ATMEL AT27LV256A-90TI 256k (32k x 8) low-voltage otp eprom Datasheet

Features
• Fast Read Access Time – 55 ns
• Dual Voltage Range Operation
•
•
•
•
•
•
•
•
•
– Low-voltage Power Supply Range, 3.0V to 3.6V
or Standard 5V ± 10% Supply Range
Pin Compatible with JEDEC Standard AT27C256R
Low-power CMOS Operation
– 20 µA Max (Less than 1 µA Typical) Standby for VCC = 3.6V
– 29 mW Max Active at 5 MHz for VCC = 3.6V
JEDEC Standard Packages
– 32-lead PLCC
– 28-lead SOIC
– 28-lead TSOP
High-reliability CMOS Technology
– 2,000V ESD Protection
– 200 mA Latchup Immunity
Rapid Programming Algorithm – 100 µs/Byte (Typical)
CMOS and TTL Compatible Inputs and Outputs
– JEDEC Standard for LVTTL
Integrated Product Identification Code
Industrial Temperature Range
Green (Pb/Halide-free) Packaging Option
256K (32K x 8)
Low-voltage
OTP EPROM
AT27LV256A
1. Description
The AT27LV256A is a high-performance, low-power, low-voltage 262,144-bit onetime programmable read-only memory (OTP EPROM) organized as 32K by 8 bits. It
requires only one supply in the range of 3.0V to 3.6V in normal read mode operation,
making it ideal for fast, portable systems using battery power.
Atmel’s innovative design techniques provide fast speeds that rival 5V parts while
keeping the low power consumption of a 3.3V supply. At VCC = 3.0V, any byte can be
accessed in less than 55 ns. With a typical power dissipation of only 18 mW at 5 MHz
and VCC = 3.3V, the AT27LV256A consumes less than one fifth the power of a standard 5V EPROM. Standby mode supply current is typically less than 1 µA at 3.3V.
The AT27LV256A is available in industry-standard JEDEC-approved one-time
programmable (OTP) plastic PLCC, SOIC and TSOP packages. All devices feature
two-line control (CE, OE) to give designers the flexibility to prevent bus contention.
The AT27LV256A operating with VCC at 3.0V produces TTL level outputs that are
compatible with standard TTL logic devices operating at VCC = 5.0V. The device is
also capable of standard 5-volt operation making it ideally suited for dual supply range
systems or card products that are pluggable in both 3-volt and 5-volt hosts.
Atmel’s AT27LV256A has additional features to ensure high quality and efficient production use. The Rapid Programming Algorithm reduces the time required to program
the part and guarantees reliable programming. Programming time is typically only
100 µs/byte. The Integrated Product Identification Code electronically identifies the
device and manufacturer. This feature is used by industry-standard programming
equipment to select the proper programming algorithms and voltages. The
AT27LV256A programs exactly the same way as a standard 5V AT27C256R and
uses the same programming equipment.
0547G–EPROM–12/07
AT27LV256A
2. Pin Configurations
Pin Name
Function
A0 - A14
Addresses
O0 - O7
Outputs
CE
Chip Enable
OE
Output Enable
NC
No Connect
2.1
28-lead SOIC Top View
1
2
3
4
5
6
7
8
9
10
11
12
13
14
VPP
A12
A7
A6
A5
A4
A3
A2
A1
A0
O0
O1
O2
GND
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VCC
A14
A13
A8
A9
A11
OE
A10
CE
O7
O6
O5
O4
O3
OE
A11
A9
A8
A13
A14
VCC
VPP
A12
A7
A6
A5
A4
A3
28-lead TSOP (Type 1) Top View
22
23
24
25
26
27
28
1
2
3
4
5
6
7
21
20
19
18
17
16
15
14
13
12
11
10
9
8
A10
CE
O7
O6
O5
O4
O3
GND
O2
O1
O0
A0
A1
A2
32-lead PLCC Top View
29
28
27
26
25
24
23
22
21
14
15
16
17
18
19
20
5
6
7
8
9
10
11
12
13
A8
A9
A11
NC
OE
A10
CE
O7
O6
O1
O2
GND
NC
O3
O4
O5
A6
A5
A4
A3
A2
A1
A0
NC
O0
4
3
2
1
32
31
30
A7
A12
VPP
NC
VCC
A14
A13
2.2
2.3
Note:
1. PLCC Package Pins 1 and 17 are Don’t Connect.
2
0547G–EPROM–12/07
AT27LV256A
3. System Considerations
Switching between active and standby conditions via the Chip Enable pin may produce transient voltage excursions. Unless accommodated by the system design, these transients may
exceed datasheet limits, resulting in device non-conformance. At a minimum, a 0.1 µF high
frequency, low inherent inductance, ceramic capacitor should be utilized for each device. This
capacitor should be connected between the VCC and Ground terminals of the device, as close
to the device as possible. Additionally, to stabilize the supply voltage level on printed circuit
boards with large EPROM arrays, a 4.7 µF bulk electrolytic capacitor should be utilized, again
connected between the VCC and Ground terminals. This capacitor should be positioned as
close as possible to the point where the power supply is connected to the array.
4. Block Diagram
5. Absolute Maximum Ratings*
Temperature Under Bias.................................. -40°C to +85°C
Storage Temperature ..................................... -65°C to +125°C
Voltage on Any Pin with
Respect to Ground .........................................-2.0V to +7.0V(1)
Voltage on A9 with
Respect to Ground ......................................-2.0V to +14.0V(1)
*NOTICE:
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability
VPP Supply Voltage with
Respect to Ground .......................................-2.0V to +14.0V(1)
Note:
1. Minimum voltage is -0.6V DC which may undershoot to -2.0V for pulses of less than 20 ns. Maximum output pin voltage is
VCC + 0.75V DC which may be exceeded if certain precautions are observed (consult application notes) and which may
overshoot to +7.0V for pulses of less than 20 ns.
3
0547G–EPROM–12/07
6. Operating Modes
Mode/Pin
Read(2)
Output Disable
Standby
(2)
CE
OE
Ai
VPP
VCC
Outputs
VIL
VIL
Ai
VIL
(2)
Rapid Program(3)
(3)
(3)
Optional PGM Verify
(1)
VCC
DOUT
VCC
VCC
High Z
(1)
X
VIH
X
X
VCC
VCC
High Z
VIL
VIH
Ai
VPP
VCC
DIN
X
VIL
Ai
VPP
VCC
DOUT
VIL
VIL
Ai
VCC
VCC
DOUT
(1)
PGM Verify
VIH
VCC
(1)
(3)
PGM Inhibit
VIH
VIH
X
VPP
VCC
High Z
Product Identification(3)(5)
VIL
VIL
A9 = VH(4)
A0 = VIH or VIL
A1 - A14 = VIL
VCC
VCC
Identification Code
Notes:
(1)
1. X can be VIL or VIH.
2. Read, output disable, and standby modes require, 3.0V ≤VCC ≤3.6V, or 4.5V ≤VCC ≤5.5V.
3. Refer to Programming Characteristics. Programming modes require VCC = 6.5V.
4. VH = 12.0 ± 0.5V.
5. Two identifier bytes may be selected. All Ai inputs are held low (VIL), except A9 which is set to VH and A0 which is toggled
low (VIL) to select the Manufacturer’s Identification byte and high (VIH) to select the Device Code byte.
