Rohm BD30KA5WFP 500ma secondary ldo regulators for local power supply Datasheet

Secondary LDO Regulator Series for Local Power Supplies
500mA Secondary LDO Regulators
for Local Power Supplies
BD□□KA5,BD□□KA5W Series,BD00KA5W Series
No.09024EAT01
●General Description
The BD□□KA5 series are low-saturation regulators that are available for output currents up to 500mA. The output voltage
precision is ±1%. These secondary LDO regulators are offered in several output voltages and package lineups with or
without ON/OFF switches (that set the circuit current to 0μA at shutdown). This series can be used for a broad spectrum of
applications ranging from TVs and car audio systems to HDDs, PCs, and DVDs. There regulators have a built-in overcurrent
protection circuit that prevents the destruction of the IC, due to output short circuits and a thermal shutdown circuit.
●Features
1) Maximum output current : 500mA
2) Output voltage precision : ±1%
3) Low-saturation voltage with PMOS output : 0.12V Typ.(Io=200mA)
4) Built-in over-current protection circuit
5) Built-in thermal shutdown circuit
6) Shutdown switch(BD□□KA5WFP and BD□□KA5WF series)
7) TO252-3,TO252-5 and SOP8 package lineup
8) Operating temperature range : -40℃ to +105℃
9) Ceramic capacitor compatible(recommended capacitance : 1μF or greater)
●Applications
Microcontrollers and all electronic devices that use logic circuits
●Product line up
Part Number
BD□□KA5WFP
BD□□KA5WF
BD□□KA5FP
1.0
○
○
○
Part Number:BD□□KA5□ □
a
b c
Symbol
a
□□
10
12
15
18
Switch
b
c
1.2
○
○
○
1.5
○
○
○
1.8
○
○
○
2.5
○
○
○
3.0
○
○
○
Details
Output Voltage Designation
Output Voltage(V)
□□
1.0V(Typ.)
25
1.2V(Typ.)
30
1.5V(Typ.)
33
1.8V(Typ.)
00
3.3
○
○
○
Variable
○
○
-
Package
TO252-5
SOP8
TO252-3
Output Voltage(V)
2.5V(Typ.)
3.0V(Typ.)
3.3V(Typ.)
Variable Output Typ
“W” included:Built-in shutdown switch
“W” not included:No shutdown switch
Package
FP:TO252-5 / TO252-3
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© 2009 ROHM Co., Ltd. All rights reserved.
F:SOP8
1/9
2009.04 - Rev.A
Technical Note
BD□□KA5,BD□□KA5W Series,BD00KA5W Series
●Absolute Maximum Ratings(Ta=25℃)
Parameter
Power Supply Voltage
Output Control Terminal Voltage
TO252-3
Power Dissipation TO252-5
SOP8
Operating Temperature Range
Ambient Storage Temperature
Maximum Junction Temperature
*1
*2
*3
*4
Symbol
Limits
Unit.
Vcc
VCTL
-0.3~+7.0*1
-0.3~Vcc*1
1200*2
1300*3
687.6*4
-40~+105
-55~+150
150
V
V
Pd
Topr
Tstg
Tjmax
℃
℃
℃
Must not exceed Pd
When a 70mm×70mm×1.6mm glass epoxy board is used. Reduce by 9.6 mW/℃ over 25℃.
When a 70mm×70mm×1.6mm glass epoxy board is used. Reduce by 10.4mW/℃ over 25℃.
When a 70mm×70mm×1.6mm glass epoxy board is used. Reduce by 5.5 mW/℃ over 25℃.
●Recommended Operating Range (Ta=25℃)
Parameter
Symbol
Input Power Supply Voltage
Vcc
Output Current
Io
*5
Output Voltage Configuration Range
Vo
Output Control Terminal Voltage
VCTL
*5
mW
Min.
2.3
0
1.0
0
Max.
5.5
500
4.0
Vcc
Unit.
V
mA
V
V
Only BD00KA5WFP and BD00KA5WF
●Electrical Characteristics (abridged)
BD□□KA5WFP / WF / FP
(Unless specified otherwise,Ta=25℃,VCTL=2V,Vcc=2.5V(Vo=1.0V,1.2V,1.5V,1.8V),Vcc=3.3V(Vo=2.5V),Vcc=5.0V(Vo=3.0V,3.3V))
Parameter
Symbol
Min.
Typ.
Max.
Unit.
