HLMP-R100, HLMP-0301, HLMP-0401, HLMP-0504 2.5 mm x 7.6 mm Rectangular LED Lamps Data Sheet Description Features The HLMP-R100, -0301, -0401, ‑0504 are solid state lamps encapsulated in a radial lead rectangular epoxy package. They utilize a tinted, diffused epoxy to provide high on-off contrast and a flat high intensity emitting surface. Borderless package design allows creation of uninterrupted light emitting areas. • Rectangular light emitting surface The HLMP-R100 uses a double heterojunction (DH) absorbing substrate (AS) aluminum gallium arsenide (AlGaAs) red LED chip in a light red epoxy package. This combination produces outstanding light output over a wide range of drive currents. • Long life: solid state reliability The HLMP-0301 has a high efficiency red GaAsP on GaP LED chip in a light red epoxy package. The HLMP-0401 provides a yellow GaAsP on GaP LED chip in a yellow epoxy package. • Flat high sterance emitting surface • Stackable on 2.54 mm (0.100 inch) centers • Ideal as flush mounted panel indicators • Ideal for backlighting legends • Choice of 4 bright colors – DH AS AlGaAs Red – High Efficiency Red – Yellow – High Performance Green • IC compatible/low current requirements The HLMP-0504 provides a green GaP LED chip in a green epoxy package. Package Dimensions 7.62 (0.300) 7.11 (0.280) 7.62 (0.300) 6.99 (0.275) 0.46 (0.018) SQ. NOMINAL 2.54 (0.100) NOMINAL CATHODE LEAD 29.21 (1.15) MIN. 8.00 (0.315) 7.37 (0.290) 2.54 (0.100) 2.16 (0.085) 1.27 (0.50) NOMINAL 2.54 (0.100) 2.29 (0.090) SIDE VIEW BOTTOM VIEW NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. AN EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040") DOWN THE LEADS. 3. THERE IS A MXIMUM 1 TAPER FROM BASE TO THE TOP OF LAMP. Selection Guide Luminous Intensity Iv (mcd) at 20 mA Color Part Number Min. Typ. DH AlGaAs Red HLMP-R100 2.1 – Red HLMP-0301 2.1 – HLMP-0301-C00xx 1.3 – HLMP-0401 3.6 – HLMP-0401-B00xx 1.4 – HLMP-0401-D00xx 3.6 – HLMP-0504 2.6 – HLMP-0504-B00xx 1.6 – HLMP-0504-C00xx 2.6 – Yellow Green Part Numbering System HLMP - x x xx - x x x xx Mechanical Options 00: Bulk 02: Tape & Reel, Straight Leads Color Bin Options 0: Full Color Bin Distribution Maximum Iv Bin Options 0: Open (No Maximum Limit) Others: Please refer to the Iv Bin Table Minimum Iv Bin Options Please refer to the Iv Bin Table Color Options 1. As AlGaAs Red 3. High Efficiency Red 4. Yellow 5. Green Package Options R,0: Rectangular 2.5 mm x 7.6 mm 2 Absolute Maximum Ratings at TA = 25°C Parameter HLMP-R100 HLMP-0301 HLMP-0401 HLMP-0504 Units Peak Forward Current 300 90 60 90 mA Average Forward Current[1] 20 25 20 25 mA DC Current[2] 30 30 20 30 mA Power Dissipation 87 135 85 135 mW Reverse Voltage (IR = 100 μA) 5 5 5 5 V Transient Forward Current[3] (10 μs Pulse) 500 500 500 500 mA Operating Temperature Range -20 to +100 -40 to +100 -40 to +100 -20 to +100 °C Storage Temperature Range -40 to +100 -40 to +100 -40 to +100 -40 to +100 Notes: 1. See Figure 5 to establish pulsed operating conditions. 