Panasonic MN101D10F Mn101d10f Datasheet

MN101D10F , MN101D10G
Type
MN101D10F
MN101D10G
ROM (×× 8-bit)
96 K
128 K
RAM (×× 8-bit)
2.5 K
Package
Minimum Instruction
Execution Time
3.5 K
QFP100-P-1818B
With main clock operated
When sub-clock operated
*Lead-free
0.1397 µs (at 4.0 V to 5.5 V, 14.32 MHz)
71.5 µs (at 2.7 V to 5.5 V fixed to 14.32 MHz internal frequency division)
61 µs (at 2.5 V to 5.5 V, 32.768 kHz)
Interrupts
• RESET • Runaway • External 0 • External 1 • External 2 • External 3 • External 4
• Timer 0 • Timer 1 • Timer 2 • Timer 3 • Timer 6 • Capstan FG • Control • HSW
• Cylinder(Drum) FG • Servo V-sync • Synchronous output • OSD • XDS • Serial 0
• Serial 1 • Serial 2 • PWM 4 • OSDV-sync
Timer Counter
Timer counter 0: 8-bit × 1 (timer function)
Clock source ····················· 1/4, 1/16 of system clock frequency
Interrupt source ················· overflow of timer counter 0
Timer counter 1: 8-bit × 1 (timer function, linear timer counter function)
Clock source ····················· 1/4 of system clock frequency; CTL signal
Interrupt source ················· overflow of timer counter 1
Timer counter 2: 16-bit × 1 (timer function, input capture,duty judgment of CTL signal(VISS/VASS detection
function), generation of remote control output carrier frequency)
Clock source ····················· 1/4, 1/16, 1/24 of system clock frequency
Interrupt source ················· overflow of timer counter 2; input of CTL specified edge; underflow of timer 2
shift register 4-bit counter; coincidence of timer 2 shift register with timer 2 shift
register compare register
Timer counter 3: 16-bit × 1 (timer function, generation of serial transmission clock)
Clock source ····················· 1/4, 1/16 of system clock frequency
Interrupt source ················· overflow of timer counter 3
Timer counter 5: 19-bit × 1 (watchdog, stable oscillation waiting function)
Clock source ····················· system clock
Watchdog interrupt source ··· 1/2 16, 1/219 of timer counter 5 frequency
Clear by stable oscillation ··· after 256 counts by timer counter 5 (2 18 counts of OSC oscillation clock)
Serial Interface
Timer counter 6: 16-bit × 1 (clock function [max. 2 s])
Clock source ····················· 1/512 of OSC oscillation clock frequency; XI oscillation clock;
1/8, 1/128 of system clock frequency
Interrupt source ················· 1/213, 1/2 14, 1/215 overflow of timer counter 6
Serial 0: 8-bit × 1 (synchronous type)
(transfer direction of MSB/LSB selectable, start condition function)
Clock source ····················· 1/8, 1/16, 1/32, 1/64, 1/128, 1/256 of system clock frequency; NSBT0 pin input
Serial 1: 8-bit × 1 (synchronous type/remote control transmission)
(transfer direction of MSB/LSB selectable, start condition function)
Clock source ····················· 1/8, 1/16, 1/32, 1/64, 1/128, 1/256 of system clock frequency; 2-division timer 3
output; NSBT1 pin input
Remote control clock ······· 2-division timer 3 output
Serial 2: 8-bit × 1 (I 2C) (master transmission/reception, slave transmission/reception)
Clock source ····················· 1/144 to 1/252 of system clock; SCK pin input
MAD00043BEM
MN101D10F, MN101D10G
OSD
Display mode
Applicable broadcasting system
Screen configuration
Character type
Character size
Enlarged characters
Character interpolation
Line background color
Line background intensity
Screen background color :
Character color
Character intensity
Border function
Border brightness
Blinking
Inverted character
Halftone
Input
Clamp method
Output
Measure against image fluctuation
Dot clock
MESECAM compatibility
XDS
Built-in U.S. closed caption data slicer (optional 1 line data can be extracted.)
ROM Correction
Correcting address designation: up to 3 addresses possible
Correction method: correction program being saved in internal RAM
I/O Pins
I/O
76
• Common use: 56
Input
1
• Common use: 1
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
menu(intermal synchronized) display, superimpose(externally synchronized) display
NTSC, PAL, PAL-M, PAL-N
24 characters × 2n rows (n = 1 to 6)
max. 256 character types (variable, include special characters)
12 × 18 dots (vertical direction: 1 dot for 2H at not enlargement)
each × 2 settings in horizontal and vertical
none
8-hue settable in the row unit at menu display
8 gradations settable in the row unit
8-huesettable at menu display
white
8 gradations settable in the row unit
1-dot border in 8 directions
4 gradations settable in the row unit
none (covered by software)
settable in the character unit
none
composite video signal input (output level: 1 V[p-p] / 2 V[p-p])
sync tip clamp, clamp level in 4 levels
composite video output
built-in AFC circuit
1/2 of OSC oscillation clock (automatic phase adjustment)
Subcarrier leak function for superimpose display
A/D Inputs
8-bit × 12-ch. (without S/H)
PWM
13-bit × 2-ch. (at repetition cycle 572 µs at 14.32 MHz),
8-bit × 1-ch. (at repetition cycle 35.7 µs, 0.572 ms, 1.14 ms, 2.29 ms at 14.32 MHz)
ICR
16-bit × 2-ch.(Speed system),
18-bit × 4-ch.(Phase system)
OCR
16-bit × 3 (Synchronous output × 2, Rec CTL × 1 )
Special Ports
3-state output (PTO) VLP pin; CTL input;Capstan FG input; Cylinder(Drum) PG/FG inputs; HSW output;
Head amp/ Rotary outputs; built-in FG amp; output of 1/4 OSC oscillation clock (1 V[p-p])
Notes
See the next page for electrical characteristics, pin assignment and support tool.
