AMIC LP62S1664C 64k x 16 bit low voltage cmos sram Datasheet

LP62S1664C Series
64K X 16 BIT LOW VOLTAGE CMOS SRAM
Document Title
64K X 16 BIT LOW VOLTAGE CMOS SRAM
Revision History
History
Issue Date
Remark
0.0
Initial issue
February 19, 2002
Preliminary
1.0
Final version release
July 16, 2003
Final
1.1
Add Pb-Free package type
August 9, 2004
1.2
Add access time 45ns grade
July 27, 2010
Rev. No.
(July, 2010, Version 1.2)
AMIC Technology, Corp.
LP62S1664C Series
64K X 16 BIT LOW VOLTAGE CMOS SRAM
Features
General Description
„ Operating voltage: 2.7V to 3.6V
„ Access times: 45/55/70 ns (max.)
„ Current:
LP62S1664C-45 series: Operating: 50mA (max.)
Standby:
5μA (max.)
LP62S1664C-55 series: Operating: 50mA (max.)
Standby:
5μA (max.)
LP62S1664C-70 series: Operating: 40mA (max.)
Standby:
5μA (max.)
„ Extended operating temperature range : -40°C to 85°C
for -LLI series
„ Full static operation, no clock or refreshing required
„ All inputs and outputs are directly TTL-compatible
„ Common I/O using three-state output
„ Data retention voltage: 2V (min.)
„ Available in 44-pin TSOP and 48-ball Mini BGA (6X8)
packages.
The LP62S1664C is a low operating current 1,048,576-bit
static random access memory organized as 65,536 words
by 16 bits and operates on low power supply voltage from
2.7V to 3.6V. It is built using AMIC’s high performance
CMOS process.
Inputs and three-state outputs are TTL compatible and
allow for direct interfacing with common system bus
structures.
The chip enable input is provided for POWER-DOWN,
device enable. Two byte enable inputs and an output
enable input are included for easy interfacing.
Data retention is guaranteed at a power supply voltage as
low as 2V.
Product Family
Power Dissipation
Product
Family
Operating
Temperature
VCC
Range
Speed
Data Retention
(ICCDR, Typ.)
Standby
(ISB1, Typ.)
Operating
(ICC2, Typ.)
LP62S1664C
-40°C ~ +85°C
2.7V~3.6V
45ns / 55ns / 70ns
0.2μA
0.3μA
3mA
Package
Type
44L TSOP
48B MBGA
1. Typical values are measured at VCC = 3.0V, TA = 25°C and not 100% tested.
2. Data retention current VCC = 2.0V.
Pin Configuration
„ TSOP (Type II)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
LP62S1664CV
A4
A3
A2
A1
A0
CE
I/O0
I/O1
I/O2
I/O3
VCC
GND
I/O4
I/O5
I/O6
I/O7
WE
A15
A14
A13
A12
NC
(July, 2010, Version 1.2)
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
„ Mini BGA (6X8) Top View
A5
A6
A7
OE
HB
LB
I/O15
I/O14
I/O13
I/O12
GND
VCC
I/O11
I/O10
I/O9
I/O8
NC
A8
A9
A10
A11
NC
1
2
3
4
5
6
A
LB
OE
A0
A1
A2
NC
B
I/O8
HB
A3
A4
CS
I/O0
C
I/O9
I/O10
A5
A6
I/O1
I/O2
D
VSS
I/O11
NC
A7
I/O3
VCC
E
VCC
I/O12
NC
NC
I/O4
VSS
F
I/O14
I/O13
A14
A15
I/O5
I/O6
G
I/O15
NC
A12
A13
WE
I/O7
H
NC
A8
A9
A10
A11
NC
LP62S1664CU
1
AMIC Technology, Corp.
LP62S1664C Series
Block Diagram
VCC
A0
GND
512 X 2048
DECODER
MEMORY ARRAY
A14
A15
I/O0
I/O8
INPUT
SENSE AMPS
INPUT
DATA
CIRCUIT
DATA
CIRCUIT
I/O15
I/O7
CE
LB
HB
OE
WE
CONTROL
CIRCUIT
(July, 2010, Version 1.2)
2
AMIC Technology, Corp.
LP62S1664C Series
Pin Description - TSOP
Pin No.
Symbol
Description
1 - 5, 18 - 21,
24 - 27,42 - 44
A0 - A15
6
CE
Chip Enable Input
7 - 10, 13 - 16,
29 - 32, 35 - 38
I/O0 - I/O15
Data Input/Outputs
17
WE
Write Enable Input
39
LB
Byte Enable Input (I/O0 to I/O7)
40
HB
Byte Enable Input (I/O8 to I/O15)
41
OE
Output Enable Input
11, 33
VCC
Power
12, 34
GND
Ground
22 , 23, 28
NC
Address Inputs
No Connection
Recommended DC Operating Conditions
(TA = -25°C to + 85°C for –LLT or -40°C to 85°C for -LLI)
Symbol
Parameter
Min.
