Vishay EBVW006A0B41Z 36 - 75vdc input; 12v/6adcoutput Datasheet

Data Sheet
September 14, 2012
EBVW006A0B Series (Eighth-Brick) DC-DC Converter Power Modules
36 - 75Vdc Input; 12V/6Adc Output
Barracuda Series™
Features



RoHS Compliant
Applications

Distributed Power Architectures

Wireless Networks

Access and Optical Network Equipment

Industrial Equipment














Options

Negative Remote On/Off logic (preferred)

Overcurrent/Overtemperature/Overvoltage
protections (Auto-restart) (preferred)

Heat plate version (-H)

Surface Mount version (-S)




Compliant to RoHS EU Directive 2002/95/EC (-Z
versions)
Flat and high-efficiency curve
Industry standard, DOSA compliant footprint
57.9mm x 22.8mm x 7.6mm
(2.28 in x 0.9 in x 0.30 in)
Low-profile height and reduced component skyline
Ultra-wide input voltage range: 36-75 Vdc
Tightly regulated output
Remote sense
Output voltage adjust: 90% to 110% of VO,nom
Constant switching frequency
Positive remote On/Off logic
Input under/overvoltage protection
Output overcurrent and overvoltage protection
Overtemperature protection
No reverse current during output shutdown
Wide operating temperature range (-40°C to 85°C)
Suitable for cold wall cooling using suitable Gap Pad
applied directly to top side of module
†
UL*Recognized to UL60950-1, CAN/CSA C22.2
‡
No.60950-1, and EN60950-1(VDE 0805-1) Licensed
§
CE mark meets 2006/95/EC directive
Meets the voltage and current requirements for ETSI
300-132-2 and complies with and licensed for basic
insulation rating per EN60950-1
2250 Vdc Isolation tested in compliance with IEEE
¤
802.3 PoE standards
**
ISO 9001 and ISO 14001 certified manufacturing
facilities
Description
The EBVW006A0B [Barracuda™] Series, eighth-brick, low-height power modules are isolated DC-DC converters
that provide a single, precisely regulated output voltage over an input voltage range of 36-75Vdc. The EBVW006A0B
provides 12Vdc nominal output voltage rated for 6Adc output current. The module incorporates Lineage Power’s vast
heritage for reliability and quality, while also using the latest in technology and component and process
standardization to achieve highly competitive cost. The open frame module construction, available in both surface
mount and through-hole packaging, enables designers to develop cost and space efficient solutions. The module
achieves typical full load efficiency greater than 90% at VIN=48Vdc. Standard features include remote On/Off, remote
sense, output voltage adjustment, overvoltage, overcurrent and overtemperature protection. An optional heat plate
allows for external standard, eighth-brick heat sink attachment to achieve higher output current in high temperature
applications.
* UL is a registered trademark of Underwriters Laboratories, Inc.
†
CSA is a registered trademark of Canadian Standards Association.
VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
§
This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed.
¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated.
** ISO is a registered trademark of the International Organization of Standards
‡
Document No: ver. 1.1
PDF name: EBVW006A0B.pdf
Data Sheet
September 14, 2012
EBVW006A0B Series Eighth-Brick Power Modules
36 - 75Vdc Input; 12V/6Adc Output
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute
stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those
given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can
adversely affect the device reliability.
Parameter
Device
Symbol
Min
Max
Unit
Input Voltage
Continuous
All
VIN
-0.3
80
Vdc
Transient, operational (≤100 ms)
All
VIN,trans
-0.3
100
Vdc
All
TA
-40
85
°C
Storage Temperature
All
Tstg
-55
125
°C
I/O Isolation Voltage (100% factory Hi-Pot tested)
All