MAD00043BEM
Electrical Characteristics
Supply current
Limit
Parameter
Symbol
Condition
Unit
min
Operating supply current
typ
max
IDD1
14.32 MHz operation without load, VDD = 5 V
50
100
mA
IDD2
1/1024 of 14.32 MHz operation without load, VDD = 2.7 V
2
5
mA
50
100
µA
10
µA
5
15
mA
5
20
µA
Stop of 14.32 MHz oscillation, VDD = 2.7 V
IDD3
32 kHz oscillation operation without load
Supply current at STOP
IDSP
Stop of oscillation without load, VDD = 5 V, Ta = 55 °C
IDHT0
14.32 MHz oscillation without load, VDD = 5 V
Supply current at HALT
Stop of 14.32 MHz oscillation, VDD = 2.7 V
IDHT1
32 kHz oscillation operation without load
(Ta = 25 °C ± 2 °C , VSS = 0 V)
A/D Converter Performance
Limit
Parameter
Symbol
Condition
Unit
min
Conversion relative error
A/D Conversion Time
Analog Input Voltage
typ
∆NLAD
tAD
max
±3
fosc = 14.32 MHz
LSB
µs
8
5
V
(Ta = 25 °C ± 2 °C , VDD = 5.0 V, VSS = 0 V)
MAD00043BEM
MN101D10F, MN101D10G
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
RCTLN
RCTLP
AVDD
CTLA
AVSS
VRI
VRO
AFG
FGF
YPG(↔P91)
YFG(PFG)
P92
PA0
PA1
PA2
PA3
PA4
PA5
PA6
SECAM(↔PA7)
FSCLPF(↔PB0)
FSCI(↔PB1)
AFCLPF(↔PB2
AFCC(↔PB3)
VDD2
Pin Assignment
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
MN101D10G
MN101D10F
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
CVIN2(PB4↔)
CVIN(PB5↔)
VSS2
CVOUT(PB6↔)
PB7
P20
P21
P22
SXI
XO(P23↔)
XI(P24↔)
VSS
OSCI
OSCO
VDD
SBUFD0(P25/PWM4↔)
PWM0
PWM1
SBUFD1(P11↔)
SBUFD2(P12↔)
SBUFD3(P13↔)
SBUFD4(P14/TC6O↔)
SBUFD5(P15↔)
SBUFD6(OSDH/P16/XDSCK↔)
SBUFD7(OSDV/P17/OSCDIV/XDSDAT↔
IRQ0(P64→)
IRQ1(P63↔)
IRQ2(P62↔)
IRQ3(P61↔)
IRQ4(P60↔)
P54
P53
P52
P51
NSDO(P50↔)
NSBT1(P07↔)
NSBI1(P06↔)
NSBO1(P05↔)
NSBT0(P02↔)
NSBI0(P01↔)
NSBO0(P00↔)
SDA(P27↔)
SCK(P26↔)
HBUFD6(P46↔)
HBUFD4(P44↔)
HBUFD2(P42↔)
HBUFD0(P40↔)
HSW
VLP
NRST(P04←)
CO
P90
AD11(↔PC3)
AD10(↔PC2)
AD9(↔PC1)
AD8(↔PC0)
AD7(↔P87)
AD6(↔P86)
AD5(↔P85)
AD4(↔P84)
AD3(↔P83)
AD2(↔P82)
AD1(↔P81)
AD0(↔P80)
P77
P76
P75
P74
P73
P72
P71
P70
ROTA(↔P67)
HAMP(↔P66)
DENV(↔P65)
QFP100-P-1818B
*Lead-free
Support Tool
In-circuit Emulator
PX-ICE101C / D + PX-PRB101D10-QFP100-P-1818B-CN-M
Flash Memory Built-in Type
Type
MN101DF10GAF
ROM (× 8-bit)
128 K
RAM (× 8-bit)
4K
Minimum instruction execution time
0.1397 µs (at 4.0 V to 5.5 V, 14.32 MHz)
71.5 µs (at 2.7 V to 5.5 V, fixed to 14.32 MHz internal division)
61 µs (at 2.5 V to 5.5 V, 32.768 kHz)
Package
MAD00043BEM
QFP100-P-1818B *Lead-free
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of
the products or technical information described in this material and controlled under the "Foreign Exchange
and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and
applied circuits examples of the products. It neither warrants non-infringement of intellectual property right
or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical
information as described in this material.
(4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are
required, or if the failure or malfunction of the products may directly jeopardize life or harm the human
body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without notice for
modification and/or improvement. At the final stage of your design, purchasing, or use of the products,
therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not
be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such
as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent
physical injury, fire, social damages, for example, by using the products.
(7) When using products for which damp-proof packing is required, observe the conditions (including shelf life
and amount of time let standing of unsealed items) agreed upon when specification sheets are individually
exchanged.
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written
permission of Matsushita Electric Industrial Co., Ltd.
2003 SEP
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