Conditions
Output Voltage
Vo
Vo(T)-0.015
Vo(T)×0.99
Vo(T)
Vo(T)
Vo(T)+0.015
Vo(T)×1.01
V
V
Circuit Current at Shutdown
Isd
-
0
1
μA
ΔVd
-
0.12
0.20
V
Io
Reg.I
Reg.L
500
-
10
25
35
75
mA
mV
mV
Tcvo
-
±100
-
ppm/℃
Io=5mA,Tj=0~125℃
Unit.
Minimum I/O Voltage
Difference*6
Output Current Capacity
Input Stability*7
Load Stability
Output Voltage
*8
Temperature Coefficient
Io=200mA (Vo=1.0V,1.2V)
Io=200mA (Vo≧1.5V)
VCTL =0V,Io=0mA
(during OFF mode)
Io=200mA,Vcc=0.95×Vo
Vcc=Vo+0.5V→5.5V,Io=200mA
Io=0mA→500mA
Vo(T):Preset output voltage value
*6 When Vo≧2.5V
*7 When 1.0≦Vo≦1.8V, Vcc=2.3V→5.5V
*8 Design guarantee(100% shipping inspection not performed)
BD00KA5WFP / WF
*9
(Unless specified otherwise, Ta=25℃, Vcc=2.5V,VL=2V,R1=30kΩ,R2=30kΩ )
Parameter
Symbol
Min.
Typ.
Max.
Circuit Current at Shutdown
Isd
-
0
1
μA
Reference Voltage
Minimum I/O Voltage
Difference*10
Output Current Capacity
Input Stability
Load Stability
Output Voltage
Temperature Coefficient*11
VADJ
0.742
0.750
0.758
V
Conditions
VCTL =0V, Io=0mA
(during OFF mode)
Io=50mA
ΔVd
-
0.12
0.20
V
Io=200mA,Vcc=0.95×Vo
Io
Reg.I
Reg.L
500
-
10
25
35
75
mA
mV
mV
Tcvo
-
±100
-
ppm/℃
*9
*10
*11
Vcc=Vo+0.5V→5.5V,Io=200mA
Io=0mA→500mA
Io=5mA,Tj=0~125℃
VOUT=VADJ×(R1+R2)÷R1(V)
VADJ×0.75V(Typ.)
When Vo≧2.5V
Design guarantee(100% shipping inspection not performed)
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2/9
2009.04 - Rev.A
Technical Note
BD□□KA5,BD□□KA5W Series,BD00KA5W Series
●Reference Data (Unless specified otherwise, Vcc=25V,VCTL =2V,and Io=0mA)
2.0
0.5
[BD15KA5WFP]
[BD15KA5WFP]
1.8
0.3
0.2
0.1
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
0.5
1.0
1.5
SUPPLY VOLTAGE:VCC[V]
Fig.1 Circuit current
300
3.0
3.5
4.0
4.5
5.0
1.4
1.2
1.0
0.8
0.6
0.4
1.0
0.8
0.6
0.4
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
SUPPLY VOLTAGE:VCC[V]
SUPPLY VOLTAGE:VCC[V]
Fig.2 Input Stability
(Io=0mA)
Fig.3 Input Stability
(Io=500mA)
60
5.0
5.5
[BD15KA5WFP]
55
50
RIPPLE REJECTION:R.R[dB]
1.6
1.2
5.5
250
200
150
100
45
40
35
30
25
20
15
10
50
5
0.0
0
0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5
0
50
100
150 200
250 300
350 400
10 15 20 25 100
30 35 40 451000
50 55 60 6510000
70 75 80 100000
85 90
450 500
OUTPUT CURRENT:IOUT[mA]
OUTPUT CURRENT:IOUT[A]
Fig.4 Load Stability
FREQUENCY:f[Hz]
Fig.5 Input/Output Voltage Difference
(Vcc=3.135V)
0.9
[BD15KA5WFP]
CIRCUIT CURRENT:Icc[mA]
1.6
1.5
1.5
1.5
1.5
1.5
1.4
[BD15KA5WFP]
[BD15KA5WFP]
0.8
CIRCUIT CURRENT:Icc[mA]
1.6
Fig.6 Ripple Rejection
(ein=10dBV,Io=100mA)
10
1.0
1.6
OUTPUT VOLTAGE:VOUT[V]
2.5
[BD33KA5WFP]
0.2
0.7
0.6
0.5
0.4
0.3
0.2
8
6
4
2
0.1
1.4
0.0
1.4
-40
-20
0
20
40
60
80
0
-40
100
-20
TEMPERATURE:Ta[℃]
20
40
60
80
100
CONTROL CURRENT:ICTL[μA]
[BD15KA5WFP]
160
140
120
100
80
60
40
0
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
CONTROL VOLTAGE:VCTL[V]
Fig.10 CTL Voltage vs. Output Voltage
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© 2009 ROHM Co., Ltd. All rights reserved.
