ON NL17SV00XV5T2 Single 2-input nand gate Datasheet

NL17SV00XV5T2
Single 2−Input NAND Gate
The NL17SV00 is an ultra−high performance 2−Input NAND gate
manufactured in 0.35 m technology, with excellent performance
down to 0.9 V. This device is ideal for extremely high speed and
high−drive applications. Additionally, limitations of board space are
no longer a constraint. The very small SOT−553 makes this device fit
most tight designs and spaces.
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Features
•
•
•
•
•
•
•
Extremely High Speed: 1.0 ns (Typ) @ VCC = 3.3 V
Designed for 0.9 to 3.3 V Operation
Overvoltage Tolerance (OVT)* Input Pins Permits Logic Translation
Balanced 24 mA Output Drive @ VCC 3.3 V
Near Zero Static Supply Current
Ultra−Tiny SOT−553 5−Pin Package, only 1.6 x 1.6 x 0.6 mm
All Devices in Package SOT−553 are Inherently Pb−Free**
MARKING
DIAGRAM
5
1
UH = Specific Device Code
D = Date Code
Typical Applications
•
•
•
•
Cellular
Digital Camera
PDA
Digital Video
UH D
SOT−553
CASE 463B
PIN DIAGRAM
Industry Leadership
• Functionally Similar to NC7SV00 and SN74AUC1G00
IN A
&
IN B
1
IN A
2
GND
3
OUT Y
Figure 1. Logic Symbol
FUNCTION TABLE
Output
A
B
Y
L
L
H
H
L
H
L
H
H
H
H
L
VCC
4
OUT Y
PIN ASSIGNMENT
IN B
Inputs
5
PIN #
FUNCTION
1
IN B
2
IN A
3
GND
4
OUT Y
5
VCC
ORDERING INFORMATION
*Overvoltage Tolerance (OVT) enables input pins to function outside (higher) of
their operating voltages, with no damage to the devices or to signal integrity.
Device
Package
Shipping†
NL17SV00XV5T2
SOT−553
(Pb−Free)
4000 Tape & Reel
(178 mm)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
**For additional information on our Pb−Free strategy and soldering details,
please download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2005
January, 2005 − Rev. 2
1
Publication Order Number:
NL17SV00XV5T2/D
NL17SV00XV5T2
MAXIMUM RATINGS
Symbol
VCC
Rating
DC Supply Voltage
VI
DC Input Voltage
VO
DC Output Voltage
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IO
Value
Unit
−0.5 to + 4.6
V
−0.5 to + 4.6
V
−0.5 to VCC +0.5
V
VI < GND
±50
mA
VO = GND
VO = VCC
−50
+50
mA
DC Output Sink Current
±50
mA
ICC
DC Supply Current per Supply Pin
±50
mA
IGND
DC Ground Current per Ground Pin
TSTG
Storage Temperature Range
±50
mA
− 65 to +150
°C
°C
TL
Lead Temperature, 1.0 mm from Case for 10 seconds
260
TJ
Junction Temperature Under Bias
+150
°C
JA
Thermal Resistance (Note 1)
250
°C/W
PD
Power Dissipation in Still Air at 85°C
250
mW
MSL
Moisture Sensitivity
FR
Flammability Rating
Level 1
Oxygen index: 28 to 34
UL 94 V−0 @ 0125 in
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC
Positive DC Supply Voltage
VIN
Digital Input Voltage
Vout
Output Voltage
IOH/IOL
Output Current
tA
Max
Unit
0.9
3.6
V
0
3.6
V
0
VCC
V
±24
±18
±6
±4
±2
±0.1
mA
−40
+85
°C
0
10
nS/V
VCC = 3.0 V to 3.6 V
VCC = 2.3 V to 2.7 V
VCC = 1.65 V to 1.95 V
VCC = 1.4 V to 1.6 V
VCC = 1.1 V to 1.3 V
VCC = 0.9 V
Operating Temperature Range. All Package Types
tr, tf
Min
VCC = 3.3V ± 0.3 V
Input Rise or Fall Time
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature °C
Time, Hours
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
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2
