TI GD75232 Multiple rs 232 drivers and receicer Datasheet

 SLLS206J − MAY 1995 − REVISED NOVEMBER 2004
D Single Chip With Easy Interface Between
D
D
D
GD65232, GD75232 . . . DB, DW, N, OR PW PACKAGE
(TOP VIEW)
UART and Serial-Port Connector of IBM
PC/AT and Compatibles
Meet or Exceed the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
Designed to Support Data Rates up to
120 kbit/s
Pinout Compatible With SN75C185 and
SN75185
VDD
RA1
RA2
RA3
DY1
DY2
RA4
DY3
RA5
VSS
description/ordering information
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
RY1
RY2
RY3
DA1
DA2
RY4
DA3
RY5
GND
The GD65232 and GD75232 combine three
drivers
and
five
receivers
from
the
Texas Instruments trade-standard SN75188 and
SN75189 bipolar quadruple drivers and receivers, respectively. The pinout matches the flow-through design
of the SN75C185 to decrease the part count, reduce the board space required, and allow easy interconnection
of the UART and serial-port connector of an IBM PC/AT and compatibles. The bipolar circuits and processing
of the GD65232 and GD75232 provide a rugged, low-cost solution for this function at the expense of quiescent
power and external passive components relative to the SN75C185.
The GD65232 and GD75232 comply with the requirements of the TIA/EIA-232-F and ITU (formerly CCITT) V.28
standards. These standards are for data interchange between a host computer and a peripheral at signaling
rates up to 20 kbit/s. The switching speeds of these devices are fast enough to support rates up to 120 kbit/s
with lower capacitive loads (shorter cables). Interoperability at the higher signaling rates cannot be expected
unless the designer has design control of the cable and the interface circuits at both ends. For interoperability
at signaling rates up to 120 kbit/s, use of TIA/EIA-423-B (ITU V.10) and TIA/EIA-422-B (ITU V.11) standards
is recommended.
ORDERING INFORMATION
PDIP (N)
SOIC (DW)
−40°C to 85°C
SSOP (DB)
TSSOP (PW)
PDIP (N)
SOIC (DW)
0°C to 70°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SSOP (DB)
TSSOP (PW)
Tube of 20
GD65232N
Tube of 25
GD65232DW
Reel of 2000
GD65232DWR
Reel of 2000
GD65232DBR
Tube of 70
GD65232PW
Reel of 2000
GD65232PWR
Tube of 20
GD75232N
Tube of 25
GD75232DW
Reel of 2000
GD75232DWR
Reel of 2000
GD75232DBR
Tube of 70
GD75232PW
Reel of 2000
GD75232PWR
TOP-SIDE
MARKING
GD65232N
GD65232
GD65232
GD65232
GD75232N
GD75232
GD75232
GD75232
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
IBM is a trademark of International Business Machines Corporation.
Copyright  2004, Texas Instruments Incorporated
! " #$%! " &$'(#! )!%*
)$#!" # ! "&%##!" &% !+% !%" %," "!$%!"
"!)) -!.* )$#! &#%""/ )%" ! %#%""(. #($)%
!%"!/ (( &%!%"*
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1
SLLS206J − MAY 1995 − REVISED NOVEMBER 2004
logic diagram (positive logic)
RA1
RA2
RA3
DY1
DY2
RA4
DY3
RA5
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
RY1
RY2
RY3
DA1
DA2
RY4
DA3
RY5
schematic (each driver)
To Other Drivers
VDD
11.6 kΩ
9.4 kΩ
Input
DAx
75.8 Ω
320 Ω
4.2 kΩ
GND
To Other
Drivers
10.4 kΩ
3.3 kΩ
VSS
To Other Drivers
Resistor values shown are nominal.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
68.5 Ω
Output
DYx
SLLS206J − MAY 1995 − REVISED NOVEMBER 2004
schematic (each receiver)
To Other Receivers
VCC
9 kΩ
5 kΩ
1.66 kΩ
Output
RYx
2 kΩ
Input
RAx
3.8 kΩ
10 kΩ
GND
To Other Receivers
Resistor values shown are nominal.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage (see Note 1): VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 V
VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 V
VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −15 V
Input voltage range, VI: Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −15 V to 7 V
Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −30 V to 30 V
Driver output voltage range, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −15 V to 15 V
Receiver low-level output current, IOL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
Package thermal impedance, θJA (see Notes 2 and 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to the network ground terminal.