Typ.
Max.
Unit
2.7
3.0
3.6
V
0
0
0
V
VCC
Supply Voltage
GND
Ground
VIH
Input High Voltage
2.2
-
VCC + 0.3
V
VIL
Input Low Voltage
-0.3
-
+0.6
V
CL
Output Load
-
-
30
pF
TTL
Output Load
-
-
1
-
(July, 2010, Version 1.2)
3
AMIC Technology, Corp.
LP62S1664C Series
Absolute Maximum Ratings*
*Comments
VCC to GND . . . . . . . . . . . . . . . . . . . . . -0.5V to +4.6V
IN, IN/OUT Volt to GND . . . . . . . . -0.5V to VCC + 0.5V
Operating Temperature, Topr . . . . . . . . -40°C to +85°C
Storage Temperature, Tstg . . . . . . . . . -55°C to +125°C
Power Dissipation, PT . . . . . . . . . . . . . . . . . . . . . 0.7W
Soldering Temp. & Time . . . . . . . . . . . . 260°C, 10 sec
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to this device.
These are stress ratings only. Functional operation of this
device at these or any other conditions above those
indicated in the operational sections of this specification is
not implied or intended. Exposure to the absolute
maximum rating conditions for extended periods may
affect device reliability.
DC Electrical Characteristics
(TA = -25°C to + 85°C for -LLT or -40°C to + 85°C for -LLI, VCC = 2.7V to 3.6V, GND = 0V)
Symbol
Parameter
LP62S1664C45LLT/LLI
LP62S1664C55LLT/LLI
LP62S1664C70LLT/LLI
Min.
Max.
Min.
Max.
Min.
Max.
-
1
-
1
-
1
⏐ILI⏐
Input Leakage
Current
⏐ILO⏐
Output Leakage
Current
-
1
-
1
-
ICC
Active Power
Supply Current
-
5
-
5
-
50
-
-
5
-
ICC1
ICC2
Dynamic
Operating
Current
ISB
ISB1
Standby Power
Supply Current
Unit
Conditions
μA
VIN = GND to VCC
1
μA
CE = VIH or OE = VIH or
LB = HB = VIH or
WE = VIL
VI/O = GND to VCC
-
5
mA
CE = VIL, II/O = 0mA
50
-
40
mA
Min. Cycle, Duty = 100%
CE = VIL, II/O = 0mA
-
5
-
5
mA
CE = VIL, VIH = VCC,
VIL = 0V, f = 1MHz,
II/O = 0 mA
0.3
-
0.3
-
0.3
mA
CE = VIH
-
5
-
5
-
5
μA
CE ≥ VCC - 0.2V
VIN ≥ 0V
VOL
Output Low
Voltage
-
0.4
-
0.4
-
0.4
V
IOL = 2.1mA
VOH
Output High
Voltage
2.2
-
2.2
-
2.2
-
V
IOH = -1.0mA
(July, 2010, Version 1.2)
4
AMIC Technology, Corp.
LP62S1664C Series
Truth Table
I/O0 to I/O7 Mode
I/O8 to I/O15 Mode
VCC Current
CE
OE
WE
LB
HB
H
X
X
X
X
Not selected
Not selected
ISB1, ISB
L
L
Read
Read
ICC1, ICC2, ICC
L
H
Read
High - Z
ICC1, ICC2, ICC
H
L
High - Z
Read
ICC1, ICC2, ICC
L
L
Write
Write
ICC1, ICC2, ICC
L
H
Write
Not Write/Hi - Z
ICC1, ICC2, ICC
H
L
Not Write/Hi - Z
Write
ICC1, ICC2, ICC
L
X
High - Z
High - Z
ICC1, ICC2, ICC
X
L
High - Z
High - Z
ICC1, ICC2, ICC
H
H
Not selected
L
L
L
X
L
H
X
L
H
H
X
X
Not selected
ISB1, ISB
Note: X = H or L
Capacitance (TA = 25°C, f = 1.0MHz)
Symbol
Parameter
Min.
Max.
Unit
Conditions
CIN*
Input Capacitance
-
6
pF
VIN = 0V
CI/O*
Input/Output Capacitance
-
8
pF
VI/O = 0V
* These parameters are sampled and not 100% tested.
(July, 2010, Version 1.2)
5
AMIC Technology, Corp.
LP62S1664C Series
AC Characteristics (TA = -25°C to +85°C for -LLT or -40°C to +85°C for -LLI, VCC = 2.7V to 3.6V)
Symbol
Parameter
LP62S1664C45LLT/LLI
LP62S1664C55LLT/LLI
LP62S1664C70LLT/LLI
Min.
