LM161, LM361 www.ti.com SNOSBJ5C – MAY 1999 – REVISED MARCH 2013 LM161/LM361 High Speed Differential Comparators Check for Samples: LM161, LM361 FEATURES DESCRIPTION • • • • • • • • The LM161/LM361 is a very high speed differential input, complementary TTL output voltage comparator with improved characteristics over the SE529/NE529 for which it is a pin-for-pin replacement. The device has been optimized for greater speed performance and lower input offset voltage. Typically delay varies only 3 ns for over-drive variations of 5 mV to 500 mV. It may be operated from op amp supplies (±15V). 1 2 Independent strobes Ensured high speed: 20 ns max Tight delay matching on both outputs Complementary TTL outputs Operates from op amp supplies: ±15V Low speed variation with overdrive variation Low input offset voltage Versatile supply voltage range Complementary outputs having maximum skew are provided. Applications involve high speed analog to digital converters and zero-crossing detectors in disk file systems. CONNECTION DIAGRAMS SOIC or PDIP Package Figure 1. Top View Package Numbers D0014A, NFF0014A TO-100 Package Figure 2. Package Number LME0010C 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2013, Texas Instruments Incorporated LM161, LM361 SNOSBJ5C – MAY 1999 – REVISED MARCH 2013 www.ti.com LOGIC DIAGRAM *Output is low when current is drawn from strobe pin. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) + Positive Supply Voltage, V +16V Negative Supply Voltage, V− −16V Gate Supply Voltage, VCC +7V Output Voltage +7V Differential Input Voltage ±5V Input Common Mode Voltage ±6V Power Dissipation 600 mW −65°C to +150°C Storage Temperature Range Operating Temperature Range TMIN TMAX −55°C to +125°C LM161 −25°C to +85°C LM361 0°C to +70°C Lead Temp. (Soldering, 10 seconds) 260°C For Any Device Lead Below V− (1) 0.3V The device may be damaged by use beyond the maximum ratings. Operating Conditions Min LM161 Supply Voltage V+ Supply Voltage V− Supply Voltage VCC ESD Tolerance (1) (2) 2 Max 15V LM361 5V 15V LM161 −6V −15V LM361 −6V −15V LM161 4.5V 5V 5.5V LM361 4.75V 5V 5.25V (1) Soldering Information Typ 5V 1600V (2) (2) PDIP Package Soldering (10 seconds) SOIC Package Vapor Phase (60 seconds) 260°C 215°C Infrared (15 seconds) 220°C Human body model, 1.5 kΩ in series with 100 pF. See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM161 LM361 LM161, LM361 www.ti.com SNOSBJ5C – MAY 1999 – REVISED MARCH 2013 Electrical Characteristics (1) (2) (1) (V+ = +10V, VCC = +5V, V− = −10V, TMIN ≤ TA ≤ TMAX, unless noted) Parameter Conditions Limits Units LM161 Min Input Offset Voltage Input Bias Current LM361 Typ Max 1 3 Min 5 TA=25°C Typ Max 1 5 mV μA 10 20 μA 30 2 μA 2 Input Offset Current TA=25°C Voltage Gain TA=25°C 3 3 V/mV Input Resistance TA=25°C, f=1 kHz 20 20 kΩ Logical “1” Output Voltage VCC=4.75V, ISOURCE=−0.5 mA 3.3 V Logical “0” Output Voltage VCC=4.75V, ISINK=6.4 mA 0.4 0.4 V Strobe Input “1” Current (Output Enabled) VCC=5.25V, VSTROBE=2.4V 200 200 μA Strobe Input “0” Current (Output Disabled) VCC=5.25V, VSTROBE=0.4V −1.6 −1.6 mA Strobe Input “0” Voltage VCC=4.75V 0.8 0.8 V Strobe Input “1” Voltage VCC=4.75V Output Short Circuit Current VCC=5.25V, VOUT=0V −55 mA Supply Current I+ V+=10V, V−=−10V, VCC=5.25V, −55°C≤TA≤125°C Supply Current I+ V+=10V, V−=−10V, VCC=5.25V, 0°C≤TA≤70°C Supply Current I− V+=10V, V−=−10V, VCC=5.25V, −55°C≤TA≤125°C Supply Current I− V+=10V, V−=−10V,VCC=5.25V, 0°C≤TA≤70°C Supply Current ICC V+=10V, V−=−10V, VCC=5.25V, −55°C≤TA≤125°C Supply Current ICC V+=10V, V−=−10V, VCC=5.25V, 0°C≤TA≤70°C Transient Response VIN = 50 mV overdrive 3 2.4 μA 5 3.3 2.4 2 2 −18 −55 V −18 4.5 mA 5 10 mA mA 10 18 mA mA 20 mA (3) Propagation Delay Time (tpd(0)) TA=25°C 14 20 14 20 ns Propagation Delay Time (tpd(1)) TA=25°C 14 20 14 20 ns Delay Between Output A and B TA=25°C 2 5 2 5 ns Strobe Delay Time (tpd(0)) TA=25°C 8 8 ns Strobe Delay Time (tpd(1)) TA=25°C 8 8 ns (1) Typical thermal impedances are as follows: (2) (3) Refer to RETS161X for LM161H and LM161J military specifications. Measurements using AC Test circuit, Fanout = 1. The devices are faster at low supply voltages. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM161 LM361 3 LM161, LM361 SNOSBJ5C – MAY 1999 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics 4 Offset Voltage Input Currents vs Ambient Temperature Figure 3. Figure 4. Input Characteristics Supply Current vs Ambient Temperature Figure 5. Figure 6. Supply Current vs Supply Voltage Propagation Delay vs Ambient Temperature Figure 7. Figure 8. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM161 LM361 LM161, LM361 www.ti.com SNOSBJ5C – MAY 1999 – REVISED MARCH 2013 Typical Performance Characteristics (continued) Delay of Output 1 With Respect to Output 2 vs Ambient Temperature Strobe Delay vs Ambient Temperature Figure 9. Figure 10. Common-Mode Pulse Response Propagation Delay vs Supply Voltage Figure 11. Figure 12. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM161 LM361 5 LM161, LM361 SNOSBJ5C – MAY 1999 – REVISED MARCH 2013 www.ti.com AC TEST CIRCUIT VIN = ±50 mV + V = +10V 6 FANOUT = 1 FANOUT = 4 V− = −10V R = 2.4k R = 680Ω VCC = 5.25V Submit Documentation Feedback C=15 pF C = 30 pF Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM161 LM361 LM161, LM361 www.ti.com SNOSBJ5C – MAY 1999 – REVISED MARCH 2013 SCHEMATIC DIAGRAM LM161 R10, R16: 85 R11, R17: 205 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM161 LM361 7 LM161, LM361 SNOSBJ5C – MAY 1999 – REVISED MARCH 2013 www.ti.com REVISION HISTORY Changes from Revision B (March 2013) to Revision C • 8 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 7 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM161 LM361 PACKAGE OPTION ADDENDUM www.ti.com 21-Mar-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM361H ACTIVE TO-100 LME 10 500 TBD Call TI Call TI 0 to 70 ( LM361H ~ LM361H) LM361H/NOPB ACTIVE TO-100 LME 10 500 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM 0 to 70 ( LM361H ~ LM361H) LM361M NRND SOIC D 14 55 TBD Call TI Call TI 0 to 70 LM361M LM361M/NOPB ACTIVE SOIC D 14 55 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM361M LM361MX/NOPB ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM361M LM361N/NOPB ACTIVE PDIP NFF 14 25 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 70 LM361N LM529CH ACTIVE TO-100 LME 10 500 TBD Call TI Call TI 0 to 70 ( LM361H ~ LM361H) LM529CN OBSOLETE PDIP NFF 14 TBD Call TI Call TI 0 to 70 LM361N NE529A OBSOLETE PDIP NFF 14 TBD Call TI Call TI 0 to 70 LM361N NE529K ACTIVE TO-100 LME 10 500 TBD Call TI Call TI 0 to 70 ( LM361H ~ LM361H) SE529K ACTIVE TO-100 LME 10 500 TBD Call TI Call TI 0 to 70 ( LM361H ~ LM361H) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 21-Mar-2015 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device LM361MX/NOPB Package Package Pins Type Drawing SOIC D 14 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 9.35 2.3 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM361MX/NOPB SOIC D 14 2500 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA MMBC006 – MARCH 2001 LME (O–MBCY–W10) METAL CYLINDRICAL PACKAGE ø 0.370 (9,40) 0.335 (8,51) ø 0.335 (8,51) 0.305 (7,75) 0.040 (1,02) 0.010 (0,25) 0.185 (4,70) 0.165 (4,19) 0.040 (1,02) 0.010 (0,25) 0.500 (12,70) MIN Seating Plane ø ø 0.021 (0,53) 0.016 (0,41) 0.160 (4,06) 0.120 (3,05) 0.120 (3,05) 0.110 (2,79) 4 3 0.034 (0,86) 0.028 (0,71) 36° 5 2 6 1 10 7 9 8 0.230 (5,84) 0.045 (1,14) 0.029 (0,74) 4202488/A 03/01 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Leads in true position within 0.010 (0,25) R @ MMC at seating plane. Pin numbers shown for reference only. Numbers may not be marked on package. Falls within JEDEC MO–006/TO-100. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 MECHANICAL DATA NFF0014A N0014A N14A (Rev G) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated