TI CD74HCT137M96 High-speed cmos logic, 3- to 8-line decoder/demultiplexer with address latch Datasheet

[ /Title
(CD74
HC137
,
CD74
HCT13
7,
CD74
HC237
,
CD74
HCT23
7)
/Subject
(High
Speed
Data sheet acquired from Harris Semiconductor
SCHS146F
March 1998 - Revised October 2003
CD74HC137, CD74HCT137,
CD54HC237, CD74HC237,
CD74HCT237
High-Speed CMOS Logic, 3- to 8-Line
Decoder/Demultiplexer with Address Latches
Features
Both circuits have three binary select inputs (A0, A1 and A2)
that can be latched by an active High Latch Enable (LE)
signal to isolate the outputs from select-input changes. A
“Low” LE makes the output transparent to the input and the
circuit functions as a one-of-eight decoder. Two Output
Enable inputs (OE1 and OE0) are provided to simplify
cascading
and
to
facilitate
demultiplexing.
The
demultiplexing function is accomplished by using the A0, A1,
A2 inputs to select the desired output and using one of the
other Output Enable inputs as the data input while holding
the other Output Enable input in its active state. In the
CD74HC137 and CD74HCT137 the selected output is a
“Low”; in the ’HC237 and CD74HCT237 the selected output is
a “High”.
• Select One of Eight Data Outputs
- Active Low for CD74HC137 and CD74HCT137
- Active High for ’HC237 and CD74HCT237
• l/O Port or Memory Selector
• Two Enable Inputs to Simplify Cascading
• Typical Propagation Delay of 13ns at VCC = 5V,
15pF, TA = 25oC (CD74HC237)
• Fanout (Over Temperature Range)
- Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
Ordering Information
• Wide Operating Temperature Range . . . -55oC to 125oC
• Balanced Propagation Delay and Transition Times
TEMP. RANGE
(oC)
PACKAGE
CD54HC237F3A
-55 to 125
16 Ld CERDIP
CD74HC137E
-55 to 125
16 Ld PDIP
CD74HC137PW
-55 to 125
16 Ld TSSOP
CD74HC137PWR
-55 to 125
16 Ld TSSOP
CD74HC137PWT
-55 to 125
16 Ld TSSOP
CD74HC237E
-55 to 125
16 Ld PDIP
CD74HC237M
-55 to 125
16 Ld SOIC
CD74HC237MT
-55 to 125
16 Ld SOIC
Description
CD74HC237M96
-55 to 125
16 Ld SOIC
The
CD74HC137,
CD74HCT137,
’HC237,
and
CD74HCT237 are high speed silicon gate CMOS decoders
well suited to memory address decoding or data routing
applications. Both circuits feature low power consumption
usually associated with CMOS circuitry, yet have speeds
comparable to low power Schottky TTL logic.
CD74HC237NSR
-55 to 125
16 Ld SOP
CD74HC237PW
-55 to 125
16 Ld TSSOP
CD74HC237PWR
-55 to 125
16 Ld TSSOP
CD74HC237PWT
-55 to 125
16 Ld TSSOP
CD74HCT137E
-55 to 125
16 Ld PDIP
CD74HCT137MT
-55 to 125
16 Ld SOIC
CD74HCT137M96
-55 to 125
16 Ld SOIC
CD74HCT237E
-55 to 125
16 Ld PDIP
PART NUMBER
• Significant Power Reduction Compared to LSTTL
Logic ICs
• HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30%, of VCC
at VCC = 5V
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
VIL= 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH
NOTE: When ordering, use the entire part number. The suffixes 96
and R denote tape and reel. The suffix T denotes a small-quantity
reel of 250.