Max.
Min.
Max.
Min.
Max.
45
-
55
-
70
-
ns
Unit
Read Cycle
tRC
Read Cycle Time
tAA
Address Access Time
-
45
-
55
-
70
ns
tACE
Chip Enable Access Time
-
45
-
55
-
70
ns
tBE
Byte Enable Access Time
-
45
-
55
-
70
ns
tOE
Output Enable to Output Valid
-
20
-
30
-
35
ns
tCLZ
Chip Enable to Output in Low Z
5
-
10
-
10
-
ns
tBLZ
Byte Enable to Output in Low Z
5
-
5
-
5
-
ns
tOLZ
Output Enable to Output in Low Z
5
-
5
-
5
-
ns
tCHZ
Chip Disable to Output in High Z
-
15
-
20
-
25
ns
tBHZ
Byte Disable to Output in High Z
-
15
-
20
-
25
ns
tOHZ
Output Disable to Output in High Z
-
15
-
20
-
25
ns
tOH
Output Hold from Address Change
5
-
5
-
10
-
ns
tWC
Write Cycle Time
45
-
55
-
70
-
ns
tCW
Chip Enable to End of Write
35
-
50
-
60
-
ns
tBW
Byte Enable to End of Write
35
-
50
-
60
-
ns
tAS
Address Setup Time
0
-
0
-
0
-
ns
tAW
Address Valid to End of Write
35
-
50
-
60
-
ns
tWP
Write Pulse Width
35
-
40
-
50
-
ns
tWR
Write Recovery Time
0
-
0
-
0
-
ns
tWHZ
Write to Output in High Z
-
20
-
25
-
30
ns
tDW
Data to Write Time Overlap
20
-
25
-
30
-
ns
tDH
Data Hold from Write Time
0
-
0
-
0
-
ns
tOW
Output Active from End of Write
5
-
5
-
5
-
ns
Write Cycle
Note: tCHZ, tBHZ and tOHZ and tWHZ are defined as the time at which the outputs achieve the open circuit condition and are
not referred to output voltage levels.
(July, 2010, Version 1.2)
6
AMIC Technology, Corp.
LP62S1664C Series
Timing Waveforms
Read Cycle 1(1, 2, 4)
tRC
Address
tAA
tOH
tOH
DOUT
Read Cycle 2(1, 2, 3)
tRC
Address
tAA
CE
tACE
tCHZ5
tCLZ5
tBE
HB, LB
tBLZ5
tBHZ5
OE
tOHZ5
tOE
tOLZ5
DOUT
Notes:
1. WE is high for Read Cycle.
2. Device is continuously enabled CE = VIL, HB = VIL and, or LB = VIL.
3. Address valid prior to or coincident with CE and ( HB and, or LB ) transition low.
4. OE = VIL.
5. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested.
(July, 2010, Version 1.2)
7
AMIC Technology, Corp.
LP62S1664C Series
Timing Waveforms (continued)
Write Cycle 1
(Write Enable Controlled)
tWC
Address
tWR3
tAW
tCW
CE
tBW
HB, LB
tAS1
tWP2
WE
tDH
tDW
DATA IN
tWHZ4
tOW
DATA OUT
Write Cycle 2
(Chip Enable Controlled)
tWC
Address
tAW
tAS1
tWR3
tCW2
CE
tBW
HB, LB
tWP
WE
tDW
tDH
DATA IN
tWHZ4
tOW
DATA OUT
(July, 2010, Version 1.2)
8
AMIC Technology, Corp.
LP62S1664C Series
Timing Waveforms (continued)
Write Cycle 3
(Byte Enable Controlled)
tWC
Address
tAW
tCW
CE
tAS1
tWR3
tBW2
HB, LB
tWP
WE
tDH
tDW
DATA IN
tWHZ4
tOW
DATA OUT
Notes: 1. tAS is measured from the address valid to the beginning of Write.
2. A Write occurs during the overlap (tWP, tBW) of a low CE , WE and ( HB and, or LB ).
3. tWR is measured from the earliest of CE or WE or ( HB and, or LB ) going high to the end of the Write cycle.
4. OE level is high or low.
5. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested.
(July, 2010, Version 1.2)
9
AMIC Technology, Corp.
LP62S1664C Series
AC Test Conditions
Input Pulse Levels
0V to 2.4V
Input Rise And Fall Time
5 ns
Input and Output Timing Reference Levels
1.5V
Output Load
See Figures 1 and 2
TTL
TTL
CL
CL
30pF
5pF
* Including scope and jig.
* Including scope and jig.
Figure 2. Output Load for tCLZ, tOLZ,
tCHZ, tOHZ, tWHZ, and tOW
Figure 1. Output Load
Data Retention Characteristics (TA = -25°C to 85°C for –LLT or -40°C to 85°C for -LLI)
Symbol
Parameter
Min.
Max.
Unit
Conditions
VDR
VCC for Data Retention
2.0
3.6
V
CE ≥ VCC - 0.2V
ICCDR
Data Retention Current
-
3*
μA
VCC = 2.0V,
CE ≥ VCC - 0.2V
VIN ≥ 0V
tCDR
Chip Disable to Data Retention Time
0
-
ns
tRC
-
ns
5
-
ms
tR
tVR
Operation Recovery Time
VCC Rise Time from Data Retention
Voltage to Operating Voltage
* LP62S1664C-45/55/70(LLT/LLI) ICCDR: max.
(July, 2010, Version 1.2)
See Retention Waveform
1μA at TA = 0°C to + 40°C
10
AMIC Technology, Corp.
LP62S1664C Series
Low VCC Data Retention Waveform
DATA RETENTION MODE
VCC
2.7V
tCDR
2.7V
tR
VDR ≥ 2V
tVR
CE
VIH
VIH
CE ≥ VDR - 0.2V
(July, 2010, Version 1.2)
11
AMIC Technology, Corp.
LP62S1664C Series
Ordering Information
Part No.
Access Time (ns)
Operating Current
Max. (mA)
Standby Current
Max. (μA)
45
50
5
LP62S1664CV-45LLIF
Package
44L Pb-Free TSOP
LP62S1664CU-45LLIF
48B Pb-Free Mini BGA
LP62S1664CV-55LLT
44L TSOP
LP62S1664CV-55LLTF
44L Pb-Free TSOP
LP62S1664CV-55LLI
44L TSOP
LP62S1664CV-55LLIF
55
50
5
44L Pb-Free TSOP
LP62S1664CU-55LLT
48B Mini BGA
LP62S1664CU-55LLTF
48B Pb-Free Mini BGA
LP62S1664CU-55LLI
48B Mini BGA
LP62S1664CU-55LLIF
48B Pb-Free Mini BGA
LP62S1664CV-70LLT
44L TSOP
LP62S1664CV-70LLTF
44L Pb-Free TSOP
LP62S1664CV-70LLI
44L TSOP
LP62S1664CV-70LLIF
70
40
5
44L Pb-Free TSOP
LP62S1664CU-70LLT
48B Mini BGA
LP62S1664CU-70LLTF
48B Pb-Free Mini BGA
LP62S1664CU-70LLI
48B Mini BGA
LP62S1664CU-70LLIF
48B Pb-Free Mini BGA
LLT : for -25°C ~ 85°C
LLI : for -40°C ~ 85°C
(July, 2010, Version 1.2)
12
AMIC Technology, Corp.
LP62S1664C Series
Package Information
TSOP 44L (Type II) Outline Dimensions
unit: inches/mm
E
E1
44
θ
L
L1
1
L
A2
A1
e
D
b
A
c
D
ZD
L1
y
Dimensions in inches
Dimensions in mm
Symbol
Min
Nom
Max
Min
Nom
Max
A
-
-
0.047
-
-
1.20
A1
0.002
-
0.006
0.05
-
0.15
A2
0.037
0.039
0.041
0.95
1.00
1.05
0.45
b
0.012
-
0.018
0.30
-
c
0.005
-
0.008
0.12
-
0.21
D
0.720
0.725
0.730
18.28
18.41
18.54
ZD
0.032 REF
0.805 REF
E
0.455
0.463
0.471
11.56
11.76
11.96
E1
0.395
0.400
0.405
10.03
10.16
10.29
L
0.019
0.023
0.027
0.49
0.59
0.69
L1
0.031 REF
e
0.80 REF
0.031 BSC
0.80 BSC
y
-
-
0.004
-
-
0.10
θ
0°
-
5°
0°
-
5°
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E1 does not include resin fins.
3. Dimension ZD includes end flash.
(July, 2010, Version 1.2)
13
AMIC Technology, Corp.
LP62S1664C Series
Package Information
Mini BGA 6X8 (48 BALLS) Outline Dimensions
unit : millimeter(mm)
Top View
Bottom View
Pin A1 Index
Pin A1 Index
6 5 4
3 2 1
C
C1
A
B
C
D
A
E
F
G
H
A
B
Diameter D
Solder Ball
B1
D
E2
0.10
E1
E
(July, 2010, Version 1.2)
Symbol
Min
Typ
Max
A
-
0.75
-
B
5.90
6.00
6.10
B1
-
3.75
-
C
7.90
8.00
8.10
C1
-
5.25
-
D
0.30
0.35
0.40
E
1.00
1.10
1.20
E1
-
0.36
-
E2
-
0.25
-
14
AMIC Technology, Corp.
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