ON MBRB2060CTG Switch-mode power rectifier Datasheet

MBRB2060CTG,
MBR2060CTG,
NRVBB2060CTT4G
Switch‐mode
Power Rectifiers
TO−220/D2PAK Surface Mount Power
Package
These state-of-the-art devices employ the use of the Schottky Barrier
principle with a platinum barrier metal.
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SCHOTTKY BARRIER
RECTIFIERS
20 AMPERES, 60 VOLTS
Features
•
•
•
•
•
•
•
•
•
•
Package Designed for Power Surface Mount Applications (D2PAK)
Center-Tap Configuration (D2PAK)
Guardring for Stress Protection
Low Forward Voltage
175°C Operating Junction Temperature
Epoxy Meets UL 94 V−0 @ 0.125 in
Short Heat Sink Tab Manufactured − Not Sheared (D2PAK)
Similar in Size to Industry Standard TO−220 Package
NRVBB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These are Pb−Free Devices
•
•
1
3
• Case: Epoxy, Molded, Epoxy Meets UL 94 V−0
• Weight: 1.7 Grams (Approximately) − D2PAK,
•
TO−220
CASE 221A
STYLE 6
4
Mechanical Characteristics:
•
D2PAK
CASE 418B
STYLE 3
1.9 Grams (Approximately) − TO−220
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds (D2PAK)
Device Meets MSL1 Requirements (D2PAK)
ESD Ratings:
♦ Machine Model = C (> 400 V)
♦ Human Body Model = 3B (> 8000 V)
MARKING DIAGRAMS
AY WW
B2060G
AKA
A
Y
WW
B2060
G
AKA
AY WW
B2060G
AKA
= Assembly Location
= Year
= Work Week
= Device Code
= Pb−Free Package
= Diode Polarity
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
September, 2014 − Rev. 10
1
Publication Order Number:
MBRB2060CT/D
MBRB2060CTG, MBR2060CTG, NRVBB2060CTT4G
MAXIMUM RATINGS (Per Leg)
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
60
V
Average Rectified Forward Current
(Rated VR, TC = 110°C) Total Device
IF(AV)
10
20
A
Peak Repetitive Forward Current
(Rated VR, Square Wave, 20 kHz, TC = 100°C)
IFRM
Non-Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
IFSM
Peak Repetitive Reverse Surge Current (2.0 ms, 1.0 kHz)
IRRM
0.5
A
Storage Temperature Range
Tstg
−65 to +175
°C
Operating Junction Temperature (Note 1)
TJ
−65 to +175
°C
dv/dt
10,000
V/ms
Rating
A
20
Voltage Rate of Change (Rated VR)
A
150
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RqJA.
THERMAL CHARACTERISTICS (Per Leg)
Characteristic
Symbol
Value
RqJC
RqJA
2.0
50
RqJA
60
Symbol
Value
Unit
°C/W
Thermal Resistance,
Junction−to−Case
Junction−to−Ambient (Note 2)
MBRB2060CTG
Junction−to−Ambient (Note 2)
