ON MC74AC153DTR2 Dual 4−input multiplexer Datasheet

MC74AC153, MC74ACT153
Dual 4−Input Multiplexer
The MC74AC153/74ACT153 is a high−speed dual 4−input
multiplexer with common select inputs and individual enable inputs
for each section. It can select two lines of data from four sources. The
two buffered outputs present data in the true (non−inverted) form. In
addition to multiplexer operation, the MC74AC153/74ACT153 can
act as a function generator and generate any two functions of three
variables.
• Outputs Source/Sink 24 mA
• ′ACT153 Has TTL Compatible Inputs
w These devices are available in Pb−free package(s). Specifications herein
apply to both standard and Pb−free devices. Please see our website at
www.onsemi.com for specific Pb−free orderable part numbers, or
contact your local ON Semiconductor sales office or representative.
VCC
Eb
S0
I3b
I2b
I1b
I0b
Zb
16
15
14
13
12
11
10
9
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DIP−16
N SUFFIX
CASE 648
16
1
16
1
16
1
2
3
4
5
6
7
8
Ea
S1
I3a
I2a
I1a
I0a
Za
GND
Figure 1. Pinout: 16−Lead Packages Conductors
(Top View)
16
PIN ASSIGNMENT
PIN
FUNCTION
I0a−I3a
Side A Data Inputs
I0b−I3b
Side B Data Inputs
S0, S1
Common Select Inputs
Ea
Side A Enable Input
Eb
Side B Enable Input
Za
Side A Output
Zb
Side B Output
1
1
SO−16
D SUFFIX
CASE 751B
TSSOP−16
DT SUFFIX
CASE 948F
EIAJ−16
M SUFFIX
CASE 966
ORDERING INFORMATION
Device
Package
Shipping
MC74AC153N
PDIP−16
25 Units/Rail
MC74ACT153N
PDIP−16
25 Units/Rail
MC74AC153D
SOIC−16
48 Units/Rail
MC74ACT153D
SOIC−16
48 Units/Rail
MC74AC153DR2
SOIC−16
2500 Tape & Reel
MC74ACT153DR2
SOIC−16
2500 Tape & Reel
MC74AC153DT
TSSOP−16
96 Units/Rail
MC74ACT153DT
TSSOP−16
96 Units/Rail
MC74AC153DTR2
TSSOP−16 2500 Tape & Reel
MC74AC153M
EIAJ−16
50 Units/Rail
MC74ACT153M
EIAJ−16
50 Units/Rail
MC74AC153MEL
EIAJ−16
2000 Tape & Reel
MC74ACT153MEL
EIAJ−16
2000 Tape & Reel
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 7 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 7
1
Publication Order Number:
MC74AC153/D
MC74AC153, MC74ACT153
TRUTH TABLE
Select
Inputs
Inputs (a or b)
Output
S0
S1
E
I0
I1
I2
I3
Z
X
L
L
H
X
L
L
L
H
L
L
L
X
L
H
X
X
X
X
L
X
X
X
X
X
X
X
X
L
L
H
L
H
L
L
H
H
L
H
H
H
H
L
L
L
L
L
X
X
X
X
X
H
X
X
X
X
X
L
H
X
X
X
X
X
L
H
H
L
H
L
H
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
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2
MC74AC153, MC74ACT153
FUNCTIONAL DESCRIPTION
S0
The MC74AC153/74ACT153 is a dual 4−input
multiplexer. It can select two bits of data from up to four
sources under the control of the common Select inputs (S0,
S1). The two 4−input multiplexer circuits have individual
active−LOW Enables (Ea,Eb) which can be used to strobe
the outputs independently. When the Enables (Ea, Eb) are
HIGH, the corresponding outputs (Za, Zb) are forced LOW.
The MC74AC153/74ACT153 is the logic implementation
of a 2−pole, 4−position switch, where the position of the
switch is determined by the logic levels supplied to the two
Select inputs. The logic equations for the outputs are shown
below.
Za = Ea•(I0a•S1•S0+I1a•S1•S0+I2a•S1•S0+I3a•S1•S0)
Zb = Eb•(I0b•S1•S0+I1b•S1•S0+I2b•S1•S0+I3b•S1•S0)
Ea I0a I1a I2a I3a I0b I1b I2b I3b Eb
S1
Za
Zb
Figure 2. Logic Symbol
Ea I0a
I1a
I2a
I3a
S1
S0
I0b
Za
NOTE:
I2b
I1b
Zb
This diagram is provided only for the understanding of logic
operations and should not be used to estimate propagation
delays.