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
© 2003, Texas Instruments Incorporated
1
CD74HC137, CD74HCT137, CD54HC237, CD74HC237, CD74HCT237
Pinout
Functional Diagram
CD54HC237 (CERDIP)
CD74HC137 (PDIP, TSSOP)
CD74HCT137 (PDIP, SOIC)
CD74HC237 (PDIP, SOIC, SOP, TSSOP)
CD74HCT237 (PDIP)
TOP VIEW
A0
A1
A2
A0 1
16 VCC
A1 2
15 Y0
A3 3
14 Y1
LE 4
13 Y2
OE1 5
12 Y3
OE0 6
11 Y4
Y7 7
10 Y5
GND 8
9 Y6
HC/HCT HC/HCT
237
137
15
Y0
Y0
1
2
3-BIT
LATCH
3
14
1 OF 8
DECODER 13
12
4
LE
11
10
OE1
OE0
5
9
6
7
Y1
Y1
Y2
Y2
Y3
Y3
Y4
Y4
Y5
Y5
Y6
Y6
Y7
Y7
GND = 8
VCC = 16
’HC137, ’HCT137 TRUTH TABLE
INPUTS
OUTPUTS
LE
OE0
OE1
A2
A1
A0
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
X
X
H
X
X
X
H
H
H
H
H
H
H
H
X
L
X
X
X
X
H
H
H
H
H
H
H
H
L
H
L
L
L
L
L
H
H
H
H
H
H
H
L
H
L
L
L
H
H
L
H
H
H
H
H
H
L
H
L
L
H
L
H
H
L
H
H
H
H
H
L
H
L
L
H
H
H
H
H
L
H
H
H
H
L
H
L
H
L
L
H
H
H
H
L
H
H
H
L
H
L
H
L
H
H
H
H
H
H
L
H
H
L
H
L
H
H
L
H
H
H
H
H
H
L
H
L
H
L
H
H
H
H
H
H
H
H
H
H
L
H
H
L
X
X
X
Depends upon the address previously applied while LE was at a logic low.
H = High Voltage Level, L = Low Voltage Level, X = Don’t Care
’HC237, ’HCT237 TRUTH TABLE
INPUTS
OUTPUTS
LE
OE0
OE1
A2
A1
A0
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
X
X
H
X
X
X
L
L
L
L
L
L
L
L
X
L
X
X
X
X
L
L
L
L
L
L
L
L
L
H
L
L
L
L
H
L
L
L
L
L
L
L
L
H
L
L
L
H
L
H
L
L
L
L
L
L
L
H
L
L
H
L
L
L
H
L
L
L
L
L
L
H
L
L
H
H
L
L
L
H
L
L
L
L
L
H
L
H
L
L
L
L
L
L
H
L
L
L
L
H
L
H
L
H
L
L
L
L
L
H
L
L
L
H
L
H
H
L
L
L
L
L
L
L
H
L
L
H
L
H
H
H
L
L
L
L
L
L
L
H
H
H
L
X
X
X
Depends upon the address previously applied while LE was at a logic low.
