ON MC74ACT00MELG Quad 2−input nand gate Datasheet

MC74AC00, MC74ACT00
Quad 2−Input NAND Gate
High−Performance Silicon−Gate CMOS
Features
•
•
•
•
•
•
•
Output Drive Capability: $24 mA
Operating Voltage Range: 2 to 6 V AC00; 4.5 to 5.5 ACT00
Low Input Current: 1.0 mA
High Noise Immunity Characteristic of CMOS Devices
In Compliance With the JEDEC Standard No. 7A Requirements
Chip Complexity: 32 FETs
Pb−Free Packages are Available
A1
B1
A2
B2
A3
B3
A4
B4
1
3
2
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MARKING
DIAGRAMS
14
PDIP−14
N SUFFIX
CASE 646
14
6
5
1
1
14
SOIC−14
D SUFFIX
CASE 751A
Y1
14
4
MC74xxx00N
AWLYYWWG
1
xxx00
AWLYWWG
1
Y2
14
Y = AB
9
8
10
12
11
13
Y3
xxx
00
ALYWG
G
TSSOP−14
DT SUFFIX
CASE 948G
1
14
1
Y4
14
PIN 14 = VCC
PIN 7 = GND
SOEIAJ−14
M SUFFIX
CASE 965
14
Figure 1. Logic Diagram
1
VCC
B4
A4
Y4
B3
A3
Y3
14
13
12
11
10
9
8
1
2
3
4
5
6
7
A1
B1
Y1
A2
B2
Y2
GND
74xxx00
ALYWG
1
xxx
= AC or ACT
A
= Assembly Location
WL or L = Wafer Lot
YY or Y = Year
WW or W = Work Week
G
= Pb−Free Package
FUNCTION TABLE
Inputs
Figure 2. Pinout: 14−Lead Packages (Top View)
Output
A
B
Y
L
L
H
H
L
H
L
H
H
H
H
L
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
October, 2006 − Rev. 9
1
Publication Order Number:
MC74AC00/D
MC74AC00, MC74ACT00
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
*0.5 to )7.0
V
*0.5 v VI v VCC )0.5
V
*0.5 v VO v VCC )0.5
V
DC Input Diode Current
$20
mA
IOK
DC Output Diode Current
$50
mA
IO
DC Output Sink/Source Current
$50
mA
ICC
DC Supply Current per Output Pin
$50
mA
IGND
DC Ground Current per Output Pin
$50
mA
TSTG
Storage Temperature Range
*65 to )150
°C
TL
Lead temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction temperature under Bias
)150
°C
qJA
Thermal resistance
PDIP
SOIC
TSSOP
78
125
170
°C/W
PD
Power Dissipation in Still Air at 85°C
PDIP
SOIC
TSSOP
78
125
170
mW
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
ESD Withstand Voltage
ILatch−Up
Latch−Up Performance
VCC
DC Supply Voltage
VI
DC Input Voltage
VO
DC Output Voltage
IIK
(Note 1)
Level 1
Oxygen Index: 30% − 35%
UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
> 2000
> 200
> 1000
V
Above VCC and Below GND at 85°C (Note 5)
$100
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. IO absolute maximum rating must be observed.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
MC74AC00
MC74ACT00
Min
Typ
Max
Unit
2.0
4.5
5.0
5.0
6.0
5.5
V
0
−
VCC
V
VCC
Supply Voltage
Vin, Vout
DC Input Voltage, Output Voltage (Ref. to GND)
tr, tf
Input Rise and Fall Time (Note 6)
MC74AC00
VCC @ 3.0 V
VCC @ 4.5 V
VCC @ 5.5 V
−
−
−
150
40
25
−
−
−
ns/V
tr, tf
Input Rise and Fall Time (Note 7)
