Rohm BD5226G-2CTR Free time delay setting cmos voltage detector (reset) ic Datasheet

Datasheet
Voltage Detector (Reset) IC Series for Automotive Application
Free Time Delay Setting
CMOS Voltage Detector (Reset) IC
BD52xx-2C Series and BD53xx-2C Series
Key Specifications
General Description
ROHM's BD52xx-2C and BD53xx-2C series are highly
accurate, low current consumption Voltage Detector
ICs with a capacitor controlled time delay. The lineup
includes N-channel open drain output (BD52xx-2C)
and CMOS output (BD53xx-2C) so that the users can
select depending on the application. The devices are
available for specific detection voltage ranging from
0.9V to 5.0V with 0.1V increment.
The time delay has ±50% accuracy in the overall
operating temperature range of -40°C to 125°C.
 Detection Voltage:
0.9V to 5.0V (Typ.)
0.1V step
 Ultra-Low Current Consumption:
0.27µA (Typ.)
 Time Delay Accuracy:
±50% (-40°C to +125°C, )
(CT pin capacitor ≥ 1nF)
Special Characteristics
 Detection Voltage Accuracy:
±3%±12mV (VDET=0.9V to 1.6V)
±3% (VDET=1.7V to 5.0V)
Special Features






(Note1)
Package
AEC-Q100 Qualified
Delay Time Setting controlled by external capacitor
Two output types (Nch open drain and CMOS output)
Ultra-low Current Consumption
Very small, lightweight and thin package
Package SSOP5 is similar to SOT-23-5 (JEDEC)
(Note1: Grade 1)
SSOP5:
W(typ) x D(typ) x H(max)
2.90mm x 2.80mm x 1.25mm
Application
All automotive devices that requires voltage detection
Application Circuit
VDD1
VDD2
VDD1
RL
Microcontroller
BD52xx-2C
Microcontroller
BD53xx-2C
RST
CCT
RST
CCT
GND
GND
Figure 1. Open Drain Output Type
BD52xx-2C Series
Pin Configuration
CT
SSOP5
TOP VIEW
Figure 2. CMOS Output Type
BD53xx-2C Series
N.C.
Lot No.
Marking
VOUT VDD GND
Pin Description
SSOP5
PIN No.
1
2
3
4
5
Symbol
VOUT
VDD
GND
N.C.
CT
Function
Output pin
Power supply voltage
GND
No connection pin
Capacitor connection pin for output delay time setting
○Product structure:Silicon monolithic integrated circuit
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
N.C. pin is electrically open and can
be connected to either VDD or GND.
○This product has no designed protection against radioactive rays
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TSZ02201-0R7R0G300200-1-2
25.Apr.2016 Rev.001
BD52xx-2C Series
BD53xx-2C Series
Ordering Information
B
D
x
x
x
x
x
-
2
C
T
R
Part
Output Type
Detection Voltage
Package
Product Rank
Packaging and forming
Number
52 : Open Drain
09 : 0.9V
G : SSOP5
C : for Automotive
specification
53 : CMOS
0.1V step
TR : Embossed tape and reel
50 : 5.0V
Lineup
Output Type
Detection Voltage Marking
5.0V
1Z
4.9V
1Y
4.8V
1X
4.7V
1W
4.6V
1V
4.5V
1U
4.4V
1T
4.3V
1S
4.2V
1R
4.1V
1Q
4.0V
1P
3.9V
1N
3.8V
08
3.7V
07
3.6V
06
3.5V
05
3.4V
04
3.3V
03
3.2V
02
3.1V
01
3.0V
5G
2.9V
Z9
2.8V
Z8
2.7V
Z7
2.6V
XS
2.5V
XR
2.4V
24
2.3V
23
2.2V
22
2.1V
21
2.0V
20
1.9V
19
1.8V
18
1.7V
17
1.6V
16
1.5V
15
1.4V
14
1.3V
13
1.2V
12
1.1V
11
1.0V
10
0.9V
09
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© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Open Drain
Part Number
BD5250
BD5249
BD5248
BD5247