2250
Vdc
Operating Ambient Temperature
(see Thermal Considerations section)
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load and temperature
conditions.
Parameter
Operating Input Voltage
Maximum Input Current
(VIN= VIN, min to VIN, max, VO= VO, set, IO=IO, max)
Input No Load Current
(VIN = 48V, IO = 0, module enabled)
Input Stand-by Current
Device
Symbol
Min
Typ
Max
Unit
All
VIN
36
48
75
Vdc
All
IIN
2.6
3.0
Adc
All
IIN,No load
80
IIN,stand-by
5
All
(VIN = 48V, module disabled)
I2t
mA
8
mA
0.5
A2s
Inrush Transient
All
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 1μH source impedance; VIN, min to VIN, max,
IO= IOmax ; See test configuration section)
All
30
mAp-p
Input Ripple Rejection (120Hz)
All
50
dB
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to an
integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included;
however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies
require a fast-acting fuse with a maximum rating of 10 A (see Safety Considerations section). Based on the
information provided in this data sheet on inrush energy and maximum DC input current, the same type of fuse with a
lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information.
LINEAGE POWER
2
Data Sheet
September 14, 2012
EBVW006A0B Series Eighth-Brick Power Modules
36 - 75Vdc Input; 12V/6Adc Output
Electrical Specifications (continued)
Parameter
Nominal Output Voltage Set-point
VIN= 48V IO=IO, max, TA=25°C)
Output Voltage
(Overall operating input voltage, resistive load, and
temperature conditions until end of life)
Output Regulation
Line (VIN=VIN, min to VIN, max)
Load (IO=IO, min to IO, max)
Temperature (Tref=TA, min to TA, max)
Output Ripple and Noise
(VIN=VIN, min to VIN, max, IO= IO, max , TA=TA, min to TA, max)
RMS (5Hz to 20MHz bandwidth)
Peak-to-Peak (5Hz to 20MHz bandwidth)
Device
Symbol
Min
Typ
Max
Unit
All
VO, set
11.80
12.00
12.24
Vdc
All
VO
11.64

12.36
Vdc
All
All
All






±0.2
±0.2
±1.0
% VO, set
% VO, set
% VO, set
All

25
50
mVrms
All

75
200
mVpk-pk

2,000
μF
6
Adc
9.0
Adc
External Capacitance
All
CO, max
0
Output Current
All
IO
0
All
IO, lim
6.6
All
IO, s/c
5
Arms
All
η
90.0
%
Output Current Limit Inception (Hiccup Mode )
(VO= 90% of VO, set)
Output Short-Circuit Current
(VO≤250mV) ( Hiccup Mode )
Efficiency
VIN=48V, TA=25°C, IO=3A, VO = 12V
7.8
All
η
90.5
%
All
fsw
280
kHz
All
Vpk

3

% VO, set
All
ts

200

µs
Device
Symbol
Min
Typ
Max
Unit
Isolation Capacitance
All
Ciso

1000

pF
Isolation Resistance
All
Riso
100


MΩ
I/O Isolation Voltage (100% factory Hi-pot tested)
All
All


2250
Vdc
Device
Symbol
Min
Typ
Max
VIN=48V, TA=25°C, IO=6A, VO = 12V
Switching Frequency
Dynamic Load Response
(dIo/dt=0.1A/µs; VIN = 48V; TA=25°C; CO>100μF)
Load Change from Io= 50% to 75% or 25% to 50% of
Io,max
Peak Deviation
Settling Time (Vo<10% peak deviation)
Isolation Specifications
Parameter
General Specifications
Parameter
Unit
9
Calculated Reliability based upon Telcordia SR-332
Issue 2: Method I Case 3 (IO=80%IO, max, TA=40°C,
airflow = 200 lfm, 90% confidence)
All
FIT
381.7
10 /Hours
All
MTBF
2,619,994
Hours
Weight (Open Frame)
All
19 (0.7)
g (oz.)
Weight (with Heat Plate)
All
30 (1.1)
g (oz.)
LINEAGE POWER
3
Data Sheet
September 14, 2012
EBVW006A0B Series Eighth-Brick Power Modules
36 - 75Vdc Input; 12V/6Adc Output
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load and temperature
conditions. See Feature Descriptions for additional information.
Parameter
Device
Symbol
Min
Typ
Max
Unit
Remote On/Off Signal Interface
(VIN=VIN, min to VIN, max ; open collector or equivalent,
Signal referenced to VIN- terminal)
Negative Logic: device code suffix “1”
Logic Low = module On, Logic High = module Off
Positive Logic: No device code suffix required
Logic Low = module Off, Logic High = module On
Logic Low - Remote On/Off Current
All
Ion/off


