VISHAY SI3590DV_06

Si3590DV
Vishay Siliconix
New Product
N- and P-Channel 30-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
N-Channel
30
P-Channel
- 30
rDS(on) (Ω)
ID (A)
0.077 at VGS = 4.5 V
3
0.120 at VGS = 2.5 V
2
0.170 at VGS = - 4.5 V
-2
0.300 at VGS = - 2.5 V
- 1.2
• TrenchFET® Power MOSFET
• Ultra Low rDS(on) N- and P-Channel
for High Efficiency
• Optimized for High-Side/Low-Side
• Minimized Conduction Losses
Pb-free
Available
RoHS*
COMPLIANT
APPLICATIONS
• Portable Devices Including PDAs, Cellular
Phones and Pagers
D1
TSOP-6
Top View
3 mm
G1
1
6
D1
S2
2
5
S1
G2
3
4
D2
S2
G2
G1
2.85 mm
Ordering Information: Si3590DV-T1
Si3590DV-T1-E3 (Lead (Pb)-free)
S1
D2
N-Channel MOSFET
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
N-Channel
10 sec
P-Channel
Steady State
10 sec
Steady State
Drain-Source Voltage
VDS
30
- 30
Gate-Source Voltage
VGS
± 12
± 12
TA = 25 °C
Continuous Drain Current (TJ = 150 °C)a
TA = 70 °C
3
2.3
IDM
Pulsed Drain Current
Continuous Source Current (Diode Conduction)a
Maximum Power Dissipationa
ID
IS
TA = 25 °C
TA = 70 °C
Operating Junction and Storage Temperature Range
PD
2.5
-2
2.0
- 1.6
V
- 1.7
- 1.3
8
-8
1.05
0.75
- 1.05
- 0.75
1.15
0.83
1.15
0.83
0.70
0.53
0.70
0.53
TJ, Tstg
Unit
- 55 to 150
A
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambienta
Maximum Junction-to-Foot (Drain)
Symbol
t ≤ 10 sec
Steady State
Steady State
RthJA
RthJF
N-Channel
P-Channel
Typ
Max
Typ
Max
93
110
93
110
130
150
130
150
75
90
75
90
Unit
°C/W
Notes:
a. Surface Mounted on 1" x 1" FR4 Board.
* Pb containing terminations are not RoHS compliant, exemptions may apply.
Document Number: 72032
S-60422-Rev. B, 20-Mar-06
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Si3590DV
Vishay Siliconix
New Product
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Static
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currenta
Drain-Source On-State Resistancea
Forward Transconductancea
Diode Forward Voltagea
VGS(th)
IGSS
IDSS
VDS = VGS, ID = 250 µA
N-Ch
0.6
1.5
VDS = VGS, ID = - 250 µA
P-Ch
- 0.6
- 1.5
VDS = 0 V, VGS = ± 12 V
N-Ch
± 100
P-Ch
± 100
VDS = 30 V, VGS = 0 V
N-Ch
1
VDS = - 30 V, VGS = 0 V
P-Ch
-1
VDS = 30 V, VGS = 0 V, TJ = 55 °C
N-Ch
5
VDS = - 30 V, VGS = 0 V, TJ = 55 °C
P-Ch
VDS ≥ 5 V, VGS = 4.5 V
N-Ch
5
VDS ≤ - 5 V, VGS = - 4.5 V
P-Ch
-5
VGS = 4.5 V, ID = 3 A
N-Ch
0.062
0.077
VGS = - 4.5 V, ID = - 2 A
P-Ch
0.135
0.170
VGS = 2.5 V, ID = 2 A
N-Ch
0.095
0.120
VGS = - 2.5 V, ID = - 1.2 A
P-Ch
0.235
0.300
VDS = 5 V, ID = 3 A
N-Ch
10
VDS = - 5 V, ID = - 2 A
P-Ch
5
IS = 1.05 A, VGS = 0 V
N-Ch
0.80
1.10
IS = - 1.05 A, VGS = 0 V
P-Ch
- 0.83
- 1.10
N-Ch
3
4.5
P-Ch
N-Ch
3.8
0.6
6
P-Ch
0.6
ID(on)
rDS(on)
gfs
VSD
V
nA
µA
-5
A
Ω
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Turn-On Delay Time
td(on)
Rise Time
Turn-Off Delay Time
Fall Time
Source-Drain Reverse Recovery Time
tr
td(off)
tf
N-Channel
VDS = 15 V, VGS = 4.5 V, ID = 2 A
P-Channel
VDS = - 15 V, VGS = - 4.5 V, ID = - 2 A
N-Channel
VDD = 15 V, RL = 15 Ω