BD5246
BD5245
BD5244
BD5243
BD5242
BD5241
BD5240
BD5239
BD5238
BD5237
BD5236
BD5235
BD5234
BD5233
BD5232
BD5231
BD5230
BD5229
BD5228
BD5227
BD5226
BD5225
BD5224
BD5223
BD5222
BD5221
BD5220
BD5219
BD5218
BD5217
BD5216
BD5215
BD5214
BD5213
BD5212
BD5211
BD5210
BD5209
2/20
CMOS
Marking
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
5F
5E
Part Number
BD5350
BD5349
BD5348
BD5347
BD5346
BD5345
BD5344
BD5343
BD5342
BD5341
BD5340
BD5339
BD5338
BD5337
BD5336
BD5335
BD5334
BD5333
BD5332
BD5331
BD5330
BD5329
BD5328
BD5327
BD5326
BD5325
BD5324
BD5323
BD5322
BD5321
BD5320
BD5319
BD5318
BD5317
BD5316
BD5315
BD5314
BD5313
BD5312
BD5311
BD5310
BD5309
TSZ02201-0R7R0G300200-1-2
25.Apr.2016 Rev.001
BD52xx-2C Series
BD53xx-2C Series
Absolute Maximum Ratings (Ta=-40°C to +125°C)
Parameter
Symbol
VDD-GND
Limit
-0.3 to +7
GND-0.3 to +7
GND-0.3 to VDD+0.3
Unit
V
70
-40 to +125
mA
°C
Junction Temperature Range
Io
Topr
Tj
-40 to +150
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Power Supply Voltage
Output Voltage
Nch Open Drain Output
VOUT
CMOS Output
Output Current
Operating Temperature Range
V
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open
circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Thermal Resistance (Note 1)
Parameter
Symbol
Thermal Resistance (Typ)
1s
(Note 3)
(Note 4)
2s2p
Unit
SSOP5
Junction to Ambient
Junction to Top Characterization Parameter
(Note 2)
θJA
376.5
185.4
°C/W
ΨJT
40
30
°C/W
(Note 1)Based on JESD51-2A(Still-Air).
(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3)Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.57mm
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
(Note 4)Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
4 Layers
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.6mm
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
74.2mm x 74.2mm
70μm
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BD52xx-2C Series
BD53xx-2C Series
Electrical Characteristics (Unless otherwise specified Ta=-40°C to +125°C, VDD=0.8V to 6V)
Parameter
Symbol
Condition
VDET=0.9V to 1.6V, VDD=HL, RL=100kΩ
Detection Voltage
VDET
VDET=1.7V to 5.0V, VDD=HL, RL=100kΩ
Hysteresis Voltage
∆VDET VDD=LHL, RL=100kΩ
Circuit Current when ON
Circuit Current when OFF
Operating Voltage Range
IDD1
IDD2
VOPL
“Low” Output Voltage (Nch)
VOL
“High” Output Voltage (Pch)
VOH
Output Leak Current (BD52xx)
ILEAK
Delay Time (L → H)
tPLH
VDD= VDET-0.2V
VDD= VDET+0.5V
VOL≤0.4V, Ta=-40°C to 125°C, RL=100kΩ
VDD=0.8V, ISINK = 0.17mA, VDET=0.9V to 1.6V
VDD=1.2V, ISINK = 1.0mA, VDET=1.7V to 5.0V
VDD=2.4V, ISINK = 2.0mA, VDET=2.7V to 5.0V
VDD=4.8V, ISOURCE=2.0mA,
VDET(0.9V to 4.2V)
VDD=6.0V, ISOURCE=2.5mA,
VDET(0.9V to 5.0V)
VDD= VDS=6V
VOUT=GND→50%, CT=0.01μF
Note 1 Note 2
Min
VDET(T)
×0.97
-0.012
VDET (T)
×0.97
VDET
×0.03
0.80
VDD-0.4
Limit
Typ
VDET
×0.05
0.23
0.27
-
Max
VDET(T)
×1.03
+0.012
VDET(T)
×1.03
VDET
×0.07
1.50
1.60
0.4
0.4
0.4
-
-
VDET(T)
VDET(T)
Unit
V
V
µA
µA
V
V
V
VDD-0.4
-
-
-
-
1.0
µA
27.7
55.5
83.2
ms
VDET(T) : Standard Detection Voltage(0.9V to 5.0V, 0.1V step)
RL: Pull-up resistor to be connected between VOUT and power supply.