0.15
mA
Logic Low - On/Off Voltage
All
Von/off
-0.7

0.6
Vdc
Logic High Voltage – (Typ = Open Collector)
All
Von/off
2.5

6.7
Vdc
Logic High maximum allowable leakage current
All
Ion/off


25
μA
Case 1: Input power is applied for at least 1 second
then the On/Off input is set from OFF to ON
(Tdelay = On/Off pin transition until VO = 10% of VO, set)
All
Tdelay
―
12
―
msec
Case 2: On/Off input is set to Logic Low (Module
ON) then input power is applied
(Tdelay = VIN reaches VIN, min until Vo=10% of VO,set)
All
Tdelay
―
22
35
msec
Output voltage Rise time (time for Vo to rise from 10%
of Vo,set to 90% of Vo, set)
All
Trise
―
15
25
msec
―
3
% VO, set
10
% VO, set
110
% VO, set
16.5
Vdc
Turn-On Delay and Rise Times
(IO=IO, max , VIN=VIN, nom, TA = 25oC)
Output Voltage Overshoot – Startup
IO= IO, max; VIN=VIN, min to VIN, max, TA = 25 oC
All
Remote Sense Range
All
Output Voltage Adjustment Range
All
Output Overvoltage Protection
All
VSENSE
90
VO, limit
13.8

Overtemperature Protection – Hiccup Auto Restart
Heat Plate
Input Undervoltage Lockout
Open
frame
Heat
Plate
All
Tref
135
O
C
Tref
120
O
C
VUVLO
Turn-on Threshold

34
36
Vdc
Turn-off Threshold
28
31
32
Vdc
1
2.0
Turn-on Threshold
76
77

Turn-off Threshold

79
81
Vdc
Hysteresis
1
2

Vdc
Hysteresis
Input Overvoltage Lockout
LINEAGE POWER
All
Vdc
VOVLO
Vdc
4
Data Sheet
September 14, 2012
EBVW006A0B Series Eighth-Brick Power Modules
36 - 75Vdc Input; 12V/6Adc Output
Characteristic Curves
o
INPUT CURRENT, IIN (A)
EFFICIENCY, η (%)
The following figures provide typical characteristics for the EBVW006A0B (12.0V, 6A) at 25 C. The figures are
identical for either positive or negative remote On/Off logic.
OUTPUT CURRENT, IO (A)
Figure 2. Input Current versus Output Current.
OUTPUT VOLTAGE
VO (V) (5V/div)
OUTPUT VOLTAGE
VO (V) (100mV/div)
On/Off VOLTAGE
VOn/Off (V) (5V/div)
Figure 1. Converter Efficiency versus Output Current.
OUTPUT CURRENT, IO (A)
TIME, t (10ms/div)
TIME, t (2µs/div)
OUTPUT VOLTAGE
VO (V) (5V/div)
OUTPUT VOLTAGE OUTPUT CURRENT
VO (V) (200mV/div)
Io(A) (1A/div)
TIME, t (200µs/div)
Figure 5. Transient Response to 0.1A/µS Dynamic
Load Change from 50% to 75% to 50% of full load,
Vin=48V, CO>100μF.
LINEAGE POWER
Figure 4. Typical Start-up Using Remote On/Off,
negative logic version shown (VIN = 48V, Io = Io,max).
INPUT VOLTAGE
VIN (V) (20V/div)
Figure 3. Typical output ripple and noise (Io = Io,max).
TIME, t (10ms/div)
Figure 6. Typical Start-up Using Input Voltage (VIN =
48V, Io = Io,max).
5
Data Sheet
September 14, 2012
EBVW006A0B Series Eighth-Brick Power Modules
36 - 75Vdc Input; 12V/6Adc Output
Test Configurations
Design Considerations
Input Filtering
CURRENT PROBE
TO OSCILLOSCOPE
LTEST
Vin+
BATTERY
12μH
33-100μF
220μF
CS
E.S.R.<0.1Ω
@ 20°C 100kHz
The power module should be connected to a low AC
impedance source. Highly inductive source
impedance can affect the stability of the power
module. For the test configuration in Figure 7, a 33100μF electrolytic capacitor (ESR<0.7Ω at 100kHz),
mounting close to the power module helps ensure the
stability of the unit. Consult the factory for further
application guidelines.
Vin-
Safety Considerations
NOTE: Measure input reflected ripple current with a simulated
source inductance (LTEST) of 12μH. Capacitor CS offsets
possible battery impedance. Measure current as shown
above.
Figure 7. Input Reflected Ripple Current Test
Setup.
COPPER STRIP
VO (+)
RESISTIVE
LOAD
SCOPE
V O (– )
1uF
10uF
GROUND PLANE
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Figure 8. Output Ripple and Noise Test Setup.
Rdistribution
Rcontact
Rcontact
Vin+
RLOAD
VO
VIN
Rdistribution
Rcontact
Rcontact
Vin-
Rdistribution
Vout+
Rdistribution
Vout-
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Figure 9. Output Voltage and Efficiency Test
Setup.
VO. IO
Efficiency
η =
LINEAGE POWER
VIN. IIN
x
100 %
For safety-agency approval of the system in which the
power module is used, the power module must be
installed in compliance with the spacing and
separation requirements of the end-use safety agency
standard, i.e., UL60950-1, CSA C22.2 No.60950-1,
and VDE0805-1(IEC60950-1).
If the input source is non-SELV (ELV or a hazardous
voltage greater than 60 Vdc and less than or equal to
75Vdc), for the module’s output to be considered as
meeting the requirements for safety extra-low voltage
(SELV), all of the following must be true:

The input source is to be provided with reinforced
insulation from any other hazardous voltages,
including the AC mains.

One VIN pin and one VOUT pin are to be
grounded, or both the input and output pins are
to be kept floating.

The input pins of the module are not operator
accessible.

Another SELV reliability test is conducted on the
whole system (combination of supply source and
subject module) as required by the safety
agencies to verify that under a single fault,
hazardous voltages do not appear at the
module’s output.
Note: Do not ground either of the input pins of the
module without grounding one of the output
pins. This may allow a non-SELV voltage to
appear between the output pins and ground.
The power module has extra-low voltage (ELV)
outputs when all inputs are ELV.
All flammable materials used in the manufacturing of
these modules are rated 94V-0 or tested to the
UL60950 A.2 for reduced thickness.
For input voltages exceeding –60 Vdc but less than or
equal to –75 Vdc, these converters have been
evaluated to the applicable requirements of basic
insulation between secondary DC mains distribution
input (classified as TNV-2 in Europe) and unearthed
SELV outputs.
The input to these units is to be provided with a
maximum 10 A fast-acting fuse in the ungrounded
lead.
6
Data Sheet
September 14, 2012
EBVW006A0B Series Eighth-Brick Power Modules
36 - 75Vdc Input; 12V/6Adc Output
Feature Descriptions
Remote On/Off
Two remote On/Off options are available. Positive
logic turns the module on during a logic high voltage
on the On/Off pin and off during a logic low. Negative
logic remote On/Off, device code suffix “1”, turns the
module off during a logic high and on during a logic
low.
Vin+
The amount of power delivered by the module is
defined as the voltage at the output terminals
multiplied by the output current. When using remote
sense and trim, the output voltage of the module can
be increased, which at the same output current would
increase the power output of the module. Care should
be taken to ensure that the maximum output power of
the module remains at or below the maximum rated
power (maximum rated power = Vo,set x Io,max).
SENSE(+)
Vout+
Ion/off
SENSE(–)
SUPPLY
ON/OFF
TRIM
VI(+)
VO(+)
VI(-)
VO(–)
II
CONTACT
RESISTANCE
IO
LOAD
CONTACT AND
DISTRIBUTION LOSSES
Von/off
Vin-
Vout-
Figure 11. Circuit Configuration for Remote
Sense .
Input Undervoltage Lockout
Figure 10. Remote On/Off Implementation.
To turn the power module on and off, the user must
supply a switch (open collector or equivalent) to
control the voltage (Von/off) between the On/Off
terminal and the VIN(-) terminal (see Figure 10). Logic
low is 0V ≤ Von/off ≤ 1.2V. The maximum Ion/off during a
logic low is 1mA and the switch should maintain a
logic low level while sinking this current.
During a logic high, the typical maximum Von/off
generated by the module is 5.6V and the maximum
allowable leakage current at Von/off = 5.6V is 25μA.
If not using the remote On/Off feature:
For positive logic, leave the On/Off pin open.
For negative logic, short the On/Off pin to VIN(-).
Remote Sense
Remote sense minimizes the effects of distribution
losses by regulating the voltage at the remote-sense
connections (See Figure 11). The voltage between
the remote-sense pins and the output terminals must
not exceed the output voltage sense range given in
the Feature Specifications table:
[VO(+) – VO(–)] – [SENSE(+) – SENSE(–)] ≤ 0.5 V
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim.
At input voltages below the input undervoltage lockout
limit, the module operation is disabled. The module
will only begin to operate once the input voltage is
raised above the undervoltage lockout turn-on
threshold, VUV/ON.
Once operating, the module will continue to operate
until the input voltage is taken below the undervoltage
turn-off threshold, VUV/OFF.
Overtemperature Protection
To provide protection under certain fault conditions,
the unit is equipped with a thermal shutdown circuit.
The unit will shut down if the thermal reference point,
O
O
Tref, exceeds 135 C (Figure 13, typical) or 120 C
(Figure 14, typical), but the thermal shutdown is not
intended as a guarantee that the unit will survive
temperatures beyond its rating. The module will
automatically restart upon cool-down to a safe
temperature.
Output Overvoltage Protection
The output overvoltage protection scheme of the
modules has an independent overvoltage loop to
prevent single point of failure. This protection feature
latches in the event of overvoltage across the output.
Cycling the On/Off pin or input voltage resets the
latching protection feature. If the auto-restart option
(4) is ordered, the module will automatically restart
upon an internally programmed time elapsing.
Overcurrent Protection
To provide protection in a fault (output overload)
condition, the unit is equipped with internal
current-limiting circuitry and can endure current
limiting continuously. At the point of current-limit
inception, the unit enters hiccup mode. If the unit is
not configured with auto–restart, it will latch off
following the overcurrent condition. The module can
be restarted by cycling the DC input power for at least
LINEAGE POWER
7
Data Sheet
September 14, 2012
EBVW006A0B Series Eighth-Brick Power Modules
36 - 75Vdc Input; 12V/6Adc Output
one second or by toggling the remote On/Off signal
for at least one second.
If the unit is configured with the auto-restart option (4),
it will remain in the hiccup mode as long as the
overcurrent condition exists. Once the output current
is brought back into its specified range, the unit will
operate normally. The average output current during
hiccup is 10% IO, max.
Output Voltage Programming
VO(+)
Rtrim-up
ON/OFF
LOAD
VOTRIM
Rtrim-down
VIN(-)
 5.11 × 12.0 × (100 + 4) 511