ID ≅ 1 A, VGEN = 10 V, RG = 6 Ω
N-Ch
1.0
P-Ch
1.5
N-Ch
5
P-Ch
5
8
N-Ch
P-Ch
12
15
23
23
8
N-Ch
13
23
P-Ch
20
30
N-Ch
7
12
P-Ch
20
30
IF = 1.05 A, di/dt = 100 A/µs
N-Ch
15
25
IF = - 1.05 A, di/dt = 100 A/µs
P-Ch
18
30
P-Channel
VDD = - 15 V, RL = 15 Ω
ID ≅ - 1 A, VGEN = - 10 V, RG = 6 Ω
trr
nC
ns
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 72032
S-60422-Rev. B, 20-Mar-06
Si3590DV
Vishay Siliconix
New Product
N-CHANNEL TYPICAL CHARACTERISTICS
25 °C unless noted
8
8
7
VGS = 5 thru 2.5 V
6
I D - Drain Current (A)
I D - Drain Current (A)
7
5
4
3
2V
2
6
5
4
3
TC = 125 °C
2
1
25 °C
1
- 55 °C
1.5 V
0
0
1
2
3
4
0
0.0
5
0.5
VDS - Drain-to-Source Voltage (V)
1.0
2.5
3.0
Transfer Characteristics
0.5
450
0.4
360
C - Capacitance (pF)
r DS(on) - On-Resistance (Ω)
2.0
VGS - Gate-to-Source Voltage (V)
Output Characteristics
0.3
0.2
Ciss
270
180
VGS = 2.5 V
0.1
90
Coss
VGS = 4.5 V
0.0
Crss
0
0
2
4
6
8
10
0
6
12
18
24
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
6
30
1.8
VDS = 15 V
ID = 2 A
5
VGS = 4.5 V
ID = 3 A
1.6
r DS(on) - On-Resistance
(Normalized)
V GS - Gate-to-Source Voltage (V)
1.5
4
3
2
1
1.4
1.2
1.0
0.8
0
0
1
2
3
Qg - Total Gate Charge (nC)
Gate Charge
Document Number: 72032
S-60422-Rev. B, 20-Mar-06
4
5
0.6
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
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Si3590DV
Vishay Siliconix
New Product
N-CHANNEL TYPICAL CHARACTERISTICS 25 °C unless noted
0.25
10
r DS(on)- On-Resistance (Ω)
I S - Source Current (A)
0.20
TJ = 150 °C
1
TJ = 25 °C
0.1
ID = 3 A
0.15
0.10
0.05
0.00
0.00
0.3
0.6
0.9
1.2
0
1.5
1
VSD - Source-to-Drain Voltage (V)
2
3
4
5
VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
Source-Drain Diode Forward Voltage
0.4
8
ID = 250 µA
6
Power (W)
V GS(th) Variance (V)
0.2
0.0
- 0.2
4
2
- 0.4
- 0.6
- 50
0
- 25
0
25
50
75
100
125
150
0.1
0.01
TJ - Temperature (°C)
1
10
30
Time (sec)
Threshold Voltage
Single Pulse Power, Junction-to-Ambient
100
IDM Limited
I D - Drain Current (A)
10
rDS(on) Limited
100 µs
1
1 ms
ID(on)
Limited
0.1
10 ms
10 s, 1 s
dc
BVDSS Limited
0.01
0.1
100 ms
TC = 25 °C
Single Pulse
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which rDS(on) is specified
Safe Operating Area, Junction-to-Case
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Document Number: 72032
S-60422-Rev. B, 20-Mar-06
Si3590DV
Vishay Siliconix
New Product
N-CHANNEL TYPICAL CHARACTERISTICS 25 °C unless noted
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.1
0.2
Notes:
0.1
PDM
t1
0.05
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 87 °C/W
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10-4
10-3
10-2
10-1
1
100
10
600
Square Wave Pulse Duration (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10-4
10-3
10-2
10-1
Square Wave Pulse Duration (sec)
1
10
Normalized Thermal Transient Impedance, Junction-to-Foot
Document Number: 72032
S-60422-Rev. B, 20-Mar-06
www.vishay.com
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Si3590DV
Vishay Siliconix
New Product
