ESDALC6V1-1BM2 Single line low capacitance TRANSIL™ for ESD protection Applications Where transient overvoltage protection in ESD sensitive equipment is required, such as: ■ Computers ■ Printers ■ Communication systems ■ Cellular phone handsets and accessories ■ Video equipment SOD-882 Features ■ 1 line low capacitance TRANSIL diode ■ Bidirectional ESD protection ■ Breakdown Voltage VBR = 6.1 V min. ■ Low diode capacitance (22 pF typ. at 0 V) ■ Low leakage current: < 100 nA at 3 V ■ Very small PCB area: 0.6 mm2 ■ Leadfree package Functional diagram I/O1 I/O2 Description The ESDALC6V1-1BM2 is a bidirectional single line TVS diode designed to protect the datalines or other I/O ports against ESD transients. The device is ideal for applications where both reduced line capacitance and board space saving are required. Order code Part number Marking ESDALC6V1-1BM2 P Benefits ■ High ESD protection level ■ High integration ■ Suitable for high density boards Complies with the following standards: IEC 61000-4-2 level 4 15 kV (air discharge) 8 kV (contact discharge) TM: TRANSIL is a trademark of STMicroelectronics MIL STD 883E - Method 3015-7: class 3 HBM (Human body model) January 2007 Rev 1 1/7 www.st.com Characteristics 1 ESDALC6V1-1BM2 Characteristics Table 1. Absolute maximum ratings (Tamb = 25° C) Symbol Value Unit Peak pulse voltage (IEC 61000-4-2 contact discharge) ± 30 kV PPP(1) Peak pulse power dissipation (8/20 µs) 140 W IPP Repetitive peak pulse current (8/20 µs) 9 A Tj Junction temperature 125 °C - 55 to + 150 °C 260 °C - 40 to + 125 °C VPP(1) Tstg TL TOP Parameter Tj initial = Tamb Storage temperature range Maximum lead temperature for soldering during 10 s Operating temperature range 1. For a surge greater than the maximum values, the diode will fail in short-circuit. Table 2. Electrical characteristics (Tamb = 25° C) Symbol Parameter VRM Stand-of voltage VBR Breakdown voltage VCL Clamping voltage IRM Leakage current @ VRM IPP Peak pulse current VF Forward voltage drop I VBR ESDALC6V1-1BM2 2/7 IR IRM V IRM IR VBR @ IR Part Number VRM IRM @ VRM max. VRM VBR Rd αT C@0V Bias typ. max. typ. min. max. V V mA nA V Ω 10-4/°C pF 6.1 8.0 1 100 3 0.65 2.5 22 ESDALC6V1-1BM2 Figure 1. Characteristics Relative variation of peak pulse power versus initial junction temperature Figure 2. PPP[Tj initial] / PPP[Tj initial=25°C) Peak pulse power versus exponential pulse duration PPP(W) 1.1 1000 Tj initial=25°C 1.0 0.9 0.8 0.7 0.6 100 0.5 0.4 0.3 0.2 0.1 Tj(°C) tp(µs) 0.0 10 0 25 Figure 3. 50 75 100 125 150 Clamping voltage versus peak pulse current (typical values) 1 Figure 4. IPP(A) 10 100 Junction capacitance versus reverse voltage applied (typical values) C(pF) 100.0 25 F=1MHz VOSC=30mVRMS Tj=25°C Tj initial=25°C 20 10.0 15 10 1.0 5 VLINE(V) VCL(V) 0 0.1 0 Figure 5. 5 10 15 20 25 30 35 40 Relative variation of leakage current versus junction temperature (typical values) 0 Figure 6. 1 2 3 4 5 ESD response to IEC 61000-4-2 (+15 kV air discharge) on each channel IR[Tj] / IR[Tj=25°C] 100 VR=3V 10 Tj(°C) 1 25 50 75 100 125 150 3/7 Ordering information scheme Figure 7. ESD response to IEC 61000-4-2 (-15 kV air discharge) on each channel ESDALC6V1-1BM2 Figure 8. S21 attenuation measurement result dB 0.00 -3 dB - 10.00 - 20.00 - 30.00 F (Hz) - 40.00 100.0k 2 1.0M 10.0M 100.0M Ordering information scheme ESDA LC 6V1 - 1 B M2 ESD Array Low Capacitance Breakdown Voltage 6V1 = 6.1 Volts min Number of lines Directional B = Bi-directional Package M2 = SOD882 4/7 1.0G ESDALC6V1-1BM2 3 Package information Package information ● Epoxy meets UL94, V0 Table 3. SOD-882 dimensions Dimensions TOP VIEW D Ref. INDEX AREA (D/2 x E/2) A A1 Inches Min. Typ. Max. A 0.40 0.47 0.50 0.016 0.019 0.020 A1 0.00 b1 0.20 0.25 0.30 0.008 0.010 0.012 b2 0.20 0.25 0.30 0.008 0.010 0.012 E SIDE VIEW Millimeters Min. Typ. 0.05 0.000 Max. 0.002 BOTTOM VIEW b1 b2 INDEX AREA (D/2 x E/2) L1 OPTIONAL PIN # 1 ID Note: L2 e D 1.00 0.039 E 0.60 0.024 e 0.65 0.026 L1 0.45 0.50 0.55 0.018 0.020 0.022 L2 0.45 0.50 0.55 0.018 0.020 0.022 Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. Figure 9. SOD-882 footprint (dimensions in mm) 0.55 0.55 0.50 0.40 5/7 Ordering information ESDALC6V1-1BM2 Figure 10. Tape and reel specifications 2.0 ± 0.05 Ø 1.5 ± 0.1 4.0 ± 0.1 1.75 ± 0.1 Pin 1 indicator bar 3.5 ±- 0.1 1.10 ± 0.05 8.0 ± 0.3 0.66 ± 0.05 4.0 ± 0.1 0.68 ± 0.05 User direction of unreeling All dimensions in mm In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 4 Ordering information Part number Marking Package Weight Base qty Delivery mode ESDALC6V1-1BM2 P(1) SOD-882 0.89 mg 3000 Tape and reel 1. The marking can be rotated by 90° to diferentiate assembly location 5 6/7 Revision history Date Revision 11-Jan-2007 1 Changes Initial release. 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