PROTEC LC0408FC15C Low capacitance flip chip array Datasheet

05153
LC0408FC3.3C
thru
LC0408FC36C
LOW CAPACITANCE FLIP CHIP ARRAY
APPLICATIONS
✔ Cellular Phones
✔ Personal Digital Assistant (PDA)
✔ Notebook Computers
✔ SMART Cards
IEC COMPATIBILITY (EN61000-4)
✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔ 61000-4-4 (EFT): 40A - 5/50ns
0402 CHIP SHOWN
FEATURES
✔ ESD Protection > 25 kilovolts
✔ Available in Voltages Ranging From 3.3V to 36V
✔ 200 Watts Peak Pulse Power per Line (tp = 8/20µs)
✔ Low Clamping Voltage
✔ Bidirectional Configuration & Monolithic Structure
✔ Protects 4 to 7 Lines
✔ Low Capacitance
✔ Low Leakage Current
✔ RoHS Compliant
MECHANICAL CHARACTERISTICS
✔ Standard EIA Chip Size: 0408
✔ Weight 0.73 milligrams (Approximate)
✔ Available in Lead-Free Plating
✔ Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
✔ Consult Factory for Leaded Device Availability
✔ Flammability Rating UL 94V-0
✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔ Device Marking On Reel
✔ Top Contacts: Solder Bump 0.004” in Height (Nominal)
PIN CONFIGURATION
05153.R7 2/07
1
www.protekdevices.com
LC0408FC3.3C
thru
LC0408FC36C
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
PARAMETER
SYMBOL
VALUE
UNITS
PPP
200
Watts
TA
-55 to 150
°C
TSTG
-55 to 150
°C
Peak Pulse Power (tp = 8/20µs) - See Figure 1
Operating Temperature
Storage Temperature
ELECTRICAL CHARACTERISTICS PER LINE
PART
NUMBER
(See Note 1)
LC0408FC3.3C
LC0408FC05C
LC0408FC08C
LC0408FC12C
LC0408FC15C
LC0408FC24C
LC0408FC36C
@ 25°C Unless Otherwise Specified
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
MAXIMUM
LEAKAGE
CURRENT
(See Note 2)
TYPICAL
CAPACITANCE
VWM
VOLTS
@ 1mA
V(BR)
VOLTS
@ IP = 1A
VC
VOLTS
@8/20µs
VC @ IPP
@VWM
ID
µA
@0V, 1 MHz
C
pF
3.3
5.9
8.0
12.0
15.0
24.0
36.0
4.0
6.0
8.5
13.3
16.7
26.7
40.0
7.0
11.0
13.2
19.8
25.4
37.2
70.0
12.5V @ 16A
13V @ 15A
18V @ 11A
26.9V @ 7.4A
34.5V @ 5.8A
50.6V @ 4A
80.0V @ 2.5A
75*
10**
1
1
1
1
1
70
35
32
30
25
20
18
Note 1: All devices are bidirectional. Electrical characteristics apply in both directions.
Note 2: *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current <500nA @ 3.3V.
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
IPP - Peak Pulse Current - % of IPP
PPP - Peak Pulse Current - Watts
10,000
1,000
200W, 8/20µs Waveform
100
10
0.01
05153.R7 2/07
FIGURE 2
PULSE WAVE FORM
120
tf
100
TEST
WAVEFORM
PARAMETERS
tf = 8µs
td = 20µs
Peak Value IPP
80
e-t
60
40
td = t I /2
PP
20
0
1
10
100
td - Pulse Duration - µs
1,000
10,000
2
0
5
10
15
t - Time - µs
20
25
30
www.protekdevices.com
LC0408FC3.3C
thru
LC0408FC36C
GRAPHS
FIGURE 3
POWER DERATING CURVE
100
Peak Pulse Power
8/20µs
% Of Rated Power
80
60
40
20
Average Power
0
0
25
50
75
100
125
TA - Ambient Temperature - °C
150
FIGURE 4
OVERSHOOT & CLAMPING VOLTAGE FOR LC0408FC05C
5 Volts per Division
35
25
15
5
-5
ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
FIGURE 5
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR LC0408FC05C
VC - Clamping Voltage - Volts
14
12
10
8
6
4
2
0
0
5
10
15
20
IPP - Peak Pulse Current - Amps
05153.R7 2/07
3
www.protekdevices.com
LC0408FC3.3C
thru
LC0408FC36C
APPLICATION INFORMATION
PRINTED CIRCUIT BOARD RECOMMENDATIONS
VALUE
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
±50µm
±20µm
60 Seconds
270°C
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
REQUIREMENTS
Non-Solder Mask Defined Pad
0.275mm DIA.
