ON NL17SH00 Single 2-input nand gate Datasheet

NL17SH00
Single 2-Input NAND Gate
The NL17SH00 is an advanced high speed CMOS 2−input NAND
gate fabricated with silicon gate CMOS technology.
The internal circuit is composed of multiple stages, including a
buffer output which provides high noise immunity and stable output.
The NL17SH00 input structure provides protection when voltages
up to 7.0 V are applied, regardless of the supply voltage. This allows
the NL17SH00 to be used to interface 5.0 V circuits to 3.0 V circuits.
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MARKING
DIAGRAM
Features
•
•
•
•
•
•
High Speed: tPD = 3.0 ns (Typ) at VCC = 5.0 V
Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
Power Down Protection Provided on Inputs
Balanced Propagation Delays
Pin and Function Compatible with Other Standard Logic Families
These are Pb−Free Devices
SOT−953
CASE 527AE
A
M
AM
1
= Specific Device Code
= Month Code
PIN ASSIGNMENT
5
1
IN A
GND
2
IN B
3
4
VCC
1
IN A
2
GND
3
IN B
4
OUT Y
5
VCC
FUNCTION TABLE
OUT Y
Inputs
Figure 1. Pinout (Top View)
IN A
&
IN B
OUT Y
Output
A
B
Y
L
L
H
H
L
H
L
H
H
H
H
L
Figure 2. Logic Symbol
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2011
August, 2011 − Rev. 1
1
Publication Order Number:
NL17SH00/D
NL17SH00
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage
−0.5 to +7.0
V
VIN
DC Input Voltage
−0.5 to +7.0
V
−0.5 to VCC +0.5
V
VOUT
DC Output Voltage
IIK
DC Input Diode Current
−20
mA
IOK
DC Output Diode Current
±20
mA
IOUT
DC Output Current
±25
mA
ICC
DC Supply Current per Supply Pin
50
mA
−65 to +150
°C
TSTG
Storage Temperature Range
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
+150
°C
PD
Power Dissipation in Still Air
50
mW
MSL
Moisture Sensitivity
FR
Flammability Rating
ILATCHUP
Level 1
Oxygen Index: 28 to 34
Latchup Performance
UL 94 V−0 @ 0.125 in
Above VCC and Below GND at 125°C (Note 1)
mA
±100
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Min
Max
Unit
VCC
DC Supply Voltage
2.0
5.5
V
VIN
DC Input Voltage
0.0
5.5
V
DC Output Voltage
0.0
VCC
V
Operating Temperature Range
−55
+125
°C
0
0
100
20
ns/V
VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V
Time, Hours
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
TJ = 80°C
Junction
Temperature °C
NORMALIZED FAILURE RATE
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
TJ = 90°C
Input Rise and Fall Time
TJ = 100°C
tr , tf
TJ = 110°C
TA
TJ = 120°C
VOUT
Parameter
TJ = 130°C
Symbol
1
1
10
100
1000
TIME, YEARS
Figure 3. Failure Rate vs. Time Junction Temperature
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2
NL17SH00
DC ELECTRICAL CHARACTERISTICS
TA = 255C
VCC
Symbol
Parameter
Test Conditions
(V)
Min
1.5
2.1
3.15
3.85
VIH
Minimum High−Level
Input Voltage
2.0
3.0
4.5
5.5
VIL
Maximum Low−Level
Input Voltage
2.0
3.0
4.5
5.5
VOH
Minimum High−Level
Output Voltage
VIN = VIH or VIL
VOL
Maximum Low−Level
Output Voltage
VIN = VIH or VIL
Typ
TA v 855C
Max
Min
1.5
2.1
3.15
3.85
0.5
0.9
1.35
1.65
VIN = VIH or VIL
IOH = −50 mA
2.0
3.0
4.5
1.9
2.9
4.4
VIN = VIH or VIL
IOH = −4 mA
IOH = −8 mA
3.0
4.5
2.58
3.94
VIN = VIH or VIL
IOL = 50 mA
2.0
3.0
4.5
VIN = VIH or VIL
IOL = 4 mA
IOL = 8 mA
Max
2.0
3.0
4.5
0.0
0.0
0.0
*555C to 1255C
Min
Max
1.5
2.1
3.15
3.85
0.5
0.9
1.35
1.65
V
0.5
0.9
1.35
1.65
1.9
2.9
4.4
1.9
2.9
4.4
2.48
3.80
2.34
3.66
Unit
V
V
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
3.0
4.5
0.36
0.36
0.44
0.44
0.52
0.52
V
IIN
Maximum Input
Leakage Current
VIN = 5.5 V or GND
0 to
5.5
$0.1
$1.0
$1.0
mA
ICC
Maximum Quiescent
Supply Current
VIN = VCC or GND
5.5
1.0
10
40
mA
AC ELECTRICAL CHARACTERISTICS Input tr = tf = 3.0 ns
TA = 255C
TA v 855C
*555C to 1255C
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎ
ÎÎÎÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎ
ÎÎÎ
ÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Typ
Max
VCC = 3.3 $ 0.3 V CL = 15 pF
CL = 50 pF
4.5
5.6
7.9
11.4
VCC = 5.0 $ 0.5 V CL = 15 pF
CL = 50 pF
3.0
3.8
5.5
Symbol
Parameter
Test Conditions
tPLH,
tPHL
Maximum Propagation
Delay, Input A or B to Y
CIN
Min
Maximum Input
Capacitance
Min
Max
Min
Max
Unit
9.5
13.0
11.0
15.5
ns
5.5
7.5
6.5
8.5
8.0
10.0
10
10
10
pF
Typical @ 25°C, VCC = 5.0 V
CPD
10
Power Dissipation Capacitance (Note 2)
pF
2. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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3
NL17SH00
A or B
VCC
50%
GND
tPLH
Y
tPHL
50% VCC
Figure 4. Switching Waveforms
VCC
OUTPUT
INPUT
CL*
*Includes all probe and jig capacitance.
A 1−MHz square input wave is recommended
for propagation delay tests.
Figure 5. Test Circuit
ORDERING INFORMATION
Device
NL17SH00P5T5G
Package
Shipping†
SOT−953
(Pb−Free)
8000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NL17SH00
PACKAGE DIMENSIONS
SOT−953
CASE 527AE
ISSUE E
X
D
PIN ONE
INDICATOR
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
A
Y
4
HE
E
1
2 3
DIM
A
b
C
D
E
e
HE
L
L2
L3
C
TOP VIEW
SIDE VIEW
e
L
5X
5X
L3
MILLIMETERS
MIN
NOM
MAX
0.34
0.37
0.40
0.10
0.15
0.20
0.07
0.12
0.17
0.95
1.00
1.05
0.75
0.80
0.85
0.35 BSC
0.95
1.00
1.05
0.175 REF
0.05
0.10
0.15
−−−
−−−
0.15
SOLDERING FOOTPRINT*
5X
0.35
5X
0.20
5X
L2
5X
BOTTOM VIEW
b
PACKAGE
OUTLINE
0.08 X Y
1.20
1
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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For additional information, please contact your local
Sales Representative
NL17SH00/D
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