Note 1 tPLH : VDD=(VDET(T)–0.1V) → (VDET(T)+0.5V) for VDET=0.9V to 1.2V
tPLH : VDD=(VDET(T)–0.5V) → (VDET(T)+0.5V) for VDET=1.3V to 5.0V
Note 2 CT delay capacitor range: open to 4.7µF.
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BD52xx-2C Series
BD53xx-2C Series
Block Diagram
VDD
VOUT
Delay
Delay
Circuit
Vref
*1
T
*1
*1
GND
*1: Parasitic Diode
CT
Figure 3. BD52xx-2C Series
VDD
*1
Delay
Delay
Circuit
Circuit
Vref
VOUT
*1
*1
*1
GND
*1: Parasitic Diode
CT
Figure 4. BD53xx-2C Series
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BD52xx-2C Series
BD53xx-2C Series
Typical Performance Curves
0.6
1.0
BD5209G-2C
0.9
BD5209G-2C
0.5
0.7
Circuit Current : IDD(µA)
Circuit Current : IDD(µA)
0.8
Ta=125°C
Ta=105°C
0.6
Ta=25°C
0.5
0.4
0.3
0.2
VDD=VDET+0.5V
0.3
0.2
VDD=VDET-0.2V
0.1
Ta=-40°C
0.1
0.4
0.0
0.0
0
1
2
3
4
5
-40 -25 -10
6
20 35 50 65 80 95 110 125
Temperature : Ta (°C)
Supply Voltage : VDD (V)
Figure 6. Circuit Current vs. Temp
Figure 5. Circuit Current vs. VDD
1.0
0.6
0.9
BD5230G-2C
BD5230G-2C
0.5
Circuit Current : IDD(µA)
0.8
Circuit Current : IDD(µA)
5
0.7
Ta=125°C
0.6
Ta=105°C
0.5
Ta=25°C
0.4
0.3
0.2
0.4
VDD=VDET+0.5V
0.3
0.2
VDD=VDET-0.2V
0.1
Ta=-40°C
0.1
0.0
0.0
0
1
2
3
4
5
-40 -25 -10
6
20 35 50 65 80 95 110 125
Temperature : Ta (°C)
Supply Voltage : VDD (V)
Figure 8. Circuit Current vs. Temp
Figure 7. Circuit Current vs. VDD
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TSZ02201-0R7R0G300200-1-2
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BD52xx-2C Series
BD53xx-2C Series
Typical Performance Curves - continued
0.6
1.0
0.9
BD5250G-2C
BD5250G-2C
0.5
Circuit Current : IDD(µA)
Circuit Current : IDD(µA)
0.8
0.7
0.6
Ta=125°C
0.5
Ta=25°C
Ta=105°C
0.4
0.3
0.2
0.3
VDD=VDET-0.2V
0.2
0.1
Ta=-40°C
0.1
VDD=VDET+0.5V
0.4
0.0
0.0
0
1
2
3
4
5
-40 -25 -10
6
20 35 50 65 80 95 110 125
Temperature : Ta (°C)
Supply Voltage : VDD (V)
Figure 10. Circuit Current vs. Temp
Figure 9. Circuit Current vs. VDD
6.0
1.3
BD5209G-2C
BD5209G-2C
1.2
Detection Voltage : VDET(V)
5.0
Output Voltage : VOUT(V)
5
4.0
3.0
2.0
1.0
1.1
VDET + ΔVDET
1.0
0.9
VDET
0.8
0.7
0.0
0.6
0.7
0.8
0.9
1.0
1.1
1.2
-40 -25 -10
5
20 35 50 65 80 95 110 125
Supply Voltage : VDD (V)
Temperature : Ta (°C)
Figure 11. Detection Voltage
Figure 12. Detection Voltage and Release Voltage
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TSZ02201-0R7R0G300200-1-2
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BD52xx-2C Series
BD53xx-2C Series
Typical Performance Curves - continued
6.0
3.6
3.5
BD5230G-2C
Detection Voltage : VDET(V)
Output Voltage : VOUT(V)
5.0
4.0
3.0
2.0
1.0
BD5230G-2C
3.4
VDET + ΔVDET
3.3
3.2
3.1
3.0
2.9
VDET
2.8
2.7
0.0
2.6
2.7
2.8
2.9
3
3.1
3.2
3.3
3.4
3.5
-40 -25 -10
20 35 50 65 80 95 110 125
Temperature : Ta (°C)
Figure 13. Detection Voltage
Figure 14. Detection Voltage and Release Voltage