P-CHANNEL TYPICAL CHARACTERISTICS 25 °C unless noted
8
8
VGS = 5 thru 3.5 V
TC = - 55 °C
7
7
25 °C
I D - Drain Current (A)
I D - Drain Current (A)
3V
6
5
4
2.5 V
3
6
5
125 °C
4
3
2
2
2V
1
1
1.5 V
0
0.0
0
0
1
2
3
4
5
0.5
1.0
2.0
2.5
3.0
3.5
VGS - Gate-to-Source Voltage (V)
VDS - Drain-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
0.75
500
0.60
400
C - Capacitance (pF)
r DS(on) - On-Resistance (Ω)
1.5
0.45
VGS = 2.5 V
0.30
VGS = 4.5 V
Ciss
300
200
0.15
100
0.00
0
Coss
Crss
0
1
2
3
4
5
6
7
0
8
12
18
24
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
30
1.8
6
VDS = 15 V
ID = 2 A
5
VGS = 4.5 V
ID = 2 A
1.6
r DS(on) - On-Resistance
(Normalized)
V GS - Gate-to-Source Voltage (V)
6
4
3
2
1.4
1.2
1.0
0.8
1
0
0
1
2
3
Qg - Total Gate Charge (nC)
Gate Charge
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6
4
5
0.6
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
Document Number: 72032
S-60422-Rev. B, 20-Mar-06
Si3590DV
Vishay Siliconix
New Product
P-CHANNEL TYPICAL CHARACTERISTICS 25 °C unless noted
0.5
10
r DS(on) - On-Resistance (Ω)
I S - Source Current (A)
0.4
TJ = 150 °C
1
TJ = 25 °C
0.3
ID = 2 A
0.2
0.1
0.0
0.1
0.00
0.3
0.6
0.9
1.2
0
1.5
1
2
3
4
5
6
7
VGS - Gate-to-Source Voltage (V)
VSD - Source-to-Drain Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
Source-Drain Diode Forward Voltage
0.4
8
ID = 250 µA
0.3
Power (W)
V GS(th) Variance (V)
6
0.2
0.1
4
0.0
2
- 0.1
- 0.2
- 50
0
- 25
0
25
50
75
100
125
150
0.1
0.01
TJ - Temperature (°C)
1
10
30
Time (sec)
Single Pulse Power, Junction-to-Ambient
Threshold Voltage
100
IDM Limited
I D - Drain Current (A)
10
rDS(on) Limited
100 µs
1
1 ms
ID(on)
Limited
0.1
10 ms
TC = 25 °C
Single Pulse
100 ms
10 s, 1 s
dc
0.01
0.1
BVDSS Limited
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which rDS(on) is specified
Safe Operating Area, Junction-to-Case
Document Number: 72032
S-60422-Rev. B, 20-Mar-06
www.vishay.com
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Si3590DV
Vishay Siliconix
New Product
P-CHANNEL TYPICAL CHARACTERISTICS 25 °C unless noted
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.1
0.2
Notes:
0.1
PDM
t1
0.05
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 87 °C/W
0.02
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10-4
10-3
10-2
10-1
1
100
10
600
Square Wave Pulse Duration (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10-4
10-3
10-2
10-1
Square Wave Pulse Duration (sec)
1
10
Normalized Thermal Transient Impedance, Junction-to-Foot
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability
data, see http://www.vishay.com/ppg?72032.
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Document Number: 72032
S-60422-Rev. B, 20-Mar-06
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Vishay
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc.,
or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by
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Document Number: 91000
Revision: 08-Apr-05
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