Diotech ABS6 Mini silicon surface mount bridge rectifier Datasheet

ABS1 THRU ABS10
MINI SILICON SURFACE MOUNT BRIDGE RECTIFIER
Reverse Voltage - 100 to 1000 Volts
Forward Current - 1.0 Ampere
FEATURES
ABS
Ideal for printed circuit board
Reliable low cost construction technique
results in inexpensive product
● High temperature soldering guaranteed :
260 °C / 10 seconds / 0.375” ( 9.5mm )
lead length at 5 lbs., ( 2.3 kg ) tension
●
0.010(0.25)
0.136(3.45)
0.028(0.7)
0.028(0.7)
0.128(3.25)
0.024(0.6)
0.012(0.3)
0~10
O
0.006(0.15)
0.006(0.15)
0.002(0.05)
0.252(6.4)
0.236(6.0)
0.169(4.3)
0.177(4.5)
●
0.161(4.1)
0.056(1.42)
0.193(4.9)
0.059(1.50) MAX.
Case : Molded Plastic
Epoxy : Device has UL flammability classification 94V-0
● Mounting Position : Any
● Marking : Type Number
●
0.20(5.1)
0.048(1.22)
0.006(0.15)
MECHANICAL DATA
0.002(0.05)
0.154(3.9)
DETAIL "A", SCALE=20/1
A
●
0.033(0.85)
0.026(0.65)
1
2
3
4
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
ABS1
ABS2
ABS4
ABS6
ABS8
ABS10
Unit
VRRM
VRWM
VR
100
200
400
600
800
1000
V
VR(RMS)
70
140
280
420
560
700
V
IO
0.8
1.0
A
IFSM
30
A
I2t
10
A 2s
@IF = 0.4A
VFM
0.95
V
@TA = 25°C
@TA = 125°C
IRM
10
150
µA
Cj
25
pF
62.5
25
°C/W
-55 to +150
°C
Average Rectified Output Current -On glass-epoxy P.C.B.
-On aluminum substrate
Non-Repetitive Peak Forward Surge Current 8.3ms
Single half sine-wave superimposed on rated load
(JEDEC Method)
I2t Rating for Fusing (t < 8.3ms)
Forward Voltage per element
Peak Reverse Current
At Rated DC Blocking Voltage
Symbol
Typical Junction Capacitance per leg (Note 2)
Typical Thermal Resistance per leg (Note 1)
Operating and Storage Temperature Range
R
R
JA
JL
Tj, TSTG
Note: 1. On aluminum suvstrate P.C.B. with an area of 0.8×0.8”(20×20mm) mounted on 0.05×0.05”(1.3×1.3mm) solder pad.
2. On glass epoxy P.C.B. mouted on 0.05×0.05”(1.3×1.3mm) pads.
ABS1 THRU ABS10
RATINGS AND CHARACTERISTIC CURVES
1.6
FIG.1- MAXIMUM FORWARD CURRENT DERATING
CURVE
100
FIG.2- TYPICAL REVERSE CHARACTERISTICS
PER BRIDGE ELEMENT
1.2
INSTANTANEOUS REVERSE CURRENT. ( A)
AVERAGE FORWARD CURRENT. (A)
1.4
ALUMINA SUBSTRATE
50.8mm X 50.8mm
SOLDERING LAND 1mm X 1mm
CONDUCTOR LAYER 20 mm
SUBSTRATE THICKNESS 0.64mm
SIN
1.0
0.8
0.6
0.4
0.2
0
0
20
40
60
80
120
100
140
160
10
Tj=100 0C
1
Tj=75 0C
0.1
Tj=25 0C
0.01
0
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE. (%)
1000
600
JUNCTION CAPACITANCE.(pF)
30
25
20
IFSM
15
10ms 10ms
1 Cycle
Ta=40 C
NON-REPETITIVE,
Single Half Sine-Wave
SINE(JEDEC
WAVE, Method)
Tj = 25OC BEFORE
SURGE CURRENT IS APPLIED
10
5
0
1
500
Tj=25 0C
400
300
200
100
10
NUMBER OF CYCLES (CYCLE)
50
INSTANTANEOUS FORWARD CURRENT. (A)
PEAK FORWARD SURGE CURRENT. (A)
35
FIG.4- TYPICAL JUNCTION CAPACITANCE
FIG.3- MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
0
0.1
100
0.5
2
10
50 100
5
20
REVERSE VOLTAGE. (V)
1
FIG.5- TYPICAL FORWARD CHARACTERISTICS
10
1
0.1
0.0
0.2
0.4
0.6
0.8
1.0
FORWARD VOLTAGE. (V)
1.2
1.4
1.6
200
500 800
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