2. Maximum power dissipation is a function of TJ(max), qJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/qJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
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SLLS206J − MAY 1995 − REVISED NOVEMBER 2004
recommended operating conditions
MIN
NOM
MAX
VDD
VSS
Supply voltage (see Note 4)
7.5
9
15
UNIT
V
Supply voltage (see Note 4)
−7.5
−9
−15
V
VCC
VIH
Supply voltage (see Note 4)
4.5
5
5.5
V
High-level input voltage (driver only)
1.9
VIL
Low-level input voltage (driver only)
IOH
High-level output current
IOL
Low-level output current
TA
Operating free-air temperature
V
0.8
Driver
−6
Receiver
−0.5
Driver
6
Receiver
16
GD65232
−40
85
GD75232
0
70
V
mA
mA
°C
NOTE 4: When powering up the GD65232 and GD75232, the following sequence should be used:
1. VSS
2. VDD
3. VCC
4. I/Os
Applying VCC before VDD may allow large currents to flow, causing damage to the device. When powering down the GD65232 and
GD75232, the reverse sequence should be used.
supply currents over recommended operating free-air temperature range
PARAMETER
TEST CONDITIONS
All inputs at 1.9 V,
IDD
Supply current from VDD
All inputs at 0.8 V,
All inputs at 1.9 V,
ISS
4
No load
No load
Supply current from VSS
All inputs at 0.8 V,
ICC
No load
Supply current from VCC
All inputs at 5 V,
No load
No load,
POST OFFICE BOX 655303
MIN
MAX
VDD = 9 V,
VDD = 12 V,
VSS = −9 V
VSS = −12 V
VDD = 15 V,
VDD = 9 V,
VSS = −15 V
VSS = −9 V
VDD = 12 V,
VDD = 15 V,
VDD = 9 V,
VSS = −12 V
VSS = −15 V
5.5
VSS = −9 V
VSS = −12 V
−15
VDD = 12 V,
VDD = 15 V,
VDD = 9 V,
VDD = 12 V,
VDD = 15 V,
VCC = 5 V
• DALLAS, TEXAS 75265
VSS = −15 V
VSS = −9 V
VSS = −12 V
VSS = −15 V
UNIT
15
19
25
4.5
mA
9
−19
−25
−3.2
mA
−3.2
−3.2
GD65232
38
GD75232
30
mA
SLLS206J − MAY 1995 − REVISED NOVEMBER 2004
DRIVER SECTION
electrical characteristics over recommended operating free-air temperature range, VDD = 9 V,
VSS = −9 V, VCC = 5 V (unless otherwise noted)
PARAMETER
VOH
VOL
High-level output voltage
IIH
IIL
High-level input current
IOS(H)
IOS(L)
ro
TEST CONDITIONS
MIN
MAX
RL = 3 kΩ,
See Figure 1
RL = 3 kΩ,
See Figure 1
VI = 5 V,
VI = 0,
See Figure 2
10
µA
Low-level input current
See Figure 2
−1.6
mA
High-level short-circuit output current
(see Note 6)
VIL = 0.8 V,
VO = 0,
See Figure 1
−4.5
−12
−19.5
mA
VIH = 2 V,
VO = 0,
VCC = VDD = VSS = 0,
See Figure 1
4.5
12
19.5
mA
Low-level short-circuit output current
7.5
UNIT
VIL = 0.8 V,
VIH = 1.9 V,
Low-level output voltage (see Note 5)
6
TYP
−7.5
V
−6
V
Output resistance (see Note 7)
VO = −2 V to 2 V
300
Ω
NOTES: 5. The algebraic convention, where the more positive (less negative) limit is designated as maximum, is used in this data sheet for logic
levels only (e.g., if −10 V is maximum, the typical value is a more negative voltage).