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
CONTROL VOLTAGE:VCTL[V]
Fig.11 CTL Voltage vs. Output Current
3/9
0.3
0.4
0.5
Fig.9 Circuit Current by load Level
200
180
0.2
OUTPUT CURRENT:IOUT[A]
20
0.5
0.1
Fig.8 Circuit Current
Temperature Characteristics
[BD15KA5WFP]
0.0
0.0
OUTPUT VOLTAGE:VOUT[V]
2.0
1.9
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0
TEMPERATURE:Ta[℃]
Fig.7 Output Voltage
(Io=5mA)
OUTPUT VOLTAGE:VOUT[V]]
2.0
[BD15KA5WFP]
DROPOUT VOLTAGE:ΔVd[mV]
OUTPUT VOLTAGE:VOUT[V]
1.8
1.4
0.0
0.0
2.0
1.6
0.2
0.0
0.0
[BD15KA5WFP]
1.8
1.6
OUTPUT VOLTAGE:VOUT[V]]
OUTPUT VOLTAGE:VOUT[V]]
0.4
CIRCUIT CURRENT:ICC[mA]
2.0
2.0
1.9
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
[BD15KA5WFP]
100
120
140
160
180
200
TEMPERATURE:[℃]
Fig.12 Thermal Shutdown
Circuit Characteristics (Io=5mA)
2009.04 - Rev.A
Technical Note
BD□□KA5,BD□□KA5W Series,BD00KA5W Series
●Block diagrams, Standard circuit examples
[BD00KA5WFP]
[BD00KA5WF]
*Output voltage configuration
GND(FIN)
Vref
1μF
VOUT=VADJ×(R1+R2)÷R1(V)
:VADJ=0.75V(Typ.)
:A value of approximately 30kΩ
is recommended for R1.
Driver
GND(7PIN)
Vcc(8PIN)
Vref
OCP
TSD
Vcc (2PIN)
CTL (1PIN)
TOP VIEW
OUT (4PIN)
N.C.(3PIN)
1μF
R2
1μF
R1
ADJ(2PIN)
R2
1μF
Pin No.
PinName
Function
1
CTL
Output voltage ON/OFF control
2
Vcc
Power supply voltage input
3
N.C.
Unconnected terminal
4
OUT
Voltage output
5
ADJ
Output voltage configuration terminal
FIN
GND
GND
R1
OCP
N.C.(3PIN) N.C.(4IN)
12
TOP VIEW
8
3
4 5
TO252-5
Pin No.
Pin Name
Function
1
OUT
Voltage output
2
3
5
6
7
8
Driver
R2
5
SOP8(BD00KA5WF)
GND(FIN)
Vref
VOUT=VADJ×(R1+R2)÷R1(V)
:VADJ=0.75V(Typ.)
:A value of approximately 30kΩ
is recommended for R1.
Fig.16
4
[BD□□KA5WFP]
*Output voltage configuration
Driver
TSD
Fig.13
TO252-5(BD00KA5WFP)
CTL (5PIN)
OUT(1PIN)
FIN
ADJ(5PIN)
GND(6PIN)
ADJ
Output voltage configuration terminal
N.C.
Unconnected terminal
CTL
Output voltage ON/OFF control
GND
GND
Vcc
Power supply voltage input
1
4
SOP8
[BD□□KA5WF]
R1
1μF
TSD
Vcc
(2PIN)
CTL (1PIN)
OCP
OUT (4PIN)
1μF
TOP VIEW
N.C.(5PIN)
N.C.(3PIN)
Vcc(8PIN)
GND(7PIN)
GND(6PIN)
CTL (5PIN)
FIN
1μF
Vref
Fig.14
Driver
TO252-5(BD□□KA5WFP)
Pin No.
Pin Name
Function
1
CTL
Output voltage ON/OFF control
2
Vcc
Power supply voltage input
3
N.C.
Unconnected terminal
4
OUT
Voltage output
5
N.C.
