Freescale MP3V5050DP Integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and calibrated Datasheet

Pressure
Freescale Semiconductor
MP3V5050
Rev 1, 11/2009
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
MP3V5050
Series
0 to 50 kPa (0 to 7.25 psi)
0.06 to 2.82 V Output
The MP3V5050 series piezoresistive transducer is a state-of-the-art
monolithic silicon pressure sensor designed for a wide range of applications,
but particularly those employing a microcontroller or microprocessor with A/D
inputs. This patented, single element transducer combines advanced
micromachining techniques, thin-film metallization, and bipolar processing to
provide an accurate, high level analog output signal that is proportional to the
applied pressure.
Features
•
•
•
•
•
•
•
2.5% Maximum Error over 0° to 85°C
Ideally suited for Microprocessor or Microcontroller-Based Systems
Temperature Compensated Over -40° to +125°C
Patented Silicon Shear Stress Strain Gauge
Thermoplastic (PPS) Surface Mount Package
Multiple Porting Options for Design Flexibility
Barbed Side Ports for Robust Tube Connection
ORDERING INFORMATION
Case
Device Name
No.
None
Small Outline Package (MP3V5050 Series)
MP3V5050DP
MP3V5050GP
MP3V5050GC6U
MP3V5050GC6T1
1351
1369
482A
482A
# of Ports
Single
Dual
Gauge
•
•
•
•
Pressure Type
Differential
•
•
•
•
SMALL OUTLINE PACKAGES
MP3V5050GC6U/6T1
CASE 482A-01
MP3V5050DP
CASE 1351-01
© Freescale Semiconductor, Inc., 2008, 2009. All rights reserved.
MP3V5050GP
CASE 1369-01
Absolute
Device
Marking
MP3V5050G
MP3V5050G
MP3V5050G
MP3V5050G
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in
Figure 4 required to meet electrical specifications.)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range(1)
POP
0
—
50
kPa
Supply Voltage(2)
VS
2.7
3.0
3.3
Vdc
Supply Current
Io
—
7.0
10
mAdc
Minimum Pressure Offset(3)
@ VS = 3.0 Volts
(0 to 85°C)
Voff
0.053
0.12
0.188
Vdc
Full Scale Output(4)
@ VS = 3.0 Volts
(0 to 85°C)
VFSO
2.752
2.8
2.888
Vdc
Full Scale Span(5)
@ VS = 3.0 Volts
(0 to 85°C)
VFSS
—
2.7
—
Vdc
Accuracy(6)
(0 to 85°C)
—
—
—
±2.5
%VFSS
V/P
—
54
—
mV/kPa
Response Time(7)
tR
—
1.0
—
ms
Output Source Current at Full Scale Output
Io+
—
0.1
—
mAdc
Warm-Up Time(8)
—
—
20
—
ms
Offset Stability(9)
—
—
±0.5
—
%VFSS
Sensitivity
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2.Device is ratiometric within this specified excitation range.
3.Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4.Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5.Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6.Accuracy (error budget) consists of the following:
Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and
from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or
maximum rated pressure at 25°C.
TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25°C.
7.Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
8.Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
9.Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MP3V5050
2
Sensors
Freescale Semiconductor
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
Pmax
200
kPa
Storage Temperature
Tstg
-40° to +125°
°C
Operating Temperature
TA
-40° to +125°
°C
1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS
2
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
3
GND
Gain Stage #2
and
Ground
Reference
Shift Circuitry
4
Vout
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
for Small Outline Package Device
Figure 1. Fully Integrated Pressure Sensor Schematic
MP3V5050
Sensors
Freescale Semiconductor
3
Pressure
On-chip Temperature Compensation and Calibration
Figure 3 illustrates the Differential/Gauge Sensing Chip in
the basic chip carrier (Case 482A). A fluorosilicone gel
isolates the die surface and wire bonds from the environment,
while allowing the pressure signal to be transmitted to the
sensor diaphragm.
The MP3V5050 series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 2 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in Figure 4. The
output will saturate outside of the specified pressure range.
Figure 4 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
3
Transfer Function:
Vout = VS*(0.018*P+0.04) ± ERROR
VS = 3.0 Vdc
TEMP = 0 to 85°C
Output (V)
2
TYPICAL
MAX
MIN
1
0
0
5
10
15
20
25
30
35
40
45
50
55
Differential Pressure (kPa)
Figure 2. Output vs. Pressure Differential
FLUOROSILICONE
GEL DIE COAT
DIE
STAINLESS
STEEL CAP
P1
WIRE BOND
THERMOPLASTIC
CASE
LEAD
FRAME
P2
DIFFERENTIAL
SENSING ELEMENT
DIE BOND
Figure 3. Cross-Sectional Diagram SOP (not to scale)
3V
Vout
OUTPUT
Vs
IPS
1.0 μF
0.01 μF
GND
470 pF
Figure 4. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646)
MP3V5050
4
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Freescale Semiconductor
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Transfer Function
Nominal Transfer Value: Vout = VS (P x 0.018 + 0.04)
± (Pressure Error x Temp. Factor x 0.018 x VS)
VS = 3.0 V ± 0.30 Vdc
Temperature Error Band
MP3V5050 SERIES
4.0
Temp
3.0
Temperature
Error
Factor
–40
0 to 85
+125
2.0
Multiplier
3
1
3
1.0
0.0
–40
–20
0
20
40
60
80
100
120
140
Temperature in °C
NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C.
Pressure Error Band
Error Limits for Pressure
3.0
Pressure Error (kPa)
2.0
1.0
Pressure (in kPa)
0.0
0
–1.0
10
20
30
40
50
60
–2.0
Pressure
Error (Max)
0 to 50 (kPa)
±1.25 (kPa)
–3.0
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
The two sides of the pressure sensor as the Pressure (P1)
side and the Vacuum (P2) side. The Pressure (P1) side is the
side containing fluorosilicone gel which protects the die from
Part Number
Case Type
harsh media. The MP3V pressure sensor is designed to
operate with positive differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
Pressure (P1) Side Identifier
MP3V5050GP
1369
Side with Port Attached
MP3V5050DP
1351
Side with Part Marking
MP3V5050GC6U/T1
482A
Vertical Port Attached
MP3V5050
Sensors
Freescale Semiconductor
5
Pressure
PACKAGE DIMENSIONS
–A–
D 8 PL
4
0.25 (0.010)
5
M
T B
S
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT.
S
N –B–
G
8
1
S
DIM
A
B
C
D
G
H
J
K
M
N
S
V
W
W
V
C
H
J
INCHES
MIN
MAX
0.415
0.425
0.415
0.425
0.500
0.520
0.038
0.042
0.100 BSC
0.002
0.010
0.009
0.011
0.061
0.071
0_
7_
0.444
0.448
0.709
0.725
0.245
0.255
0.115
0.125
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
12.70
13.21
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0_
7_
11.28
11.38
18.01
18.41
6.22
6.48
2.92
3.17
–T–
K
M
PIN 1 IDENTIFIER
SEATING
PLANE
CASE 482A-01
ISSUE A
UNIBODY PACKAGE
MP3V5050
6
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Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MP3V5050
Sensors
Freescale Semiconductor
7
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MP3V5050
8
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Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MP3V5050
Sensors
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Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MP3V5050
10
Sensors
Freescale Semiconductor
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MP3V5050
Rev. 1
11/2009
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