Rtrim −up = 
−
− 10.22 ΚΩ
1.225 × 4
4


Rtrim −up = 1.16MΩ
Trimming allows the output voltage set point to be
increased or decreased from the default value. This is
accomplished by connecting an external resistor
between the TRIM pin and either the VO(+) pin or the
VO(-) pin.
VIN(+)
Where ∆ % =  Vdesired − 12.0  × 100


12.0


For example, to trim-up the output voltage of the
module by 4% to 12.48V, Rtrim-up is calculated is as
follows:
∆% = 4
VO(-)
Figure 12. Circuit Configuration to Trim Output
Voltage.
Connecting an external resistor (Rtrim-down) between
the TRIM pin and the VO(-) (or Sense(-)) pin
decreases the output voltage set point. To maintain
set point accuracy, the trim resistor tolerance should
be ±1.0%.
The following equation determines the required
external resistor value to obtain a percentage output
voltage change of Δ%
 511

− 10.22 ΚΩ
Rtrim − down = 
∆
%


Where ∆ % =  12.0V − Vdesired  × 100
12.0V


For example, to trim-down the output voltage of the
module by 6% to 11.28V, Rtrim-down is calculated as
follows:
The voltage between the VO(+) and VO(–) terminals
must not exceed the minimum output overvoltage
protection value shown in the Feature Specifications
table. This limit includes any increase in voltage due
to remote-sense compensation and output voltage
set-point adjustment trim.
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim. The amount of power
delivered by the module is defined as the voltage at
the output terminals multiplied by the output current.
When using remote sense and trim, the output
voltage of the module can be increased, which at the
same output current would increase the power output
of the module. Care should be taken to ensure that
the maximum output power of the module remains at
or below the maximum rated power (maximum rated
power = VO,set x IO,max).
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation and the need for increased
reliability. A reduction in the operating temperature of
the module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel.
The thermal reference points, Tref, used in the
specifications for open frame modules is shown in
Figure 13. For reliable operation, these temperatures
o
should not exceed 125 C.
∆% = 6
 511