6. Output short-circuit conditions must maintain the total power dissipation below absolute maximum ratings.
7. Test conditions are those specified by TIA/EIA-232-F and as listed above.
switching characteristics, VCC = 5 V, VDD = 12 V, VSS = −12 V, TA = 25°C
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
tPLH
Propagation delay time,
low- to high-level output
RL = 3 kΩ to 7 kΩ,
CL = 15 pF,
See Figure 3
315
500
ns
tPHL
Propagation delay time,
high- to low-level output
RL = 3 kΩ to 7 kΩ,
CL = 15 pF,
See Figure 3
75
175
ns
Transition time,
low- to high-level output
60
100
ns
RL = 3 kΩ to 7 kΩ
CL = 15 pF,
See Figure 3
tTLH
CL = 2500 pF,
See Figure 3 and Note 8
1.7
2.5
µs
tTHL
Transition time,
high- to low-level output
RL = 3 kΩ to 7 kΩ
CL = 15 pF,
See Figure 3
40
75
ns
CL = 2500 pF,
See Figure 3 and Note 8
1.5
2.5
µs
NOTE 8: Measured between ±3-V and ±3-V points of the output waveform (TIA/EIA-232-F conditions); all unused inputs are tied either high
or low.
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5
SLLS206J − MAY 1995 − REVISED NOVEMBER 2004
RECEIVER SECTION
electrical characteristics over recommended operating conditions (unless otherwise noted)
PARAMETER
MIN
TYP†
MAX
See Figure 5
1.75
1.9
2.3
See Figure 5
1.55
TEST CONDITIONS
TA = 25°C,
TA = 0°C to 70°C,
VIT+
Positive-going input threshold voltage
VIT−
Vhys
Negative-going input threshold voltage
0.75
Input hysteresis voltage (VIT+ − VIT−)
0.5
VOH
High-level output voltage
IOH = −0.5 mA
VIH = 0.75 V
Inputs open
VOL
Low-level output voltage
IOL = 10 mA,
VI = 3 V
IIH
High-level input current
VI = 25 V,
See Figure 5
VI = 3 V,
See Figure 5
VI = −25 V,
See Figure 5
VI = −3 V,
See Figure 4
See Figure 5
IIL
Low-level input current
2.6
2.3
0.97
1.25
UNIT
V
V
V
4
5
V
2.6
0.2
0.45
GD65232
3.6
11
GD75232
3.6
8.3
V
mA
0.43
GD65232
−3.6
−11
GD75232
−3.6
−8.3
mA
−3.4
−12
mA
TYP
MAX
UNIT
−0.43
IOS
Short-circuit output current
† All typical values are at TA = 25°C, VCC = 5 V, VDD = 9 V, and VSS = −9 V.
switching characteristics, VCC = 5 V, VDD = 12 V, VSS = −12 V, TA = 25°C
PARAMETER
6
TEST CONDITIONS
MIN
tPLH
tPHL
Propagation delay time, low- to high-level output
107
250
ns
Propagation delay time, high- to low-level output
42
150
ns
tTLH
tTHL
Transition time, low- to high-level output
175
350
ns
16
60
ns
tPLH
tPHL
Propagation delay time, low- to high-level output
100
160
ns
Propagation delay time, high- to low-level output
60
100
ns
tTLH
tTHL
Transition time, low- to high-level output
90
175
ns
15
50
ns
CL = 50 pF,
RL = 5 kΩ
kΩ,
See Figure 6
Transition time, high- to low-level output
CL = 15 pF,
RL = 1.5 kΩ
kΩ,
Transition time, high- to low-level output
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
See Figure 6
SLLS206J − MAY 1995 − REVISED NOVEMBER 2004
PARAMETER MEASUREMENT INFORMATION
IOS(L)
VDD
VDD or GND
VCC
−IOS(H)
VSS or GND
VI
VO
RL = 3 kΩ
VSS
Figure 1. Driver Test Circuit for VOH, VOL, IOS(H), and IOS(L)
VDD
VCC
IIH
VI
−IIL
VI
VSS
Figure 2. Driver Test Circuit for IIH and IIL
3V
Input
VDD
Input V
CC
1.5 V
1.5 V
0V
tPHL
Pulse
Generator
RL
See Note A
CL
(see Note B)
90%
50%
10%
Output
VSS
tPLH
50%
10%
tTHL
TEST CIRCUIT
90%
VOH
VOL
tTLH
VOLTAGE WAVEFORMS
NOTES: A. The pulse generator has the following characteristics: tw = 25 µs, PRR = 20 kHz, ZO = 50 Ω, tr = tf < 50 ns.