H = High Voltage Level, L = Low Voltage Level, X = Don’t Care
2
CD74HC137, CD74HCT137, CD54HC237, CD74HC237, CD74HCT237
Functional Block Diagram
A0
15
LE
1
A0
Y0
A0
p
14
n
Y1
LE
LE
p
13
Y2
n
12
LE
Y3
A1
2
A1
A1 LATCH
A0
11
Y4
10
3
A2
Y5
A2
A2 LATCH
A2
9
Y6
LE
7
4
LE
Y7
LE
5
OE1
6
OE0
3
CD74HC137, CD74HCT137, CD54HC237, CD74HC237, CD74HCT237
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA
Package Thermal Impedance, θJA (see Note 1):
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67oC/W
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73oC/W
NS (SOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64oC/W
PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . 108oC/W
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
Operating Conditions
Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
TEST
CONDITIONS
PARAMETER
25oC
-40oC TO 85oC -55oC TO 125oC
SYMBOL
VI (V)
IO (mA)
VCC
(V)
VIH
-
-
2
1.5
-
-
1.5
-
1.5
-
V
4.5
3.15
-
-
3.15
-
3.15
-
V
6
4.2
-
-
4.2
-
4.2
-
V
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
HC TYPES
High Level Input
Voltage
Low Level Input
Voltage
High Level Output
Voltage
CMOS Loads
VIL
VOH
-
VIH or VIL
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or VIL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
II
VCC or
GND
-
2
-
-
0.5
-
0.5
-
0.5
V
4.5
-
-
1.35
-
1.35
-
1.35
V
6
-
-
1.8
-
1.8
-
1.8
V
-0.02
2
1.9
-
-
1.9
-
1.9
-
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-0.02
6
5.9
-
-
5.9
-
5.9
-
V
-
-
-
-
-
-
-
-
-
V
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
-5.2
6
5.48
-
-
5.34
-
5.2
-
V
0.02
2
-
-
0.1
-
0.1
-
0.1
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
0.02
6
-
-
0.1
-
0.1
-
0.1
V
-
-
-
-
-
-
-
-
-
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
5.2
6
-
-
0.26
-
0.33
-
0.4
V
-
6
-
-
±0.1
-
±1
-
±1
µA
4
CD74HC137, CD74HCT137, CD54HC237, CD74HC237, CD74HCT237
DC Electrical Specifications
(Continued)
TEST
CONDITIONS
25oC
-40oC TO 85oC -55oC TO 125oC
SYMBOL
VI (V)
IO (mA)
VCC
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
ICC
VCC or
GND
0
6
-
-
8
-
80
-
160
µA
High Level Input
Voltage
VIH
-
-
4.5 to
5.5
2
-
-
2
-
2
-
V
Low Level Input
Voltage
VIL
-
-
4.5 to
5.5
-
-
0.8
-
0.8
-
0.8
V
High Level Output
Voltage
CMOS Loads
VOH
VIH or VIL
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
PARAMETER
Quiescent Device
Current
HCT TYPES
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or VIL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
Quiescent Device
Current
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
II
VCC and
GND
0
5.5
-
-
±0.1
-
±1
-
±1
µA
ICC
VCC or
GND
0
5.5
-
-
8
-
80
-
160
µA
∆ICC
(Note 2)
VCC
-2.1
-
4.5 to
5.5
-
100
360
-
450
-
490
µA
NOTE:
2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.
HCT Input Loading Table
INPUT
UNIT LOADS
All
1.5
NOTE: Unit Load is ∆ICC limit specified in DC Electrical Table, e.g.,
360µA max at 25oC.
Prerequisite For Switching Specifications
PARAMETER
HC TYPES
An to LE Setup Time