Temperature:
TP for Lead-Free (SnAgCu): 260-270°C
TP for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
TP
Temperature - °C
Ramp-up
Ramp-down
TL
TSMAX
155°
TSMIN
140°
TS - Preheat
t 25°C to Peak
30-60 seconds
05153.R7 2/07
Ramp-up
15 seconds
4
Solder Time
15-20 seconds
Ramp-down
www.protekdevices.com
LC0408FC3.3C
thru
LC0408FC36C
0408 PACKAGE OUTLINE & DIMENSIONS
PACKAGE DIMENSIONS
A
B
C
SIDE
PACKAGE OUTLINE
MILLIMETERS
INCHES
A
0.56 NOM
0.022 NOM
B
0.86 NOM
0.034 NOM
C
0.99 ± 0.0254
0.039 ± 0.001
E
0.15 SQ
0.006 SQ
F
2.0 ± 0.0254
0.079 ± 0.001
G
0.15 NOM
0.006 NOM
H
0.127 MAX
0.005 MAX
G
TOP
DIM
I
E
0.003 MIN
0.406 NOM
0.016 NOM
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).
F
H
END
0.076 MIN
I
PAD DIMENSIONS
MOUNTING PAD LAYOUT - Option 1
D
A
C
MILLIMETERS
INCHES
A
C
D
E
F
G
H
I
0.51
0.30
0.46
0.20
0.15 SQ
0.71
0.99
0.51
0.020
0.012
0.018
0.008
0.006 SQ
0.028
0.039
0.020
E
DIE
SOLDER
BUMP
DIM
NOTE:
H
G
1. Preferred: Using 0.1mm (0.004”) stencil.
F
I
SOLDER PADS
SOLDER PRINT 0.010” - 0.012” DIA.
SOLDER
MASK
05153.R7 2/07
5
www.protekdevices.com
LC0408FC3.3C
thru
LC0408FC36C
0408 PACKAGE OUTLINE & DIMENSIONS
PACKAGE DIMENSIONS
MOUNTING PAD LAYOUT - Option 2
MILLIMETERS
DIM
COPPER CONTACT 0.009” [0.23] DIA.
A
DIE
SOLDER
BUMP
INCHES
A
0.51
0.020
F
0.15 SQ
0.006 SQ
G
0.71
0.028
H
0.99
0.039
I
0.51
0.020
H
G
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and outline:
.xxx ± 0.05mm (± 0.002”).
3. Preferred: Using 0.1mm (0.004”) stencil.
I
F
TAPE & REEL ORIENTATION
SOLDER PRINT 0.014” [0.36] DIA.
SOLDER
MASK
Quad Die - 0408
NOTE:
1. Top view of tape. Solder bumps are face down in tape
package.
TAPE & REEL ORDERING NOMENCLATURE
1.
2.
3.
4.
Surface mount product is taped and reeled in accordance with EIA 481.
8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. OrderingSuffix: -T75-1, i.e., LC0408FC05C-T75-1.
8mm Paper Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-2, i.e., LC0408FC05C-T75-2.
Suffix - LF = Lead-Free, i.e., LC0408FC05C-LF-T75-1.
Outline & Dimensions: Rev 4 - 2/04, 06021
COPYRIGHT © ProTek Devices 2007
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s
and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.
05153.R7 2/07
6
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: [email protected]
Web Site: www.protekdevices.com
www.protekdevices.com
Similar pages