Diodes DMN5L06DWK Dual n-channel enhancement mode mosfet Datasheet

DMN5L06DWK
DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
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Mechanical Data
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Dual N-Channel MOSFET
Low On-Resistance (1.0V max)
Very Low Gate Threshold Voltage
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
Ultra-Small Surface Mount Package
ESD Protected up to 2kV
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Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
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Halogen and Antimony Free. “Green” Device (Note 3)
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Qualified to AEC-Q101 Standards for High Reliability
Case: SOT363
Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram
Terminals: Finish – Matte Tin annealed over Alloy 42
leadframe. Solderable per MIL-STD-202, Method 208
Weight: 0.006 grams (approximate)
SOT363
ESD PROTECTED TO 2kV
D2
G1
S1
S2
G2
D1
Top View
Internal Schematic
Top View
Ordering Information (Note 4)
Part Number
DMN5L06DWK-7
Notes:
Case
SOT363
Packaging
3000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
DAB = Marking Code
YM = Date Code Marking
Y = Year ex: T = 2006
M = Month ex: 9 = September
DAB YM
DAB YM
NEW PRODUCT
Features
Date Code Key
Year
Code
Month
Code
2006
T
2007
U
2008
V
…
…
2012
Z
2013
A
2014
B
2015
C
2016
D
2017
E
2018
F
2019
G
Jan
1
Feb
2
Mar
3
Apr
4
May
5
Jun
6
Jul
7
Aug
8
Sep
9
Oct
O
Nov
N
Dec
D
DMN5L06DWK
Document number: DS30930 Rev. 6 - 2
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© Diodes Incorporated
DMN5L06DWK
Maximum Ratings @TA = +25°C unless otherwise specified
Characteristic
NEW PRODUCT
Drain Source Voltage
Gate-Source Voltage
Drain Current
Symbol
VDSS
VGSS
Unit
V
V
ID
Value
50
±20
305
800
Symbol
PD
RθJA
TJ, TSTG
Value
250
500
-65 to +150
Unit
mW
°C/W
°C
Continuous
Pulsed (Note 6)
mA
Thermal Characteristics @TA = +25°C unless otherwise specified
Characteristic
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
Electrical Characteristics @TA = +25°C unless otherwise specified
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
@ TC = +25°C
Gate-Body Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Min
Typ
Max
Unit
BVDSS
IDSS
50




60
V
nA
IGSS


1
500
50
µA
nA
nA
VGS(th)




1.4


1.0
V
3.0
2.5
2.0
Ω
ID(ON)
|Yfs|
VSD
0.49



0.5
200
0.5


1.4
A
mS
V
Ciss
Coss
Crss






50
25
5.0
pF
pF
pF
RDS (ON)
On-State Drain Current
Forward Transconductance
Source-Drain Diode Forward Voltage
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Notes:
Symbol
Test Condition
VGS = 0V, ID = 10µA
VDS = 50V, VGS = 0V
VGS = ±12V, VDS = 0V
VGS = ±10V, VDS = 0V
VGS = ±5V, VDS = 0V
VDS = VGS, ID = 250µA
VGS = 1.8V, ID = 50mA
VGS = 2.5V, ID = 50mA
VGS = 5.0V, ID = 50mA
VGS = 10V, VDS = 7.5V
VDS =10V, ID = 0.2A
VGS = 0V, IS = 115mA
VDS = 25V, VGS = 0V
f = 1.0MHz
5. Device mounted on FR-4 PCB.
6. Pulse width ≤10µS, Duty Cycle ≤1%.
7. Short duration pulse test used to minimize self-heating effect.
DMN5L06DWK
Document number: DS30930 Rev. 6 - 2
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© Diodes Incorporated
NEW PRODUCT
DMN5L06DWK
VGS, GATE-SOURCE VOLTAGE (V)
Fig. 2 Typical Transfer Characteristics
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 1 Typical Output Characteristics
RDS(on), STATIC DRAIN-SOURCE
ON-RESISTANCE ( Ω)
10
0
-50
75 100 125 150
-25
25
50
0
Tch, CHANNEL TEMPERATURE (°C)
Fig. 3 Gate Threshold Voltage vs. Channel Temperature
1
0
ID, DRAIN CURRENT (A)
Fig. 4 Static Drain-Source On-Resistance vs. Drain Current
RDS(on), STATIC DRAIN-SOURCE
ON-RESISTANCE (Ω)
RDS(on), STATIC DRAIN-SOURCE
ON-RESISTANCE (Ω)
10
1
ID, DRAIN CURRENT (A)
Fig. 5 Static Drain-Source On-Resistance vs. Drain Current
DMN5L06DWK
Document number: DS30930 Rev. 6 - 2
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VGS, GATE SOURCE VOLTAGE (V)
Fig. 6 Static Drain-Source On-Resistance
vs. Gate-Source Voltage
August 2014
© Diodes Incorporated
IDR, REVERSE DRAIN CURRENT (A)
RDS(on), STATIC DRAIN-SOURCE
ON-RESISTANCE (Ω)
IDR, REVERSE DRAIN CURRENT (A)
|Yfs|, FORWARD TRANSFER ADMITTANCE (S)
TA, AMBIENT TEMPERATURE (°C)
Fig. 7 Static Drain-Source On-State Resistance
vs. Ambient Temperature
1
ID, DRAIN CURRENT (A)
Fig.10 Forward Transfer Admittance vs. Drain Current
250
PD, POWER DISSIPATION (mW)
NEW PRODUCT
DMN5L06DWK
200
150
100
50
0
-50
0
50
100
TA, AMBIENT TEMPERATURE (°C)
Fig. 11 Derating Curve - Total
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Document number: DS30930 Rev. 6 - 2
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DMN5L06DWK
Package Outline Dimensions
NEW PRODUCT
A
SOT363
Dim Min Max Typ
A 0.10 0.30 0.25
B 1.15 1.35 1.30
C 2.00 2.20 2.10
D
0.65 Typ
F 0.40 0.45 0.425
H 1.80 2.20 2.15
J
0
0.10 0.05
K 0.90 1.00 1.00
L 0.25 0.40 0.30
M 0.10 0.22 0.11
0°
8°
α
All Dimensions in mm
B C
H
K
M
J
D
F
L
Suggested Pad Layout
C2
Z
C2
C1
G
Y
Dimensions Value (in mm)
Z
2.5
G
1.3
X
0.42
Y
0.6
C1
1.9
C2
0.65
X
DMN5L06DWK
Document number: DS30930 Rev. 6 - 2
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NEW PRODUCT
IMPORTANT NOTICE
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
www.diodes.com
DMN5L06DWK
Document number: DS30930 Rev. 6 - 2
6 of 6
www.diodes.com
August 2014
© Diodes Incorporated
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