5.6
6.0
5.5
BD5250G-2C
Detection Voltage : VDET(V)
5.0
Output Voltage : VOUT(V)
5
Supply Voltage : VDD (V)
4.0
3.0
2.0
1.0
BC
BD5250G-2C
VDET + ΔVDET
5.4
5.3
5.2
5.1
5.0
VDET
4.9
4.8
4.7
0.0
4.6
4.7
4.8
4.9
5.0
5.1
5.2
5.3
5.4
5.5
5.6
-40 -25 -10
5
20 35 50 65 80 95 110 125
Supply Voltage : VDD (V)
Temperature : Ta (°C)
Figure 15. Detection Voltage
Figure 16. Detection Voltage and Release Voltage
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TSZ02201-0R7R0G300200-1-2
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BD52xx-2C Series
BD53xx-2C Series
Typical Performance Curves - continued
Pull-up to 5V
Pull-up resistance: 100kΩ
Pull-up to VDD
Pull-up resistance: 100kΩ
6.0
4.0
BD5230G-2C
BD5230G-2C
3.5
Output Voltage : VOUT(V)
Output Voltage : VOUT(V)
5.0
Ta=125°C
4.0
Ta=105°C
Ta=25°C
3.0
Ta=-40°C
2.0
1.0
3.0
2.5
2.0
1.5
Ta=125°C
1.0
Ta=105°C
Ta=25°C
0.5
Ta=-40°C
0.0
0.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0.0
0.5
1.0
2.0
2.5
Supply Voltage : VDD (V)
Supply Voltage : VDD (V)
Figure 17. I/O Characteristics
Figure 18. I/O Characteristics
3.0
3.5
Pull-up to VDD
Pull-up resistance: 100kΩ
Pull-up to 5V
Pull-up resistance: 100kΩ
1.0
Minimum Operating Voltage: VOPL(V)
1.0
Minimum Operating Voltage: VOPL(V)
1.5
0.8
0.6
0.4
0.2
0.8
0.6
0.4
0.2
0.0
0.0
-40 -25 -10
5
-40 -25 -10
20 35 50 65 80 95 110 125
5
20 35 50 65 80 95 110 125
Temperature : Ta (°C)
Temperature : Ta (°C)
Figure 19. Operating Limit Voltage
Figure 20. Operating Limit Voltage
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TSZ02201-0R7R0G300200-1-2
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BD52xx-2C Series
BD53xx-2C Series
Typical Performance Curves - continued
70
70
BD5309G-2C
BD5250G-2C
VDD = 2V
60
"Low" Output Current : IOL(mA)
"High" Output Current : IOH(mA)
60
VDD = 4V
50
40
30
VDD = 3V
20
VDD = 2V
10
50
40
30
20
VDD = 1.2V
10
VDD = 0.85V
VDD = 1.2V
0
0
0.0
1.0
2.0
3.0
4.0
5.0
0.0
1.0
1.5
2.0
2.5
Drain-Source Voltage : VDS (V)
Drain-Source Voltage : VDS (V)
Figure 21. “High” Output Current
Figure 22. “Low” Output Current
35
3.0
70
BD5309G-2C
30
25
Ta=25°C
Ta=105°C
20
BD5220G-2C
60
Ta=-40°C
"Low" Output Current : IOL(mA)
"High" Output Current : IOH(mA)
0.5
Ta=125°C
15
10
5
Ta=-40°C
50
Ta=25°C
40
Ta=105°C
30
Ta=125°C
20
10
0
0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
0.0
0.5
1.0
1.5
2.0
2.5
Supply Voltage : VDD (V)
Supply Voltage : VDD (V)
Figure 23. “High” Output Current (VDS=0.5V)
Figure 24. “Low” Output Current (VDS=0.5V)
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3.0
TSZ02201-0R7R0G300200-1-2
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BD52xx-2C Series
BD53xx-2C Series
Typical Performance Curves - continued
70
80
60
CCT=10nF
Delay Time (H~L) : tPHL(µs)
Delay Time (L~H) : tPLH(ms)
70
60
50
40
CCT=4.7nF
30
20
50
40
30
20
10
10
0
0
-40 -25 -10
5
-40 -25 -10
20 35 50 65 80 95 110 125
5
20 35 50 65 80 95 110 125
Temperature : Ta (°C)
Temperature : Ta (°C)
Figure 26. Output Delay Time (H~L)
Figure 25. Output Delay Time (L~H)
100000
70
Ta=-40°C
Delay Time (H~L) : tPHL(µs)
Delay Time (L~H) : tPLH(ms)
60
Ta=25°C
10000
Ta=105°C
1000
Ta=125°C
100
10
1
0.1
0.0001
50
40
30
20
10
0.001
0.01
0.1
1
10
CT Pin Capacitance : CCT (µF)
0.001
0.01
0.1
1
10
CT Pin Capacitance : CCT (µF)
Figure 27. Output Delay Time (L~H)
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0.0001
Figure 28. Output Delay Time (H~L)
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BD52xx-2C Series
BD53xx-2C Series
Application Information
1. Explanation of Operation
For both the open drain type (Figure 29) and the CMOS output type (Figure 30), the detection and release voltages
are used as threshold voltages. When the voltage applied to the VDD pin reaches the applicable threshold voltage,
the VOUT pin voltage switches from either “High” to “Low” or from “Low” to “High”. BD52xx-2C series and
BD53xx-2C series have delay time function which set tPLH (output “Low” to ”High”) using an external capacitor
connected in CT pin (CCT). Because the BD52xx-2C series uses an open drain output type, it is necessary to connect
a pull up resistor to VDD or another power supply if needed [The output “High” voltage (VOUT) in this case becomes
VDD or the voltage of the other power supply].
VDD
VDD
VOUT
Vref
Delay
Circuit
Delay
Circuit
Vref
GND
GND
CT
CT
Figure 30. (BD53xx-2C type internal block diagram)
Figure 29. (BD52xx-2C type internal block diagram)
2.
VOUT
Setting of Detector Delay Time
Delay time L~H (tPLH) is the time when VOUT rises to 1/2 of VDD after VDD rises up and beyond the release
voltage (VDET+∆VDET). The delay time (tPLH) at the rise of VDD is determined by delay coefficient, CT capacitor and
delay time when CT pin is open (tCTO) and calculated from the following formula. When CT capacitor ≥ 1nF, tCTO has
less effect and tPLH computation is shown on Example No.2. The result has ±50% tolerance within the operating
temperature range of -40°C to +125°C
Formula: (Ta=25°C)
𝑡𝑃𝐿𝐻 = 𝐶𝐶𝑇 × 𝐷𝑒𝑙𝑎𝑦 𝐶𝑜𝑒𝑓𝑓𝑖𝑐𝑖𝑒𝑛𝑡 + 𝑡𝐶𝑇𝑂
[s]
where:
CCT is the CT pin external capacitor
6
Delay Coefficient is equal to 5.55 x 10
Note1
tCTO is the delay time when CT=open
Temperature
Ta = -40°C to +125°C
Delay Time (tCTO)
Min
15µs
Typ
50µs
Max
150µs
Note1: tCTO is design guarantee only; outgoing inspection is not done on all products.
Example No.1:
CT capacitor = 100pF
𝑡𝑃𝐿𝐻_𝑚𝑖𝑛 = (100 × 10−12 × 5.55 × 106 ) × 0.5 + 15 × 10−6 = 292µ𝑠
𝑡𝑃𝐿𝐻_𝑡𝑦𝑝 = (100 × 10−12 × 5.55 × 106 ) × 1.0 + 50 × 10−6 = 605µ𝑠
𝑡𝑃𝐿𝐻_𝑚𝑎𝑥 = (100 × 10−12 × 5.55 × 106 ) × 1.5 + 150 × 10−6 = 983µ𝑠
Example No.2:
CT capacitor = 1nF
𝑡𝑃𝐿𝐻_𝑡𝑦𝑝 = 1 × 10−9 × 5.55 × 106 = 5.55𝑚𝑠
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3.