MBR2060CTG
2. When mounted using minimum recommended pad size on FR−4 board.
ELECTRICAL CHARACTERISTICS (Per Leg)
Characteristic
Maximum Instantaneous Forward Voltage (Note 3)
(iF = 20 Amps, TJ = 125°C)
(iF = 20 Amps, TJ = 25°C)
vF
Maximum Instantaneous Reverse Current (Note 3)
(Rated dc Voltage, TJ = 125°C)
(Rated dc Voltage, TJ = 25°C)
iR
Unit
V
0.85
0.95
mA
35
0.15
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
ORDERING INFORMATION
Device
MBRB2060CTG
Package
Shipping†
D2PAK
50 Units / Rail
(Pb−Free)
MBRB2060CTT4G
D2PAK
(Pb−Free)
800 Units / Tape & Reel
NRVBB2060CTT4G*
D2PAK
(Pb−Free)
800 Units / Tape & Reel
MBR2060CTG
TO−220
(Pb−Free)
50 Units / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NRVBB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
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2
50
TJ = 150°C
125°C
20
I R, REVERSE CURRENT (mA)
i F, INSTANTANEOUS FORWARD CURRENT (AMPS)
MBRB2060CTG, MBR2060CTG, NRVBB2060CTT4G
150°C
10
100°C
5
TJ = 25°C
3
1
10
TJ = 125°C
TJ = 100°C
1
0.1
0.01
0.5
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
vF, INSTANTANEOUS VOLTAGE (VOLTS)
0.9
1
TJ = 25°C
0
20
dc
40
60
80
100
VR, REVERSE VOLTAGE (VOLTS)
120
140
Figure 2. Typical Reverse Current Per Diode
20
18
RATED VOLTAGE APPLIED
RqJC = 2°C/W
AVERAGE POWER (WATTS)
IF(AV) , AVERAGE FORWARD CURRENT (AMPS)
Figure 1. Typical Forward Voltage Per Diode
20
15
SQUARE WAVE
10
5.0
IPK/IAV = 5
TJ = 125°C
PI
16
IPK/IAV = 10
14
12
IPK/IAV = 20
10
SQUARE
WAVE
8
6
DC
4
2
0
0
80
100
120
140
TC, CASE TEMPERATURE (°C)
160
180
0
Figure 3. Typical Current Derating, Case,
Per Leg
2
4
6
8
10
12
14
AVERAGE CURRENT (AMPS)
16
18
Figure 4. Average Power Dissipation and
Average Current
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3
20
MBRB2060CTG, MBR2060CTG, NRVBB2060CTT4G
PACKAGE DIMENSIONS
D2PAK 3
CASE 418B−04
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 418B−01 THRU 418B−03 OBSOLETE,
NEW STANDARD 418B−04.
C
E
V
W
−B−
4
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
S
V
A
1
2
S
3
−T−
SEATING
PLANE
K
W
J
G
D
H
3 PL
0.13 (0.005)
VARIABLE
CONFIGURATION
ZONE
M
T B
M
N
R
M
STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. CATHODE
P
U
L
L
L
M
M
F
F
F
VIEW W−W
1
VIEW W−W
2
VIEW W−W
3
SOLDERING FOOTPRINT*
10.49
8.38
16.155
2X
3.504
2X
1.016
5.080
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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4
INCHES
MIN
MAX
0.340 0.380
0.380 0.405
0.160 0.190
0.020 0.035
0.045 0.055
0.310 0.350
0.100 BSC
0.080
0.110
0.018 0.025
0.090
0.110
0.052 0.072
0.280 0.320
0.197 REF
0.079 REF
0.039 REF
0.575 0.625
0.045 0.055
MILLIMETERS
MIN
MAX
8.64
9.65
9.65 10.29
4.06
4.83
0.51
0.89
1.14
1.40
7.87
8.89
2.54 BSC
2.03
2.79
0.46
0.64
2.29
2.79
1.32
1.83
7.11
8.13
5.00 REF
2.00 REF
0.99 REF
14.60 15.88
1.14
1.40
MBRB2060CTG, MBR2060CTG, NRVBB2060CTT4G
PACKAGE DIMENSIONS
TO−220
CASE 221A−09
ISSUE AH
−T−
B
SEATING
PLANE
C
F
T
S
4
DIM
A
B
C
D
F
G
H
J
K
L
N
Q
R
S
T
U
V
Z
A
Q
1 2 3
U
H
K
Z
L
R
V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
J
G
D
INCHES
MIN
MAX
0.570
0.620
0.380
0.415
0.160
0.190
0.025
0.038
0.142
0.161
0.095
0.105
0.110
0.161
0.014
0.024
0.500
0.562
0.045
0.060
0.190
0.210
0.100
0.120
0.080
0.110
0.045
0.055
0.235
0.255
0.000
0.050
0.045
----0.080
MILLIMETERS
MIN
MAX
14.48
15.75
9.66
10.53
4.07
4.83
0.64
0.96
3.61
4.09
2.42
2.66
2.80
4.10
0.36
0.61
12.70
14.27
1.15
1.52
4.83
5.33
2.54
3.04
2.04
2.79
1.15
1.39
5.97
6.47
0.00
1.27
1.15
----2.04
N
STYLE 6:
PIN 1.
2.
3.
4.
ANODE
CATHODE
ANODE
CATHODE
ON Semiconductor and the
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MBRB2060CT/D
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