7. DC and AC Operating Conditions for Read Operation
AT27LV256A
Industrial Operating Temperature (Case)
VCC Power Supply
4
-55
-90
-40°C - 85°C
-40°C - 85°C
3.0V to 3.6V
3.0V to 3.6V
5V ± 10%
5V ± 10%
AT27LV256A
0547G–EPROM–12/07
AT27LV256A
8. DC and Operating Characteristics for Read Operation
Symbol
Parameter
Condition
Min
Max
Units
VCC = 3.0V to 3.6V
ILI
Input Load Current
VIN = 0V to VCC
±1
µA
ILO
Output Leakage Current
VOUT = 0V to VCC
±5
µA
IPP1(2)
VPP(1) Read/Standby Current
VPP = VCC
10
µA
VCC(1) Standby Current
ISB1 (CMOS), CE = VCC ± 0.3V
20
µA
ISB
ISB2 (TTL), CE = 2.0 to VCC + 0.5V
100
µA
ICC
VCC Active Current
8
mA
VIL
Input Low Voltage
-0.6
0.8
V
VIH
Input High Voltage
2.0
VCC + 0.5
V
VOL
Output Low Voltage
IOL = 2.0 mA
0.4
V
VOH
Output High Voltage
IOH = -2.0 mA
f = 5 MHz, IOUT = 0 mA, CE = VIL
2.4
V
VCC = 4.5V to 5.5V
ILI
ILO
IPP1
(2)
Input Load Current
VIN = 0V to VCC
±1
µA
Output Leakage Current
VOUT = 0V to VCC
±5
µA
VPP(1)
VPP = VCC
10
µA
ISB1 (CMOS), CE = VCC ± 0.3V
100
µA
ISB2 (TTL), CE = 2.0 to VCC + 0.5V
1
mA
f = 5 MHz, IOUT = 0 mA, CE = VIL
20
mA
Read/Standby Current
ISB
VCC(1) Standby Current
ICC
VCC Active Current
VIL
Input Low Voltage
-0.6
0.8
V
VIH
Input High Voltage
2.0
VCC + 0.5
V
VOL
Output Low Voltage
IOL = 2.1 mA
0.4
V
Output High Voltage
IOH = -400 µA
VOH
Notes:
2.4
V
1. VCC must be applied simultaneously with or before VPP, and removed simultaneously with or after VPP.
2. VPP may be connected directly to VCC, except during programming. The supply current would then be the sum of ICC and IPP.
5
0547G–EPROM–12/07
9. AC Characteristics for Read Operation
VCC = 3.0V to 3.6V and 4.5V to 5.5V
AT27LV256A
-55
Symbol
Parameter
Condition
Address to Output Delay
CE = OE = VIL
tCE(2)
CE to Output Delay
tOE(2)(3)
OE to Output Delay
tDF(4)(5)
OE or CE High to Output Float,
Whichever Occurred First
tOH
Output Hold from Address, CE or OE,
Whichever Occurred First
tACC
(3)
-90
Max
Units
55
90
ns
OE = VIL
55
90
ns
CE = VIL
35
50
ns
30
40
ns
Max
Min
0
Min
0
ns
10. AC Waveforms for Read Operation(1)
Notes:
1. Timing measurement references are 0.8V and 2.0V. Input AC drive levels are 0.45V and 2.4V, unless otherwise specified.
2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE.
3. OE may be delayed up to tACC - tOE after the address is valid without impact on tACC.
4. This parameter is only sampled and is not 100% tested.
5. Output float is defined as the point when data is no longer driven.
6
AT27LV256A
0547G–EPROM–12/07
AT27LV256A
11. Input Test Waveforms and Measurement Levels
tR, tF < 20 ns (10% to 90%)
12. Output Test Load
Note: CL = 100 pF including
jig capacitance.
13. Pin Capacitance
f = 1 MHz, T = 25°C(1)
Symbol
Typ
Max
Units
Conditions
CIN
4
8
pF
VIN = 0V
COUT
8
12
pF
VOUT = 0V
Note:
1. Typical values for nominal supply voltage. This parameter is only sampled and is not 100% tested.
7
0547G–EPROM–12/07
14. Programming Waveforms(1)
Notes:
1. The Input Timing Reference is 0.8V for VIL and 2.0V for VIH.
2. tOE and tDFP are characteristics of the device but must be accommodated by the programmer.
3. When programming the AT27LV256A a 0.1 µF capacitor is required across VPP and ground to suppress spurious voltage
transients.