B. CL includes probe and jig capacitance.
Figure 3. Driver Test Circuit and Voltage Waveforms
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7
SLLS206J − MAY 1995 − REVISED NOVEMBER 2004
PARAMETER MEASUREMENT INFORMATION
VDD
VCC
VI
VSS
Figure 4. Receiver Test Circuit for IOS
VDD
VCC
−IOH
VOH
VIT,
VI
VOL
IOL
VSS
Figure 5. Receiver Test Circuit for VIT, VOH, and VOL
4V
Input
VDD
Input V
CC
50%
50%
0V
tPHL
Pulse
Generator
RL
See Note A
CL
(see Note B)
90%
Output
VSS
50%
10%
tPLH
50%
10%
tTHL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. The pulse generator has the following characteristics: tw = 25 µs, PRR = 20 kHz, ZO = 50 Ω, tr = tf < 50 ns.
B. CL includes probe and jig capacitance.
Figure 6. Receiver Propagation and Transition Times
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
90%
VOH
VOL
tTLH
SLLS206J − MAY 1995 − REVISED NOVEMBER 2004
TYPICAL CHARACTERISTICS
DRIVER SECTION
OUTPUT CURRENT
vs
OUTPUT VOLTAGE
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
VOLTAGE TRANSFER CHARACTERISTICS
12
9
12
IO − Output Current − mA
VO − Output Voltage − V
16
VDD = 9 V, VSS = −9 V
6
VDD = 6 V, VSS = −6 V
3
0
−3
−6
−9
ÎÎÎÎ
ÎÎÎÎ
0
0.2
0.4
0.6
VDD = 9 V
VSS = −9 V
TA = 25°C
4
0
−4
1
1.2 1.4
1.6 1.8
−20
−16
2
−12
0
SHORT-CIRCUIT OUTPUT CURRENT
vs
FREE-AIR TEMPERATURE
0
−3
−6
16
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
1000
VDD = 9 V
VSS = −9 V
RL = 3 kΩ
TA = 25°C
IOS(L) (VI = 1.9 V)
3
12
SLEW RATE
vs
LOAD CAPACITANCE
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
6
8
Figure 8
SR − Slew Rate − V/ µs
IOS − Short-Circuit Output Current − mA
4
−4
3-kΩ
Load Line
VO − Output Voltage − V
Figure 7
9
−8
ÎÎÎÎÎ
VI − Input Voltage − V
12
VOH (VI = 0.8 V)
ÎÎÎÎÎ
ÎÎÎÎÎ
−8
−16
0.8
VOL (VI = 1.9 V)
8
−12
RL = 3 kΩ
TA = 25°C
−12
ÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
20
VDD = 12 V, VSS = −12 V
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
VDD = 9 V
VSS = −9 V
VO = 0
100
10
IOS(H) (VI = 0.8 V)
−9
−12
0
10
20
30
40
50
60
70
1
10
TA − Free-Air Temperature − °C
100
1000
10000
CL − Load Capacitance − pF
Figure 9
Figure 10
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SLLS206J − MAY 1995 − REVISED NOVEMBER 2004
TYPICAL CHARACTERISTICS
2.4
2
2.2
1.8
2
V IT − Input Threshold Voltage − V
V IT − Input Threshold Voltage − V
INPUT THRESHOLD VOLTAGE
vs
FREE-AIR TEMPERATURE
VIT+
1.8
1.6
1.4
1.2
1
VIT−
0.8
0.6
INPUT THRESHOLD VOLTAGE
vs
SUPPLY VOLTAGE
VIT+
1.6
1.4
1.2
1
VIT−
0.8
0.6
0.4
0.2
0.4
0
10
20
30
40
50
60
0
70
2
3
4
TA − Free-Air Temperature − °C
5
6
7
8
9
10
VCC − Supply Voltage − V
Figure 11
Figure 12
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÁÁÁÁ
ÎÎÎÎÎ
ÁÁÁÁ
NOISE REJECTION
5
Amplitude − V
4
3
ÎÎÎÎ
ÁÁÁÁ
ÎÎÎÎÎ
2
CC = 12 pF
16