Figure 3. Logic Diagram
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3
I3b Eb
MC74AC153, MC74ACT153
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage (Referenced to GND)
−0.5 to +7.0
V
VIN
DC Input Voltage (Referenced to GND)
−0.5 to VCC +0.5
V
VOUT
DC Output Voltage (Referenced to GND)
−0.5 to VCC +0.5
V
IIN
DC Input Current, per Pin
±20
mA
IOUT
DC Output Sink/Source Current, per Pin
±50
mA
ICC
DC VCC or GND Current per Output Pin
±50
mA
Tstg
Storage Temperature
−65 to +150
°C
*Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC
Supply Voltage
VIN, VOUT
DC Input Voltage, Output Voltage (Ref. to GND)
tr, tf
Input Rise and Fall Time (Note 1)
′AC Devices except Schmitt Inputs
tr, tf
Input Rise and Fall Time (Note 2)
′ACT Devices except Schmitt Inputs
TJ
Junction Temperature (PDIP)
TA
Operating Ambient Temperature Range
IOH
IOL
Min
Typ
Max
′AC
2.0
5.0
6.0
′ACT
4.5
5.0
5.5
0
−
VCC
VCC @ 3.0 V
−
150
−
VCC @ 4.5 V
−
40
−
VCC @ 5.5 V
−
25
−
VCC @ 4.5 V
−
10
−
VCC @ 5.5 V
−
8.0
−
Unit
V
V
ns/V
ns/V
−
−
140
°C
−40
25
85
°C
Output Current − High
−
−
−24
mA
Output Current − Low
−
−
24
mA
1. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.
2. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
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MC74AC153, MC74ACT153
DC CHARACTERISTICS
Symbol
Parameter
VCC
(V)
74AC
74AC
TA = +25°C
TA =
−40°C to
+85°C
Typ
Unit
Conditions
Guaranteed Limits
VIH
Minimum High Level
Input Voltage
3.0
4.5
5.5
1.5
2.25
2.75
2.1
3.15
3.85
2.1
3.15
3.85
V
VOUT = 0.1 V
or VCC − 0.1 V
VIL
Maximum Low Level
Input Voltage
3.0
4.5
5.5
1.5
2.25
2.75
0.9
1.35
1.65
0.9
1.35
1.65
V
VOUT = 0.1 V
or VCC − 0.1 V
VOH
Minimum High Level
Output Voltage
3.0
4.5
5.5
2.99
4.49
5.49
2.9
4.4
5.4
2.9
4.4
5.4
V
3.0
4.5
5.5
−
−
−
2.56
3.86
4.86
2.46
3.76
4.76
3.0
4.5
5.5
0.002
0.001
0.001
0.1
0.1
0.1
0.1
0.1
0.1
3.0
4.5
5.5
−
−
−
0.36
0.36
0.36
0.44
0.44
0.44
5.5
−
±0.1
5.5
−
5.5
5.5
VOL
Maximum Low Level
Output Voltage
IIN
Maximum Input
Leakage Current
IOLD
†Minimum Dynamic
Output Current
IOHD
ICC
Maximum Quiescent
Supply Current
V
*VIN = VIL or VIH
−12 mA
IOH
−24 mA
−24 mA
IOUT = 50 mA
V
*VIN = VIL or VIH
12 mA
IOL
24 mA
24 mA
±1.0
mA
VI = VCC, GND
−
75
mA
VOLD = 1.65 V Max
−
−
−75
mA
VOHD = 3.85 V Min
−
8.0
80
mA
VIN = VCC or GND
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC.
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5
V
IOUT = −50 mA
MC74AC153, MC74ACT153
AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)
Symbol
VCC*
(V)
Parameter
74AC
74AC
TA = +25°C
CL = 50 pF
TA = −40°C
to +85°C
CL = 50 pF
Min
Typ
Max
Min
Max
Unit
Fig.
No.
tPLH
Propagation Delay
Sn to Zn
3.3
5.0
2.5
2.0
9.5
6.5
15.0
11.0
2.5
2.0
17.5
12.5
ns
3−6
tPHL
Propagation Delay
Sn to Zn
3.3
5.0
3.0
2.5
8.5
6.5
14.5
11.0
2.5
2.0
16.5
12.0
ns
3−6
tPLH
Propagation Delay
En to Zn
3.3
5.0
2.5
1.5
8.0
5.5
13.5
9.5
2.0
1.5
16.0
11.0
ns
3−6
tPHL
Propagation Delay
En to Zn
3.3
5.0
2.5
2.0
7.0
5.0
11.0
8.0
2.0
1.5
12.5
9.0
ns
3−6
tPLH
Propagation Delay
In to Zn
3.3
5.0
2.5
1.5
7.5
5.5
12.5
9.0
2.0
1.5
14.5
10.5
ns
3−5
tPHL
Propagation Delay
In to Zn
3.3
5.0
1.5
1.5
7.0
5.0
11.5
8.5
1.5
1.5
13.0
10.0
ns
3−5
*Voltage Range 3.3 V is 3.3 V ±0.3 V.