8
AT27LV256A
0547G–EPROM–12/07
AT27LV256A
15. DC Programming Characteristics
TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V
Limits
Symbol
Parameter
Test Conditions
ILI
Input Load Current
VIN = VIL, VIH
VIL
Input Low Level
VIH
Input High Level
VOL
Output Low Voltage
IOL = 2.1 mA
VOH
Output High Voltage
IOH = -400 µA
ICC2
VCC Supply Current (Program and Verify)
IPP2
VPP Current
VID
A9 Product Identification Voltage
Min
Max
Units
±10
µA
-0.6
0.8
V
2.0
VCC + 0.5
V
0.4
V
2.4
V
25
mA
25
mA
12.5
V
CE = VIL
11.5
16. AC Programming Characteristics
TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V
Limits
Symbol
Parameter
tAS
Address Setup Time
tOES
OE Setup Time
tDS
Data Setup Time
tAH
Address Hold Time
tDH
Data Hold Time
tDFP
Test Conditions
Min
Input Rise and Fall Times:
(10% to 90%) 20 ns
Input Pulse Levels:
0.45V to 2.4V
(2)
OE High to Output Float Delay
Max
VPP Setup Time
tVCS
VCC Setup Time
tPW
CE Program Pulse Width(3)
tOE
Data Valid from OE(2)
tPRT
VPP Pulse Rise Time During Programming
Units
2
µs
2
µs
2
µs
0
µs
2
µs
0
tVPS
Notes:
(1)
130
ns
Input Timing Reference Level:
0.8V to 2.0V
2
µs
2
µs
Output Timing Reference Level:
0.8V to 2.0V
95
105
µs
150
ns
50
ns
1. VCC must be applied simultaneously or before VPP and removed simultaneously or after VPP.
2. This parameter is only sampled and is not 100% tested. Output Float is defined as the point where data is no longer driven –
see timing diagram.
3. Program Pulse width tolerance is 100 µsec ± 5%.
17. Atmel’s AT27LV256A Integrated Product Identification Code(1)
Pins
A0
O7
O6
O5
O4
O3
O2
O1
O0
Hex
Data
Manufacturer
0
0
0
0
1
1
1
1
0
1E
Device Type
1
1
0
0
0
1
1
0
0
8C
Codes
Note:
1. The AT27LV256A has the same Product Identification Code as the AT27C256R. Both are programming compatible.
9
0547G–EPROM–12/07
18. Rapid Programming Algorithm
A 100 µs CE pulse width is used to program. The address is set to the first location. VCC is
raised to 6.5V and VPP is raised to 13.0V. Each address is first programmed with one 100 µs
CE pulse without verification. Then a verification/reprogramming loop is executed for each
address. In the event a byte fails to pass verification, up to 10 successive 100 µs pulses are
applied with a verification after each pulse. If the byte fails to verify after 10 pulses have been
applied, the part is considered failed. After the byte verifies properly, the next address is
selected until all have been checked. VPP is then lowered to 5.0V and VCC to 5.0V. All bytes
are read again and compared with the original data to determine if the device passes or fails.
10
AT27LV256A
0547G–EPROM–12/07
AT27LV256A
19. Ordering Information
19.1
Standard Package
ICC (mA)
tACC
(ns)
Active
Standby
55
8
90
8
Note:
19.2
Ordering Code
Package
0.02
AT27LV256A-55JI
AT27LV256A-55RI
AT27LV256A-55TI
32J
28R(1)
28T
Industrial
(-40° C to 85° C)
0.02
AT27LV256A-90JI
AT27LV256A-90RI
AT27LV256A-90TI
32J
28R(1)
28T
Industrial
(-40° C to 85° C)
Not recommended for new designs. Use Green package option.
Green Package Option (Pb/Halide-free)
ICC (mA)
tACC
(ns)
Active
Standby
55
8
90
8
Note:
Operation Range
Ordering Code
Package
Operation Range
0.02
AT27LV256A-55JU
AT27LV256A-55RU
AT27LV256A-55TU
32J
28R(1)
28T
Industrial
(-40° C to 85° C)
0.02
AT27LV256A-90JU
AT27LV256A-90RU
AT27LV256A-90TU
32J
28R(1)
28T
Industrial
(-40° C to 85° C)