Unconnected terminal
FIN
GND
GND
TSD
4 5
N.C.(3PIN)
TO252-5
R2
R1
OUT(1PIN)
3
12
OCP
N.C.(3PIN) N.C.(4IN)
1μF
TOP VIEW
Fig.17
8
5
SOP8(BD□□KA5WF)
Pin Name
Function
1
OUT
Voltage output
N.C.
Unconnected terminal
1
2
Vref
Driver
3
R2
TSD
5
6
OCP
7
8
N.C.(2PIN)
(1PIN)
1μF
OUT (3PIN)
4
SOP8
4
R1
Vcc
Pin No.
CTL
Output voltage ON/OFF control
GND
GND
Vcc
Power supply voltage input
TOP VIEW
1μF
FIN
N.C. pins are electrically open to the inside of the IC chip.
Fig.15
TO252-5(BD□□KA5FP)
Pin No.
Pin Name
Function
1
Vcc
Power supply voltage input
2
N.C.
Unconnected terminal
3
OUT
Voltage output
FIN
GND
GND
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© 2009 ROHM Co., Ltd. All rights reserved.
2
1
3
TO252-3
4/9
2009.04 - Rev.A
Technical Note
BD□□KA5,BD□□KA5W Series,BD00KA5W Series
●Input / Output Equivalent Circuit Diagrams
Vcc Vcc
Vcc
Vcc
※
31.25kΩ 2kΩ
outside the IC between ADJ and GND and
OUT
CTL
With BD00KA5WFP/WF,R1and R2 are connected
between OUT and ADJ.
25kΩ
R2
ADJ
(BD00KA5WFP/WF)
R1
Fig.18
Fig.19
●Thermal Design
Power
Dissipation:Pd(W)
許容損失:Pd(W)
Power
:Pd(W)
PowerDissipation
Dissipation:Pd(W)
1.30
Rohm standard board mounting
Board size:70×70×1.6mm
2
Copper foil area:7×7mm
θja=104.2(℃/W)
1.6
1.2
0.8
0.4
800
1.20
1.2
0.8
0.4
0.0
0.0
0
25
50
75
100
125
150
687.6mW
(1)When using a standard board:
θj-c=181.8(℃/W)
(2) When using an IC alone
θj-a=222.2(℃/W)
600
(1)
562.6mW
400
(2)
200
0
0
25
50
75
100
125
150
周囲温度:Ta(℃)
Ambient
temperature:Ta(℃)
Ambient temperature:Ta(℃)
Fig.20 Power Dissipation heat
reducing characteristics
SOP8
1000
許容損失:Pd(W)
Rohm standard board mounting
Board size:70×70×1.6mm
2
Copper foil area:7×7mm
θja=96.2(℃/W)
1.6
TO252-3
2.0
Power Dissipation:Pd(W)
TO252-5
2.0
Fig.21 Power Dissipation heat
reducing characteristics
0
25
50
75
100
125
150
Ambient
temperature:Ta(℃)
周囲温度:Ta(℃)
Fig.22 Power Dissipation heat
reducing characteristics
When using at temperatures over Ta=25℃, please refer to the power dissipation shown in Fig.20 through 22.
The IC characteristics are closely related to the temperature at which the IC is used, so if the temperature exceeds the
maximum junction temperature TjMAX, the device may malfunction or be destroyed. The heat of the IC requires sufficient
consideration regarding instantaneous destruction and long-term operation reliability. In order to protect the IC from thermal
damage, it is necessary to operate it at temperatures less than the maximum junction temperature TjMAX.
Even when the ambient temperature Ta is a normal temperature(25℃), the chip(junction) temperature Tj may be quite high,
so please operate the IC at temperatures less than the acceptable loss Pd.
The calculation method for power consumption Pc(W) is as follows :
Pc = (Vcc-Vo)×Io+Vcc×Icca
Acceptable loss Pd≧Pc
Solving for the load current IO in order to operate within the acceptable loss,
Io≦
Vcc:Input voltage
Vo:Output voltage
Io:Load current
Icca:Circuit current
Pd – Vcc×Icca
Vcc-Vo
It is then possible to find the maximum load current IoMAX with respect to the applied voltage Vcc at the time of thermal design.
Calculation Example
Example 1) When Ta=85℃, Vcc=2.5V, Vo=1.0V
0.676-2.5×Icca
Io≦
2.5-1.0
Io≦440mA (Icca : 2mA)
BA10KA5WFP(TO252-5 packaging)
θja=96.2℃/W → -10.4mW/℃
25℃=1300mW → 85℃=676mW
Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating
temperature ranges.