NL17SV00XV5T2
DC CHARACTERISTICS– Digital Section (Voltages Referenced to GND)
TA = 25°C
Symbol
Parameter
VCC
Min
VIH
High Level
Input Voltage
0.90
1.10 = VCC 1.30
1.40 VCC 1.60
1.65 VCC 1.95
2.30 VCC 2.70
2.70 VCC 3.60
0.65 x VCC
0.65 x VCC
0.65 x VCC
0.65 x VCC
1.6
2.0
VIL
Low Level
Input Voltage
0.90
1.10 VCC 1.30
1.40 VCC 1.60
1.65 VCC 1.95
2.30 VCC 2.70
2.70 VCC 3.60
VOH
High Level
Output Voltage
VOL
Low Level
Output Voltage
IIN
Input
Leakage Current
IOFF
Power Off
Leakage Current
ICC
Quiescent
Supply Current
Condition
TA = −40 to 85°C
Max
Min
Max
0.65 x VCC
0.65 x VCC
0.65 x VCC
0.65 x VCC
1.6
2.0
0.35 x VCC
0.35 x VCC
0.35 x VCC
0.35 x VCC
0.7
0.8
Unit
V
0.35 x VCC
0.35 x VCC
0.35 x VCC
0.35 x VCC
0.7
0.8
V
IOH = −100 A
0.90
1.10 VCC 1.30
1.40 VCC 1.60
1.65 VCC 1.95
2.30 VCC 2.70
2.70 VCC 3.60
VCC − 0.1
VCC − 0.1
VCC − 0.2
VCC − 0.2
VCC − 0.2
VCC − 0.2
VCC − 0.1
VCC − 0.1
VCC − 0.2
VCC − 0.2
VCC − 0.2
VCC − 0.2
IOH = −2.0 mA
1.10 VCC 1.30
0.75 x VCC
0.75 x VCC
IOH = −4.0 mA
1.40 VCC 1.60
0.75 x VCC
0.75 x VCC
IOH = −6.0
6 0 mA
1.65
65 VCC 1.95
95
2.30 VCC 2.70
1.25
5
2.0
1.25
5
2.0
IOH = −12 mA
2.30 VCC 2.70
2.70 VCC 3.60
1.8
2.2
1.8
2.2
IOH = −18 mA
2.30 VCC 2.70
2.70 VCC 3.60
1.7
2.4
1.7
2.4
IOH = −24 mA
2.70 VCC 3.60
2.2
2.2
IOL = 100 A
0.90
1.10 VCC 1.30
1.40 VCC 1.60
1.65 VCC 1.95
2.30 VCC 2.70
2.70 VCC 3.60
0.1
0.1
0.2
0.2
0.2
0.2
0.1
0.1
0.2
0.2
0.2
0.2
IOL = 2.0 mA
1.10 VCC 1.30
0.25 x VCC
0.25 x VCC
IOL = 4.0 mA
1.40 VCC 1.60
0.25 x VCC
0.25 x VCC
IOL = 6.0 mA
1.65 VCC 1.95
0.3
0.3
IOL = 12 mA
2.30 VCC 2.70
2.70 VCC 3.60
0.4
0.4
0.4
0.4
IOL = 18 mA
2.30 VCC 2.70
2.70 VCC 3.60
0.6
0.4
0.6
0.4
IOL = 24 mA
2.70 VCC 3.60
0.55
0.55
0 = VI = 3.6 V
0.90 to 3.60
±0.1
±0.9
A
0
1
5
A
0.90 to 3.60
0.9
5
A
VI = VCC or GND
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3
V
V
NL17SV00XV5T2
AC CHARACTERISTICS (Input tr = tf = 3.0 nS)
−40°C
25°C
Min
Typ
85°C
Symbol
Parameter
Condition
VCC
Max
Min
Max
TPHL,,
TPLH
Propagation Delay
CL = 15 pF, RL = 1.0 M
0.90
CL = 15 pF, RL = 2.0 k
1.10 VCC 1.30
1.40 VCC 1.60
3.0
1.0
6.0
3.2
9.9
6.0
1.0
1.0
14.6
7.2
nS
CL = 30 pF, RL = 500 k
1.65 VCC 1.95
2.30 VCC 2.70
2.70 VCC 3.60
1.0
0.8
0.7
1.9
1.2
1.0
4.5
2.6
2.3
1.0
0.7
0.6
5.3
3.7
3.0
nS
13
Unit
nS
CIN
Input Capacitance
0
2.0
pF
COUT
Output Capacitance
0
4.5
pF
CPD
Power Dissipation
Capacitance
0.90 to 3.60
20
pF
VI = 0 V or VCC
F = 10 MHz
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4
NL17SV00XV5T2
PACKAGE DIMENSIONS
SOT−553
5−LEAD PACKAGE
CASE 463B−01
ISSUE A
A
−X−
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
C
K
4
1
2
B
−Y−
3
D
G
S
DIM
A
B
C
D
G
J
K
S
J
5 PL
0.08 (0.003)
M
X Y
MILLIMETERS
MIN
MAX
1.50
1.70
1.10
1.30
0.50
0.60
0.17
0.27
0.50 BSC
0.08
0.18
0.10
0.30
1.50
1.70
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.35
0.0531
1.0
0.0394
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
INCHES
MIN
MAX
0.059
0.067
0.043
0.051
0.020
0.024
0.007
0.011
0.020 BSC
0.003
0.007
0.004
0.012
0.059
0.067
NL17SV00XV5T2
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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NL17SV00XV5T2/D
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