2. For AlGaAs Red, Red, and Green Series derate linearly from 50°C at 0.5 mA/°C. For Yellow Series derate linearly from 50°C at 0.2 mA/°C. 3. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and wirebond. It is not recommended that the device be operated at peak current beyond the peak forward current listed in the Absolute Maximum Ratings. 3 Electrical/Optical Characteristics at TA = 25°C HLMP-R100 HLMP-0301 HLMP-0401 HLMP-0504 Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Units Test Conditions Sym. Description 2q1/2 Included Angle Between Half Luminous Intensity Points 100 100 100 100 Deg. Note 1. Fig. 6 lP Peak Wavelength 645 635 583 565 nm Measurement at Peak ld Dominant Wavelength 637 626 585 569 nm Note 2. Dl1/2 Spectral Line Halfwidth 20 40 36 28 nm ts Speed of Response 30 90 90 500 ns C Capacitance 30 16 18 18 pF VF = 0; f = 1 MHz RqJ-PIN Thermal Resistance 260 260 260 260 °C/W Junction to Cathode Lead VF Forward Voltage 1.8 V IF = 20 mA Figure 2. VR Reverse Breakdown Voltage V IR = 100 μA hv Luminous Efficacy lm/W Note 3. 2.2 1.9 5.0 2.6 5.0 80 2.1 2.6 5.0 145 2.2 3.0 5.0 500 595 Notes: 1. q1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 2. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 3. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv is the luminous efficacy in lumens/watt. 1.0 TA = 25 °C AlGaAs RED RELATIVE INTENSITY GREEN 0.5 YELLOW 0 500 HIGH EFFICIENCY RED 550 600 650 WAVELENGTH – nm Figure 1. Relative intensity vs. wavelength. 4 700 750 80 70 60 HER 50 YELLOW 40 30 20 GREEN 10 0 1.0 2.0 1.3 2.0 HER, YELLOW, GREEN 1.5 1.0 AlGaAs RED 0.5 4.0 3.0 5.0 0.9 0.8 AlGaAs RED 0.7 0.6 0 5 30 25 0 Hz 2 z 100 300 H 10 1 KHz z 1 tP – PULSE DURATION – s HER, ORANGE, YELLOW, and GREEN 3 KHz IPEAK MAX. RATIO OF MAXIMUM PEAK CURRENT TO TEMPERATURE DERATED IDC MAX. MAXIMUM DC CURRENT 100 4 3 1 10,000 1000 10000 tp – PULSE DURATION – s AlGaAs RED Figure 5. Maximum tolerable peak current vs. peak duration (IPEAK MAX determined from temperature derated IDC MAX). 20 30 40 50 10 0 1.0 0.8 0.6 60 70 80 90 0.4 0.2 10 20 30 40 Figure 6. Relative luminous intensity vs. angular displacement. 5 50 60 70 80 90 100 20 30 40 50 60 70 80 90 Figure 4. Relative efficiency (luminous intensity per unit current) vs. peak current. hv (300 mA) for AlGaAs Red = 0.7. ATE – 5 10 KH 1000 10 9 8 7 6 10 IPEAK – PEAK CURRENT PER LED – mA SH R 1.5 100 20 EFRE z z 100 H z 1 KHz 300 H 3 KHz z 10 KH Hz 30 KH 2.0 10 15 10 f–R 3.0 100 K RATIO OF MAXIMUM TOLERABLE PEAK CURRENT TO MAXIMUM TOLERABLE DC CURRENT GREEN 1.0 0.4 Figure 3. Relative luminous intensity vs. forward current. 4.0 IPEAK MAX. IDC MAX. 1.1 IDC – DC CURRENT PER LED – mA Figure 2. Forward current vs. forward voltage. VF (300 mA) for AlGaAs Red = 2.6 volts typical. 1 HER 0.5 0 VF – FORWARD VOLTAGE – V 1.0 YELLOW 1.2 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) IF – FORWARD CURRENT – mA 2.5 AlGaAs RED ηPEAK – RELATIVE EFFICIENCY 90 Intensity Bin Limits Intensity Bin Limits, continued Color Bin Intensity Range (mcd) Min. Max. Red C D E F G H I J K L M N O P Q R S T U V W X Y Z 1.5 2.4 3.8 6.1 9.7 15.5 24.8 39.6 63.4 101.5 162.4 234.6 340.0 540.0 850.0 1200.0 1700.0 2400.0 3400.0 4900.0 7100.0 10200.0 14800.0 21400.0 Maximum tolerance for each bin limit is ±18%. 2.4 3.8 6.1 9.7 15.5 24.8 39.6 63.4 101.5 162.4 234.6 340.0 540.0 850.0 1200.0 1700.0 2400.0 3400.0 4900.0 7100.0 10200.0 14800.0 21400.0 30900.0 Color Bin Intensity Range (mcd) Min. Max. Yellow B C D E 1.6 2.5 4.0 6.5 2.5 4.0 6.5 10.3 F 10.3 16.6 G 16.6 26.5 H 26.5 42.3 I 42.3 67.7 J 67.7 108.2 K 108.2 173.2 L 173.2 250.0 M 250.0 360.0 N 360.0 510.0 O 510.0 800.0 P 800.0 1250.0 Q 1250.0 1800.0 R 1800.0 2900.0 S 2900.0 4700.0 T 4700.0 7200.0 U 7200.0 11700.0 V 11700.0 18000.0 W 18000.0 27000.0 B C D E F G H I J K L M N O P Q R S T U V W 1.8 2.9 4.7 7.6 12.0 19.1 30.7 49.1 78.5 125.7 201.1 289.0 417.0 680.0 1100.0 1800.0 2700.0 4300.0 6800.0 10800.0 16000.0 25000.0 2.9 4.7 7.6 12.0 19.1 30.7 49.1 78.5 125.7 201.1 289.0 417.0 680.0 1100.0 1800.0 2700.0 4300.0 6800.0 10800.0 16000.0 25000.0 40000.0 Green Maximum tolerance for each bin limit is ±18%. 6 Color Categories Lambda (nm) Color Category# Min. Max. Green 6 561.5 564.5 5 564.5 567.5 4 567.5 570.5 3 570.5 573.5 2 573.5 576.5 1 582.0 584.5 3 584.5 587.0 2 587.0 589.5 4 589.5 592.0 5 592.0 593.0 Yellow Tolerance for each bin limit is ±0.5 nm. Mechanical Option Matrix Mechanical Option Code Definition 00 Bulk Packaging, minimum increment 500 pcs/bag 02 Tape & Reel, straight leads, minimum increment 1300 pcs/reel Note: All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago representative for further clarification/information. 7 Precautions Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions • Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C, before handling. • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. • Recommended PC board plated through hole sizes for LED component leads: • Recommended soldering conditions: Diagonal Plated Through Hole Diameter Wave Soldering Manual Solder Dipping 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.646 mm (0.025 inch) 0.976 to 1.078 mm (0.038 to 0.042 inch) Pre-heat Temperature 105°C Max. – Pre-heat Time 30 sec Max. – 0.508 x 0.508 mm (0.020 x 0.020 inch) 0.718 mm (0.028 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) Peak Temperature 250°C Max. 260°C Max. Dwell Time 3 sec Max. 5 sec Max. TURBULENT WAVE 250 TEMPERATURE – °C LED Component Lead Size Note: Refer to application note AN1027 for more information on soldering LED components. LAMINAR WAVE HOT AIR KNIFE BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150°C (100C PCB) SOLDER WAVE TEMPERATURE = 245°C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA 200 150 FLUXING 100 50 30 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 0 10 20 30 60 40 50 TIME – SECONDS 70 80 90 100 Figure 7. Recommended wave soldering profile For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2015 Avago Technologies. All rights reserved. AV02-1554EN - June 24, 2015