An to LE Hold Time
25oC
-40oC TO 85oC -55oC TO 125oC
SYMBOL
VCC
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
tSU
2
50
-
-
65
-
75
-
ns
4.5
10
-
-
13
-
15
-
ns
6
9
-
-
11
-
13
-
ns
2
30
-
-
40
-
45
-
ns
4.5
6
-
-
8
-
9
-
ns
6
5
-
-
7
-
8
-
ns
tH
5
CD74HC137, CD74HCT137, CD54HC237, CD74HC237, CD74HCT237
Prerequisite For Switching Specifications
PARAMETER
(Continued)
25oC
-40oC TO 85oC -55oC TO 125oC
SYMBOL
VCC
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
tW
2
50
-
-
65
-
75
-
ns
4.5
10
-
-
13
-
15
-
ns
6
9
-
-
1
-
13
-
ns
4.5
10
-
-
13
-
15
-
ns
LE Pulse Width
HCT TYPES
An to LE Setup Time
tSU
An to LE Hold Time
CD74HCT137
tH
4.5
7
-
-
9
-
11
-
ns
CD74HCT237
tH
4.5
5
-
-
5
-
5
-
ns
tW
4.5
10
-
-
13
-
15
-
ns
LE Pulse Width
Switching Specifications Input tr, tf = 6ns
PARAMETER
HC TYPES
Propagation Delay
CD74HC137, CD74HCT137
SYMBOL
TEST
CONDITIONS
tPLH, tPHL CL = 50pF
An to any Y
Propagation Delay
’HC237, CD74HCT237
tPLH, tPHL CL = 50pF
An to any Y
-40oC TO
85oC
25oC
-55oC TO 125oC
VCC (V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
2
-
-
180
-
225
-
270
ns
4.5
-
-
36
-
45
-
54
ns
6
-
-
31
-
38
-
46
ns
2
-
-
160
-
200
-
240
ns
4.5
-
-
32
-
40
-
48
ns
6
-
-
27
-
34
-
41
ns
Address to Output
CD74HC137
tPLH, tPHL CL = 15pF
5
5
15
-
-
-
-
-
ns
’HC237
tPLH, tPHL CL = 15pF
5
-
13
-
-
-
-
-
ns
OE0 to any Y or Y
OE1 to any Y or Y
LE to any Y or Y
Power Dissipation
Capacitance, (Notes 3, 4)
CD74HC137
’HC237
Output Transition Time
Input Capacitance
tPLH, tPHL CL = 50pF
tTLH, tTHL CL = 50pF
tTLH, tTHL CL = 50pF
2
-
-
145
-
180
-
220
ns
4.5
-
-
29
-
36
-
44
ns
6
-
-
25
-
31
-
38
ns
2
-
-
145
-
180
-
220
ns
4.5
-
-
29
-
36
-
44
ns
6
-
-
25
-
31
-
38
ns
2
-
-
190
-
240
-
285
ns
4.5
-
-
38
-
48
-
57
ns
6
-
-
32
-
41
-
48
ns
-
-
-
-
-
pF
CPD
CL = 15pF
5
-
19
CPD
CL = 15pF
5
-
23
-
-
-
-
-
pF
tTLH, tTHL CL = 50pF
2
-
-
75
-
95
-
110
ns
4.5
-
-
15
-
19
-
22
ns
6
-
-
13
-
16
-
19
ns
-
-
-
10
-
10
-
10
pF
CI
-
6
CD74HC137, CD74HCT137, CD54HC237, CD74HC237, CD74HCT237
Switching Specifications Input tr, tf = 6ns (Continued)
PARAMETER
TEST
CONDITIONS
SYMBOL
HCT TYPES
Propagation Delay
An to any Y or Y
Address to Output
-40oC TO
85oC
25oC
-55oC TO 125oC
VCC (V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
4.5
-
-
38
-
48
-
57
ns
tPLH, tPHL CL = 50pF
tPLH, tPHL CL = 15pF
5
-
16
-
-
-
-
-
ns
OE0 to any Y (HC137)
tPLH, tPHL CL = 50pF
4.5
-
-
35
-
44
-
53
ns
OE0 to any Y (HC237)
tPLH, tPHL CL = 50pF
4.5
-
-
33
-
41
-
60
ns
OE1 to any Y (HC137)
tTLH, tTHL CL = 50pF
4.5
-
-
37
-
46
-
56
ns
OE1 to any Y (HC237)
tTLH, tTHL CL = 50pF
4.5
-
-
35
-
44
-
53
ns
LE to any Y (HC137)
tTLH, tTHL CL = 50pF
4.5
-
-
44
-
55
-
66
ns
LE to any Y (HC237)
tTLH, tTHL CL = 50pF
4.5
-
-
42
-
53
-
63
ns
Power Dissipation
Capacitance, (Notes 3, 4)
CD74HC137
’HC237
Output Transition Time
CPD
CL = 15pF
5
-
19
-
-
-
-
-
pF
CPD
CL = 15pF
5
-
23
-
-
-
-
-
pF
22
ns
10
pF
tTLH, tTHL CL = 50pF
Input Capacitance
CI
4.5
-
15
-
-
-
10
19
-
10
-
NOTES:
3. CPD is used to determine the dynamic power consumption, per gate.
4. PD = VCC2 fi (CPD + CL) where: fi = Input Frequency, CL = Output Load Capacitance, VCC = Supply Voltage.
Test Circuits and Waveforms
tfCL
trCL
CLOCK
tWL + tWH =
90%
10%
I
fCL
CLOCK
50%
50%
1.3V
0.3V
FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
tf = 6ns
tf = 6ns
tr = 6ns
VCC
90%
50%
10%
GND
tTLH
GND
tTHL
90%
50%
10%
INVERTING
OUTPUT
3V
2.7V
1.3V
0.3V
INPUT
tTHL
GND
tWH
NOTE: Outputs should be switching from 10% VCC to 90% VCC in
accordance with device truth table. For fMAX, input duty cycle = 50%.
FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
tr = 6ns
1.3V
1.3V
tWL
tWH
NOTE: Outputs should be switching from 10% VCC to 90% VCC in
accordance with device truth table. For fMAX, input duty cycle = 50%.
tPHL
2.7V
0.3V
GND
tWL
INPUT
tfCL = 6ns
I
fCL
3V
VCC
50%
10%
tWL + tWH =
trCL = 6ns
tTLH
90%
1.3V
10%
INVERTING
OUTPUT
tPHL
tPLH
FIGURE 3. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC
tPLH
FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
7
CD74HC137, CD74HCT137, CD54HC237, CD74HC237, CD74HCT237
Test Circuits and Waveforms
trCL
tfCL
trCL
CLOCK
INPUT
(Continued)
VCC
90%
GND
tH(H)
GND
tH(H)
VCC
DATA
INPUT
50%
tH(L)
3V
1.3V
1.3V
1.3V
GND
tSU(H)
tSU(H)
tSU(L)
tTLH
90%
OUTPUT
tTHL
90%
50%
10%
tTLH
90%
1.3V
OUTPUT
tREM
3V
SET, RESET
OR PRESET
GND
tTHL
1.3V
10%
FIGURE 5. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME,
AND PROPAGATION DELAY TIMES FOR EDGE
TRIGGERED SEQUENTIAL LOGIC CIRCUITS
tPHL
1.3V
GND
IC
CL
50pF
GND
90%
tPLH
50%
IC
tSU(L)
tPHL
tPLH
tREM
VCC
SET, RESET
OR PRESET
1.3V
0.3V
tH(L)
DATA
INPUT
3V
2.7V
CLOCK
INPUT
50%
10%
tfCL
CL
50pF
FIGURE 6. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME,
AND PROPAGATION DELAY TIMES FOR EDGE
TRIGGERED SEQUENTIAL LOGIC CIRCUITS
8
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
5962-8860601EA
ACTIVE
CDIP
J
16
1
None
Call TI
Level-NC-NC-NC
CD54HC237F
ACTIVE
CDIP
J
16
1
None
Call TI
Level-NC-NC-NC
CD54HC237F3A
ACTIVE
CDIP
J
16
1
None
Call TI
Level-NC-NC-NC
CD74HC137E
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
CD74HC137PW
ACTIVE
TSSOP
PW
16
90
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
CD74HC137PWR
ACTIVE
TSSOP
PW
16
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
CD74HC137PWT
ACTIVE
TSSOP
PW
16
250
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
CD74HC237E
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
CD74HC237M
ACTIVE
SOIC
D
16
40
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD74HC237M96
ACTIVE
SOIC
D
16
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD74HC237MT
ACTIVE
SOIC
D
16
250
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD74HC237NSR
ACTIVE
SO
NS
16
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD74HC237PW
ACTIVE
TSSOP
PW
16
90
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
CD74HC237PWR
ACTIVE
TSSOP
PW
16
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
CD74HC237PWT
ACTIVE
TSSOP
PW
16
250
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
CD74HCT137E
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
CD74HCT137M96
ACTIVE
SOIC
D
16
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD74HCT137MT
ACTIVE
SOIC
D
16
250
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD74HCT237E
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright  2005, Texas Instruments Incorporated
Similar pages