider chain is data
clock with which the data from Laser ROM
(LROM) is addressed, encoded and sent to
Modulator Switch.
The layout of divider chain is designed in a way
that different data rates can be chosen with metal
mask (options).
The following division factors are possible on
request:
H4006
128, 256, 1024, 2048, 4094 and 8192.
The standard is 512.
Others
As mentioned in Output Sequence, during the
pause (LW) the Modulator Switch is OFF. When
observing the pause duration one has to
remember that the time with Modulator Switch
OFF effectively observed can vary due to
different terminations of STDMS. The stop bit at
0 can be represented either by Modulator Switch
ON or OFF depending on the data. The start bit
at 1 adds 1/2 of data period OFF (transition in the
middle of bit period).
Figure below show the four possible terminations
of STDMS and its influence on entire period
passed by Modulator Switch OFF. Level LOW
represents Modulator Switch OFF. LDB stands for
last data bit.
LDB
1
1
0
0
Last data
bit
Stop bit
at 0
Pause 8 +1 bit periods
This transition is not due to Miller encoding.
Start bit
at 1
Figure 8
Pad Description
Name
C2
C1
VDD
Tout
TESTn
VSS
Description
connection to antenna
connection to antenna
positive supply
test output
test input with pull up
negative supply
Table 6
9
H4006
EM MICROELECTRONIC-MARIN SA
CID package
339
189
259
141
160
VSS
TESTn TOUT
FRONT VIEW
0.127±0.012
137
0.485±0.015
Pad position
VDD
TOP VIEW
4±0.2
H4006
317
150
MARKING
AREA
150
1041
8.5±0.3
C2
6±0.2
C1
1600
Dimensions in µm
R0.5±0.1
PCB package
4.0 mm
0.5±
0.12
1.0 mm max.
Coil2
Coil1
1.3±
0.05
1.3±
0.05
0.4±0.1
8.0 mm
EM
Dimensions in mm
Ordering Information
Coil2
Coil1
Dimensions in mm
The H4006 is available in :
- Chip form *
H4006 501 IC
- CIDpack
H4006 501 CID
- PCB package
H4006 501 COB
*Chip will be delivered in wafer form.
Thickness of the wafer: 180 µm ± 20 µm (7 mils)
EM Microelectronic-Marin SA cannot assume responsibility for use of any circuitry described other than circuitry entirely
embodied in an EM Microelectronic-Marin SA product. EM Microelectronic-Marin SA reserves the right to change the
specifications without notice at any time. You are strongly urged to ensure that the information given has not been
superseded by a more up to date version.
© 1997 EM Microelectronic-Marin SA, 01/98 Rev. A/194
10
EM MICROELECTRONIC-MARIN SA
CH-2074 Marin, Switzerland Tel. +41 32 755 51 11, Fax. +41 32 755 5403
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