CC = 300 pF
14
CC = 500 pF
CC = 100 pF
1
0
10
40
MAXIMUM SUPPLY VOLTAGE
vs
FREE-AIR TEMPERATURE
VCC = 5 V
TA = 25°C
See Note A
100
400 1000
tw − Pulse Duration − ns
4000 10000
NOTE A: This figure shows the maximum amplitude of a
positive-going pulse that, starting from 0 V, does not cause
a change of the output level.
VDD − Maximum Supply Voltage − V
6
12
10
8
6
4
2
0
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
RL ≥ 3 kΩ (from each output to GND)
0
10
30
Figure 14
POST OFFICE BOX 655303
40
50
TA − Free-Air Temperature − °C
Figure 13
10
20
• DALLAS, TEXAS 75265
60
70
SLLS206J − MAY 1995 − REVISED NOVEMBER 2004
APPLICATION INFORMATION
Diodes placed in series with the VDD and VSS leads protect the GD65232 and GD75232 in the fault condition in which
the device outputs are shorted to ±15 V and the power supplies are at low and provide low-impedance paths to ground
(see Figure 15).
VDD
GD65232,
GD75232
±15 V
VDD
Output
GD65232,
GD75232
VSS
VSS
Figure 15. Power-Supply Protection to Meet Power-Off Fault Conditions of TIA/EIA-232-F
TL16C450
ACE
RI
DTR
CTS
SO
RTS
SI
DSR
DCD
−12 V
11
43
12
37
13
40
14
13
15
36
16
11
17
41
18
42
19
5V
20
VSS
GND
RY5
RA5
DA3
DY3
RY4
RA4
DA2
DY2
DA1
GD65232,
GD75232
DY1
RY3
RA3
RY2
RA2
RY1
RA1
VCC
VDD
10
5
9
RI
8
DTR
7
CTS
6
TX
5
RTS
4
RX
3
DSR
2
DCD
1
9
C3
TIA/EIA-232-F
DB9S
Connector
C2
C1
6
1
12 V
Figure 16. Typical Connection
POST OFFICE BOX 655303
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11
PACKAGE OPTION ADDENDUM
www.ti.com
4-Mar-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
GD65232DBR
ACTIVE
SSOP
DB
20
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
GD65232DW
ACTIVE
SOIC
DW
20
25
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
GD65232DWR
ACTIVE
SOIC
DW
20
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
GD65232N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
GD65232PW
ACTIVE
TSSOP
PW
20
70
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
GD65232PWR
ACTIVE
TSSOP
PW
20
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
GD75232DB
OBSOLETE
SSOP
DB
20
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
GD75232DBR
ACTIVE
SSOP
DB
20
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
GD75232DW
ACTIVE
SOIC
DW
20
25
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
GD75232DWR
ACTIVE
SOIC
DW
20
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
GD75232N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
GD75232PW
ACTIVE
TSSOP
PW
20
70
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
GD75232PWR
ACTIVE
TSSOP
PW
20
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
4-Mar-2005
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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