BD53xx-2C Series
Timing Waveform
The following shows the relationship between the input voltage VDD and the output voltage VOUT when the power supply
voltage VDD is sweep up and sweep down.
VDD
RL
VDD
Delay
Circuit
Vref
VOUT
GND
CT
CCT
Figure 31. BD52xx-2C Set-up
VDD
⑤
VDET+ΔVDET
Hysteresis Voltage (ΔVDET)
VDET
VOPL: <0.8V
t
① ② ③
④
⑤
② ③
④
⑤
②
①
VOUT
t
undefined
tPLH
tPHL
tPLH
undefined
tPHL
Figure 32. Timing Diagram
① When the power supply turns on, the Output Voltage (VOUT) is undefined until VDD overcomes the Operating
Voltage Limit (VOPL).
② VOUT will turn to “Low” as VDD increases above VOPL but less than the Release Voltage (VDET+ΔVDET),
③ When VDD exceeds the Release Voltage (VDET+ΔVDET), delay time (tPLH) set by capacitor at CT pin (CCT)
will happen then VOUT will switch from “Low” to “High”.
④ VOUT will remain “High” until VDD do not fall below the Detection Voltage (VDET).
⑤ When VDD drops below VDET, VOUT will switch from “High” to “Low” with a delay of tPHL.
*The potential difference between the detection voltage and the release voltage is known as the Hysteresis
Voltage width (∆VDET). The system is designed such that the output will not toggle with power supply fluctuations
within this hysteresis width, preventing malfunctions due to noise.
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4.
BD53xx-2C Series
Circuit Applications
(1) Examples of common application circuits
VDD1
VDD2
RL
Application examples of BD52xx-2C series
(Open-drain output type) and BD53xx-2C series
(CMOS output type) are shown below.
Microcontroller
BD52xx-2C
RST
CCT
GND
Figure 33. Open Drain Output Type
CASE2: Power supply of the microcontroller (VDD1) is
the same as the power supply of the reset detection
(VDD1).
Use a CMOS output type (BD53xx-2C) device or an
open-drain output type (BD52xx-2C) device with a
pull-up resistor between the output and VDD1.
VDD1
Microcontroller
BD53xx-2C
CASE1: Power supply of the microcontroller (VDD2)
differs from the power supply of the reset detection
(VDD1).
Use an open drain output type (BD52xx-2C) device
with a load resistance RL attached as shown
in Figure33.
RST
CCT
GND
Figure 34. CMOS Output type
(2) The following is an example of circuit application in which an OR connection between two types of detection voltage
resets the microcontroller.
VDD1
VDD2
VDD3
RL
Microcontroller
BD52xx-2C
NO.1
CCT
BD52xx-2C
NO.2
RST
CCT
GND
Figure 35. OR Circuit Connection Application
To reset the microcontroller when many independent power supplies are used in the system, OR connect an open
drain output type (BD52xx-2C series) to the microcontroller’s input with pull-up resistor to the supply voltage of the
microcontroller (VDD3) as shown in Figure 35. By pulling-up to VDD3, output “High” voltage of micro-controller power
supply is possible.
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BD53xx-2C Series
Circuit Applications (continued)
(3) Examples of the power supply with resistor dividers
In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an inrush current will
flow into the circuit when the output level switches from “Low” to “High” or vice versa. Inrush current is a sudden
surge of current that flows from the power supply (V DD) to ground (GND) as the output logic changes its state. This
current flow may cause malfunction in the systems operation such as output oscillations, etc.