MC74ACT00
VCC @ 4.5 V
VCC @ 5.5 V
−
−
10
8.0
−
−
ns/V
TJ
Junction Temperature
−
−
150
°C
TA
Operating Ambient Temperature Range
−55
25
125
°C
IOH
Output Current − High
−
−
−24
mA
IOL
Output Current − Low
−
−
24
mA
6. Vin from 30% to 70% VCC.
7. Vin from 0.8 V to 2.0 V.
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2
MC74AC00, MC74ACT00
DC CHARACTERISTICS
MC74AC00
Symbol
Parameter
VCC
(V)
TA = +255C
TA = −405C to +855C
Typ
TA = −555C + 1255C
Guaranteed Limits
Unit
Conditions
VIH
Minimum High Level
Input Voltage
3.0
4.5
5.5
1.5
2.25
2.75
2.1
3.15
3.85
2.1
3.15
3.85
2.1
3.15
3.85
V
VOUT = 0.1 V
or VCC − 0.1 V
VIL
Maximum Low Level
Input Voltage
3.0
4.5
5.5
1.5
2.25
2.75
0.9
1.35
1.65
0.9
1.35
1.65
0.9
1.35
1.65
V
VOUT = 0.1 V
or VCC − 0.1 V
VOH
Minimum High Level
Output Voltage
3.0
4.5
5.5
2.99
4.49
5.49
2.9
4.4
5.4
2.9
4.4
5.4
2.9
4.4
5.4
V
IOUT = −50 mA
3.0
4.5
5.5
−
−
−
2.56
3.86
4.86
2.46
3.76
4.76
2.4
3.7
4.7
V
*VIN = VIL or VIH
−12 mA
IOH
−24 mA
−24 mA
3.0
4.5
5.5
0.002
0.001
0.001
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
IOUT = 50 mA
3.0
4.5
5.5
−
−
−
0.36
0.36
0.36
0.44
0.44
0.44
0.5
0.5
0.5
V
*VIN = VIL or VIH
12 mA
IOL
24 mA
24 mA
VOL
Maximum Low Level
Output Voltage
IIN
Maximum Input
Leakage Current
5.5
−
$0.
1
$1.0
$1.0
mA
VI = VCC, GND
IOLD
†Minimum Dynamic
Output Current
5.5
−
−
75
50
mA
VOLD = 1.65 V Max
5.5
−
−
−75
−50
mA
VOHD = 3.85 V Min
Maximum Quiescent
Supply Current
5.5
−
4.0
40
40
mA
VIN = VCC or GND
IOHD
ICC
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC.
AC CHARACTERISTICS (tr = tf = 3.0 nS; CL = 50 pF; see Figures 3 and 4 for Waveforms)
MC74AC00
VCC*
(V)
TA = +255C
TA = −405C to +855C
TA = −555C to + 1255C
Min
Typ
Max
Min
Max
Min
Max
Unit
tPLH
Propagation Delay
3.3
5.0
2.0
1.5
7.0
6.0
9.5
8.0
2.0
1.5
10.0
8.5
1.0
1.0
11.0
8.5
ns
tPHL
Propagation Delay
3.3
5.0
1.5
1.5
5.5
4.5
8.0
6.5
1.0
1.0
8.5
7.0
1.0
1.0
9.0
7.0
ns
Symbol
Parameter
*Voltage Range 3.3 V is 3.3 V $0.3 V.
Voltage Range 5.0 V is 5.0 V $0.5 V.
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3
MC74AC00, MC74ACT00
DC CHARACTERISTICS
MC74ACT00
Symbol
Parameter
VCC
(V)
TA = +255C
TA = −405C to +855C
Typ
TA = −555C to + 1255C
Guaranteed Limits
Unit
Conditions
VIH
Minimum High Level
Input Voltage
4.5
5.5
1.5
1.5
2.0
2.0
2.0
2.0
2.0
2.0
V
VOUT = 0.1 V
or VCC − 0.1 V
VIL
Maximum Low Level
Input Voltage
4.5
5.5
1.5
1.5
0.8
0.8
0.8
0.8
0.8
0.8
V
VOUT = 0.1 V
or VCC − 0.1 V
VOH
Minimum High Level
Output Voltage
4.5
5.5
4.49
5.49
4.4
5.4
4.4
5.4
4.4
5.4
V
IOUT = −50 mA
4.5
5.5
−
−
3.86
4.86
3.76
4.76
3.7
4.7
V
*VIN = VIL or VIH
IOH
−24 mA
−24 mA
4.5
5.5
0.001
0.001
0.1
0.1
0.1
0.1
0.1
0.1
V
IOUT = 50 mA
4.5
5.5
−
−
0.36
0.36
0.44
0.44
0.5
0.5
V
*VIN = VIL or VIH
IOL
24 mA
24 mA
VOL
Maximum Low Level
Output Voltage
IIN
Maximum Input
Leakage Current
5.5
−
$0.1
$1.0
$1.0
mA
VI = VCC, GND
DICCT
Additional Max. ICC/Input
5.5
0.6
−
1.5
1.6
mA
VI = VCC − 2.1 V
IOLD
†Minimum Dynamic
Output Current
5.5
−
−
75
50
mA
VOLD = 1.65 V Max
5.5
−
−
−75
−50
mA
VOHD = 3.85 V Min
Maximum Quiescent
Supply Current
5.5
−
4.0
40
40
mA
VIN = VCC or GND
IOHD
ICC
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
AC CHARACTERISTICS (tr = tf = 3.0 nS; CL = 50 pF; see Figures 3 and 4 for Waveforms)
MC74ACT00
Symbol
Parameter
TA = +255C
TA = −405C to +855C
TA = −555C to +1255C
VCC*
(V)
Min
Typ
Max
Min
Max
Min
Max
Unit
tPLH
Propagation Delay
5.0
1.5
5.5
9.0
1.0
9.5
1.0
9.5
ns
tPHL
Propagation Delay
5.0
1.5
4.0
7.0
1.0
8.0
1.0
8.0
ns
*Voltage Range 5.0 V is 5.0 V $0.5 V.