1. The 28-pin SOIC package is not recommended for new designs.
Package Type
32J
32-lead, Plastic J-leaded Chip Carrier (PLCC)
28R
28-lead, 0.330" Wide, Plastic Gull Wing Small Outline (SOIC)
28T
28-lead, Thin Small Outline Package (TSOP)
11
0547G–EPROM–12/07
20. Packaging Information
20.1
32J – PLCC
1.14(0.045) X 45˚
PIN NO. 1
IDENTIFIER
1.14(0.045) X 45˚
0.318(0.0125)
0.191(0.0075)
E1
E2
B1
E
B
e
A2
D1
A1
D
A
0.51(0.020)MAX
45˚ MAX (3X)
COMMON DIMENSIONS
(Unit of Measure = mm)
D2
Notes:
1. This package conforms to JEDEC reference MS-016, Variation AE.
2. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is .010"(0.254 mm) per side. Dimension D1
and E1 include mold mismatch and are measured at the extreme
material condition at the upper or lower parting line.
3. Lead coplanarity is 0.004" (0.102 mm) maximum.
SYMBOL
MIN
NOM
MAX
A
3.175
–
3.556
A1
1.524
–
2.413
A2
0.381
–
–
D
12.319
–
12.573
D1
11.354
–
11.506
D2
9.906
–
10.922
E
14.859
–
15.113
E1
13.894
–
14.046
E2
12.471
–
13.487
B
0.660
–
0.813
B1
0.330
–
0.533
e
NOTE
Note 2
Note 2
1.270 TYP
10/04/01
R
12
2325 Orchard Parkway
San Jose, CA 95131
TITLE
32J, 32-lead, Plastic J-leaded Chip Carrier (PLCC)
DRAWING NO.
REV.
32J
B
AT27LV256A
0547G–EPROM–12/07
AT27LV256A
20.2
28R – SOIC
B
E
E1
PIN 1
e
D
A
A1
COMMON DIMENSIONS
(Unit of Measure = mm)
0º ~ 8º
C
L
Note: 1. Dimensions D and E1 do not include mold Flash
or protrusion. Mold Flash or protrusion shall not exceed
0.25 mm (0.010").
SYMBOL
MIN
NOM
MAX
A
2.39
–
2.79
A1
0.050
–
0.356
D
18.00
–
18.50
E
11.70
–
12.50
E1
8.59
–
8.79
B
0.356
–
0.508
C
0.203
–
0.305
L
0.94
–
1.27
e
NOTE
Note 1
Note 1
1.27 TYP
5/18/2004
R
2325 Orchard Parkway
San Jose, CA 95131
TITLE
28R, 28-lead, 0.330" Body Width,
Plastic Gull Wing Small Outline (SOIC)
DRAWING NO.
REV.
28R
C
13
0547G–EPROM–12/07
20.3
28T – TSOP
PIN 1
0º ~ 5º
c
Pin 1 Identifier Area
D1 D
L
b
e
L1
A2
E
A
GAGE PLANE
SEATING PLANE
COMMON DIMENSIONS
(Unit of Measure = mm)
A1
MIN
NOM
MAX
A
–
–
1.20
A1
0.05
–
0.15
A2
0.90
1.00
1.05
D
13.20
13.40
13.60
D1
11.70
11.80
11.90
Note 2
E
7.90
8.00
8.10
Note 2
L
0.50
0.60
0.70
SYMBOL
Notes:
1. This package conforms to JEDEC reference MO-183.
2. Dimensions D1 and E do not include mold protrusion. Allowable
protrusion on E is 0.15 mm per side and on D1 is 0.25 mm per side.
3. Lead coplanarity is 0.10 mm maximum.
L1
NOTE
0.25 BASIC
b
0.17
0.22
0.27
c
0.10
–
0.21
e
0.55 BASIC
12/06/02
R
14
2325 Orchard Parkway
San Jose, CA 95131
TITLE
28T, 28-lead (8 x 13.4 mm) Plastic Thin Small Outline
Package, Type I (TSOP)
DRAWING NO.
REV.
28T
C
AT27LV256A
0547G–EPROM–12/07
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International
Atmel Corporation
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0547G–EPROM–12/07
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