V1
(Note1)
IDD
RA
(RA≤100kohm)
I1
VDD
Inrush Current
BD52xx-2C
BD53xx-2C
(Note1)
RB
CVDD
(CVDD≥0.1μF)
VOUT
GND
0
Figure 36. Resistor Divider Connection Application
VDD
VDET
Figure 37. VDD Voltage vs. Current Consumption
A voltage drop [Inrush current (I1)] × [input resistor (RA)] is caused by the inrush current, and causes the input
voltage to drop when the output switches from “Low” to “High”. When the input voltage decreases and falls below
the detection voltage, the output voltage switches from “High” to “Low”. At this time, the inrush current stops flowing
through output “Low”, and the voltage drop is reduced. As a result, the output switches from “Low” to “High”, which
again causes the inrush current to flow and the voltage to drop. This operation repeats and will result to oscillation.
In case resistor divider will not use and only RA will use, same response will happen.
Note1: The circuit connection mentioned above does not guarantee successful operation.
Please perform thorough evaluation using the actual application and set countermeasures
100
100.0
BD5309G-2C
90
BD5309G-2C
Inrush Current : IDD (µA)
Inrush Current : IDD (µA)
80
10.0
1.0
70
60
50
40
30
20
10
0.1
0
1.0
2.0
3.0
4.0
5.0
6.0
-40 -25 -10
5
20 35 50 65 80 95 110 125
Supply Voltage : VDD (V)
Temperature : Ta (°C)
Figure 38. IDD Inrush Current Ta=25°C
Figure 39. IDD Inrush Current VDD=6V
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BD53xx-2C Series
Circuit Applications (continued)
Depending on the application set-up, there are times that VDD voltage is always below the Release Voltage (VDET+ΔVDET)
because of the effect of inrush current as shown in Figure 40.
Voltage
V1
VDET+ΔVDET
VDD
ΔVDROP = Inrush Current x RA
Hysteresis Voltage (ΔVDET)
VDET
t
Figure 40. VDD Drop Caused by Inrush Current
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BD53xx-2C Series
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2.
Power Supply Line
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all
power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on
the ground voltage. The power supply and ground lines must be as short and thick as possible to reduce line
impedance.
5.
Thermal Consideration
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may
result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the
board size and copper area to prevent exceeding the maximum junction temperature rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of
connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line
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BD53xx-2C Series
Operational Notes – continued
12. Regarding Input Pins of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation
of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.
Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower
than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply
voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages
within the values specified in the electrical characteristics of this IC
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within
the Area of Safe Operation (ASO).
15. Bypass Capacitor for Noise Rejection
To help reject noise, put more than 0.1µF capacitor between VDD pin and GND. Be careful when using extremely big
capacitor as transient response will be affected.
16. The VDD line impedance might cause oscillation because of the detection current.
17. A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.
18. External Parameters
The recommended value of CT Capacitor is from open to 4.7µF and pull-up resistance value is 50kΩ to 1MΩ. There are
many factors (board layout, etc) that can affect characteristics. Operating beyond the recommended values does not
guarantee correct operation. Please verify and confirm using practical applications.
19. When VDD falls below the minimum operating voltage, output will be open. When output is connected to pull-up voltage,
output will be equivalent to pull-up voltage.
20. Power-on Reset Operation
Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual
operation.
21. CT Pin Discharge
Due to the capabilities of the CT pin discharge transistor, the CT pin may not completely discharge when a short input
pulse is applied, and in this case the delay time may not be controlled. Please verify the actual operation.
22. This IC has extremely high impedance pins. Small leak current due to the uncleanness of PCB surface might cause
unexpected operations. Application values in these conditions should be selected carefully. If 10MΩ leakage is assumed
between the CT and GND pin, it is recommended to insert 1MΩ resistor between CT and VDD pin. However, delay time
will change when resistor is connected externally to CT pin so verify the delay time requirements when using this set-up.
Also, when similar leakage is assumed between VOUT and GND pin, consider to set the value of pull up resistor lower
than 1/10 of the impedance of assumed leakage route.
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BD53xx-2C Series
External Dimension Diagram, Packaging and Forming Specification
Package Name
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BD53xx-2C Series
Revision History
Date
Revision
2016/04/25
001
Changes
New
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Notice
Precaution on using ROHM Products
1.
(Note 1)
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
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Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
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Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
BD5209G-2C - Web Page
Part Number
Package
Unit Quantity
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
BD5209G-2C
SSOP5
3000
3000
Taping
inquiry
Yes
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