Rtrim−down = 
− 10.22 ΚΩ
 6

AIRFLOW
Rtrim − down = 74.9ΚΩ
Connecting an external resistor (Rtrim-up) between the
TRIM pin and the VO(+) (or Sense (+)) pin increases
the output voltage set point. The following equation
determines the required external resistor value to
obtain a percentage output voltage change of Δ%:
 5.11 × 12.0 × (100 + ∆ %) 511

Rtrim −up = 
−
− 10.22 ΚΩ
1.225 × ∆ %
∆%


LINEAGE POWER
Figure 13. Tref Temperature Measurement
Locations for Open Frame Module.
The thermal reference point, Tref, used in the
specifications for modules with a heat plate is shown
in Figure 14. For reliable operation, this temperature
O
should not exceed 115 C.
8
Data Sheet
September 14, 2012
EBVW006A0B Series Eighth-Brick Power Modules
36 - 75Vdc Input; 12V/6Adc Output
AIRFLOW
cold wall, as shown in Figure 19. This capability is
achieved by insuring the top side component skyline
profile achieves no more than 1mm height difference
between the tallest and the shortest power train part
that benefits from contact with the gap pad material.
The output current derating versus cold wall
temperature, when using a gap pad such as Bergquist
GP2500S20, is shown in Figure 20.
Figure 14. Tref Temperature Measurement
Location for Module with Heat plate.
Heat Transfer via Convection
OUTPUT CURRENT, IO (A)
Please refer to the Application Note ‘Thermal
Characterization Process For Open-Frame BoardMounted Power Modules’ for a detailed discussion of
thermal aspects including maximum device
temperatures.
Figure 19. Cold Wall Mounting
OUTPUT CURRENT, IO (A)
Increased airflow over the module enhances the heat
transfer via convection. Derating curves showing the
maximum output current that can be delivered by
each module versus local ambient temperature (TA)
for natural convection and up to 2m/s (400 ft./min)
forced airflow are shown in Figures 15 - 36.
COLD PLATE TEMPERATURE, TC (oC)
Figure 20. Derated Output Current versus Cold
Wall Temperature with Local Ambient
Temperature Around Module at 85C; VIN = 48V.
Through-Hole Soldering Information
Lead-Free Soldering
AMBIENT TEMPERATURE, TA (oC)
OUTPUT CURRENT, IO (A)
Figure 15. Output Current Derating for the Open
Frame Module; Airflow in the Transverse Direction
from Vout(-) to Vout(+); VIN =48.
The EBVW006A0Bxx RoHS-compliant through-hole
products use SAC (Sn/Ag/Cu) Pb-free solder and
RoHS-compliant components. They are designed to
be processed through single or dual wave soldering
machines. The pins have a RoHS-compliant finish
that is compatible with both Pb and Pb-free wave
soldering processes. A maximum preheat rate of
3°C/s is suggested. The wave preheat process
should be such that the temperature of the power
module board is kept below 210°C. For Pb solder,
the recommended pot temperature is 260°C, while the
Pb-free solder pot is 270°C max.
Paste-in-Hole Soldering
AMBIENT TEMPERATURE, TA (oC)
Figure 16. Output Current Derating for the Module
with Heat plate; Airflow in the Transverse
Direction from Vout(-) to Vout(+);VIN =48V.
Heat Transfer via Conduction
The EBVW006A0Bxx module is compatible with
reflow paste-in-hole soldering processes shown in
Figures 23-25. Since the EBVW006A0BxxZ module is
not packaged per J-STD-033 Rev.A, the module must
be baked prior to the paste-in-hole reflow process.
EBVW006A0Bxx-HZ modules are not compatible with
paste-in-hole reflow soldering. Please contact your
Lineage Power Sales Representative for further
information.
The module can also be used in a sealed
environment with cooling via conduction from the
module’s top surface through a gap pad material to a
LINEAGE POWER
9
Data Sheet
September 14, 2012
EBVW006A0B Series Eighth-Brick Power Modules
36 - 75Vdc Input; 12V/6Adc Output
Surface Mount Information
MSL Rating
The EBVW006A0B-SZ module has a MSL rating of
2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are provided for the
EBVW006A0Bxx-SZ modules. These sealed
packages should not be broken until time of use.
Once the original package is broken, the floor life of
