ON MC10H211 Dual 3-input 3-output nor gate Datasheet

 SEMICONDUCTOR TECHNICAL DATA
The MC10H211 is designed to drive up to six transmission lines simultan–
eously. The multiple outputs of this device also allow the wire “OR”–ing of
several levels of gating for minimization of gate and package count.
The ability to control three parallel lines with minimum propagation delay
from a single point makes the MC10H211 particularly useful in clock distribution
applications where minimum clock skew is desired.
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
• Propagation Delay, 1.0 ns Typical
• Power Dissipation, 160 mW Typical
• Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
• Voltage Compensated
• MECL 10K–Compatible
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
MAXIMUM RATINGS
Characteristic
Symbol
Rating
Unit
VEE
VI
–8.0 to 0
Vdc
0 to VEE
Vdc
Power Supply (VCC = 0)
Input Voltage (VCC = 0)
Output Current — Continuous
— Surge
Iout
50
100
mA
Operating Temperature Range
TA
Tstg
0 to +75
°C
–55 to +150
–55 to +165
°C
°C
Storage Temperature Range — Plastic
— Ceramic
LOGIC DIAGRAM
2
12
0°
Symbol
Min
Power Supply Current
IE
IinH
IinL
Input Current High
Input Current Low
High Output Voltage
Low Output Voltage
High Input Voltage
Low Input Voltage
25°
Max
Min
—
42
—
720
0.5
—
75°
Max
Min
—
38
—
450
0.5
—
Max
Unit
—
42
mA
—
450
µA
0.3
—
µA
VOH
VOL
–1.02 –0.84 –0.98 –0.81 –0.92
–0.735
Vdc
–1.95 –1.63 –1.95 –1.63 –1.95
–1.60
Vdc
VIH
VIL
–1.17 –0.84 –1.13 –0.81 –1.07
–0.735
Vdc
–1.95 –1.48 –1.95 –1.48 –1.95
–1.45
Vdc
VCC1 = PINS 1, 15
VCC2 = PIN 16
VEE = PIN 8
DIP
PIN ASSIGNMENT
AC PARAMETERS
Propagation Delay
13
14
9
10
11
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note)
Characteristic
3
4
5
6
7
VCC1
1
16
VCC2
AOUT
2
15
VCC1
0.7
1.6
0.7
1.6
0.7
1.7
ns
Rise Time
tpd
tr
0.9
2.0
0.9
2.2
0.9
2.4
ns
AOUT
3
14
BOUT
Fall Time
tf
0.9
2.0
0.9
2.2
0.9
2.4
ns
AOUT
4
13
BOUT
AIN
5
12
BOUT
AIN
6
11
BIN
AIN
7
10
BIN
VEE
8
9
BIN
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table,
after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed
circuit board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated
through a 50–ohm resistor to –2.0 volts.
Note: If crosstalk is present, double bypass capacitor to 0.2 µF.
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 6–11 of the Motorola MECL Data
Book (DL122/D).
3/93
 Motorola, Inc. 1996
2–296
REV 5
MC10H211
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
0.007 (0.180) M T L–M
B
Y BRK
–N–
U
N
S
0.007 (0.180) M T L–M
S
S
N
S
D
–L–
–M–
Z
W
20
D
1
V
0.010 (0.250)
G1
X
S
T L–M
S
N
S
VIEW D–D
A
0.007 (0.180) M T L–M
S
N
S
R
0.007 (0.180) M T L–M
S
N
S
Z
C
H
–T–
SEATING
PLANE
F
VIEW S
G1
0.010 (0.250) S T L–M
S
0.007 (0.180)
M
T L–M
S
N
S
VIEW S
S
N
S
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
MECL Data
DL122 — Rev 6
N
K
0.004 (0.100)
J
S
K1
E
G
0.007 (0.180) M T L–M
2–297
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
–––
0.025
–––
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
–––
0.020
2_
10 _
0.310
0.330
0.040
–––
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
–––
0.64
–––
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
–––
0.50
2_
10 _
7.88
8.38
1.02
–––
MOTOROLA
MC10H211
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
–A–
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–B–
C
L
DIM
A
B
C
D
E
F
G
H
K
L
M
N
–T–
K
N
SEATING
PLANE
M
E
F
J
G
D
16 PL
0.25 (0.010)
16 PL
0.25 (0.010)
M
T A
T B
M
–A–
9
1
8
B
F
C
L
S
–T–
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
–––
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15 _
0.51
1.01
S
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
16
S
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
–––
0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15 _
0.020
0.040
T A
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
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◊
MOTOROLA
2–298
*MC10H211/D*
MC10H211/D
MECL Data
DL122 — Rev 6
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