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
DC CHARACTERISTICS
Symbol
Parameter
VCC
(V)
74ACT
74ACT
TA = +25°C
TA =
−40°C to
+85°C
Typ
Guaranteed Limits
Unit
Conditions
VIH
Minimum High Level
Input Voltage
4.5
5.5
1.5
1.5
2.0
2.0
2.0
2.0
V
VOUT = 0.1 V
or VCC − 0.1 V
VIL
Maximum Low Level
Input Voltage
4.5
5.5
1.5
1.5
0.8
0.8
0.8
0.8
V
VOUT = 0.1 V
or VCC − 0.1 V
VOH
Minimum High Level
Output Voltage
4.5
5.5
4.49
5.49
4.4
5.4
4.4
5.4
V
4.5
5.5
−
−
3.86
4.86
3.76
4.76
4.5
5.5
0.001
0.001
0.1
0.1
0.1
0.1
4.5
5.5
−
−
0.36
0.36
0.44
0.44
V
*VIN = VIL or VIH
24 mA
IOL
24 mA
VOL
Maximum Low Level
Output Voltage
V
V
IOUT = −50 mA
*VIN = VIL or VIH
−24 mA
IOH
−24 mA
IOUT = 50 mA
IIN
Maximum Input
Leakage Current
5.5
−
±0.1
±1.0
mA
VI = VCC, GND
DICCT
Additional Max. ICC/Input
5.5
0.6
−
1.5
mA
VI = VCC − 2.1 V
IOLD
†Minimum Dynamic
Output Current
5.5
−
−
75
mA
VOLD = 1.65 V Max
5.5
−
−
−75
mA
VOHD = 3.85 V Min
5.5
−
8.0
80
mA
VIN = VCC or GND
IOHD
ICC
Maximum Quiescent
Supply Current
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
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6
MC74AC153, MC74ACT153
AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)
Symbol
VCC*
(V)
Parameter
74ACT
74ACT
TA = +25°C
CL = 50 pF
TA = −40°C
to +85°C
CL = 50 pF
Min
Typ
Max
Min
Max
Unit
Fig.
No.
tPLH
Propagation Delay
Sn to Zn
5.0
3.0
7.0
11.5
2.0
13.5
ns
3−6
tPHL
Propagation Delay
Sn to Zn
5.0
3.0
7.0
11.5
2.5
13.5
ns
3−6
tPLH
Propagation Delay
En to Zn
5.0
2.0
6.5
10.5
2.0
12.5
ns
3−6
tPHL
Propagation Delay
En to Zn
5.0
3.0
6.0
9.5
2.5
11.0
ns
3−6
tPLH
Propagation Delay
In to Zn
5.0
2.5
5.5
9.5
2.0
11.0
ns
3−5
tPHL
Propagation Delay
In to Zn
5.0
2.0
5.5
9.5
2.0
11.0
ns
3−5
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
CAPACITANCE
Symbol
Parameter
Value
Typ
Unit
Test Conditions
CIN
Input Capacitance
4.5
pF
VCC = 5.0 V
CPD
Power Dissipation Capacitance
65
pF
VCC = 5.0 V
MARKING DIAGRAMS
DIP−16
SO−16
MC74AC153N
AWLYYWW
AC153
AWLYWW
MC74ACT153N
AWLYYWW
ACT153
AWLYWW
A
WL, L
YY, Y
WW, W
= Assembly Location
= Wafer Lot
= Year
= Work Week
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7
TSSOP−16
EIAJ−16
AC
153
ALYW
74AC153
ALYW
ACT
153
ALYW
74ACT153
ALYW
MC74AC153, MC74ACT153
PACKAGE DIMENSIONS
PDIP−16
N SUFFIX
16 PIN PLASTIC DIP PACKAGE
CASE 648−08
ISSUE R
−A−
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
B
F
C
DIM
A
B
C
D
F
G
H
J
K
L
M
S
L
S
SEATING
PLANE
−T−
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
T A
M
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
SO−16
D SUFFIX
16 PIN PLASTIC SOIC PACKAGE
CASE 751B−05
ISSUE J
−A−
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
−B−
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
−T−
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
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8
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
MC74AC153, MC74ACT153
PACKAGE DIMENSIONS
TSSOP−16
DT SUFFIX
16 PIN PLASTIC TSSOP PACKAGE
CASE948F−01
ISSUE O
16X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
S
K
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
K1
2X
L/2
16
9
J1
B
−U−
L
SECTION N−N
J
PIN 1
IDENT.
8
1
N
0.15 (0.006) T U
S
0.25 (0.010)
A
−V−
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE −W−.
N
F
DETAIL E
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
D
DETAIL E
H
G
EIAJ−16
M SUFFIX
16 PIN PLASTIC EIAJ PACKAGE
CASE966−01
ISSUE O
16
LE
9
Q1
E HE
1
M_
L
8
Z
DETAIL P
D
e
VIEW P
A
A1
b
0.13 (0.005)
c
M
0.10 (0.004)
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9
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.18
0.28
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193
0.200
0.169
0.177
−−−
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.007
0.011
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
−−−
2.05
0.05
0.20
0.35
0.50
0.18
0.27
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
−−−
0.78
INCHES
MIN
MAX
−−−
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
−−−
0.031
MC74AC153, MC74ACT153
Notes
http://onsemi.com
10
MC74AC153, MC74ACT153
Notes
http://onsemi.com
11
MC74AC153, MC74ACT153
Notes
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12
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MC74AC153/D
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