the product at conditions of ≤ 30°C and 60% relative
humidity varies according to the MSL rating (see JSTD-033A). The shelf life for dry packed SMT
packages is a minimum of 12 months from the bag
seal date, when stored at the following conditions: <
40° C, < 90% relative humidity.
Pick and Place
The EBVW006A0Bxx-S modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a
label designed to provide a large surface area for pick
and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
o
temperatures of up to 300 C. The label also carries
product information such as product code, serial
number and the location of manufacture.
technology called “Column Pin” (CP) connectors.
Figure 22 shows the new CP connector before and
after reflow soldering onto the end-board assembly.
The CP is constructed from a solid copper pin with an
integral solder ball attached, which is composed of
tin/lead (Sn/Pb) solder for non-Z codes, or Sn/Ag3/Cu
(SAC) solder for –Z codes.
Figure 22. Column Pin Connector Before and After
Reflow Soldering.
The CP connector design is able to compensate for
large amounts of planarity and still ensure a reliable
SMT solder joint. Typically, the eutectic solder melts
at 363°C (Sn/Pb solder) or 217-236°C (SAC solder),
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. The
following instructions must be observed when SMT
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
Tin Lead Soldering
Figure 21. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
Reflow Soldering Information
The surface mountable modules in the
EBVW006A0Bxx-S family use our newest SMT
LINEAGE POWER
The EBVW006A0Bxx-S power modules are lead free
modules and can be soldered either in a lead-free
solder process or in a conventional Tin/Lead (Sn/Pb)
process. It is recommended that the customer review
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following instructions must be observed when
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process,
peak reflow temperatures are limited to less than
235°C. Typically, the eutectic solder melts at 363°C,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
10
Data Sheet
September 14, 2012
EBVW006A0B Series Eighth-Brick Power Modules
36 - 75Vdc Input; 12V/6Adc Output
Surface Mount Information (continued)
Lead Free Soldering
The –Z version of the EBVW006A0B modules are
lead-free (Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and a
SnPb soldering process. Failure to observe the
instructions below may result in the failure of or cause
damage to the modules and can adversely affect
long-term reliability.
Pb-free Reflow Profile
Power systems will comply with J-STD-015 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
Per J-STD-020 Rev. C
Peak Temp 260°C
250
Reflow Temp (°C)
established by accurately measuring the modules CP
reliable soldering, the solder reflow profile should be
connector temperatures.
300
200
* Min. Time Above 235°C
15 Seconds
Cooling
Zone
150
Heating Zone
1°C/Second
*Time Above 217°C
60 Seconds
100
50
0
Reflow Time (Seconds)
Figure 25. Recommended linear reflow profile
using Sn/Ag/Cu solder.
Post Solder Cleaning and Drying
Considerations
REFLOW TEMP (°C)
Post solder cleaning is usually the final circuit board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001).
REFLOW TIME (S)
MAX TEMP SOLDER (°C)
Figure 23. Reflow Profile for Tin/Lead (Sn/Pb)
process.
o
Figure 24. Time Limit Curve Above 205 C for
Tin/Lead (Sn/Pb) process.
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure 25.
LINEAGE POWER
11
Data Sheet
September 14, 2012
EBVW006A0B Series Eighth-Brick Power Modules
36 - 75Vdc Input; 12V/6Adc Output
EMC Considerations
The circuit and plots in Figure 26 shows a suggested configuration to meet the conducted emission limits of EN55022
Class B.
Figure 26. EMC Considerations.
For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028).
VIN = 48V, Io = Io,max, L Line
LINEAGE POWER
VIN = 48V, Io = Io,max, N Line
12
Data Sheet
September 14, 2012
EBVW006A0B Series Eighth-Brick Power Modules