CAPACITANCE
Symbol
Parameter
Value
Typ
Test Conditions
Unit
CIN
Input Capacitance
4.5
VCC = 5.0 V
pF
CPD
Power Dissipation Capacitance
30
VCC = 5.0 V
pF
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4
MC74AC00, MC74ACT00
tf
tr
VCC
90%
INPUT
Vmi
A OR B
10%
GND
tPLH
OUTPUT Y
tPHL
50%
Vmi
= 50% for MC74AC00
= 1.5 V for MC74ACT00
Figure 3. Switching Waveforms
INPUT
OUTPUT
DEVICE
UNDER
TEST
450 W
CL*
*Includes all probe and jig capacitance
Figure 4. Test Circuit
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5
50 W Scope
Test Point
MC74AC00, MC74ACT00
ORDER INFORMATION
Device
Package
MC74AC00D
SOIC−14
MC74AC00DG
SOIC−14
(Pb−Free)
MC74AC00N
PDIP−14
MC74AC00NG
PDIP−14
(Pb−Free)
MC74AC00DR2
SOIC−14
MC74AC00DR2G
SOIC−14
(Pb−Free)
MC74AC00DTR2
TSSOP−14*
MC74AC00DTR2G
TSSOP−14*
MC74AC00MEL
SOEIAJ−14
MC74AC00MELG
SOEIAJ−14
(Pb−Free)
MC74ACT00N
PDIP−14
MC74ACT00NG
PDIP−14
(Pb−Free)
MC74ACT00D
SOIC−14
MC74ACT00DG
SOIC−14
(Pb−Free)
MC74ACT00DR2
SOIC−14
MC74ACT00DR2G
SOIC−14
(Pb−Free)
MC74ACT00DTR2
TSSOP−14*
MC74ACT00DTR2G
TSSOP−14*
MC74ACT00MEL
SOEIAJ−14
MC74ACT00MELG
SOEIAJ−14
(Pb−Free)
Shipping †
55 Units / Rail
25 Units / Rail
2500 / Tape and Reel
2000 / Tape and Reel
25 Units / Rail
55 Units / Rail
2500 / Tape and Reel
2000 / Tape and Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
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6
MC74AC00, MC74ACT00
PACKAGE DIMENSIONS
SOIC−14
CASE 751A−03
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
−A−
14
8
−B−
P 7 PL
0.25 (0.010)
M
7
1
G
−T−
D 14 PL
0.25 (0.010)
T B
S
A
DIM
A
B
C
D
F
G
J
K
M
P
R
J
M
K
M
F
R X 45 _
C
SEATING
PLANE
B
M
S
SOLDERING FOOTPRINT*
7X
7.04
14X
1.52
1
14X
0.58
1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337 0.344
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
0_
7_
0.228 0.244
0.010 0.019
MC74AC00, MC74ACT00
PDIP−14
CASE 646−06
ISSUE P
14
8
1
7
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
B
A
F
L
N
C
−T−
SEATING
PLANE
H
G
D 14 PL
J
K
0.13 (0.005)
M
M
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8
DIM
A
B
C
D
F
G
H
J
K
L
M
N
INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.290
0.310
−−−
10 _
0.015
0.039
MILLIMETERS
MIN
MAX
18.16
19.56
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.37
7.87
−−−
10 _
0.38
1.01
MC74AC00, MC74ACT00
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G−01
ISSUE B
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
S
N
2X
14
L/2
M
B
−U−
L
PIN 1
IDENT.
N
F
7
1
0.15 (0.006) T U
0.25 (0.010)
8
S
DETAIL E
ÇÇÇ
ÉÉÉ
ÇÇÇ
ÉÉÉ
ÇÇÇ
K
A
−V−
K1
J J1
SECTION N−N
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
D
H
G
DETAIL E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
MILLIMETERS
INCHES
DIM MIN
MAX
MIN MAX
A
4.90
5.10 0.193 0.200
B
4.30
4.50 0.169 0.177
C
−−−
1.20
−−− 0.047
D
0.05
0.15 0.002 0.006
F
0.50
0.75 0.020 0.030
G
0.65 BSC
0.026 BSC
H
0.50
0.60 0.020 0.024
J
0.09
0.20 0.004 0.008
J1
0.09
0.16 0.004 0.006
K
0.19
0.30 0.007 0.012
K1 0.19
0.25 0.007 0.010
L
6.40 BSC
0.252 BSC
M
0_
8_
0_
8_
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
14X
0.36
14X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
9
MC74AC00, MC74ACT00
PACKAGE DIMENSIONS
SOEIAJ−14
CASE 965−01
ISSUE A
14
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
LE
8
Q1
E HE
M_
L
7
1
DETAIL P
Z
D
VIEW P
A
e
A1
b
0.13 (0.005)
c
M
0.10 (0.004)
DIM
A
A1
b
c
D
E
e
HE
0.50
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
−−−
2.05
0.05
0.20
0.35
0.50
0.10
0.20
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
−−−
1.42
INCHES
MIN
MAX
−−− 0.081
0.002
0.008
0.014
0.020
0.004
0.008
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
−−− 0.056
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