AOSMD AON3806 Common-drain dual n-channel enhancement mode field effect transistor Datasheet

AON3806
Common-Drain Dual N-Channel Enhancement Mode Field
Effect Transistor
General Description
Features
The AON3806 uses advanced trench technology to
provide excellent RDS(ON), low gate charge and
operation with gate voltages as low as 1.8V while
retaining a 12V VGS(MAX) rating. It is ESD protected.
This device is suitable for use as a uni-directional or
bi-directional load switch, facilitated by its commondrain configuration. Standard Product AON3806is Pbfree (meets ROHS & Sony 259 specifications).
AON3806L is a Green Product ordering option.
AON3806 and AON3806L are electrically identical.
VDS (V) = 20V
ID = 7.3 A (VGS = 10V)
RDS(ON) < 26mΩ (VGS = 4.5V)
RDS(ON) < 27mΩ (VGS = 4V)
RDS(ON) < 32mΩ (VGS = 2.5V)
ESD Rating: 2500V HBM
D1
DFN 3x3
Top View
Bottom View
S2
D2
G2
D2
S1
D1
G1
D1
G1
G2
S1
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
TA=25°C
Continuous Drain
Current A
Pulsed Drain Current
ID
IDM
TA=70°C
B
Junction and Storage Temperature Range
Alpha & Omega Semiconductor, Ltd.
Maximum
20
Units
V
±12
V
30
2.2
W
1.4
TJ, TSTG
°C
-55 to 150
Symbol
t ≤ 10s
Steady-State
Steady-State
A
5.8
PD
TA=70°C
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A
Maximum Junction-to-Lead C
S2
7.3
TA=25°C
Power Dissipation A
D2
RθJA
RθJL
Typ
43
77
36
Max
56
110
50
Units
°C/W
°C/W
°C/W
AON3806
Electrical Characteristics (T J=25°C unless otherwise noted)
Symbol
Parameter
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
Min
Conditions
ID=250µA, VGS=0V
1
IGSS
Gate-Body leakage current
VDS=0V, VGS=±10V
BVGSO
Gate-Source Breakdown Voltage
VDS=0V, IG=±250uA
±12
VGS(th)
Gate Threshold Voltage
VDS=VGS ID=250µA
0.5
ID(ON)
On state drain current
VGS=4.5V, VDS=5V
30
TJ=55°C
Gate resistance
SWITCHING PARAMETERS
Qg
Total Gate Charge
Qgs
Gate Source Charge
1
V
A
VGS=4V, ID=7.1A
22
27
mΩ
VGS=2.5V, ID=6.6A
26
32
mΩ
1
V
2.5
A
VDS=5V, ID=7.3A
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Reverse Transfer Capacitance
0.71
26
IS=1A,VGS=0V
Diode Forward Voltage
Maximum Body-Diode Continuous Current
Rg
V
35
Forward Transconductance
Crss
µA
21
VSD
Output Capacitance
µA
29
TJ=125°C
gFS
Coss
5
10
VGS=4.5V, ID=7.3A
IS
Units
V
VDS=16V, VGS=0V
Zero Gate Voltage Drain Current
Static Drain-Source On-Resistance
Max
20
IDSS
RDS(ON)
Typ
VGS=0V, VDS=10V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
VGS=4.5V, VDS=10V, ID=7.3A
30
0.74
mΩ
S
1390
pF
190
pF
150
pF
1.5
Ω
15.4
nC
1.4
nC
Qgd
Gate Drain Charge
4
nC
tD(on)
Turn-On DelayTime
6.2
ns
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
tf
Turn-Off Fall Time
VGS=5V, VDS=10V, RL=1.4Ω,
RGEN=3Ω
11
ns
40.5
ns
10
ns
trr
Body Diode Reverse Recovery Time
IF=7.3A, dI/dt=100A/µs
15
Qrr
Body Diode Reverse Recovery Charge IF=7.3A, dI/dt=100A/µs
5.1
ns
nC
A: The value of R θJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C.
The value in any given application depends on the user's specific board design. The current rating is based on the t≤ 10s thermal
resistance rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.
D. The static characteristics in Figures 1 to 6,12,14 are obtained using 80µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The
SOA curve provides a single pulse rating.
Rev 0: April 2006
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Alpha & Omega Semiconductor, Ltd.
AON3806
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
20
30
10V
3V
VDS=5V
VGS =2V
4V
15
ID(A)
ID(A)
20
10
10
125°C
5
VGS =1.5V
25°C
0
0
0
1
2
3
4
5
0.0
VDS(Volts)
1.0
30
1.6
Normalize ON-Resistance
VGS =2.5V
25
20
VGS =4.5V
15
10
0
5
10
15
1.5
2.0
2.5
VGS(Volts)
Figure 2: Transfer Characteristics
Figure 1: On-Regions Characteristics
RDS(ON)(mΩ)
0.5
VGS=2.5V
ID=6.6A
1.4
VGS=4.5V
ID=7.3A
1.2
1.0
0.8
20
0
ID(A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
25
50
75
100
125
150
175
Temperature (°C)
Figure 4: On-Resistance vs. Junction
Temperature
60
1E+01
ID=7.3A
1E+00
125°C
1E-01
40
IS(A)
RDS(ON)(mΩ)
50
125°C
30
1E-02
1E-03
25°C
20
25°C
1E-04
1E-05
10
0
2
4
6
8
VGS(Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
Alpha & Omega Semiconductor, Ltd.
0.0
0.2
0.4
0.6
0.8
VSD(Volts)
Figure 6: Body-Diode Characteristics
1.0
AON3806
5
2000
4
1600
Capacitance (pF)
VGS(Volts)
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
3
VDS=10V
ID=7.3A
2
Ciss
1200
800
Crss
400
1
0
0
0
5
10
15
0
20
100.0
T J(Max)=150°C
T A=25°C
Power (W)
1ms
0.1s
RDS(ON)
limited 1s
10ms
20
0
0.001
DC
0.1
1
10
100
Figure 9: Maximum Forward Biased Safe
Operating Area (Note E)
D=T on/T
T J,PK =T A+PDM.ZθJA.RθJA
RθJA=56°C/W
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note E)
VDS (Volts)
ZθJA Normalized Transient
Thermal Resistance
20
10
10s
10
15
T J(Max)=150°C
T A=25°C
30
100µs
10.0
0.1
10
40
10µs
1.0
5
VDS(Volts)
Figure 8: Capacitance Characteristics
Qg (nC)
Figure 7: Gate-Charge Characteristics
ID (Amps)
Coss
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
1
PD
0.1
T on
0.01
0.00001
0.0001
0.001
0.01
0.1
1
T
10
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
Alpha & Omega Semiconductor, Ltd.
100
1000
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