36 - 75Vdc Input; 12V/6Adc Output
Mechanical Outline for Through-Hole Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (unless otherwise indicated)
x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]
*Top side label includes Lineage Power name, product designation and date code.
LINEAGE POWER
13
Data Sheet
September 14, 2012
EBVW006A0B Series Eighth-Brick Power Modules
36 - 75Vdc Input; 12V/6Adc Output
Mechanical Outline for Surface Mount Module (-S Option)
Dimensions are in millimeters and [inches].
Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (unless otherwise indicated)
x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]
* Top side label includes Lineage Power name, product designation and date code.
LINEAGE POWER
14
Data Sheet
September 14, 2012
EBVW006A0B Series Eighth-Brick Power Modules
36 - 75Vdc Input; 12V/6Adc Output
Mechanical Outline for Through-Hole Module with Heat Plate (-H Option)
Dimensions are in millimeters and [inches].
Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (unless otherwise indicated)
x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]
LINEAGE POWER
15
Data Sheet
September 14, 2012
EBVW006A0B Series Eighth-Brick Power Modules
36 - 75Vdc Input; 12V/6Adc Output
Recommended Pad Layout
Dimensions are in millimeters and [inches].
Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (unless otherwise indicated)
x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]
Pin
1
2
3
4
5
6
7
8
Function
Vi(+)
ON/OFF
Vi(-)
Vo(-)
SENSE(-)
TRIM
SENSE(+)
Vo(+)
SMT Recommended Pad Layout (Component Side View)
Pin
Function
1
Vi(+)
2
ON/OFF
3
Vi(-)
4
Vo(-)
5
SENSE(-)
6
TRIM
7
SENSE(+)
8
Vo(+)
NOTES: FOR 0.030” X 0.025” RECTANGULAR PIN, USE 0.050” PLATED THROUGH-HOLE DIAMETER
FOR 0.62 DIA” PIN, USE 0.076” PLATED THROUGH-HOLE DIAMETER
TH Recommended Pad Layout (Component Side View)
LINEAGE POWER
16
Data Sheet
September 14, 2012
EBVW006A0B Series Eighth-Brick Power Modules
36 - 75Vdc Input; 12V/6Adc Output
Packaging Details
The surface mount versions of the EBVW006A0B
(suffix –S) are supplied as standard in the plastic trays
shown in Figure 27.
Each tray contains a total of 12 power modules. The
trays are self-stacking and each shipping box for the
EBVW006A0B (suffix –S) surface mount module
contains 4 full trays plus one empty hold-down tray
giving a total number of 48 power modules.
Tray Specification
Material
Max surface resistivity
Color
Capacity
Min order quantity
Antistatic coated PVC
12
10 Ω/sq
Clear
12 power modules
48 pcs (1 box of 4 full trays
+ 1 empty top tray)
Figure 27. Surface Mount Packaging Tray.
LINEAGE POWER
17
Data Sheet
September 14, 2012
EBVW006A0B Series Eighth-Brick Power Modules
36 - 75Vdc Input; 12V/6Adc Output
Ordering Information
Please contact your Lineage Power Sales Representative for pricing, availability and optional features.
Table 1. Device Codes
Product Codes
Input Voltage
Output Output
Voltage Current
On/Off
Logic
Connector
Type
EBVW006A0B41Z
48V (36-75Vdc)
12.0V
6A
Negative
Through-hole
EBVW006A0B41-HZ
48V (36-75Vdc)
12.0V
6A
Negative
Through-hole
EBVW006A0B41-SZ
48V (36-75Vdc)
12.0V
6A
Negative
Surface mount
Comcodes
150027602
Table 2. Device Coding Scheme and Options
Asia-Pacific Headquarters
Tel: +86.021.54279977*808
World Wide Headquarters
Lineage Power Corporation
601 Shiloh Road, Plano, TX 75074, USA
+1-888-LINEAGE(546-3243)
(Outside U.S.A.: +1-972-244-WATT(9288))
www.lineagepower.com
e-mail: [email protected]
Europe, Middle-East and Africa Headquarters
Tel: +49.89.878067-280
India Headquarters
Tel: +91.80.28411633
Lineage Power reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or
application. No rights under any patent accompany the sale of any such product(s) or information.
Lineage Power DC-DC products are protected under various patents. Information on these patents is available at www.lineagepower.com/patents.
© 2010 Lineage Power Corporation, (Plano, Texas) All International Rights Reserved.
Document No: ver. 1.1
PDF name: EBVW006A0B.pdf
Similar pages