The power consumption PC of the IC when there is a short circuit (short between Vo and GND) is :
Pc=Vcc×(Icca+Ishort)
*Ishort : Short circuit current
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5/9
2009.04 - Rev.A
Technical Note
BD□□KA5,BD□□KA5W Series,BD00KA5W Series
●Terminal Vicinity Settings and Cautions
・Vcc Terminal
Please attach a capacitor (greater than 1μF) between Vcc and GND.
The capacitance values differ depending on the application, so chose a capacitor with sufficient margin and verify the
operation on actual board.
・GND Terminal
Please be sure to keep the set ground and IC ground at the same potential level so that a potential difference does not
arise between them. If a potential difference arises between the set ground and the IC ground, the preset voltage will not
be output properly, causing the system to become unstable. Please reduce the impedance by making the ground patterns
as wide as possible and reducing the distance between the set ground and the IC ground as much as possible.
・CTL Terminal
31.25kΩ
The CTL terminal is turned ON at 2.0V and higher, and OFF at
0.8V and lower, within the operating power supply voltage
CTL
range.The power supply and the CTL terminal may be started
up and shut down in any order without problems.
25kΩ
Fig.23 Input equivalent circuit
ESR (Ω)
●Vo Terminal
Please be sure to attach an anti-oscillation capacitor between Vo and GND.
100
Oscillation region
発振領域
OUT
10
Stable region
安定領域
IC
1μF
ESR
Cin
1
Vcc
Vcc
1μF
VCTL
2V
0.1
OUT
1μF
CTL GND ADJ R2
Io(ROUT)
R1
R1=30kΩ,R2=2kΩ
0.01
0
100
200
300
400
Iout(mA)
Fig.24 Output Equivalent Circuit
500
Io(mA)
Fig.25 ESR-Io Characteristics
Be sure to place an anti-oscillation capacitor between the output terminal and the GND. Oscillations may arise if the
capacitance value changes, due to factors such as temperature changes. A 1μF capacitor with small internal series
resistance (ESR) such as a ceramic capacitor is recommended as an anti-oscillation capacitor. Ceramic capacitors generally
have favorable temperature characteristics and DC bypass characteristics. When selecting a ceramic capacitor, a high
voltage capacitor (good DC bypass characteristics) with temperature characteristics that are superior to those of X5R or X7R,
is recommended. In applications where input voltage and load fluctuations are rapid, please decide on a capacitor after
sufficiently confirming its properties according to its specifications in the actual application.
静電容量変化率(%)
50V Max.Input
80
60
16V Max.Input
40
10V Max.Input
20
0
50V Max.Input
100
静電容量変化率(%)
100
120
Rate of change in electrostatic capacitance (%)
120
Rate of change in electrostatic capacitance (%)
静電容量変化率(%)
Rate of change in electrostatic capacitance (%)
120
80
16V Max.Input
60
10V Max.Input
40
20
0
0
1
2
3
4
DC bypass Vdc(V)
直流バイアスVdc(V)
(a)
Capacitance-bypass
characteristics (Y5V)
100
80
X7R
X5R
Y5V
60
40
Vdc=0
20
0
0
1
2
3
4
-25
DC bypass Vdc(V)
直流バイアスVdc(V)
(b)Capacitance-bypass
characteristics(X5R,X7R)
0
25
50
75
Temp(℃)
Temp(℃)
(C)Capacitance-temperature
characteristics(X5R,X7R,Y5V)
Fig.26 :General characteristics of ceramic capacitors
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6/9
2009.04 - Rev.A
Technical Note
BD□□KA5,BD□□KA5W Series,BD00KA5W Series
●Other Caution
○Protection Circuits
Over-current Protection Circuit
A built-in over-current protection circuit corresponding to the current capacity prevents the destruction of the IC when
there are load shorts. This protection circuit is a “7”-shaped current control circuit that is designed such that the current
is restricted and does not latch even when a large current momentarily flows through the system with a high-capacitance
capacitor. However, while this protection circuit is effective for the prevention of destruction due to unexpected accidents,
it is not suitable for continuous operation or transient use. Please be aware when creating thermal designs that the
over-current protection circuit has negative current capacity characteristics with regard to temperature.
○Thermal Shutdown Circuit (Thermal Protection)
This system has a built-in temperature protection circuit for the purpose of protecting the IC from thermal damage. As
shown in Fig. 20-22, this must be used within the range of acceptable loss, but if the acceptable loss is continuously
exceeded, the chip temperature Tj increases, causing the thermal shutdown circuit to operate. When the thermal
shutdown circuit operates, the operation of the circuit is suspended. The circuit resumes operation immediately after the
chip temperature Tj decreases, so the output repeats the ON and OFF states (Please refer to Figs.12 for the temperatures
at which the temperature protection circuit operates).
There are cases in which the IC is destroyed due to thermal runaway when it is left in the overloaded state. Be sure to
avoid leaving the IC in the overloaded state.
○Reverse Current
In order to prevent the destruction of the IC when a reverse current flows through the IC, it is recommended that a diode
be placed between the Vcc and Vo and a pathway be created so that the current can escape (Refer to Fig.27).
Reverse current
OUT
Vcc
CTL
GND
Fig.27 : Bypass diode
○This IC is BI-CMOS IC that has a P-board (substrate) and P+ isolation between each element, as shown in Fig.28. A P-N
junction is formed between this P-layer and the N-layer of each element, and the P-N junction operates as :
- a parasitic diode when the electric potential relationship is GND> Terminal A, GND> Terminal B, or
- a parasitic transistor when the electric potential relationship is Terminal B > GND> Terminal A.
Parasitic elements are structurally inevitable in the IC. The operation of parasitic elements induces mutual interference
between circuits, causing malfunctions and eventually the destruction of the IC. Take precaution as not to use the IC in
ways that would cause parasitic elements to operate. For example, applying a voltage that is lower than the GND
(P-board) to the input terminal.
Transistor (NPN)
B
E
Resistor
(Pin A)
(Pin B) O
(Pin B)
B
GND
E
N
P+
N
P+
P
N
P+
N
N
P
P
P+
P
N
GND
Parasitic element
or transistor
N
Parasitic element
GND
Parasitic element
or transistor
C
GND
(Pin A)
Parasitic element
GND
Fig. 28 : Basic structure example
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© 2009 ROHM Co., Ltd. All rights reserved.
7/9
2009.04 - Rev.A
Technical Note
BD□□KA5,BD□□KA5W Series,BD00KA5W Series
●Ordering part number
B
D
1
Part number
8
K
A
5
Current capacity
500mA
Output voltage
00:Variable
Other:Fixed
W
F
P
Shutdown switch パッケージ
W : Include
FP
F
:TO252-3
TO252-5
: SOP8
-
E
2
Packaging and forming specification
E2: Embossed tape and reel
TO252-3
<Tape and Reel information>
6.5±0.2
C0.5
1.5±0.2
+0.2
5.1 -0.1
Tape
Embossed carrier tape
Quantity
2000pcs
2.3±0.2
0.5±0.1
E2
Direction
of feed
The direction is the 1pin of product is at the lower left when you hold
( reel on the left hand and you pull out the tape on the right hand
1.5
2
3
0.8
1
0.65
)
2.5
9.5±0.5
5.5±0.2
FIN
0.65
0.5±0.1
0.75
2.3±0.2
1.0±0.2
2.3±0.2
1pin
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
TO252-5
<Tape and Reel information>
2.3±0.2
6.5±0.2
C0.5
1.5±0.2
+0.2
5.1 -0.1
0.5±0.1
Tape
Embossed carrier tape
Quantity
2000pcs
Direction
of feed
The direction is the 1pin of product is at the lower left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
1.5
4 5
0.8
1 2 3
2.5
9.5±0.5
5.5±0.2
FIN
E2
0.5±0.1
0.5
1.27
1.0±0.2
1pin
Reel
(Unit : mm)
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© 2009 ROHM Co., Ltd. All rights reserved.
8/9
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2009.04 - Rev.A
Technical Note
BD□□KA5,BD□□KA5W Series,BD00KA5W Series
SOP8
<Tape and Reel information>
6
5
+6°
4° −4°
0.3MIN
7
4.4±0.2
6.2±0.3
8
1 2
3
0.9±0.15
5.0±0.2
(MAX 5.35 include BURR)
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
4
0.595
1.5±0.1
+0.1
0.17 -0.05
0.11
S
1.27
0.42±0.1
1pin
Reel
(Unit : mm)
www.rohm.com
© 2009 ROHM Co., Ltd. All rights reserved.
9/9
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2009.04 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of
any of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
www.rohm.com
© 2009 ROHM Co., Ltd. All rights reserved.
R0039A
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